CN213357788U - Horizontal electroplating production line convenient to clearance current conducting plate copper sediment - Google Patents
Horizontal electroplating production line convenient to clearance current conducting plate copper sediment Download PDFInfo
- Publication number
- CN213357788U CN213357788U CN202022046683.8U CN202022046683U CN213357788U CN 213357788 U CN213357788 U CN 213357788U CN 202022046683 U CN202022046683 U CN 202022046683U CN 213357788 U CN213357788 U CN 213357788U
- Authority
- CN
- China
- Prior art keywords
- copper
- brush
- plate
- conductive plate
- conducting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The application relates to the field of electroplating conductive devices, in particular to a horizontal electroplating production line convenient for cleaning conductive plate copper slag, which solves the problem that the copper slag generated by abrasion of a copper carbon brush and a conductive plate can influence the contact of the copper carbon brush and the conductive plate in the subsequent electroplating process. The electroplating rack comprises a rack, chain wheels arranged at two ends of the rack and a chain in transmission fit with the two chain wheels, wherein the chain wheels are connected with a motor, a plating solution tank is arranged on one side of the rack, and a plurality of hanging tools used for clamping electroplated parts are arranged on the outer side of the chain. The top of hanger is connected with the current conducting plate, and one side that the frame is close to the plating bath groove is provided with the plate electrode that is used for connecting the power, rotates on the plate electrode to be connected with a plurality of copper carbon brushes, and the one end butt that the plate electrode was kept away from to the copper carbon brush is in the current conducting plate. One side of the frame, which is far away from the plating solution tank, is provided with a brush and a blowing mechanism in sequence along the transmission direction of the chain at the side. This application can be at the automatic copper slag clean up on the current conducting plate in current conducting plate data send process.
Description
Technical Field
The application relates to the field of electroplating conductive devices, in particular to a horizontal electroplating production line convenient for cleaning conductive plate copper slag.
Background
The current continuous electroplating assembly line mainly comprises vertical electroplating and horizontal electroplating, and the vertical electroplating is difficult to meet the technical requirements of high-quality and high-reliability interconnected holes under the condition that the aspect ratio of through holes in an electroplated product is large or dead blind holes appear, so that a horizontal electroplating process is usually adopted. The horizontal electroplating has wider adaptive size range, does not need to be hung by hands or tools, realizes all automatic operation, has no damage to the surface of the substrate in the process of improving and ensuring the operation, and is very favorable for realizing large-scale production.
Horizontal electroplating is a plating mode in which a plated part is placed in a mode of being parallel to the liquid level of a plating solution from a vertical mode, the plated part is a cathode, the plated part is clamped by a hanger and is continuously conveyed through a chain for electroplating, and a power supply is connected above the hanger to form a loop. The plurality of hangers form closed-loop circulating transmission under the transmission of the chain, and the plating solution groove is positioned on one side of the two parallel sides of the chain. Because the hanger is in a continuous moving state when clamping the electroplated part, the power supply is generally connected with a plurality of copper carbon brushes, the copper carbon brushes are arranged on one side of the chain above the plating solution tank, and the copper carbon brushes are abutted with the conductive plates on the hanger to form a loop in the electroplating process.
In order to guarantee the stability of current transmission, the copper carbon brush generally can closely butt with the current conducting plate, but under the continuous removal of hanger, the wearing and tearing are more serious between copper carbon brush and the current conducting plate, and copper sediment can be produced with the current conducting plate when wearing and tearing to the copper carbon brush, all can accumulate a small amount of copper sediment on the current conducting plate after every electroplating cycle, can influence the compactness of follow-up circulation electroplating in-process copper carbon brush and current conducting plate contact, and then cause the influence to the quality of follow-up electroplating.
SUMMERY OF THE UTILITY MODEL
In order to improve the problem that the copper sediment that copper carbon brush and current conducting plate wearing and tearing produced can lead to the fact the influence to the contact of follow-up electroplating in-process copper carbon brush and current conducting plate, this application provides a horizontal electroplating production line convenient to clearance current conducting plate copper sediment.
The application provides a horizontal electroplating production line convenient to clearance current conducting plate copper sediment adopts following technical scheme:
a horizontal electroplating production line convenient for cleaning copper slag of a conductive plate comprises a rack, chain wheels arranged at two ends of the rack and chains matched with the chain wheels in a transmission manner, wherein one chain wheel is connected with a motor, a plating solution tank is arranged at one side of the rack, a plurality of hangers used for clamping electroplated parts are arranged at the outer side of the chains, the top of each hanger is connected with the conductive plate, one side of the rack, which is close to the plating solution tank, is provided with a plate electrode used for connecting a power supply, a plurality of copper carbon brushes are arranged on the plate electrode, one ends of the copper carbon brushes are rotatably connected to the plate electrode, one ends of the copper carbon brushes, which are far away from the plate electrode, are abutted against the conductive plate, the distance between two adjacent copper carbon brushes is smaller than the length of the conductive plate, one side of the rack, which is far away from the plating solution tank, the brush comprises a brush handle connected to the rack and brush bristles densely distributed on the lower surface of the brush handle, and the brush bristles are abutted to the upper surface of the conductive plate.
Through adopting above-mentioned technical scheme, the chain drives the continuous transmission of hanger and forms closed loop circulation during electroplating, because the one end rotation of copper carbon brush is connected in the plate electrode, the other end of copper carbon brush receives the action of gravity to rotate downwards and butt in the current-conducting plate, thereby form the return circuit with the plating solution in the plating bath and electroplate, when electroplating partial current-conducting plate conveying of accomplishing to the frame when keeping away from the one side of plating bath, the brush can clear up the copper sediment that produces because of copper carbon brush and current-conducting plate looks wearing and tearing on the current-conducting plate, clean the copper sediment from the current-conducting plate, then blow to the upper surface of current-conducting plate through the mechanism of blowing again, further clear up remaining copper sediment, the effect of clearing up the current-conducting plate has been improved, avoid remaining copper sediment to cause the influence and lead to electroplating quality to reduce to subsequent electroplating in.
Optionally, the bristles are made of copper wire.
Through adopting above-mentioned technical scheme, the copper wire elasticity is good, and hardness is little, is favorable to protecting the current conducting plate, and the copper wire wearability is good simultaneously, long service life.
Optionally, the blowing mechanism includes an air compression pump, a blowing pipe communicated with the air compression pump, and a blowing nozzle communicated with one end of the blowing pipe far away from the air compression pump, and the blowing nozzle is obliquely aligned downwards to the conductive plate and faces the transmission direction of one side of the plating solution tank far away from the chain.
By adopting the technical scheme, when the current conducting plate passes through the air blowing mechanism, high-pressure air generated by the air compression pump is blown out from the air blowing nozzle through the air blowing pipe to blow residual copper slag on the current conducting plate, so that the residual copper slag after the brush is cleaned is completely blown, and the residual amount of the copper slag on the current conducting plate is reduced.
Optionally, the blowing nozzle is flat.
Through adopting above-mentioned technical scheme, the blowing nozzle sets up to the platykurtic can increase the area of blowing to the current conducting plate, has improved the effect of the clearance of blowing to the current conducting plate.
Optionally, a water tank is arranged on one side of the frame, which is far away from the plating solution tank, and the brush and the blowing mechanism are both located above the water tank.
Through adopting above-mentioned technical scheme, the copper sediment that brush and mechanism of blowing cleared up fell into the basin in to avoid the copper sediment directly to fall subaerial and bring the trouble for the clearance, also can avoid simultaneously subaerial too much copper sediment of accumulation and produce the dust easily.
Optionally, the current conducting plate with be connected with the mounting box between the hanger, the both ends opening of mounting box, the current conducting plate set up in the mounting box, the one end of mounting box bottom is connected with copper slag groove, copper slag groove is connected along keeping away from the direction of mounting box extends to adjacently the below of mounting box, adjacent two gap between the mounting box is located the top in copper slag groove.
Through adopting above-mentioned technical scheme, in the transmission course of plated item, because the one end and the current conducting plate looks butt of copper carbon brush, therefore the copper carbon brush can be blockked along with the removal of current conducting plate with the copper slag that the current conducting plate produced because of wearing and tearing, when current conducting plate and copper carbon brush break away from, the copper slag can fall in the copper slag groove, the copper slag groove is collected the copper slag, avoid the copper slag to fall in the plating bath to cause the pollution and cause the influence to the electroplating quality of plated item to the plating solution, also convenient the unified processing to the copper slag simultaneously.
Optionally, one end of the copper carbon brush, which is far away from the electrode plate, is connected with an extension brush, and the extension brush is in contact with the surface of the conductive plate.
Through adopting above-mentioned technical scheme, the setting of extension brush and the contact of electrically conductive face has increased the area of contact of copper carbon brush with the current conducting plate, is favorable to improving current transmission's stability, has reduced the possibility that opens circuit.
Optionally, the extension brush with be connected with between the plate electrode and compress tightly the subassembly, compress tightly the subassembly including connect in the installation piece of plate electrode with connect in the pressure spring of installation piece, the pressure spring is kept away from the one end of installation piece connect in the extension brush, work as the extension brush with when the current conducting plate looks butt, the pressure spring is in compression state.
Through adopting above-mentioned technical scheme, the elasticity of pressure spring makes extension brush and the inseparable butt of current conducting plate when electroplating, has guaranteed current transmission's stability, and along with electroplating going on, when extension brush constantly wearing and tearing, the elasticity of pressure spring can make extension brush and current conducting plate looks butt all the time, and then makes the copper carbon brush and the current conducting plate keep being connected electrically, avoids appearing the condition of opening circuit and leads to the electroplating quality of plated item to receive the influence.
In summary, the present application includes at least one of the following beneficial technical effects:
when the conductive plate of the electroplating completed part is conveyed to one side of the rack far away from the plating solution tank, the brush can clean copper slag generated by abrasion of the copper carbon brush and the conductive plate on the conductive plate, clean the copper slag from the conductive plate, and blow the upper surface of the conductive plate through the blowing mechanism, so that the residual copper slag is further cleaned, the cleaning effect on the conductive plate is improved, and the reduction of electroplating quality caused by the influence of the residual copper slag on the contact of the copper carbon brush and the conductive plate in the subsequent electroplating process is avoided;
the water tank can collect the copper slag cleaned by the brush and the blowing mechanism, so that the copper slag is prevented from directly falling onto the ground to cause trouble in cleaning, and meanwhile, dust is prevented from being easily generated due to excessive copper slag accumulated on the ground;
the copper slag groove can collect copper slag pushed down by the copper carbon brush from the current-conducting plate, so that the copper slag is prevented from falling into the plating bath to pollute the plating solution and influence the plating quality of a plated part, and meanwhile, the copper slag is conveniently treated in a unified manner;
the pressing assembly can enable the extension brush to be in tight butt joint with the current conducting plate, the stability of current transmission is guaranteed, the extension brush can be always in butt joint with the current conducting plate along with the electroplating, the copper carbon brush is further electrically connected with the current conducting plate, and the electroplating quality of an electroplated part caused by the broken circuit is prevented from being affected.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present application.
Fig. 2 is an enlarged schematic view of a portion a in fig. 1.
Fig. 3 is a schematic structural diagram of another view angle according to an embodiment of the present application.
Fig. 4 is an enlarged schematic view of a portion B in fig. 2.
Description of reference numerals: 1. a frame; 11. a sprocket; 12. a chain; 13. a motor; 14. a hanger; 15. plating solution tanks; 16. a water tank; 2. mounting a box; 21. a copper slag groove; 3. a conductive plate; 4. an electrode plate; 5. a copper carbon brush; 51. a lengthening brush; 6. a wire; 71. mounting a sheet; 72. a pressure spring; 8. a brush; 81. a brush handle; 82. brushing; 91. an air compression pump; 92. an air blowing pipe; 93. and a blowing nozzle.
Detailed Description
The present application is described in further detail below with reference to the attached drawings.
The embodiment of the application discloses horizontal electroplating production line convenient to clearance conducting plate copper sediment. Referring to fig. 1, the horizontal electroplating production line convenient for cleaning the copper slag on the conductive plate comprises a frame 1, chain wheels 11 horizontally arranged at two ends of the frame 1 and a chain 12 in transmission fit with the two chain wheels 11, wherein one chain wheel 11 is connected with a motor 13, and a plating solution tank 15 is arranged at one side of the frame 1.
Referring to fig. 1 and 2, a plurality of hangers 14 for clamping electroplated parts are uniformly installed at intervals outside the chain 12, a mounting box 2 made of stainless steel is horizontally installed at the top of each hanger 14, and a conductive plate 3 is embedded in each mounting box 2. A plate electrode 4 for connecting a power supply is horizontally arranged on one side, close to the plating solution tank 15, of the rack 1, a plurality of copper carbon brushes 5 are arranged on the plate electrode 4 at even intervals, one ends of the copper carbon brushes 5 are rotatably connected to the plate electrode 4 through pin shafts, and one ends, far away from the plate electrode 4, of the copper carbon brushes 5 abut against the upper surface of the conductive plate 3. In other embodiments, the mounting box 2 may be made of other metal materials with conductive performance.
During electroplating, the chain 12 drives the hanger 14 to continuously transmit to form a closed loop circulation, because one end of the copper carbon brush 5 is rotatably connected to the electrode plate 4, and the other end of the copper carbon brush 5 is rotated downwards under the action of gravity and is abutted against the conductive plate 3, a loop is formed with the electroplating solution in the electroplating solution tank 15 for electroplating.
In order to ensure that each conductive plate 3 is at least abutted against one copper carbon brush 5 at any moment in the electroplating process, the distance between every two adjacent copper carbon brushes 5 is smaller than the length of the conductive plate 3, so that the electroplated part is ensured to be electrified all the time, and the electroplating quality is prevented from being influenced.
Referring to fig. 2, in this embodiment, two ends of each mounting box 2 are open, the bottoms of the same ends of the plurality of mounting boxes 2 are connected to a copper slag groove 21, the copper slag groove 21 extends to the lower side of the adjacent mounting box 2 along the direction away from the connecting mounting box 2, and the gap between the two adjacent mounting boxes 2 is located above the copper slag groove 21.
In the transmission course of plated item, because the one end of copper carbon brush 5 and the 3 looks butt of current conducting plate, consequently the copper slag that copper carbon brush 5 and current conducting plate 3 produced because of wearing and tearing can be blockked by copper carbon brush 5 along with current conducting plate 3's removal, when current conducting plate 3 breaks away from with copper carbon brush 5, the copper slag can fall in the copper slag groove 21, copper slag groove 21 is collected the copper slag, avoid the copper slag to fall to cause the pollution and cause the influence to the electroplating quality of plated item to the plating bath in the plating bath, also convenient the unified processing to the copper slag simultaneously.
Referring to fig. 2, in order to improve the stability of current transmission, one end of the copper carbon brush 5, which is far away from the electrode plate 4, is connected with an extension brush 51, the extension brush 51 and the copper carbon brush 5 are integrated, one end of the pressure spring 72, which is far away from the mounting piece 71, is connected with the extension brush 51, and in the electroplating process, the extension brush 51 is in surface contact with the conductive plate 3, so that the contact area between the copper carbon brush 5 and the conductive plate 3 is increased, and the possibility of open circuit is reduced. And a lead 6 is connected between the copper carbon brush 5 and the electrode plate 4, so that the electrode plate 4 can continuously and stably transmit current to the copper carbon brush 5, and the electroplating quality is improved.
The electrode plate 4 is provided with a plurality of groups of pressing assemblies for enabling the copper carbon brush 5 to abut against the conductive plate 3, and each group of pressing assemblies comprises an installation piece 71 horizontally and fixedly installed on the upper surface of the electrode plate 4 through a bolt and a pressure spring 72 connected to one end, far away from the electrode plate 4, of the lower surface of the installation piece 71. One end of the compression spring 72 remote from the mounting piece 71 is connected to the extension brush 51, and when the extension brush 51 abuts against the conductive plate 3, the compression spring 72 is in a compressed state.
The elasticity of pressure spring 72 makes extension brush 51 and the inseparable butt of current conducting plate 3 during electroplating, has guaranteed current transmission's stability, and along with electroplating going on, when extension brush 51 was constantly worn and torn, the elasticity of pressure spring 72 can make extension brush 51 and current conducting plate 3 butt all the time, and then makes copper carbon brush 5 and current conducting plate 3 keep being connected, avoids appearing the condition of opening circuit and leads to the electroplating quality of plated item to receive the influence.
Referring to fig. 3 and 4, a brush 8 and an air blowing mechanism are sequentially installed on one side of the frame 1 away from the plating solution tank 15 along the transmission direction of the chain 12 on the side, the brush 8 comprises a brush holder 81 fixedly connected to the frame 1 through a bolt and bristles 82 densely distributed on the lower surface of the brush holder 81, and the bristles 82 abut against the upper surface of the conductive plate 3.
The blowing mechanism comprises an air compression pump 91, a blowing pipe 92 communicated with the air compression pump 91 and a blowing nozzle 93 communicated with one end of the blowing pipe 92 far away from the air compression pump 91, wherein the blowing nozzle 93 is obliquely and downwards aligned to the conductive plate 3 and faces the transmission direction of one side of the chain 12 far away from the plating solution tank 15.
When electroplating partial current conducting plate 3 conveying to frame 1 and keeping away from one side of plating bath 15, brush 8 can clear up the copper sediment that produces because of copper carbon brush 5 and current conducting plate 3 looks wearing and tearing on the current conducting plate 3, clean the copper sediment from current conducting plate 3, then blow to the upper surface of current conducting plate 3 through gas blow pipe 92 and blowing nozzle 93, further clear up remaining copper sediment, the clearance effect to current conducting plate 3 has been improved, the volume of remaining of copper sediment on the current conducting plate 3 has been reduced, avoid remaining copper sediment to cause the influence and lead to electroplating quality to reduce to subsequent electroplating in-process copper carbon brush 5 and current conducting plate 3's contact.
In this embodiment, the brush hairs 82 are made of copper wires, and the copper wires have good elasticity and small hardness, so that the conductive plate 3 is protected, and meanwhile, the copper wires have good wear resistance and long service life.
Referring to fig. 4, in order to improve the effect of blowing and cleaning the conductive plate 3, the blowing nozzle 93 is formed in a flat shape, so that the blowing area of the conductive plate 3 is increased to clean the copper slag on the conductive plate 3.
Referring to fig. 3, basin 16 is installed to one side that frame 1 kept away from plating bath 15, and brush 8 and blowing mechanism all are located basin 16's top, and when clearing up current conducting plate 3, the copper sediment that brush 8 and blowing mechanism cleared up can fall into basin 16 in to avoid the copper sediment directly to fall subaerial and bring the trouble for the clearance, also can avoid subaerial too much copper sediment of accumulation and produce the dust easily simultaneously.
The implementation principle of the horizontal electroplating production line convenient for cleaning the copper slag of the conductive plate in the embodiment of the application is as follows: when in electroplating, the extension brush 51 is abutted against the conductive plate 3, and the extension brush 51 is tightly abutted against the conductive plate 3 by the elasticity of the pressure spring 72, so that the stability of current transmission is ensured, and a loop is formed with the electroplating solution in the electroplating solution tank 15 for electroplating. In the electroplating process, the copper slag generated by the copper carbon brush 5 and the conductive plate 3 due to abrasion can be blocked by the copper carbon brush 5 along with the movement of the conductive plate 3 and is relatively pushed, when the conductive plate 3 is separated from the copper carbon brush 5, the copper slag can be pushed into the copper slag groove 21 to be collected, and the phenomenon that the copper slag falls into the electroplating bath to pollute the electroplating solution and influence the electroplating quality of an electroplated part is avoided. When electroplating partial current conducting plate 3 and conveying to frame 1 and keeping away from one side of plating bath 15, brush 8 can clear up the copper slag on the current conducting plate 3, clean the copper slag from current conducting plate 3, then blow through gas blow pipe 92 and blowing nozzle 93 to the upper surface of current conducting plate 3, further clear up remaining copper slag, the volume of remaining of copper slag on the current conducting plate 3 has been reduced, avoid remaining copper slag to cause the influence and lead to electroplating quality to reduce to the contact of follow-up electroplating in-process copper carbon brush 5 and current conducting plate 3.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. The utility model provides a horizontal electroplating production line convenient to clearance conducting plate copper sediment, include frame (1), set up in sprocket (11) and with two at frame (1) both ends sprocket (11) transmission fit's chain (12), one of them sprocket (11) are connected with motor (13), one side of frame (1) is provided with plating bath groove (15), the outside of chain (12) is provided with a plurality of hangers (14) that are used for centre gripping plated item, its characterized in that: the top of the hanger (14) is connected with a conductive plate (3), one side of the rack (1) close to the plating solution tank (15) is provided with an electrode plate (4) used for connecting a power supply, the electrode plate (4) is provided with a plurality of copper carbon brushes (5), one end of each copper carbon brush (5) is rotatably connected with the electrode plate (4), one end of each copper carbon brush (5) far away from the electrode plate (4) is abutted against the conductive plate (3), the distance between every two adjacent copper carbon brushes (5) is smaller than the length of the conductive plate (3), one side of the rack (1) far away from the plating solution tank (15) is sequentially provided with a brush (8) and a blowing mechanism along the transmission direction of the chain (12) at the side, the brush (8) comprises a brush handle (81) connected with the rack (1) and bristles (82) densely distributed on the lower surface of the brush handle (81), the brush (82) abuts against the upper surface of the conductive plate (3).
2. The horizontal electroplating production line convenient for cleaning the conductive plate copper slag as claimed in claim 1, which is characterized in that: the bristles (82) are made of copper wire.
3. The horizontal electroplating production line convenient for cleaning the conductive plate copper slag as claimed in claim 1, which is characterized in that: the blowing mechanism comprises an air compression pump (91), a blowing pipe (92) communicated with the air compression pump (91) and a blowing nozzle (93) communicated with one end, far away from the air compression pump (91), of the blowing pipe (92), wherein the blowing nozzle (93) is obliquely and downwards aligned to the conductive plate (3) and faces the transmission direction of one side, far away from the plating solution tank (15), of the chain (12).
4. The horizontal electroplating production line convenient for cleaning the conductive plate copper slag as claimed in claim 3, which is characterized in that: the blowing nozzle (93) is flat.
5. The horizontal electroplating production line convenient for cleaning the conductive plate copper slag as claimed in claim 1, which is characterized in that: a water tank (16) is arranged on one side, away from the plating solution tank (15), of the rack (1), and the brush (8) and the blowing mechanism are both located above the water tank (16).
6. The horizontal electroplating production line convenient for cleaning the conductive plate copper slag as claimed in claim 1, which is characterized in that: the utility model discloses a copper slag groove, including mounting box (2), conducting plate (3), mounting box (2), conducting plate (3) and hanger (14), be connected with mounting box (2) between the both ends opening of mounting box (2), conducting plate (3) set up in mounting box (2), the one end of mounting box (2) bottom is connected with copper slag groove (21), copper slag groove (21) are connected along keeping away from the direction of mounting box (2) extends to adjacent the below of mounting box (2), adjacent two gap between mounting box (2) is located the top of copper slag groove (21).
7. The horizontal electroplating production line convenient for cleaning the conductive plate copper slag as claimed in claim 1, which is characterized in that: one end, far away from the electrode plate (4), of the copper carbon brush (5) is connected with an extension brush (51), and the extension brush (51) is in surface contact with the conductive plate (3).
8. The horizontal electroplating production line convenient for cleaning the conductive plate copper slag as claimed in claim 7, which is characterized in that: extension brush (51) with be connected with between electrode board (4) and compress tightly the subassembly, compress tightly the subassembly including connect in installation piece (71) of electrode board (4) with connect in pressure spring (72) of installation piece (71), pressure spring (72) are kept away from the one end of installation piece (71) connect in extension brush (51), work as extension brush (51) with during current conducting plate (3) looks butt, pressure spring (72) are in compression state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022046683.8U CN213357788U (en) | 2020-09-17 | 2020-09-17 | Horizontal electroplating production line convenient to clearance current conducting plate copper sediment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022046683.8U CN213357788U (en) | 2020-09-17 | 2020-09-17 | Horizontal electroplating production line convenient to clearance current conducting plate copper sediment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213357788U true CN213357788U (en) | 2021-06-04 |
Family
ID=76153859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022046683.8U Active CN213357788U (en) | 2020-09-17 | 2020-09-17 | Horizontal electroplating production line convenient to clearance current conducting plate copper sediment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213357788U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112921383A (en) * | 2021-01-20 | 2021-06-08 | 珠海松柏科技有限公司 | Electroplating production equipment and instant starting method of rectifier |
| CN114855232A (en) * | 2022-04-14 | 2022-08-05 | 南通盛杰拉链有限公司 | Metal zipper gold plating device based on automatic circulation |
| CN116024640A (en) * | 2023-02-07 | 2023-04-28 | 东莞市清溪瑞坤机械厂 | Electroplating processing equipment and processing method for metal zipper |
-
2020
- 2020-09-17 CN CN202022046683.8U patent/CN213357788U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112921383A (en) * | 2021-01-20 | 2021-06-08 | 珠海松柏科技有限公司 | Electroplating production equipment and instant starting method of rectifier |
| CN112921383B (en) * | 2021-01-20 | 2022-09-16 | 珠海松柏科技有限公司 | Electroplating production equipment and instant starting method of rectifier |
| CN114855232A (en) * | 2022-04-14 | 2022-08-05 | 南通盛杰拉链有限公司 | Metal zipper gold plating device based on automatic circulation |
| CN116024640A (en) * | 2023-02-07 | 2023-04-28 | 东莞市清溪瑞坤机械厂 | Electroplating processing equipment and processing method for metal zipper |
| CN116024640B (en) * | 2023-02-07 | 2024-04-23 | 东莞市铭鑫华表面处理科技有限公司 | Electroplating processing equipment and processing method for metal zipper |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213357788U (en) | Horizontal electroplating production line convenient to clearance current conducting plate copper sediment | |
| CN112144099B (en) | Horizontal electroplating production line and transmission mechanism thereof | |
| CN208279712U (en) | A kind of electroplating device with impurity removal function | |
| CN213680941U (en) | Take cleaning function's electroplating process equipment for hardware products | |
| CN112048754A (en) | Horizontal electroplating production line, conveying system thereof and horizontal clamping mechanism | |
| CN216965530U (en) | Cleaning device for micro-arc electrophoresis production line | |
| CN213357790U (en) | Cathode conducting device convenient for collecting copper slag of conducting plate | |
| CN210632677U (en) | Steel wire surface drawing dust cleaning device | |
| CN218691768U (en) | Waste lithium battery retrieves and uses surface edulcoration device | |
| CN214651568U (en) | Belt feeder cleaning device | |
| CN217628697U (en) | Electroplating equipment | |
| CN214771065U (en) | Precision instruments processing is with equipment of polishing | |
| CN207904396U (en) | A kind of cleaning device of plated conductive seat and hanger contact surface | |
| CN212388140U (en) | Horizontal electroplating production line, conveying system thereof and horizontal clamping mechanism | |
| CN112916441A (en) | Residual anode cleaning device capable of being hung in electrolytic refining cell | |
| CN209066019U (en) | Foil machine is used in a kind of processing of Novel electrolytic copper foil | |
| CN113337859A (en) | Electroplating cleaning line with rotating structure | |
| CN212451679U (en) | Two-way water washing equipment | |
| CN213739745U (en) | Electroplating production line | |
| CN220635493U (en) | Manufacturing device of anode copper ball for electroplating | |
| CN210367922U (en) | Crystallizer copper plate electroplating cleaning device | |
| CN114808090B (en) | Copper plate and strip double-plating unit tin plating equipment for electric equipment production | |
| CN214178899U (en) | Sea cucumber and abalone belt cleaning device | |
| CN213357789U (en) | Electroplating cathode conducting device | |
| CN217797574U (en) | Automatic cleaning device for conductive rod at diamond wire pre-plating position |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |