CN213739745U

CN213739745U - Electroplating production line

Info

Publication number: CN213739745U
Application number: CN202021476195.4U
Authority: CN
Inventors: 田方成
Original assignee: Dongguan Suyuan Automation Equipment Co ltd
Current assignee: Dongguan Suyuan Automation Equipment Co ltd
Priority date: 2020-07-23
Filing date: 2020-07-23
Publication date: 2021-07-20
Anticipated expiration: 2030-07-23

Abstract

The utility model discloses an electroplating production line, which comprises an electroplating bath, a moving mechanism and a conductive mechanism; the moving mechanism comprises a fixed frame, a driving device, a moving frame and a cathode hanger; the fixing frame is arranged on one side of the electroplating bath; the driving device is arranged on one side of the fixed frame; the movable frame is movably arranged on the other side of the fixed frame and is in transmission connection with the output end of the driving device; the cathode hanger is arranged at one end of the movable frame; the conductive mechanism comprises a cathode copper bar, a conductive water box, a conductive copper flat, a connecting copper flat, a conductive copper block and a lead; the cathode copper bar and the conductive water box are arranged on one side of the fixing frame; electrolyte is arranged in the conductive water box; the conductive copper flat is arranged in the conductive water box and is soaked in the electrolyte; one end of the connecting copper flat is connected with the cathode copper bar, and the other end of the connecting copper flat is directly connected with the top of the conductive copper flat; the conductive copper block is arranged at the bottom of the movable frame, and the bottom of the conductive copper block is in sliding contact with the top of the conductive copper flat; the conducting wire is connected between the conductive copper block and the cathode hanger.

Description

Electroplating production line

Technical Field

The utility model belongs to the technical field of electroplating production, concretely relates to electroplating production line.

Background

During electroplating, plating metal or other insoluble materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer. In order to eliminate the interference of other cations and make the coating uniform and firm, a solution containing the metal cations of the coating is used as an electroplating solution to keep the concentration of the metal cations of the coating constant. The purpose of electroplating is to plate a metal coating on a substrate, altering the surface properties or dimensions of the substrate. The electroplating can enhance the corrosion resistance of the metal (the plating metal is mostly corrosion-resistant metal), increase the hardness, prevent abrasion, improve the conductivity, the smoothness, the heat resistance and the surface beauty.

In the existing electroplating production line, most of conducting connecting materials between a cathode copper bar and a cathode hanger are stainless steel materials, so that the conducting performance is poor, the current transmission effect is poor, and the electroplating effect on the surface of a product is poor.

SUMMERY OF THE UTILITY MODEL

The utility model provides an electroplating production line with an auxiliary conductive device for solving the technical problems.

The utility model discloses a realize its technological effect and the solution that adopts does:

an electroplating production line comprises an electroplating bath, a moving mechanism and a conductive mechanism; the moving mechanism comprises a fixed frame, a driving device, a moving frame and a cathode hanger; the fixing frame is arranged on one side of the electroplating bath; the driving device is arranged on one side of the fixed frame; the movable frame is movably arranged on the other side of the fixed frame and is in transmission connection with the output end of the driving device; the cathode hanger is arranged at one end of the movable frame and vertically extends into the electroplating bath; the conductive mechanism comprises a cathode copper bar, a conductive water box, a conductive copper flat, a connecting copper flat, a conductive copper block and a lead; the cathode copper bar and the conductive water box are arranged on one side of the fixing frame; electrolyte is arranged in the conductive water box; the conductive copper flat is arranged in the conductive water box and is soaked in the electrolyte; one end of the connecting copper flat is connected with the cathode copper bar, and the other end of the connecting copper flat is directly connected to the top of the conductive copper flat; the conductive copper block is arranged at the bottom of the movable frame, and the bottom of the conductive copper block is in sliding contact with the top of the conductive copper flat; one end of the lead is connected with the conductive copper block, and the other end of the lead is connected with the cathode hanger.

Preferably, the electroplating bath comprises a bath body and a plurality of spray pipes; the spray pipes are symmetrically arranged in the groove body in two rows, and any one spray pipe is provided with a plurality of nozzles; the cathode hanger is suspended between the two rows of the spray pipes.

Preferably, the bottom of the tank body is provided with a waste liquid discharge pipe communicated with the inside of the tank body.

Preferably, the device further comprises a transmission device; the transmission device comprises a driving chain wheel, a chain and a driven chain wheel; the driving chain wheel is rotatably arranged at the top of the fixed frame; the driving device is in transmission connection with the driving chain wheel through a belt; the chain meshing transmission is arranged on the outer sides of the two driving chain wheels; the driven chain wheel is rotatably arranged at one end of the movable frame and is in meshing transmission with the top of the chain.

Preferably, one end of the moving frame is slidably arranged on the cathode copper bar; one side of the fixed frame is provided with a supporting frame; the conductive water box is arranged at the top of the support frame; the conductive copper block is arranged at the bottom of the other end of the movable frame; the conductive copper block vertically extends into the conductive water box and is arranged at the top of the conductive copper flat in a sliding mode.

Preferably, two sliding blocks are arranged at the bottom of one end of the moving frame; the two sliding blocks are respectively clamped on two sides of the cathode copper bar in a sliding manner.

The utility model has the advantages that: the cathode copper bar is electrically connected with the cathode hanger sequentially through the connecting copper flat, the conductive copper block and the lead, the copper is good in conductivity, so that the speed of current flowing from the cathode bar to the cathode hanger is higher, and the electroplating efficiency of a product is greatly improved; meanwhile, the conductive copper flat is arranged in a conductive water box storing electrolyte, and the electrolyte can improve the conductivity of the conductive copper flat, so that the electroplating efficiency of the product is further improved.

Drawings

FIG. 1 is a schematic side view of an electroplating line according to an embodiment of the present invention;

FIG. 2 is an enlarged view of the area A in FIG. 1;

FIG. 3 is a schematic front view of an electroplating production line disclosed in an embodiment of the present invention;

fig. 4 is an enlarged view of the area B in fig. 3.

And (3) identification and explanation: 1-fixed frame, 2-driving device, 3-moving frame, 4-cathode hanger, 5-cathode copper bar, 6-conductive water box, 7-conductive copper flat, 8-connecting copper flat, 9-conductive copper block, 10-wire, 11-tank body, 12-spray pipe, 13-nozzle, 14-waste liquid discharge pipe, 15-driving sprocket, 16-chain, 17-driven sprocket, 18-supporting frame, 19-slide block.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When one element is referred to as being "fixedly attached" to another element, it can be fixedly attached by welding, bolting, gluing, or the like.

Referring to fig. 1-4, in a preferred embodiment of the present invention, an electroplating line is disclosed, which includes an electroplating bath, a moving mechanism and a conductive mechanism; the moving mechanism comprises a fixed frame 1, a driving device 2, a moving frame 3 and a cathode hanger 4; the fixing frame 1 is arranged on one side of the electroplating bath; the driving device 2 is arranged on one side of the fixed frame 1; the movable frame 3 is movably arranged on the other side of the fixed frame 1 and is in transmission connection with the output end of the driving device 2; the cathode hanger 4 is arranged at one end of the moving frame 3 and vertically extends into the electroplating bath; the conductive mechanism comprises a cathode copper bar 5, a conductive water box 6, a conductive copper flat 7, a connecting copper flat 8, a conductive copper block 9 and a lead 10; the cathode copper bar 5 and the conductive water box 6 are arranged on one side of the fixing frame 1; the conductive water box 6 is internally provided with electrolyte; the conductive copper flat 7 is arranged in the conductive water box 6 and is soaked in electrolyte; one end of the connecting copper flat 8 is connected with the cathode copper bar 5, and the other end is directly connected with the top of the conductive copper flat 7; the conductive copper block 9 is arranged at the bottom of the movable frame 3, and the bottom of the conductive copper block 9 is in sliding contact with the top of the conductive copper flat 7; one end of the lead 10 is connected with the conductive copper block 9, and the other end is connected with the cathode hanger 4. In particular, the drive means 2 employ a servomotor.

Specifically, the electroplating bath comprises a bath body 11 and a plurality of spray pipes 12; the plurality of spray pipes 12 are symmetrically arranged in two rows in the groove body 11, and a plurality of nozzles 13 are arranged on any one spray pipe 12; the cathode hanger 4 is suspended between two rows of the lances 12. After the plating plate is fixed on the cathode hanger 4, the plating solution is sprayed on the plating plate through the spray pipe 12 and the nozzle 13, and the plating operation is performed.

Specifically, the bottom of the tank body 11 is provided with a waste liquid discharge pipe 14 communicated with the inside of the tank body 11, and waste liquid used in the tank body 11 can be discharged after the tank body is opened.

Specifically, the device further comprises a transmission device; the transmission comprises a driving chain wheel 15, a chain 16 and a driven chain wheel 17; the driving chain wheel 15 is rotationally arranged at the top of the fixed frame 1; the driving device 2 is in transmission connection with the driving chain wheel 15 through a belt; the chain 16 is arranged outside the driving chain wheel 15 in a meshing transmission manner; the driven sprocket 17 is rotatably disposed at one end of the moving frame 3, and is disposed on top of the chain 16 in a meshing transmission manner. The driving device 2 drives the driving chain wheel 15 to rotate through the belt, then the driving chain 16 rotates, the driven chain wheel 17 synchronously meshes with the rotation of the chain 16 to move, and the moving of the moving frame 3 is realized.

Specifically, one end of the moving frame 3 is slidably arranged on the cathode copper bar 5; a supporting frame 18 is arranged on one side of the fixed frame 1; the conductive water box 6 is arranged on the top of the support frame 18; the conductive copper block 9 is arranged at the bottom of the other end of the movable frame 3; the conductive copper block 9 vertically extends into the conductive water box 6 and is arranged at the top of the conductive copper flat 7 in a sliding manner. The two ends of the movable frame 3 are respectively supported by the cathode copper bar 5 and the support frame 18, so that the movable frame 3 can move stably.

Specifically, two sliding blocks 19 are arranged at the bottom of one end of the moving frame 3; the two sliding blocks 19 are respectively clamped on two sides of the cathode copper bar 5 in a sliding manner. The two sliding blocks 19 can ensure that the moving frame 3 moves along the arrangement direction of the cathode copper bar, and can also avoid derailment of the moving frame.

As can be seen from the above description, the conductive mechanism of the utility model has good conductive performance and high electroplating efficiency.

While the preferred embodiments of the present invention have been illustrated in detail in the accompanying drawings, it should be understood that the scope of the invention includes, but is not limited to, the embodiments described above; the specific structure disclosed in the drawings is only a preferred embodiment of the present invention, and those skilled in the art can also develop other embodiments on this basis, and any simple deformation or equivalent replacement without departing from the innovative concept of the present invention is covered by the present invention, which belongs to the protection scope of the present invention.

Claims

1. An electroplating production line, characterized by comprising:

an electroplating bath;

a moving mechanism; the moving mechanism comprises a fixed frame, a driving device, a moving frame and a cathode hanger; the fixing frame is arranged on one side of the electroplating bath; the driving device is arranged on one side of the fixed frame; the movable frame is movably arranged on the other side of the fixed frame and is in transmission connection with the output end of the driving device; the cathode hanger is arranged at one end of the movable frame and vertically extends into the electroplating bath;

a conductive mechanism; the conductive mechanism comprises a cathode copper bar, a conductive water box, a conductive copper flat, a connecting copper flat, a conductive copper block and a lead; the cathode copper bar and the conductive water box are arranged on one side of the fixing frame; electrolyte is arranged in the conductive water box; the conductive copper flat is arranged in the conductive water box and is soaked in the electrolyte; one end of the connecting copper flat is connected with the cathode copper bar, and the other end of the connecting copper flat is directly connected to the top of the conductive copper flat; the conductive copper block is arranged at the bottom of the movable frame, and the bottom of the conductive copper block is in sliding contact with the top of the conductive copper flat; one end of the lead is connected with the conductive copper block, and the other end of the lead is connected with the cathode hanger.

2. An electroplating line according to claim 1, characterized in that: the electroplating bath comprises a bath body and a plurality of spray pipes; the spray pipes are symmetrically arranged in the groove body in two rows, and any one spray pipe is provided with a plurality of nozzles; the cathode hanger is suspended between the two rows of the spray pipes.

3. An electroplating line according to claim 2, characterized in that: and a waste liquid discharge pipe communicated with the interior of the tank body is arranged at the bottom of the tank body.

4. An electroplating line according to claim 1, characterized in that: the device also comprises a transmission device; the transmission device comprises a driving chain wheel, a chain and a driven chain wheel; the driving chain wheel is rotatably arranged at the top of the fixed frame; the driving device is in transmission connection with the driving chain wheel through a belt; the chain meshing transmission is arranged on the outer sides of the two driving chain wheels; the driven chain wheel is rotatably arranged at one end of the movable frame and is in meshing transmission with the top of the chain.

5. An electroplating line according to claim 1, characterized in that: one end of the moving frame is arranged on the cathode copper bar in a sliding mode; one side of the fixed frame is provided with a supporting frame; the conductive water box is arranged at the top of the support frame; the conductive copper block is arranged at the bottom of the other end of the movable frame; the conductive copper block vertically extends into the conductive water box and is arranged at the top of the conductive copper flat in a sliding mode.

6. An electroplating line according to claim 1, characterized in that: the bottom of one end of the movable frame is provided with two sliding blocks; the two sliding blocks are respectively clamped on two sides of the cathode copper bar in a sliding manner.