CN220827482U - Hardware surface electroplating device - Google Patents

Hardware surface electroplating device Download PDF

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CN220827482U
CN220827482U CN202321751858.2U CN202321751858U CN220827482U CN 220827482 U CN220827482 U CN 220827482U CN 202321751858 U CN202321751858 U CN 202321751858U CN 220827482 U CN220827482 U CN 220827482U
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electroplating
clamping
hardware
plate
clamping mechanism
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蔡如研
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Huizhou Hengdeyuan Industrial Co ltd
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Huizhou Hengdeyuan Industrial Co ltd
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Abstract

The utility model relates to a hardware surface electroplating device, which comprises an electroplating box and also comprises a supporting frame, wherein a transverse plate of the supporting frame is positioned above the electroplating box, a lifting mechanism is arranged on the transverse plate, a clamping mechanism which is clamped and released by a motor drive is connected below the lifting mechanism, a supporting plate is also arranged below the clamping mechanism, the supporting plate is fixedly connected with the clamping mechanism, an impeller is arranged on the inner side wall of the electroplating box, and the clamping mechanism is connected with a wire. According to the hardware surface electroplating device provided by the utility model, through the cooperation of the lifting mechanism, the clamping mechanism and the supporting plate, the electroplating of all surfaces of the hardware can be completed in one electroplating operation without changing the clamping position after one electroplating, and meanwhile, the air bubbles on the surface of the hardware are removed through the arrangement of the impeller, so that electroplating unevenness and electroplating bad phenomena such as scorching, whitening, chromatic aberration and the like possibly occurring are avoided, and the whole electroplating work flow is simple, convenient and quick to operate.

Description

一种五金件表面电镀装置A hardware surface electroplating device

技术领域Technical Field

本实用新型涉及电镀加工技术领域,具体涉及一种五金件表面电镀装置。The utility model relates to the technical field of electroplating processing, in particular to a hardware surface electroplating device.

背景技术Background technique

五金件,是指用金、银、铜、铁、锡等金属通过加工,铸造得到的工具,用来固定东西、加工东西、装饰等。为了防止五金件金属氧化(如锈蚀),提高其耐磨性、导电性、反光性、抗腐蚀性(硫酸铜等)及增进美观等,通常会在其表面上镀上一薄层其它金属或合金,称为电镀。Hardware refers to tools made of gold, silver, copper, iron, tin and other metals through processing and casting, which are used to fix things, process things, and decorate. In order to prevent the metal oxidation (such as rust) of hardware, improve its wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance its appearance, a thin layer of other metals or alloys is usually plated on its surface, which is called electroplating.

电镀过程为在含有预镀金属的盐类溶液中,以被镀基体金属为阴极,通过电解作用使镀液中预镀金属的阳离子在基体金属表面沉积出来,形成镀层。The electroplating process is to use the base metal to be plated as the cathode in a salt solution containing the pre-plated metal, and through electrolysis, the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal to form a plating layer.

现有技术中的电镀方式,当采用夹持机构夹住待镀件进行电镀时,由于待镀件被夹持的部分无法与电镀液接触导致电镀不均匀,需要对待镀件调整夹持后进行二次电镀。In the prior art electroplating method, when a clamping mechanism is used to clamp the workpiece for electroplating, the clamped portion of the workpiece cannot contact the electroplating solution, resulting in uneven electroplating. The workpiece needs to be adjusted and clamped before secondary electroplating.

并且电镀工件在投入到电镀液时,有时容易在表面附着一些气泡,在电镀过程中由于气泡部位是不导电的,得不到金属沉积,会形成凹坑导致电镀不均匀,因被电镀工件存在高电流区与低电流区,电流密度不一致,容易造成烧焦、发白、色差等电镀不良现象,从而降低电镀合格率,次品增加,导致生产成本提高。In addition, when the electroplated workpiece is put into the electroplating solution, some bubbles are sometimes easily attached to the surface. During the electroplating process, since the bubble area is not conductive, no metal deposition can be obtained, and pits will be formed, resulting in uneven electroplating. Since the electroplated workpiece has high current areas and low current areas, the current density is inconsistent, which can easily cause electroplating defects such as burning, whitening, and color difference, thereby reducing the electroplating qualification rate, increasing defective products, and increasing production costs.

对于以上导致电镀不均匀的情况,目前缺少综合改善的装置。There is currently a lack of comprehensive improvement devices for the above-mentioned situations that lead to uneven electroplating.

实用新型内容Utility Model Content

本实用新型的目的是设计一种五金件表面电镀装置,使其实现均匀电镀五金件,并且操作简便快捷。The utility model aims to design a hardware surface electroplating device so as to realize uniform electroplating of the hardware and to be simple and quick to operate.

为实现上述目的,本实用新型提供如下技术方案:In order to achieve the above purpose, the utility model provides the following technical solutions:

一种五金件表面电镀装置,包括电镀箱,还包括支撑架,所述支撑架的横板位于所述电镀箱的上方,所述横板上设置有升降机构,所述升降机构下方连接有由电机驱动夹紧和放开的夹持机构,所述夹持机构下方还设置有托板,所述托板与所述夹持机构固定连接,所述电镀箱的内侧壁设置有叶轮,所述夹持机构与所述托板连接有电线。A hardware surface electroplating device includes an electroplating box and a support frame, wherein a horizontal plate of the support frame is located above the electroplating box, a lifting mechanism is arranged on the horizontal plate, a clamping mechanism driven by a motor to clamp and release is connected below the lifting mechanism, a support plate is also arranged below the clamping mechanism, the support plate is fixedly connected to the clamping mechanism, an impeller is arranged on the inner side wall of the electroplating box, and electric wires are connected to the clamping mechanism and the support plate.

进一步,上述的一种五金件表面电镀装置,所述升降机构包括设置在所述横板上表面的驱动装置、位于所述横板下方且与所述驱动装置输出端固接的牵引架、设置在所述牵引架上的两个导向杆,所述导向杆穿透所述横板并与设置在所述横板上的套筒间隙配合。Furthermore, in the above-mentioned hardware surface electroplating device, the lifting mechanism includes a driving device arranged on the upper surface of the horizontal plate, a traction frame located below the horizontal plate and fixedly connected to the output end of the driving device, and two guide rods arranged on the traction frame, and the guide rods penetrate the horizontal plate and are gap-matched with the sleeve arranged on the horizontal plate.

进一步,上述的一种五金件表面电镀装置,所述夹持机构包括与所述牵引架固接的移动块、设置在所述移动块一侧的电机、与所述电机的输出轴固定连接的长杆和与所述长杆的外部螺纹连接的两个夹板,所述移动块中部开设有通槽,所述长杆穿透所述移动块并与所述移动块转动连接,所述夹板位于所述通槽内并与所述通槽滑动连接,所述长杆位于所述通槽的部分设有旋向相反、分别与两块所述夹板螺纹配合的两段螺纹。Furthermore, in the above-mentioned hardware surface electroplating device, the clamping mechanism includes a moving block fixedly connected to the traction frame, a motor arranged on one side of the moving block, a long rod fixedly connected to the output shaft of the motor and two clamping plates connected to the external threads of the long rod, a through groove is opened in the middle of the moving block, the long rod penetrates the moving block and is rotatably connected to the moving block, the clamping plate is located in the through groove and is slidably connected to the through groove, and the part of the long rod located in the through groove is provided with two sections of threads with opposite rotation directions, which respectively cooperate with the threads of the two clamping plates.

进一步,上述的一种五金件表面电镀装置,所述托板上还设置有保护栏。Furthermore, in the above-mentioned hardware surface electroplating device, a protective fence is also provided on the support plate.

进一步,上述的一种五金件表面电镀装置,所述通槽的两个侧壁开设有滑槽,所述夹板上设有凸起,所述夹板通过所述凸起与所述滑槽滑动连接。Furthermore, in the above-mentioned hardware surface electroplating device, two side walls of the through groove are provided with sliding grooves, and the clamping plate is provided with protrusions, and the clamping plate is slidably connected with the sliding grooves through the protrusions.

与现有技术相比,本实用新型的有益效果:Compared with the prior art, the utility model has the following beneficial effects:

本实用新型提供的五金件表面电镀装置,升降机构可控制夹持机构和托板进出电镀液,夹持机构和托板通电,夹持机构可夹紧或放开五金件,夹紧五金件时五金件除被夹持的左右两侧部分其他表面包括底面均被电镀,被放开的五金件落入托板内实现左右两侧原先被夹持部分的电镀,实现了五金件在一次电镀作业中即可完成所有表面的电镀,而无需在一次电镀后变换夹持位置再次电镀,同时叶轮的设置去除了五金件表面的气泡,避免了电镀不均匀及可能出现的烧焦、发白、色差等电镀不良现象,整个电镀工作流程操作简便快捷。The utility model provides a hardware surface electroplating device, and the lifting mechanism can control the clamping mechanism and the support plate to enter and exit the plating solution. The clamping mechanism and the support plate are energized, and the clamping mechanism can clamp or release the hardware. When the hardware is clamped, all surfaces of the hardware except the clamped left and right sides, including the bottom surface, are electroplated. The released hardware falls into the support plate to realize the electroplating of the originally clamped parts on the left and right sides, so that the electroplating of all surfaces of the hardware can be completed in one electroplating operation, and there is no need to change the clamping position after one electroplating and electroplate again. At the same time, the setting of the impeller removes bubbles on the surface of the hardware, avoids uneven electroplating and possible electroplating defects such as scorching, whitening, color difference, etc., and the entire electroplating workflow is simple and quick to operate.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

为了更清楚地说明本实用新型实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

图1为本实用新型的整体结构示意图;FIG1 is a schematic diagram of the overall structure of the utility model;

图2为本实用新型的A处局部放大示意图;FIG2 is a partial enlarged schematic diagram of point A of the present utility model;

图中所标各部件的名称如下:The names of the components marked in the figure are as follows:

1、电镀箱;2、支撑架;3、升降机构;31、驱动装置;32、导向杆;33、套筒;34、牵引架;4、夹持机构;41、电机;42、移动块;43、夹板;44、托板;45、保护栏;5、叶轮。1. Electroplating box; 2. Support frame; 3. Lifting mechanism; 31. Driving device; 32. Guide rod; 33. Sleeve; 34. Traction frame; 4. Clamping mechanism; 41. Motor; 42. Moving block; 43. Clamping plate; 44. Support plate; 45. Guardrail; 5. Impeller.

具体实施方式Detailed ways

下面将结合本实用新型中的附图,对本实用新型中的技术方案进行清楚、完整地描述,显然,所描述的仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The following will be combined with the drawings in the utility model to clearly and completely describe the technical solution in the utility model. Obviously, what is described is only a part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

实施例:请参考图1-2,一种五金件表面电镀装置,包括电镀箱1、支撑架2、升降机构3、夹持机构4、托板44和叶轮5。支撑架2的横板位于电镀箱1上方,升降机构3设置在横板上,升降机构3包括驱动装置31、牵引架34和导向杆32,驱动装置31固定连接在横板上表面上,其输出端向下穿透横板并且末端固定连接牵引架34,牵引架34两端分别固定连接有导向杆32,导向杆32向上穿透横板并与设置在横板上的套筒33间隙配合。升降机构3使得夹持机构4、托板44可上下移动,启动升降机构3的驱动装置31,驱动装置31通过其输出端带动牵引架34升降,进而带动夹持机构4和托板44升降,夹持机构4设置在升降机构3下方,托板44位于夹持机构4的下方,导向杆32防止了升降过程中牵引架34的左右前后转动。Embodiment: Please refer to Figures 1-2, a hardware surface electroplating device includes an electroplating box 1, a support frame 2, a lifting mechanism 3, a clamping mechanism 4, a support plate 44 and an impeller 5. The horizontal plate of the support frame 2 is located above the electroplating box 1, and the lifting mechanism 3 is arranged on the horizontal plate. The lifting mechanism 3 includes a driving device 31, a traction frame 34 and a guide rod 32. The driving device 31 is fixedly connected to the upper surface of the horizontal plate, and its output end penetrates the horizontal plate downward and the end is fixedly connected to the traction frame 34. The two ends of the traction frame 34 are respectively fixedly connected with guide rods 32, and the guide rods 32 penetrate the horizontal plate upward and are in clearance with the sleeve 33 arranged on the horizontal plate. The lifting mechanism 3 enables the clamping mechanism 4 and the support plate 44 to move up and down. The driving device 31 of the lifting mechanism 3 is started, and the driving device 31 drives the traction frame 34 to move up and down through its output end, thereby driving the clamping mechanism 4 and the support plate 44 to move up and down. The clamping mechanism 4 is arranged below the lifting mechanism 3, and the support plate 44 is located below the clamping mechanism 4. The guide rod 32 prevents the traction frame 34 from rotating left and right and forward and backward during the lifting process.

夹持机构4包括移动块42、电机41、夹板43,移动块42与升降机构3的牵引架34固定连接,电机41固定连接在移动块42的一侧,电机41的输出轴固定连接有一长杆,移动块42上表面开设有贯穿上下表面的通槽,长杆穿透整个移动块42并与移动块42通过轴承转动连接,夹板43设有两块并与长杆的外部螺纹连接,夹板43位于通槽内并与通槽滑动连接。在本实施例中,通槽的两个侧壁开设有滑槽,夹板43上还设有凸起,夹板43通过凸起与滑槽滑动连接。凸起的设置防止了夹板43绕长杆的转动。长杆位于通槽的部分设有旋向相反、分别与两块所述夹板43螺纹配合的两段螺纹。当启动电机41时,电机41的输出轴带动长杆绕其轴心旋转,由于夹板43与长杆的外部螺纹连接,夹板43会相应地沿轴移动,由于长杆上分别与两块夹板43螺纹连接的两段螺纹旋向相反,所以长杆转动时两夹板43会靠近或分开,可通过改变电机41输出轴旋转方向来控制夹板43夹紧或放开待镀五金件。夹持机构4连接有电线,具体为两夹板43连接着电线,电线为两夹板43通电。The clamping mechanism 4 includes a moving block 42, a motor 41, and a clamping plate 43. The moving block 42 is fixedly connected to the traction frame 34 of the lifting mechanism 3. The motor 41 is fixedly connected to one side of the moving block 42. The output shaft of the motor 41 is fixedly connected to a long rod. The upper surface of the moving block 42 is provided with a through groove that runs through the upper and lower surfaces. The long rod penetrates the entire moving block 42 and is rotatably connected to the moving block 42 through a bearing. The clamping plate 43 is provided with two pieces and is connected to the external thread of the long rod. The clamping plate 43 is located in the through groove and is slidably connected to the through groove. In this embodiment, the two side walls of the through groove are provided with a slide groove, and the clamping plate 43 is also provided with a protrusion. The clamping plate 43 is slidably connected to the slide groove through the protrusion. The setting of the protrusion prevents the clamping plate 43 from rotating around the long rod. The part of the long rod located in the through groove is provided with two sections of threads with opposite rotation directions, which are respectively matched with the two clamping plates 43 threads. When the motor 41 is started, the output shaft of the motor 41 drives the long rod to rotate around its axis. Since the clamping plate 43 is connected to the external thread of the long rod, the clamping plate 43 will move along the axis accordingly. Since the two sections of threads on the long rod that are respectively connected to the two clamping plates 43 have opposite rotation directions, the two clamping plates 43 will move closer or apart when the long rod rotates. The clamping plate 43 can be controlled to clamp or release the hardware to be plated by changing the rotation direction of the output shaft of the motor 41. The clamping mechanism 4 is connected with wires, specifically, the two clamping plates 43 are connected with wires, and the wires energize the two clamping plates 43.

本实施例中,移动块42下表面固接的连接管连接到托板44下表面,连接管中设有电线,电线为托板44通电。托板44上还设置有保护栏45。托板44的长度大于两夹板43之间的最大距离。当夹板43放开五金件后,五金件会掉落在托板44上,保护栏45使得五金件不会掉出托板44。In this embodiment, the connecting pipe fixed to the lower surface of the moving block 42 is connected to the lower surface of the support plate 44. The connecting pipe is provided with an electric wire, and the electric wire is used to energize the support plate 44. A protective fence 45 is also provided on the support plate 44. The length of the support plate 44 is greater than the maximum distance between the two clamping plates 43. When the clamping plate 43 releases the hardware, the hardware will fall on the support plate 44, and the protective fence 45 prevents the hardware from falling out of the support plate 44.

电镀箱1与支撑架2横板平行的一个内侧壁设置有叶轮5,叶轮5由固接在该侧壁外侧相应位置的动力装置提供运作所需动力。当启动动力装置时,叶轮5会转动,带动电镀液流动,由于叶轮5朝向夹持机构4和托板44,电镀液会形成冲击夹持机构4和托板44的水流,控制叶轮5功率到合适大小,可以去除五金件表面的气泡。An inner side wall of the electroplating box 1 parallel to the horizontal plate of the support frame 2 is provided with an impeller 5, and the impeller 5 is powered by a power device fixed to a corresponding position on the outer side of the side wall. When the power device is started, the impeller 5 rotates, driving the electroplating liquid to flow. Since the impeller 5 faces the clamping mechanism 4 and the support plate 44, the electroplating liquid forms a water flow that impacts the clamping mechanism 4 and the support plate 44. By controlling the power of the impeller 5 to a suitable size, bubbles on the surface of the hardware can be removed.

本实施例的工作原理:本实施例提供了一种五金件表面电镀装置,包括电镀箱1、支撑架2、升降机构3、夹持机构4、托板44和叶轮5。其中,升降机构3控制夹持机构4和托板44的升降运动,夹持机构4可夹紧或放开五金件,具体夹持位置为五金件的左右两侧,五金件被放开时会掉入到下方的托板44中,此时五金件的底面与托板44接触,夹持五金件的两个夹板43和托板44都通电,叶轮5可使电镀液形成朝向夹持机构4和托板44的水流以去除五金件表面的气泡。具体工作流程为:启动夹持机构4的电机41使夹板43夹紧待渡五金件的左右两侧,启动叶轮5的动力装置使叶轮5工作,启动升降机构3的驱动装置31使夹持机构4的夹板43和托板44下降进入电镀液中,给夹板43通电流使五金件除与夹板43接触左右两侧的部分外其他表面包括底面都电镀上金属层,控制夹持机构4的电机41使夹板43放开五金件,五金件掉落到托板44上,五金件的底面与托板44接触而左右两侧暴露在电镀液中,给托板44通电流,在电流作用下电镀液中的金属离子在五金件表面沉积形成镀层原先未电镀的左右两侧被电镀,期间叶轮5一直工作带动电镀液消除五金件表面的气泡。五金件表面都附上镀层后,控制升降机构3使夹持机构4的夹板43和托板44上升离开液面,收取托板44中完成电镀作业的五金件。Working principle of this embodiment: This embodiment provides a hardware surface electroplating device, including an electroplating box 1, a support frame 2, a lifting mechanism 3, a clamping mechanism 4, a support plate 44 and an impeller 5. Among them, the lifting mechanism 3 controls the lifting and lowering movement of the clamping mechanism 4 and the support plate 44, and the clamping mechanism 4 can clamp or release the hardware. The specific clamping position is the left and right sides of the hardware. When the hardware is released, it will fall into the support plate 44 below. At this time, the bottom surface of the hardware is in contact with the support plate 44, and the two clamping plates 43 and the support plate 44 that clamp the hardware are energized. The impeller 5 can make the electroplating liquid form a water flow toward the clamping mechanism 4 and the support plate 44 to remove bubbles on the surface of the hardware. The specific working process is as follows: start the motor 41 of the clamping mechanism 4 so that the clamping plate 43 clamps the left and right sides of the hardware to be transferred, start the power device of the impeller 5 to make the impeller 5 work, start the driving device 31 of the lifting mechanism 3 to make the clamping plate 43 and the supporting plate 44 of the clamping mechanism 4 descend into the electroplating solution, pass current through the clamping plate 43 so that the other surfaces of the hardware except the parts on the left and right sides in contact with the clamping plate 43, including the bottom surface, are electroplated with a metal layer, control the motor 41 of the clamping mechanism 4 so that the clamping plate 43 releases the hardware, and the hardware falls onto the supporting plate 44, the bottom surface of the hardware contacts the supporting plate 44 and the left and right sides are exposed to the electroplating solution, pass current through the supporting plate 44, and under the action of the current, the metal ions in the electroplating solution are deposited on the surface of the hardware to form a coating, and the left and right sides that were not electroplated before are electroplated, and during this period, the impeller 5 keeps working to drive the electroplating solution to eliminate bubbles on the surface of the hardware. After the surfaces of the hardware parts are coated with the plating layer, the lifting mechanism 3 is controlled to make the clamping plate 43 and the supporting plate 44 of the clamping mechanism 4 rise up and leave the liquid surface, and the hardware parts that have completed the electroplating operation in the supporting plate 44 are collected.

需要说明的是,当元件被称为“固定于”另一个元件,它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件,它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“上”、“下”、“左”、“右”、“前”、“后”以及类似的表述只是为了说明的目的。It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "upper", "lower", "left", "right", "front", "rear" and similar expressions used herein are for illustrative purposes only.

Claims (5)

1.一种五金件表面电镀装置,包括电镀箱(1),其特征在于:还包括支撑架(2),所述支撑架(2)的横板位于所述电镀箱(1)的上方,所述横板上设置有升降机构(3),所述升降机构(3)下方连接有由电机(41)驱动夹紧和放开的夹持机构(4),所述夹持机构(4)下方还设置有托板(44),所述托板(44)与所述夹持机构(4)固定连接,所述电镀箱(1)的内侧壁设置有叶轮(5),所述夹持机构(4)与所述托板(44)连接有电线。1. A hardware surface electroplating device, comprising an electroplating box (1), characterized in that it also includes a support frame (2), the horizontal plate of the support frame (2) is located above the electroplating box (1), a lifting mechanism (3) is arranged on the horizontal plate, a clamping mechanism (4) driven by a motor (41) to clamp and release is connected below the lifting mechanism (3), a support plate (44) is also arranged below the clamping mechanism (4), the support plate (44) is fixedly connected to the clamping mechanism (4), an impeller (5) is arranged on the inner side wall of the electroplating box (1), and the clamping mechanism (4) and the support plate (44) are connected by electric wires. 2.根据权利要求1所述的一种五金件表面电镀装置,其特征在于:所述升降机构(3)包括设置在所述横板上表面的驱动装置(31)、位于所述横板下方且与所述驱动装置(31)输出端固接的牵引架(34)、设置在所述牵引架(34)上的两个导向杆(32),所述导向杆(32)穿透所述横板并与设置在所述横板上的套筒(33)间隙配合。2. A hardware surface electroplating device according to claim 1, characterized in that: the lifting mechanism (3) includes a driving device (31) arranged on the upper surface of the horizontal plate, a traction frame (34) located below the horizontal plate and fixedly connected to the output end of the driving device (31), and two guide rods (32) arranged on the traction frame (34), and the guide rods (32) penetrate the horizontal plate and are clearance-matched with the sleeve (33) arranged on the horizontal plate. 3.根据权利要求2所述的一种五金件表面电镀装置,其特征在于:所述夹持机构(4)包括与所述牵引架(34)固接的移动块(42)、设置在所述移动块(42)一侧的电机(41)、与所述电机(41)的输出轴固定连接的长杆和与所述长杆的外部螺纹连接的两个夹板(43),所述移动块(42)中部开设有通槽,所述长杆穿透所述移动块(42)并与所述移动块(42)转动连接,所述夹板(43)位于所述通槽内并与所述通槽滑动连接,所述长杆位于所述通槽的部分设有旋向相反、分别与两块所述夹板(43)螺纹配合的两段螺纹。3. A hardware surface electroplating device according to claim 2, characterized in that: the clamping mechanism (4) includes a moving block (42) fixedly connected to the traction frame (34), a motor (41) arranged on one side of the moving block (42), a long rod fixedly connected to the output shaft of the motor (41) and two clamping plates (43) connected to the external threads of the long rod, a through groove is opened in the middle of the moving block (42), the long rod penetrates the moving block (42) and is rotatably connected to the moving block (42), the clamping plate (43) is located in the through groove and is slidably connected to the through groove, and the part of the long rod located in the through groove is provided with two sections of threads with opposite rotation directions, which are respectively matched with the threads of the two clamping plates (43). 4.根据权利要求1所述的一种五金件表面电镀装置,其特征在于:所述托板(44)上还设置有保护栏(45)。4. A hardware surface electroplating device according to claim 1, characterized in that a protective fence (45) is also provided on the support plate (44). 5.根据权利要求3所述的一种五金件表面电镀装置,其特征在于:所述通槽的两个侧壁开设有滑槽,所述夹板(43)上设有凸起,所述夹板(43)通过所述凸起与所述滑槽滑动连接。5. A hardware surface electroplating device according to claim 3, characterized in that: two side walls of the through groove are provided with sliding grooves, and the clamping plate (43) is provided with a protrusion, and the clamping plate (43) is slidably connected to the sliding groove through the protrusion.
CN202321751858.2U 2023-07-05 2023-07-05 Hardware surface electroplating device Expired - Fee Related CN220827482U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119082831A (en) * 2024-10-11 2024-12-06 恒超源洗净科技(深圳)有限公司 Electroplating equipment and electroplating method based on post-treatment water washing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119082831A (en) * 2024-10-11 2024-12-06 恒超源洗净科技(深圳)有限公司 Electroplating equipment and electroplating method based on post-treatment water washing

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