CN213338522U - Firm tablet computer structure capable of efficiently dissipating heat - Google Patents
Firm tablet computer structure capable of efficiently dissipating heat Download PDFInfo
- Publication number
- CN213338522U CN213338522U CN202022774238.3U CN202022774238U CN213338522U CN 213338522 U CN213338522 U CN 213338522U CN 202022774238 U CN202022774238 U CN 202022774238U CN 213338522 U CN213338522 U CN 213338522U
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- radiator
- rear shell
- heat
- assembly
- shell
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a can high-efficient radiating firm type panel computer structure, including the major structure, the major structure comprises preceding shell subassembly, mainboard subassembly, backshell subassembly triplex. The rear shell assembly mainly comprises a rear shell, a radiator and a fan. The radiator and the fan are fixed on the rear shell, the high-heating chip on the main board assembly is tightly attached to the radiator, the radiator is tightly attached to the rear shell, high-heat-conductivity-coefficient heat-conducting silicone grease is filled between the radiator and the main board assembly and between the radiator and the rear shell, a heat dissipation channel is formed, and then the heat is dissipated to the air through the surface of the machine shell to achieve the heat dissipation effect. The utility model discloses firm type panel computer can normally work under 85 ℃ ambient temperature and can not appear blocking and the phenomenon of halting.
Description
Technical Field
The utility model relates to an electronic product, especially a can high-efficient radiating firm type panel computer.
Background
As a man-machine and data interaction display device, the firm tablet personal computer is widely applied to engineering equipment and agricultural equipment along with the rapid development of the Internet of things.
However, the working environment of engineering equipment and agricultural equipment is in a severe environment, and the phenomena of jamming and crash of the tablet personal computer due to overheating in use are often caused by overhigh environmental temperature, so that the requirements of users cannot be met.
Disclosure of Invention
The utility model discloses the purpose is in order to solve above-mentioned technical problem, provides a high-efficient radiating structure, solves and leads to the dull and stereotyped card pause and the problem of halting to appear because of mainboard owner chip is overheated in the use.
The utility model provides a technical scheme that its technical problem adopted is:
a firm tablet personal computer structure capable of efficiently dissipating heat comprises a main body structure, wherein the main body structure is composed of a front shell assembly, a main board assembly and a rear shell assembly. The rear shell assembly mainly comprises a rear shell, a radiator and a fan.
The radiator and the fan are fixed on the rear shell, the high-heating chip on the main board assembly is tightly attached to the radiator, the radiator is tightly attached to the rear shell, high-heat-conductivity-coefficient heat-conducting silicone grease is filled between the radiator and the main board assembly and between the radiator and the rear shell, a heat dissipation channel is formed, and then the heat is dissipated to the air through the surface of the machine shell to achieve the heat dissipation effect.
The front shell assembly is connected with the rear shell assembly through bolts, and the main board assembly is fixed on the rear shell assembly through bolts.
The radiator is made of copper materials or cold pipes or soaking plates.
The rear shell is made of aluminum magnesium alloy.
The utility model has the advantages that:
the utility model discloses firm type panel computer can normally work under 85 ℃ ambient temperature and can not appear blocking and the phenomenon of halting.
Drawings
Fig. 1 is an overall exploded view of the present invention.
Fig. 2 is an exploded view of the rear housing assembly of the present invention.
Fig. 3 is a view of the inner side structure of the rear housing assembly of the present invention.
Fig. 4 is a structural view of the rear case heat dissipation fin of the present invention.
Description of the main elements in the figures
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown, and which are provided so as to provide a more thorough and complete disclosure of the invention.
The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 4, the present invention includes a front housing assembly 300, a rear housing assembly 100 fixed to the front housing assembly 300, and a main board assembly 200 (shown in fig. 1) fixed to the rear housing assembly 100, wherein the rear housing assembly 100 includes a fan 110, a heat sink 120, and a rear housing 130 (shown in fig. 2).
The motherboard assembly 200 is connected to the heat sink 120, the middle of the motherboard assembly is filled with high-thermal-conductivity thermal-conductive silicone grease, and the motherboard assembly 200 and the heat sink 120 form a heat dissipation channel by filling the thermal-conductive silicone grease to integrate the two components.
The heat sink 120 is made of copper or a cold pipe/vapor chamber, and is specifically selected according to the amount of heat generated by the main chip of the motherboard assembly 200, the heat sink 120 is fixed to the rear housing 130, and the middle of the heat sink is filled with high-thermal-conductivity-coefficient heat-conducting silicone grease, so that the heat sink 120 and the rear housing 130 form a heat-dissipating channel, the fan 110 is fixed in the rear housing 130 (as shown in fig. 3), the rear housing 130 is made of an aluminum-magnesium alloy material, which is a high-efficiency heat-dissipating material, and meanwhile, the surface of the rear housing is provided with heat-dissipating fins 140 to increase the contact area.
It can be understood that the main board assembly 200, the main chip or heat sink 120 and the rear housing 130 are integrated with the outside air to form a high-efficiency heat dissipation channel, and the fan 110 operates to blow air to cool the main chip of the main board assembly 200 during operation of the tablet computer to circulate air in the enclosed space in the tablet computer to promote thermal circulation, so that the main chip of the main board assembly is always at a normal operating temperature.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Various modifications and changes may be made by those skilled in the art to the present invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
Claims (4)
1. The utility model provides a can high-efficient radiating firm type panel computer structure, includes major structure, major structure comprises preceding shell subassembly, mainboard subassembly, backshell subassembly triplex, characterized by: the rear shell assembly mainly comprises a rear shell, a radiator and a fan; the radiator and the fan are fixed on the rear shell, the high-heating chip on the main board assembly is tightly attached to the radiator, the radiator is tightly attached to the rear shell, high-heat-conductivity-coefficient heat-conducting silicone grease is filled between the radiator and the main board assembly and between the radiator and the rear shell, a heat dissipation channel is formed, and then the heat is dissipated to the air through the surface of the machine shell to achieve the heat dissipation effect.
2. The structure of the tablet personal computer capable of dissipating heat efficiently as claimed in claim 1, wherein: the front shell assembly is connected with the rear shell assembly through bolts, and the main board assembly is fixed on the rear shell assembly through bolts.
3. The structure of the tablet personal computer capable of dissipating heat efficiently as claimed in claim 1, wherein: the radiator is made of copper materials or cold pipes or soaking plates.
4. The structure of the tablet personal computer capable of dissipating heat efficiently as claimed in claim 1, wherein: the rear shell is made of aluminum magnesium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022774238.3U CN213338522U (en) | 2020-11-26 | 2020-11-26 | Firm tablet computer structure capable of efficiently dissipating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022774238.3U CN213338522U (en) | 2020-11-26 | 2020-11-26 | Firm tablet computer structure capable of efficiently dissipating heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213338522U true CN213338522U (en) | 2021-06-01 |
Family
ID=76078730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022774238.3U Active CN213338522U (en) | 2020-11-26 | 2020-11-26 | Firm tablet computer structure capable of efficiently dissipating heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213338522U (en) |
-
2020
- 2020-11-26 CN CN202022774238.3U patent/CN213338522U/en active Active
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