CN213333772U - Film light-emitting planar light source LED lighting device with double-channel heat dissipation on front side and back side - Google Patents
Film light-emitting planar light source LED lighting device with double-channel heat dissipation on front side and back side Download PDFInfo
- Publication number
- CN213333772U CN213333772U CN202022598573.2U CN202022598573U CN213333772U CN 213333772 U CN213333772 U CN 213333772U CN 202022598573 U CN202022598573 U CN 202022598573U CN 213333772 U CN213333772 U CN 213333772U
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- Prior art keywords
- led chip
- chip board
- lighting device
- shell
- light source
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 14
- 239000011093 chipboard Substances 0.000 claims abstract description 34
- 239000012528 membrane Substances 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 3
- 239000004922 lacquer Substances 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a radiating membrane of positive and negative binary channels light emitting plane light source LED lighting device, including preceding shell, the fretwork is equipped with the net on the preceding shell, the net both sides symmetry respectively are equipped with membrane light emitting source and LED chip board, one side that the preceding shell was kept away from to LED chip board is equipped with the backshell. The heat emitted by the LED chip board is LED out of the rear shell through the aluminum alloy rear shell which is in contact with the rear surface and is conducted to the natural environment; the heat directly emitted by the LED chip board is conducted to the front glass sheet through the film light-emitting source and conducted to the natural environment through the glass sheet; the LED chip board is attached to the middle latticed part of the grid front shell of the front shell through the light guide glue, and the selected light guide glue has a good heat conduction function, so that heat generated by the chip can be conducted to the front shell through the light guide glue; thereby further realization positive and negative binary channels heat dissipation, the backshell not only need not the lacquer piece, and whole lamp is simpler, frivolous moreover, brings very big facility for production, installation etc..
Description
Technical Field
The utility model relates to a lighting device's technical field specifically is a radiating membrane luminescence plane light source led lighting device of positive and negative binary channels.
Background
LED lighting has grown to this day, with some technologies mature, but some technology bottlenecks are not. As is well known, LED lighting is a photoelectric conversion process, and more than 70% of consumed electric energy is converted into heat energy, so that a large part of the functions of the LED manufacturing process are to be used for heat dissipation. The LED lamp is used for the limitation of the traditional process, the heat dissipation can only be realized from the rear shell, and the way is basically realized only by the rear shell, so that the higher requirement is improved for the manufacture of the rear shell of the lamp, so that the rear shell of the LED lamp with higher power is thicker, and paint sheets with special heat dissipation basically exist, so that the lamp is heavier, and great inconvenience is brought to transportation, assembly, installation, maintenance and the like.
SUMMERY OF THE UTILITY MODEL
The utility model mainly provides a radiating membrane luminescence plane light source led lighting device of positive and negative binary channels for solve the technical problem who provides among the above-mentioned background art.
The utility model provides a technical scheme that above-mentioned technical problem adopted does:
the utility model provides a radiating membrane of positive and negative binary channels light-emitting plane light source LED lighting device, includes the preceding shell, the fretwork is equipped with the net on the preceding shell, the net both sides symmetry respectively are equipped with membrane light emitting source and LED chip board, one side that the preceding shell was kept away from to LED chip board is equipped with the backshell, one side that the preceding shell was kept away from to membrane light emitting source is equipped with the glass piece.
Furthermore, the LED chip board is provided with the isolation glue in a vacuum pressing mode, and even if the LED chip board is strongly sprayed with water or soaked in water for a long time, the light source cannot be affected.
Furthermore, the chip on the LED chip board is fixed on the PCB board by using a flip-chip technology and solder paste, so that heat generated by the chip can be transferred to the PCB board through the solder paste, the heat is transferred to the rear shell through the contact between the PCB board and the rear shell, and the heat is transferred to the natural environment through the contact with air.
Furthermore, one side of the LED chip board close to the rear shell is in contact with the rear shell through heat conduction silicone grease, so that heat conduction is accelerated.
Further, the LED chip board is in contact with the mesh on the front case, so that heat is directly conducted to the front case.
Furthermore, the front shell and the rear shell are made of one of aluminum alloy, stainless steel and titanium alloy, and the function of heat conduction is achieved.
Compared with the prior art, the beneficial effects of the utility model are that:
the heat emitted by the LED chip board is LED out of the rear shell through the aluminum alloy rear shell which is in contact with the rear surface and is conducted to the natural environment;
the heat directly emitted by the LED chip board is conducted to the front glass sheet through the film light-emitting source and conducted to the natural environment through the glass sheet;
the LED chip board is attached to the middle latticed part of the grid front shell of the front shell through the light guide glue, and the selected light guide glue has a good heat conduction function, so that heat generated by the chip can be conducted to the front shell through the light guide glue;
thereby further realization positive and negative binary channels heat dissipation, the backshell not only need not the lacquer piece, and whole lamp is simpler, frivolous moreover, brings very big facility for production, installation etc..
The present invention will be explained in detail with reference to the drawings and specific embodiments.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the overall explosion structure of the present invention;
fig. 3 is a schematic diagram of the front shell of the present invention.
In the figure: 1. a front housing; 1a, a grid; 2. a film light source; 3. an LED chip board; 4. a rear housing; 5. a glass sheet.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully with reference to the accompanying drawings, in which several embodiments of the present invention are shown, but the present invention can be implemented in different forms, and is not limited to the embodiments described in the text, but rather, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may be present, and when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, as the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the use of the term knowledge in the specification of the present invention is for the purpose of describing particular embodiments and is not intended to limit the present invention, and the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Please refer to fig. 1-3, a front-back dual-channel heat-dissipation film light-emitting planar light source LED lighting device includes a front shell 1, a grid 1a is hollowed out on the front shell 1, a film light-emitting source 2 and an LED chip board 3 are symmetrically disposed on two sides of the grid 1a, a rear shell 4 is disposed on one side of the LED chip board 3 away from the front shell 1, and a glass sheet 5 is disposed on one side of the film light-emitting source 2 away from the front shell.
Please refer to fig. 2, the LED chip board 3 is provided with an isolation adhesive by vacuum lamination; in the embodiment, through the mutual cooperation between the isolation glue and the LED chip board 3, the waterproofness of the LED chip board 3 is further improved, and even if strong water spraying or long-time water immersion is carried out, the light source is still not affected.
Please refer to fig. 2-3, wherein the chip on the LED chip board 3 is fixed on the PCB board by solder paste using flip-chip technology, one side of the LED chip board 3 close to the rear case 4 contacts with the rear case 4 through the heat conductive silicone grease, the LED chip board 3 contacts with the grid 1a on the front case 1, and the front case 1 and the rear case 4 are made of one of aluminum alloy, stainless steel and titanium alloy; in this embodiment, through the mutual cooperation between front shell 1 and rear shell 4 and LED chip board 3 to further two ports of realization are simultaneously with the derivation of heat, realize the binary channels heat dissipation.
The utility model discloses a concrete operation as follows:
the heat that LED chip board 3 sent is exported on 4 casings of backshells and is conducted to natural environment through the aluminum alloy backshell 4 with the back contact, the heat that LED chip board 3 directly sent is conducted to preceding glass piece and is conducted to natural environment through the glass piece through membrane luminescent light source 2 in, the LED chip board 3 is laminated with the middle net 1a part of the preceding shell 1 of net 1a through the leaded light glue, because the leaded light glue of chooseing for use has fine heat-conduction function, make the heat that the chip produced can pass through leaded light and glue and pass to preceding shell 1.
The present invention has been described above with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above-mentioned manner, if the method and the technical solution of the present invention are adopted, the present invention can be directly applied to other occasions without substantial improvement, and the present invention is within the protection scope of the present invention.
Claims (6)
1. The utility model provides a radiating membrane of positive and negative binary channels light-emitting plane light source LED lighting device, includes preceding shell (1), its characterized in that, the fretwork is equipped with net (1 a) on preceding shell (1), net (1 a) both sides symmetry respectively are equipped with membrane light emitting source (2) and LED chip board (3), one side that preceding shell (1) was kept away from in LED chip board (3) is equipped with backshell (4), one side that preceding shell was kept away from in membrane light emitting source (2) is equipped with glass piece (5).
2. The front-back dual-channel heat dissipation film light emitting planar light source LED lighting device as claimed in claim 1, wherein an isolation adhesive is pressed on the LED chip board (3) in vacuum.
3. The front-back dual-channel heat dissipation film light-emitting planar light source LED lighting device as claimed in claim 2, wherein the chip on the LED chip board (3) is fixed on the PCB board by solder paste using flip-chip technology.
4. The front-back dual-channel heat dissipation film light-emitting planar light source LED lighting device as claimed in claim 3, wherein the side of the LED chip board (3) close to the rear casing (4) is in contact with the rear casing (4) through a heat-conducting silicone grease.
5. A front-back dual-channel heat dissipation film light-emitting planar light source LED lighting device as claimed in claim 4, wherein the LED chip board (3) is in contact with the grid (1 a) on the front case (1).
6. A front-back dual-channel heat dissipation film-luminous planar light source led lighting device according to claim 5 or 4, wherein the front case (1) and the rear case (4) are made of one of aluminum alloy, stainless steel and titanium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022598573.2U CN213333772U (en) | 2020-11-11 | 2020-11-11 | Film light-emitting planar light source LED lighting device with double-channel heat dissipation on front side and back side |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022598573.2U CN213333772U (en) | 2020-11-11 | 2020-11-11 | Film light-emitting planar light source LED lighting device with double-channel heat dissipation on front side and back side |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213333772U true CN213333772U (en) | 2021-06-01 |
Family
ID=76078522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022598573.2U Expired - Fee Related CN213333772U (en) | 2020-11-11 | 2020-11-11 | Film light-emitting planar light source LED lighting device with double-channel heat dissipation on front side and back side |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213333772U (en) |
-
2020
- 2020-11-11 CN CN202022598573.2U patent/CN213333772U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210601 |
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| CF01 | Termination of patent right due to non-payment of annual fee |