CN213318188U - Laser fusion brazing welding device for three-dimensional weld joint - Google Patents
Laser fusion brazing welding device for three-dimensional weld joint Download PDFInfo
- Publication number
- CN213318188U CN213318188U CN202021655879.0U CN202021655879U CN213318188U CN 213318188 U CN213318188 U CN 213318188U CN 202021655879 U CN202021655879 U CN 202021655879U CN 213318188 U CN213318188 U CN 213318188U
- Authority
- CN
- China
- Prior art keywords
- module
- laser
- welding
- solder
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model provides a laser melting and brazing welding device for three-dimensional welding seams, which comprises a rotary clamping mechanism, a brazing filler metal feeding module, a laser melting and brazing module, an auxiliary wetting module, a back-end laser and a post-processing module; the laser welding and brazing module comprises an airflow spraying module and an atmosphere control module; the gas flow injection module comprises a solder delivery port for feeding solder, a nozzle, a built-in laser and a gas inlet, and the gas inlet, the solder delivery port and the nozzle are communicated; the atmosphere control module comprises an air storage container and an airflow control valve, and an outlet of the air storage container is communicated with an air inlet of the airflow injection module through the airflow control valve; the solder feeding module faces the solder delivery opening; the nozzle, the rear laser and the post-processing module of the airflow jet module face the welding platform. The technical scheme of the utility model can realize highly integrated, degree of automation is high, can improve laser welding efficiency when guaranteeing welding quality.
Description
Technical Field
The utility model belongs to the technical field of laser welding, especially, relate to a laser fusion welding device of three-dimensional welding seam.
Background
With the rapid development of the electronic industry, the size of the electronic system is smaller and smaller, and the integration level is higher and higher, so that devices and modules made of different materials and types need to be integrated with each other to manufacture high-performance and multifunctional integrated electronic equipment. Due to the great difference of the dissimilar alloys in chemical composition, organization structure, physical and chemical properties and the like, the prior art is difficult to be widely suitable for the packaging of a plurality of electronic devices. On one hand, with the continuous reduction of the size of the connecting joint, the deposition difficulty of the brazing filler metal interconnection structure on the surface of the three-dimensional complex structure is increased day by day. On the other hand, the optoelectronic module with low temperature tolerance is easy to lose effectiveness and affect reliability at higher process temperature, and the traditional packaging processes such as reflow soldering, hot press soldering and the like generally need to pre-coat a solder layer and integrally heat a welding structure, so that the requirements of packaging heterogeneous materials and interconnecting heat-sensitive components cannot be met. Therefore, a local packaging process that combines selective solder coating and concentrated heat input must be developed to meet the connection and manufacturing requirements of the new generation of electronic devices.
The laser welding process is an efficient precise welding method using a laser beam with high energy density as a heat source. The laser welding has the characteristics of high power density and small heat affected zone, is suitable for packaging heat sensitive components, and is expected to realize local connection between dissimilar alloy materials. However, with the change of materials to be connected and the change of a soldering process, the wettability of the solder on the joint surface can be changed remarkably, so that the interconnection quality of the soldered joint cannot be ensured by directly soldering by using a laser welding process. Particularly, on high-thermal-conductivity alloy materials such as aluminum, nickel, kovar alloy and the like, due to the fact that the liquid brazing filler metal is rapidly cooled, sufficient wetting spreading and an interface metallurgical reaction process cannot be carried out, and defects such as air holes, insufficient solder, interface cracks and the like are easily formed. Therefore, there is a need to optimize existing laser welding processes to improve the quality of the weld.
SUMMERY OF THE UTILITY MODEL
To above technical problem, the utility model discloses a laser of three-dimensional welding seam melts welding set that brazes has solved the encapsulation difficult problem between the complicated structure device of receiving a little.
To this end, the utility model discloses a technical scheme do:
a laser melting brazing welding device for three-dimensional welding seams comprises a rotary clamping mechanism, a brazing filler metal feeding module, a laser melting brazing module, an auxiliary wetting module, a rear laser and a post-processing module, wherein the rotary clamping mechanism comprises a rotary movement driving assembly and a clamping component; the laser melting and brazing module comprises an airflow jetting module and an atmosphere control module, and a laser is arranged in a nozzle of the airflow jetting module; the post-processing module is a continuous laser or a focusing infrared heater;
in the rotary clamping structure, a rotary movement driving assembly is connected with a clamping component, and the clamping component is connected with a laser fusion brazing module;
the gas flow injection module comprises a solder delivery port for feeding solder, a nozzle, a built-in laser and a gas inlet, and the gas inlet, the solder delivery port and the nozzle are communicated;
the atmosphere control module comprises an air storage container and an airflow control valve, and an outlet of the air storage container is communicated with an air inlet of the airflow injection module through the airflow control valve;
the solder feeding module faces the solder delivery opening;
the nozzle, the rear laser and the post-processing module of the airflow jet module face to the joint of the devices to be connected; the auxiliary wetting module is positioned on the welding platform or on one side of the welding platform.
When the device is used, a device to be connected is placed on the welding platform, and the rotary movement driving assembly drives the clamping component, so that the laser welding and brazing module is driven to move, position and rotate in the x direction, the y direction and the z direction in the welding process;
the solder feeding module feeds the low-temperature solder to a solder delivery port; the atmosphere control module introduces inert gas into the airflow injection module through the air inlet, then a built-in laser is used for in-situ melting of low-temperature brazing filler metal, the melted brazing filler metal is injected to a joint of a device to be connected by means of airflow of the airflow injection module, and the auxiliary wetting module heats the joint of the device to be connected and promotes wetting;
after the brazing filler metal is sprayed, the subsequent laser applies a second laser to heat the brazing filler metal again;
and the post-processing module is used for carrying out heat preservation post-processing on the welding seam to finish metallurgical connection.
By adopting the technical scheme, the device can realize high integration, and the laser welding efficiency can be improved while the welding quality is ensured.
The high-pressure airflow through the inert gas sprays the melted brazing filler metal to the position of a welding seam, so that higher brazing filler metal conveying efficiency can be guaranteed, and equipment can be simplified relative to a mechanical (plunger, clamping structure and the like) brazing filler metal conveying device, so that the equipment integration level is improved by arranging a laser inside a nozzle, and meanwhile, the liquid brazing filler metal can be matched with a welding area in a self-adaptive mode. Through the auxiliary wetting module, the energy state of the liquid solder can be improved, and the spreading and flowing of the liquid solder are promoted. And applying a second laser by the subsequent laser, remelting the brazing filler metal again can promote the brazing filler metal to be further wetted and spread, strengthen the interface metallurgical reaction and improve the surface appearance of the welding seam.
As a further improvement of the utility model, the rotary motion drive assembly is connected with the programmable controller electricity, controls through the programmable controller to control the position of laser melting module of brazing.
As a further improvement, the rotary clamping mechanism is a bionic robot or a multi-axis linkage manipulator which is used for grabbing and carrying articles according to a fixed procedure.
As a further improvement, the auxiliary wetting module is a heating module, an ultrasonic vibration module, an electrifying module or a reducing atmosphere applying module.
As a further improvement of the utility model, the laser emitting direction of the built-in laser is towards the solder.
As a further improvement of the present invention, the back laser is a programmable pulse laser.
As a further improvement of the present invention, the laser fusion brazing welding device for three-dimensional welding seam comprises a control module and a three-dimensional vision measurement auxiliary module, wherein the control module is electrically connected with the three-dimensional vision measurement auxiliary module, a programmable controller, a brazing filler metal feeding module, an air flow injection module, a nozzle built-in laser, an air flow control valve, an auxiliary wetting module, a back-end laser and a post-processing module; the auxiliary wetting module is integrated on a welding platform for placing a device to be connected;
the vision measurement auxiliary system measures the position of the device to be connected and feeds the position back to the control module, and the control module controls the programmable controller, the brazing filler metal feeding module, the airflow injection module, the laser with the built-in nozzle, the airflow control valve, the auxiliary wetting module, the subsequent laser and the post-processing module to work according to the position of the device to be connected fed back by the vision measurement auxiliary system.
In the technical scheme, the vision measurement auxiliary system adopts the image recognition technology in the prior art, and feeds back the position of the joint to the control module, so that the airflow jet module, the rear laser and the post-processing module face the joint. In addition, the programmable controller mainly controls the direction of the airflow injection module according to the position fed back by the vision measurement auxiliary system so as to enable the airflow injection module to be aligned with the connection position. The brazing filler metal feeding module, the airflow jetting module, the laser with the built-in nozzle, the airflow control valve, the auxiliary wetting module, the subsequent laser and the post-processing module are all modules in the prior art. The solder feeding module can be a ball feeding module, namely a conveying mechanism, and can also be realized in a spraying mode.
The high-precision three-dimensional vision auxiliary system further comprises a high-resolution and high-frame-rate camera assembly which is matched with a rotary clamping mechanism and a brazing filler metal feeding module controlled by a programmable controller, so that the brazing filler metal can be delivered under the precision of 10 mu m, and higher welding efficiency and brazing filler metal utilization rate can be ensured.
The laser melting brazing welding device for the three-dimensional welding seam adopts the following steps to weld the devices to be connected:
step S1, processing a groove structure at the joint of the device to be connected, and then performing surface treatment; selecting low-temperature brazing filler metal with proper size;
step S2, melting the low-temperature brazing filler metal in situ by adopting laser brazing filler metal, spraying the melted brazing filler metal to a joint by means of high-pressure airflow, and completing primary connection by means of an auxiliary wetting and filling method;
and step S3, after the solder is sprayed, applying a second laser to heat the solder again for secondary remelting, and after a period of time, carrying out heat preservation post-treatment on the welding seam to complete metallurgical connection.
Furthermore, the included angle between the groove structure at the joint and the normal direction is 30-75 degrees, and the depth of the groove is 0.1-0.5 mm. By adopting the technical scheme, the proper interface gradient and depth can effectively deliver the brazing filler metal, and the sufficient filling and metallurgical connection of the brazing filler metal in the packaging process are ensured.
Further, the surface treatment in step S1 includes: firstly removing surface pollutants or an oxide layer; then adopting plasma activation, chemical plating, electroplating, surface spraying or vapor deposition to prepare and form a single-layer or multi-element transition metallization layer of Cr/Ni/Au, Ti/Ni, Ni/Sn, Ag and Cu on the surface. Further, mechanical grinding, ultrasonic pickling and the like are adopted for surface treatment to remove surface pollutants or oxide layers.
Further, in step S2, the low-temperature solder is micro-nano composite solder powder or solder balls, wherein the particle size of the solder powder is 0.1-100 μm, and the diameter of the solder balls is 100 μm-1 mm.
Further, In step S2, the material of the low temperature solder includes Sn-Bi, Sn-Ag-Cu or Sn-In low temperature composite solder alloy and flux.
Compared with the prior art, the beneficial effects of the utility model are that:
by adopting the technical scheme of the utility model, the laser ball/powder spraying process is used, the brazing filler metal layer is not required to be deposited, the operation steps are simpler, and the rapid brazing filler metal deposition and the in-situ connection of the connection interface with a complex structure can be realized in a one-step manner; meanwhile, the heat affected zone is small in the packaging process, the structural deformation and the thermal damage of the electronic device caused by overhigh temperature are avoided, the energy loss is reduced, and the method is particularly suitable for the welding packaging of the heat-sensitive device or the low-temperature electronic device.
The device can realize high integration and high automation degree, and can improve the laser welding efficiency while ensuring the welding quality.
Drawings
Fig. 1 is a schematic structural diagram of a laser fusion brazing welding device for three-dimensional welding seams of the present invention.
Fig. 2 is a schematic structural diagram of a laser fusion brazing module according to an embodiment of the present invention.
Fig. 3 is a schematic view of spreading welding of the low-temperature solder in an embodiment of the present invention from the solder ball by three times of heating.
Fig. 4 is a welding seam solder spreading welding schematic diagram of the embodiment of the invention.
The reference numerals include: 1-three-dimensional vision measurement auxiliary module, 2-rotary clamping mechanism, 3-laser melting and brazing module, 4-auxiliary wetting module, 5-atmosphere control module, 6-back laser, 7-post processing module, 8-programmable pulse controller, 9-solder feeding module, 10-solder ball, 11-nozzle, 12-laser, 13-melted solder ball, 14-back laser, 15-second laser, 16-defocused laser beam, 17-laser, 18-airflow spraying module, 19-solder delivery port and 20-air inlet; 21-air container, 22-air flow control valve.
Detailed Description
Preferred embodiments of the present invention are described in further detail below.
Example 1
As shown in fig. 1-2, a laser fusion brazing welding device for three-dimensional welding seams comprises a rotary clamping mechanism 2 for clamping a device to be connected, a brazing filler metal feeding module 9, a laser fusion brazing module 3, an auxiliary wetting module 4, a rear laser 6 and a post-processing module 7.
The rotary clamping mechanism 2 comprises a rotary movement driving assembly and a clamping component, the rotary movement driving assembly is connected with the clamping component, and the clamping component is connected with the laser fusion brazing module 3.
The laser melting and brazing module 3 comprises an airflow injection module 18 and an atmosphere control module 5, wherein the airflow injection module 18 comprises a solder delivery port 19 for feeding solder, a nozzle 11, a built-in laser 17 and an air inlet 20, and the air inlet 20, the solder delivery port 19 and the nozzle 11 are communicated; the atmosphere control module 5 comprises an air storage container 21 and an air flow control valve 22, wherein the outlet of the air storage container 21 is communicated with the air inlet 20 of the air flow injection module 18 through the air flow control valve 22; the solder feed module 9 faces the solder delivery opening 19.
The post-processing module 7 is a low-power continuous laser or a focusing infrared heater. The auxiliary wetting module 4 is a heating module, an ultrasonic vibration module, an electrifying module or a reducing atmosphere applying module, and is integrated on a welding platform for placing a device to be connected.
The nozzle 11, the back laser 6 and the post-processing module 7 of the laser welding and brazing module 3 face the joint of the devices to be connected on the welding platform.
In this embodiment, the rotary clamping mechanism 2 is a multi-axis linkage manipulator; the brazing filler metal feeding module 9 is a ball feeding mechanism; the auxiliary wetting module 4 is a heating mechanism; the post-processing module 7 adopts a low-power continuous laser.
The laser welding and brazing welding device can be preheated and connected under special atmospheres such as nitrogen and hydrogen, and can finish the movement, positioning and rotation of the structure to be welded in the three directions of x, y and z by controlling the rotary clamping mechanism 2.
As shown in fig. 1 to 3, when in use, a device to be connected is placed on a welding platform, and the rotary clamping mechanism 2 drives the laser welding and brazing module 3 to move, position and rotate in the x, y and z directions in the welding process; the solder feeding module 9 feeds the solder balls 10 to the solder delivery opening 19; the atmosphere control module 5 introduces inert gas into the gas flow injection module 18 through the gas inlet 20, controls the size of the gas flow through the gas flow control valve 22, then the built-in laser 17 emits laser 12 to the solder ball 10 to perform in-situ melting of the solder ball 10, and injects the melted solder ball 13 to the joint of the device to be connected by means of the gas flow injection module 18, and the auxiliary wetting module 4 heats the joint of the device to be connected to promote wetting;
after the solder is sprayed, the back laser 14 applies a second laser 15 to heat the solder again;
and the post-processing module uses the defocused laser beam 16 to perform heat preservation post-processing on the welding seam to finish the metallurgical connection.
In the whole solder spraying process, the solder feeding module 9 continuously feeds balls, and the rotary clamping mechanism 2 drives the laser melting and brazing module 3 to move, position and rotate in the x direction, the y direction and the z direction ceaselessly in the welding process. In the whole process, the atmosphere control module 5 can apply special atmospheres such as nitrogen, hydrogen and the like to the joint of the device to be connected and the laser welding and brazing module 3, so that the device to be connected is preheated and connected by the low-temperature brazing filler metal in the atmosphere of nitrogen or hydrogen.
By adopting the technical scheme, compared with the integral heating of the traditional reflow soldering, the heat input is concentrated and is more suitable for heat-sensitive components, compared with the solder spreading and metallurgical connection process of one-time laser welding, the solder spreading and metallurgical connection process is more sufficient, and the connection strength of a welding joint is higher.
Example 2
As shown in fig. 1, in addition to embodiment 1, the laser fusion brazing welding apparatus for a three-dimensional weld includes a control module and a three-dimensional vision measurement auxiliary module 1, wherein the rotary clamping mechanism 2 is electrically connected to a programmable controller, and the programmable controller controls the action of the rotary clamping mechanism 2, thereby controlling the laser fusion brazing module.
The control module is electrically connected with the three-dimensional vision measurement auxiliary module 1, the programmable controller, the brazing filler metal feeding module 9, the airflow spraying module 18, the laser 17 arranged in the nozzle 11, the atmosphere control module 5, the auxiliary wetting module 4, the subsequent laser 6 and the post-processing module 7; the back laser 6 is connected with a programmable pulse controller 8 and is a programmable pulse laser.
The high-precision three-dimensional vision measurement auxiliary module 1 comprises a high-resolution high-frame-rate camera assembly, and is matched with the rotary clamping mechanism 2 and the brazing filler metal feeding module 9 controlled by the programmable controller, so that the brazing filler metal can be delivered under the precision of 10 micrometers, and higher welding efficiency and brazing filler metal utilization rate can be ensured.
The three-dimensional vision measurement auxiliary module 1, the programmable controller, the brazing filler metal feeding module 9, the laser melting and brazing module 3, the atmosphere control module 5, the auxiliary wetting module 4 (heating mechanism), the subsequent laser 6 and the post-processing module 7 (low-power continuous laser) can all adopt the devices in the prior art.
When the device is in work, the vision measurement auxiliary system measures the position of the device to be connected and feeds the position back to the control module, and the control module controls the programmable controller, the brazing filler metal feeding module 9, the airflow spraying module 18, the laser 17 arranged in the nozzle 11, the atmosphere control module 5, the auxiliary wetting module 4, the subsequent laser 6 and the post-processing module 7 to work according to the position of the device to be connected fed back by the vision measurement auxiliary system.
By adopting the technical scheme, besides the advantages of the embodiment 1, the device has more integrated functions, can accurately control and detect the delivery of the brazing filler metal, the appearance of a welding joint, the working parameters of a laser and the like, and greatly improves the laser welding efficiency.
The following is an example of welding using the low-temperature laser fusion-brazing packaging device for the three-dimensional weld seam.
Example 3
As shown in fig. 3 and 4, the welding of the aluminum alloy housing and the kovar alloy sealing cover in the photoelectric signal processor comprises the following steps:
(1) pickling the to-be-welded surfaces of the aluminum alloy and the kovar alloy to be welded to remove pollutants, polishing by using a polishing machine to remove oxides, mechanically polishing a joint until an included angle between a groove structure and a normal direction is 55 degrees, wherein the depth of the groove is 0.3 mm, plating a Ti layer with the thickness of 40 nm on the surface of the aluminum alloy, plating a Ni layer with the thickness of 100 nm on the surface of the kovar alloy, and then plating a Cr layer with the thickness of 200 nm;
(2) preparing Sn52In eutectic solder balls 10 with the diameter of 500 mu m, and conveying the solder balls 10 to a nozzle 11 through a solder feeding module 9 (a ball conveying device);
(3) emitting laser 12 to heat and melt the solder balls through a laser 17 arranged in the nozzle, and spraying the melted solder balls 13 to the welding seams of the aluminum alloy and the kovar alloy by means of high-pressure airflow;
(4) immediately using a subsequent laser 14 (100W) to generate a second laser 15 (the spot diameter is 30 mu m) to heat the sprayed solder ball, heating the sprayed solder ball to 150 ℃, and promoting the sprayed solder ball to melt and fill a weld joint to form a solder joint;
(5) and (3) performing low-temperature heating or heat preservation on the welding joint by using a defocused laser beam 16, wherein the working interval time of the laser beam is 0.1 s, the spot size is 10 mu m, and the heating temperature is 100 ℃, so that the metallurgical reaction and packaging are completed.
Adopt dual laser beam to add thermal welding to the brazing filler metal in this example, wet the metallurgical reaction that spreads and between solder and the base metal more abundant for laser welding of tradition, the welded joint quality is higher, and in addition, laser welding is more concentrated for traditional monolithic heating's reflow soldering technology heat input, has avoided the heat damage to photoelectric components and parts.
Example 4
In an LED device, a Cu bonding pad and a SiC ceramic plate are welded by means of bottom preheating:
(1) pickling a Cu bonding pad to be welded and the surface of a SiC ceramic plate to remove pollutants, polishing by a polishing machine to remove oxides on the surface of the bonding pad, plating Au/Ni on the Cu bonding pad, wherein the thickness of Au is 100 nm, the thickness of Ni is 200 nm, plating a Ti layer with the thickness of 30 nm on the surface of the SiC ceramic plate, mechanically polishing the joint until the included angle between the groove structure and the normal direction is 45 degrees, and the depth of the groove is 0.1 mm;
(2) preheating the to-be-welded parts of the Cu bonding pad and the SiC ceramic plate to 150 ℃, preparing Sn3.0Ag0.5Cu eutectic solder balls with the diameter of 760 mu m, and conveying the solder balls to a nozzle through a ball conveying device;
(3) a laser is arranged in the nozzle, laser is emitted and heated until the surface of the solder ball is melted, and the melted solder ball is sprayed to the welding seam of the Cu bonding pad and the SiC ceramic by means of high-pressure airflow;
(4) immediately using a laser (70W) to generate second laser (the spot diameter is 40 mu m) to heat the sprayed and welded ball to 230 ℃, and promoting the sprayed and welded ball to melt and fill a welding line under the action of surface tension to form a solder joint;
(5) and (3) carrying out low-temperature heating or heat preservation on the welded joint by using a defocused laser beam, wherein the working interval time of the laser beam is 0.2 s, the spot size is 15 mu m, and the heating temperature is 180 mu m.
In addition to the advantages of embodiment 3, the present embodiment has the advantages that the plating layer on the surface of the Cu pad and the SiC ceramic plate helps to enhance the wetting and metallurgical effects of the solder and the base material, and the local preheating of the Cu pad and the SiC ceramic plate helps to wet the solder and accelerate the inter-atomic diffusion between the solder and the base material, thereby improving the joint performance.
Example 5
In a high-power module, welding of an aluminum heat sink and a Cu bonding pad:
(1) pickling the surface of a Cu bonding pad to be welded and an aluminum radiator to remove pollutants, polishing by a polishing machine to remove surface oxides, wherein the included angle between the mechanical polishing joint position and the groove structure and the normal direction is 35 degrees, and the groove depth is 0.2 mm;
(2) introducing N into laser brazing equipment2 Maintaining the gas atmosphere, preparing Sn58Bi solder balls with the diameter of about 640 mu m, and conveying the solder balls to a nozzle through a ball conveying device;
(3) a laser is arranged in the nozzle, laser is emitted and heated until the surface of the solder ball is melted, and the melted solder ball is sprayed to the welding seam of the Cu bonding pad and the aluminum radiator by means of high-pressure airflow;
(4) the second laser (spot diameter 50) was generated immediately using a laser (80W)
) Heating the sprayed solder ball to above 150 deg.C, promoting it to melt and fill the weld joint under the action of surface tensionForming a solder joint;
(5) and (3) carrying out low-temperature heating or heat preservation on the welding joint by using focused infrared rays, wherein the working interval time of the focused infrared rays is 0.2 s, the spot size is 40 mu m, and the heating temperature is 120 ℃.
This example has the advantages of example 3, and the laser welding process is widely applicable to a variety of welding applications, N2 The oxidation of the Cu bonding pad can be avoided under the protective atmosphere, and meanwhile, the energy state of the liquid solder is improved, and the spreading and flowing of the liquid solder are promoted.
Comparative example 1
The method comprises the steps of preparing powder from Sb9Zn eutectic solder, mixing various solvents, activators, scaling powders and the like to prepare soldering paste, firstly coating the soldering paste on a bonding pad of the SMT circuit board, then accurately installing surface assembly components on fixed positions of the SMT circuit board, melting the soldering paste by reflow soldering to firmly weld the surface assembly components and the PCB board together, and finally cleaning to remove welding residues.
In addition, when the PCB and all components are integrally heated, the PCB is easy to deform, stress concentration may exist at welding spot positions after cooling, and heat damage may be caused to heat sensitive components. To sum up, the present invention has significant performance advantages and reliability over this embodiment and meets the requirements of current optoelectronic device development for interconnect technology.
Comparative example 2
A Sn3.0Ag0.5Cu eutectic solder ball with the diameter of 560 mu m is planted on the chip and reversely buckled on a Cu bonding pad, a laser (with the power of 100W) is adopted to emit a laser beam (with the spot diameter of 25 mu m) to act on the position of the solder ball until the solder ball is melted, a spreading welding seam is wetted, and a welding joint is formed after the solder is completely melted and cooled, so that the interconnection between the chip and the PCB is realized.
Under the process conditions of the embodiment, when most of laser beams are converged on the brazing filler metal, the brazing filler metal is melted too fast, the temperature of the base metal is low, so that the brazing filler metal cannot well wet the base metal, the filling effect is influenced, the surface of a formed brazing seam is uneven, and a virtual welding spot can be formed; meanwhile, the rapid cooling of the brazing filler metal can cause the problems of insufficient wetting and spreading, stress concentration and the like in reliability. To sum up, the present invention has significant performance advantages over this embodiment.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (7)
1. The laser melting brazing welding device for the three-dimensional welding seam is characterized in that: the device comprises a rotary clamping mechanism, a brazing filler metal feeding module, a laser melting and brazing module, an auxiliary wetting module, a rear laser and a post-processing module, wherein the rotary clamping mechanism comprises a rotary movement driving assembly and a clamping component; the laser welding and brazing module comprises an airflow spraying module and an atmosphere control module; the post-processing module is a continuous laser or a focusing infrared heater;
in the rotary clamping structure, a rotary movement driving assembly is connected with a clamping component, and the clamping component is connected with a laser fusion brazing module;
the gas flow injection module comprises a solder delivery port for feeding solder, a nozzle, a built-in laser and a gas inlet, and the gas inlet, the solder delivery port and the nozzle are communicated;
the atmosphere control module comprises an air storage container and an airflow control valve, and an outlet of the air storage container is communicated with an air inlet of the airflow injection module through the airflow control valve;
the solder feeding module faces the solder delivery opening;
the nozzle, the rear laser and the post-processing module of the airflow jet module face to the joint of a device to be connected on the welding platform; the auxiliary wetting module is positioned on the welding platform or on one side of the welding platform.
2. The laser fusion brazing welding device for the three-dimensional weld according to claim 1, characterized in that: the rotary motion driving component is electrically connected with the programmable controller.
3. The laser fusion brazing welding device for the three-dimensional weld according to claim 1, characterized in that: the rotary clamping mechanism is a bionic robot for grabbing and carrying objects according to a fixed program.
4. The laser fusion brazing welding device for the three-dimensional weld according to claim 1, characterized in that: the auxiliary wetting module is a heating module, an ultrasonic vibration module, an electrifying module or a reducing atmosphere applying module.
5. The laser fusion brazing welding device for the three-dimensional weld according to claim 1, characterized in that: the laser emission direction of the built-in laser is towards the solder.
6. The laser fusion brazing welding device for the three-dimensional weld according to claim 1, characterized in that: the back laser is a programmable pulse laser.
7. The laser fusion brazing welding device for the three-dimensional weld according to any one of claims 2 to 6, characterized in that: the device comprises a control module and a three-dimensional vision measurement auxiliary module, wherein the control module is electrically connected with the three-dimensional vision measurement auxiliary module, a programmable controller, a brazing filler metal feeding module, an airflow jetting module, a nozzle built-in laser, an airflow control valve, an auxiliary wetting module, a subsequent laser and a post-processing module; the auxiliary wetting module is integrated on a welding platform for placing a device to be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021655879.0U CN213318188U (en) | 2020-08-11 | 2020-08-11 | Laser fusion brazing welding device for three-dimensional weld joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021655879.0U CN213318188U (en) | 2020-08-11 | 2020-08-11 | Laser fusion brazing welding device for three-dimensional weld joint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213318188U true CN213318188U (en) | 2021-06-01 |
Family
ID=76095731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021655879.0U Active CN213318188U (en) | 2020-08-11 | 2020-08-11 | Laser fusion brazing welding device for three-dimensional weld joint |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213318188U (en) |
-
2020
- 2020-08-11 CN CN202021655879.0U patent/CN213318188U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112008178B (en) | Laser fusion brazing packaging method and device for three-dimensional weld joint | |
| US5193738A (en) | Methods and apparatus for soldering without using flux | |
| JP7050002B2 (en) | Visible laser welding of electronic packaging, automotive electrical equipment, batteries, and other components | |
| EP0406351B1 (en) | Ultrasonic laser soldering | |
| US8012866B2 (en) | Method of bonding semiconductor devices utilizing solder balls | |
| US6513701B2 (en) | Method of making electrically conductive contacts on substrates | |
| US7648901B2 (en) | Manufacturing process and apparatus therefor utilizing reducing gas | |
| CN213318188U (en) | Laser fusion brazing welding device for three-dimensional weld joint | |
| CN103165480A (en) | Preparation method for flip chip salient point | |
| JPH11320154A (en) | Laser welding method for pin joining on printed circuit board | |
| CN103151430B (en) | Nano metal particles realize the preparation method of the low-temperature metal interface connection of LED | |
| CN105655260B (en) | A kind of micro- interconnected salient points preparation method and device | |
| CN104112707B (en) | A kind of solid ultrasonic bonding method based on nickel and copper micropin cone foreign structure | |
| CN106735663B (en) | The preparation method and structure of compound thin space microbonding point between a kind of all-metal | |
| JP7411829B2 (en) | High resolution soldering | |
| JP2006167735A (en) | Manufacturing method for equipment and structural material or the like | |
| Zakel et al. | High speed laser solder jetting technology for optoelectronics and MEMS packaging | |
| JP5853135B2 (en) | Electrode joining method and circuit member joining line | |
| CN108615689A (en) | A kind of preparation method of full Cu3Sn compounds connector for power device package | |
| US20040245228A1 (en) | Attach aligned optics and microelectronics with laser soldering methods | |
| Spletter et al. | A laser based system for tape automated bonding to integrated circuits | |
| KR100808106B1 (en) | Formation method of solder bumps using thin film heater fabricated on IC chip or IC chip wafer and the facility to make the same | |
| JPH088284A (en) | Wire bonding structure and its reinforcement method | |
| CN114434039A (en) | Welding flux for low-temperature interconnection of copper and aluminum dissimilar materials and welding method | |
| CN110349871A (en) | A kind of Cu-Cu direct interconnection method in electronic package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |