CN213275875U - Temperature control flow channel for chip test - Google Patents
Temperature control flow channel for chip test Download PDFInfo
- Publication number
- CN213275875U CN213275875U CN202022352469.5U CN202022352469U CN213275875U CN 213275875 U CN213275875 U CN 213275875U CN 202022352469 U CN202022352469 U CN 202022352469U CN 213275875 U CN213275875 U CN 213275875U
- Authority
- CN
- China
- Prior art keywords
- runner
- bottom plate
- flow channel
- temperature
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
Abstract
The utility model discloses a chip test is with accuse temperature runner, include: the runner bottom plate, the internally mounted of runner bottom plate has first runner and second runner, first runner and second runner are turbine form, install the through-hole on the runner bottom plate at first runner and second runner center, the welding has the runner apron on the runner bottom plate of first runner and second runner upside, the utility model relates to a chip test is with accuse temperature runner's advantage is: compact structure, the structure is light, and it is convenient to install, and the installation screw hole on the runner bottom plate is used for conveniently connecting other parts, and the locating hole of runner bottom plate both sides makes things convenient for the location installation of chip, when using, carries out the injection of the liquid of the different temperatures of runner and notes out through the horn mouth joint, makes the runner be in three temperature (low temperature, normal atmospheric temperature, high temperature) states fast, and chip efficiency of software testing is high, excellent in use effect.
Description
Technical Field
The utility model relates to an electronic chip tests technical field, especially relates to a chip test is with accuse temperature runner.
Background
With the continuous development of electronic chip technology, the testing technology of packaged chips also becomes an important technical key for ensuring the production quality and accelerating the production flow in the electronic industry. Generally, the packaged electronic chip needs to be electrically tested at a predetermined high temperature to know the stability of the packaged chip. Before the test of encapsulation chip, need test under the condition of different temperatures to the chip, with performance and the inefficacy problem of test chip under different temperatures, at present, need use temperature control mechanism when testing the chip under different temperatures, normally adjust the temperature through the control of heating rod, but the efficiency that the heating rod adjusted the temperature is low, can't satisfy the chip test under the three temperature (low temperature, normal atmospheric temperature and high temperature) condition fast, the result of use is poor, consequently design a structure light, it is efficient to control the temperature, a chip test that excellent in use effect is with accuse temperature runner.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the temperature control flow channel for the chip test is light in structure, good in temperature control effect and good in using effect.
In order to solve the technical problem, the utility model discloses a technical scheme is: a temperature control flow channel for chip testing comprises: a runner bottom plate, a first runner and a second runner are arranged in the runner bottom plate, the first runner and the second runner are in a turbine shape, a through hole is arranged on the runner bottom plate at the center of the first runner and the second runner, a runner cover plate is welded on the runner bottom plate at the upper side of the first runner and the second runner, the front side of the runner cover plate is provided with a first adapter nut mounting hole and a second adapter nut mounting hole, the first adapter nut mounting hole and the second adapter nut mounting hole are respectively provided with a first adapter nut and a second adapter nut, the first switching nut and the second switching nut are respectively provided with a first bell-mouth joint and a second bell-mouth joint, the first bell mouth joint is communicated with the first flow channel, the second bell mouth joint is communicated with the second flow channel, and the flow channel bottom plates on the two sides of the flow channel cover plate are respectively provided with a positioning hole and an installation screw hole.
Furthermore, the runner bottom plate, the runner cover plate, the first adapter nut, the second adapter nut, the first bell mouth joint and the second bell mouth joint are all made of red copper.
The utility model relates to a chip test is with accuse temperature runner's advantage is: compact structure, the structure is light, and it is convenient to install, and the installation screw hole on the runner bottom plate is used for conveniently connecting other parts, and the locating hole of runner bottom plate both sides makes things convenient for the location installation of chip, when using, carries out the injection of the liquid of the different temperatures of runner and notes out through the horn mouth joint, makes the runner be in three temperature (low temperature, normal atmospheric temperature, high temperature) states fast, and chip efficiency of software testing is high, excellent in use effect.
Drawings
Fig. 1 is a schematic structural view of the temperature control flow channel for chip testing according to the present invention.
Fig. 2 is a top view of the temperature control flow channel for chip testing according to the present invention.
Detailed Description
The invention will be further elucidated by means of specific embodiments in the following description, in conjunction with the drawings, in which: for those skilled in the art, modifications of the invention in various equivalent forms will fall within the scope of the appended claims without departing from the principles of the invention.
As shown in fig. 1-2, a temperature-controlled flow channel for chip testing includes: the flow channel bottom plate comprises a flow channel bottom plate 1, wherein a first flow channel 2 and a second flow channel 3 are arranged inside the flow channel bottom plate 1, the first flow channel 2 and the second flow channel 3 are in a turbine shape, a through hole 4 is arranged on the flow channel bottom plate 1 at the center of the first flow channel 2 and the second flow channel 3, a flow channel cover plate 5 is welded on the flow channel bottom plate 1 at the upper side of the first flow channel 2 and the second flow channel 3, a first switching nut mounting hole 6 and a second switching nut mounting hole 7 are arranged at the front side of the flow channel cover plate 5, a first switching nut 8 and a second switching nut 9 are respectively arranged on the first switching nut mounting hole 6 and the second switching nut mounting hole 7, a first bell mouth joint 10 and a second bell mouth joint 11 are respectively arranged on the first switching nut 8 and the second switching nut 9, the first bell mouth joint 10 is communicated with the first flow channel 2, and the second bell mouth joint 11 is communicated with the second flow channel 3, and the runner bottom plates 1 at two sides of the runner cover plate 5 are respectively provided with a positioning hole 12 and an installation screw hole 13.
Further, the runner bottom plate 1, the runner cover plate 5, the first adapter nut 8, the second adapter nut 9, the first bell-mouth joint 10 and the second bell-mouth joint 11 are all made of red copper.
The utility model relates to a chip test is with accuse temperature runner, compact structure, the structure is light, it is convenient to install, installation screw hole 13 on the runner bottom plate 1 is used for conveniently connecting other parts, the locating hole 12 of runner bottom plate 1 both sides makes things convenient for the location installation of chip (not marked in the picture), when using, carry out the injection of the liquid of the different temperatures of runner and annotate out through the horn mouth joint, make the runner can be in three temperature (low temperature, normal atmospheric temperature, high temperature) states fast, chip test efficiency is high, excellent in use effect.
Claims (2)
1. A temperature control flow channel for chip testing is characterized by comprising: the runner bottom plate (1), the internally mounted of runner bottom plate (1) has first runner (2) and second runner (3), first runner (2) and second runner (3) are turbine-shaped, install through-hole (4) on runner bottom plate (1) at first runner (2) and second runner (3) center, the welding has runner apron (5) on runner bottom plate (1) of first runner (2) and second runner (3) upside, the front side of runner apron (5) is equipped with first switching nut mounting hole (6) and second switching nut mounting hole (7), install first switching nut (8) and second switching nut (9) on first switching nut mounting hole (6) and second switching nut mounting hole (7) respectively, install first horn mouth joint (10) and second horn mouth joint (11) on first switching nut (8) and second switching nut (9) respectively, first horn mouth connects (10) and first runner (2) communicate with each other, second horn mouth connects (11) and second runner (3) communicate with each other, install locating hole (12) and installation screw hole (13) on runner bottom plate (1) of runner apron (5) both sides respectively.
2. The temperature-controlled flow channel for chip testing according to claim 1, wherein the flow channel bottom plate (1), the flow channel cover plate (5), the first adapter nut (8), the second adapter nut (9), the first bell-mouth joint (10) and the second bell-mouth joint (11) are all made of red copper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022352469.5U CN213275875U (en) | 2020-10-21 | 2020-10-21 | Temperature control flow channel for chip test |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022352469.5U CN213275875U (en) | 2020-10-21 | 2020-10-21 | Temperature control flow channel for chip test |
Publications (1)
Publication Number | Publication Date |
---|---|
CN213275875U true CN213275875U (en) | 2021-05-25 |
Family
ID=75950920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202022352469.5U Active CN213275875U (en) | 2020-10-21 | 2020-10-21 | Temperature control flow channel for chip test |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN213275875U (en) |
-
2020
- 2020-10-21 CN CN202022352469.5U patent/CN213275875U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN213275875U (en) | Temperature control flow channel for chip test | |
CN205983364U (en) | Solid state hard drives , Solid state hard drives support and solid state hard drives device | |
CN212722972U (en) | Test fixture for optical communication device | |
CN219350216U (en) | Water cooling heat dissipation device for testing bare chip power amplifier by probe station | |
CN207964890U (en) | A kind of clamping device of circuit board testing | |
CN210690638U (en) | Packaged chip test fixture | |
CN109827693A (en) | A kind of crimp type power semiconductor internal pressure distribution measurement system | |
CN213275880U (en) | Three temperature test device of encapsulation type chip | |
CN212811639U (en) | Embedded high-power microwave functional module | |
CN219574299U (en) | Small-batch bare chip detection device | |
CN221827587U (en) | EEPROM chip encryption school block of preventing high temperature | |
CN210323278U (en) | Novel chip test adsorption structure | |
CN207166853U (en) | A kind of novel stabilising structural circuit plate | |
CN212093919U (en) | Lead frame blanking die of stripper plate gas-opening groove | |
CN220672560U (en) | Ceramic shell for driving chip | |
CN219267683U (en) | LED copper aluminum substrate quick dam structure | |
CN107415224B (en) | A kind of 7D print system and its Method of printing | |
CN219555477U (en) | Cooling mechanism for chip test | |
CN213544746U (en) | Chip test is with integrative device of fixed pressure measurement | |
CN221378169U (en) | Test fixture for PCB | |
CN218243967U (en) | Circuit board structure with auxiliary positioning plate | |
CN213957446U (en) | PCB test fixture that positioning accuracy is high | |
CN218006632U (en) | Mounting structure of low-cost high-power amplifier | |
CN209170207U (en) | A kind of brick power module of novel open-frame structure | |
CN220289915U (en) | Pin-grid plug miniaturized optical device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211102 Address after: No. 410 Jucai Road, Binjiang District, Hangzhou City, Zhejiang Province Patentee after: HANGZHOU CHANGCHUAN TECHNOLOGY Co.,Ltd. Address before: 215000 1st floor, No.4 workshop, 118 Putian Road, Weiting, Suzhou Industrial Park, Jiangsu Province Patentee before: Suzhou wulechuan Precision Electronics Co.,Ltd. |