CN210690638U

CN210690638U - Packaged chip test fixture

Info

Publication number: CN210690638U
Application number: CN201921247060.8U
Authority: CN
Inventors: 吴明涛; 王战朋; 刘振
Original assignee: Suzhou Ydm Precision Machinery Co ltd
Current assignee: Suzhou Ydm Precision Machinery Co ltd
Priority date: 2019-08-04
Filing date: 2019-08-04
Publication date: 2020-06-05
Anticipated expiration: 2029-08-04

Abstract

The utility model discloses a packaged chip test fixture, include: the bottom plate, the well side of bottom plate is equipped with the chip standing groove, the chip inslot is equipped with the sensor fixed block, the sensor fixed block middle side is equipped with the sensor mounting groove, the week side of bottom plate is equipped with the fix with screw hole, be equipped with the indium piece in the chip standing groove, install the indium piece in the chip standing groove of sensor fixed block upside, install the chip jack catch in the chip standing groove of indium piece upside. The utility model relates to a packaged chip test fixture's advantage is: the structure is compact, the installation is stable, the chip clamping jaws are arranged on the middle side of the bottom plate and used for fixing and supporting the chip, the indium sheet is added in the middle of the bottom plate, the indium sheet has the excellent characteristics of good ductility, low melting point, low resistance, corrosion resistance and the like, and the chip is well protected.

Description

Packaged chip test fixture

Technical Field

The utility model relates to an accurate electronic test technical field especially relates to a encapsulation chip test fixture.

Background

With the continuous development of electronic chip technology, the testing technology of packaged chips also becomes an important technical key for ensuring the production quality and accelerating the production flow in the electronic industry. Generally, the packaged electronic chip needs to be electrically tested at a predetermined high temperature to know the stability of the packaged chip. When the chip is tested, the traditional chip clamp has the problems of unstable fixing mode, single function and poor testing effect,

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the packaging chip test fixture is stable in fixation and good in test effect.

In order to solve the technical problem, the utility model discloses a technical scheme is: a packaged chip test fixture, comprising: the bottom plate, the well side of bottom plate is equipped with the chip standing groove, be equipped with the sensor fixed block in the chip standing groove, the sensor fixed block well side is equipped with the sensor mounting groove, week side of bottom plate is equipped with the screw fixed orifices, install indium piece in the chip standing groove of sensor fixed block upside, install the chip jack catch in the chip standing groove of indium piece upside, install the screw in the screw fixed orifices, there is the anchor clamps clamp plate top of bottom plate through the screw mounting, the well side of anchor clamps clamp plate is equipped with the draw-in groove, the draw-in groove is detained in chip jack catch week side, be equipped with the gasket mounting groove on the bottom plate of draw-in groove both sides, there is the gasket through uide pin.

Preferably, rectangular grooves are formed in two sides of the bottom plate, and positioning bushings are mounted in the rectangular grooves.

Preferably, the bottom plate is made of red copper material.

The utility model relates to a packaged chip test fixture's advantage is: the structure is compact, the installation is stable, the chip clamping jaws are arranged on the middle side of the bottom plate and used for fixing and supporting the chip, and the indium sheet is added in the middle of the bottom plate, has the excellent characteristics of good ductility, low melting point, low resistance, corrosion resistance and the like, and has good protection effect on the chip; a sensor is arranged in the middle sensor mounting groove, and a ventilation adsorption chip is arranged outside the sensor through the induction of the sensor; the positioning bushings are placed on the two sides of the bottom plate through the two rectangular grooves, and the bottom plate has the excellent characteristics of fatigue resistance, impact resistance and the like, so that the testing requirement under the high-temperature condition is met; the bottom plate is made of red copper, so that the high-temperature-resistant and pressure-resistant copper-clad laminate has excellent conductivity, high temperature resistance and pressure resistance; the clamp pressing plate further stabilizes the chip clamping plate, and the rigidity of the whole structure is also increased.

Drawings

Fig. 1 is a front view of the test fixture for packaged chips of the present invention.

Fig. 2 is a schematic structural diagram of a bottom plate of the package chip testing jig of the present invention.

Fig. 3 is a top view of the bottom plate of the package chip testing jig of the present invention.

Fig. 4 is a rear view of the bottom plate of the test fixture for packaged chips of the present invention.

Fig. 5 is a schematic structural view of a clamp pressing plate of the test clamp for packaged chips of the present invention.

Detailed Description

The invention will be further elucidated by means of specific embodiments in the following description, in conjunction with the drawings, in which: for those skilled in the art, modifications of the invention in various equivalent forms will fall within the scope of the appended claims without departing from the principles of the invention.

As shown in fig. 1 to 5, a packaged chip test jig includes: bottom plate 1, the well side of bottom plate 1 is equipped with chip standing groove 2, be equipped with sensor fixed block 3 in the chip standing groove 2, the side is equipped with sensor mounting groove 4 in the sensor fixed block 3, the week side of bottom plate 1 is equipped with screw fixed orifices 5, install indium piece 6 in the chip standing groove of 3 upsides of sensor fixed block, install chip jack catch 8 in the chip standing groove 2 of the 6 upsides of indium piece, install screw 9 in the screw fixed orifices 5, anchor clamps clamp plate 10 is installed through screw 9 in the top of bottom plate 1, the well side of anchor clamps clamp plate 10 is equipped with draw-in groove 11, draw-in groove 11 is detained in chip jack catch 8 week side, be equipped with gasket mounting groove 12 on the bottom plate 1 of draw-in groove 11 both sides, install gasket 15 through uide pin 13 and cross screw 14 on the gasket mounting groove 12.

Preferably, rectangular grooves 16 are formed in two sides of the bottom plate 1, and positioning bushings 17 are installed in the rectangular grooves 16.

Preferably, the bottom plate 1 is made of red copper material.

The utility model relates to a packaged chip test fixture, compact structure, the installation is firm, and the side is equipped with chip jack catch 8 in the bottom, is used for fixing, supporting the chip, has added indium piece 7 in the middle, and indium piece 7 has good ductility, and the melting point is low, and low resistance, excellent characteristics such as anticorrosive have fine guard action to the chip; a sensor is arranged in the middle sensor mounting groove 4, and a ventilation adsorption chip is arranged outside the sensor through the induction of the sensor; positioning bushings 17 are placed on two sides of the bottom plate 1 through two rectangular grooves 16, so that the bottom plate has excellent characteristics of fatigue resistance, impact resistance and the like, and the testing requirement under the high-temperature condition is met; the bottom plate 1 is made of red copper and has excellent conductivity, high temperature resistance and pressure resistance; the clamp press plate 10 further stabilizes the chip clamp plate and also adds rigidity to the overall structure.

Claims

1. A packaged chip test fixture, comprising: the improved sensor comprises a bottom plate (1), wherein a chip placing groove (2) is arranged on the middle side of the bottom plate (1), a sensor fixing block (3) is arranged in the chip placing groove (2), a sensor mounting groove (4) is arranged on the middle side of the sensor fixing block (3), screw fixing holes (5) are formed in the peripheral side of the bottom plate (1), indium sheets (6) are installed in the chip placing groove (2) on the upper side of the sensor fixing block (3), chip clamping claws (8) are installed in the chip placing groove (2) on the upper side of the indium sheets (6), screws (9) are installed in the screw fixing holes (5), a clamp pressing plate (10) is installed above the bottom plate (1) through the screws (9), a clamping groove (11) is formed in the middle side of the clamp pressing plate (10), the clamping groove (11) is buckled on the peripheral side of the chip clamping claws (8), gasket mounting grooves (12) are formed in the bottom, and a gasket (15) is arranged on the gasket mounting groove (12) through a guide pin (13) and a cross screw (14).

2. The clamp for testing the packaged chip as claimed in claim 1, wherein the base plate (1) is provided with rectangular grooves (16) at two sides, and the rectangular grooves (16) are internally provided with positioning bushings (17).

3. The packaged chip test fixture of claim 1, wherein the base plate (1) is a copper material.