CN213264578U - Silicon chip discharging device - Google Patents
Silicon chip discharging device Download PDFInfo
- Publication number
- CN213264578U CN213264578U CN202022237073.6U CN202022237073U CN213264578U CN 213264578 U CN213264578 U CN 213264578U CN 202022237073 U CN202022237073 U CN 202022237073U CN 213264578 U CN213264578 U CN 213264578U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- fixed
- linear module
- silicon
- quartz boat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model belongs to the technical field of silicon chip conveying equipment and specifically relates to silicon chip blowing device. The feeding device comprises a machine table, a quartz boat moving mechanism, a first silicon wafer aligning mechanism, a second double-moving seat linear module, a silicon wafer grabbing mechanism, a silicon wafer sinking mechanism, a second silicon wafer aligning mechanism and a positioning mechanism, wherein the machine table is provided with the first quartz boat moving mechanism, the first silicon wafer aligning mechanism, the second double-moving seat linear module, the silicon wafer sinking mechanism and the second silicon wafer aligning mechanism, and the first double-moving seat linear module is positioned above the first silicon wafer aligning mechanism and the second silicon wafer aligning mechanism. The utility model discloses a mobilizable quartz boat bears the silicon chip. And aligning the silicon wafer before grabbing through the first silicon wafer aligning mechanism. And aligning the silicon wafers which are overlapped together through a second silicon wafer aligning mechanism. And grabbing the silicon wafer through the silicon wafer grabbing mechanism. And the silicon wafer is sunk into the quartz boat through the silicon wafer sinking mechanism. This application has improved the efficiency that the quartz boat was packed into to silicon chip.
Description
Technical Field
The utility model belongs to the technical field of silicon chip conveying equipment and specifically relates to silicon chip blowing device.
Background
In the process of production and processing of the silicon wafer, the silicon wafer needs to be grabbed and placed in a quartz boat. However, the existing equipment for putting the silicon wafers into the quartz boat has low working efficiency.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem described in the background art, the utility model provides a silicon chip blowing device. The silicon wafers are carried by a movable quartz boat. And aligning the silicon wafer before grabbing through the first silicon wafer aligning mechanism. And aligning the silicon wafers which are overlapped together through a second silicon wafer aligning mechanism. And grabbing the silicon wafer through the silicon wafer grabbing mechanism. And the silicon wafer is sunk into the quartz boat through the silicon wafer sinking mechanism. This application has improved the efficiency that the quartz boat was packed into to silicon chip.
The utility model provides a technical scheme that its technical problem adopted is:
the utility model provides a silicon chip blowing device, includes that board, quartz boat moving mechanism, silicon chip align mechanism one, the linear module of double mobile seat, silicon chip snatch the mechanism, the silicon chip sinks the mechanism, silicon chip align mechanism two, positioning mechanism, install quartz boat moving mechanism, silicon chip align mechanism one, the linear module of double mobile seat, silicon chip sink the mechanism, silicon chip align mechanism two on the board, the linear module of double mobile seat is located silicon chip align mechanism one and silicon chip align mechanism two tops, install the silicon chip on two slides of the linear module of double mobile seat respectively and snatch the mechanism, be equipped with the perforation that is used for passing the silicon chip and sinks the mechanism on the board, silicon chip align mechanism two is located quartz boat moving mechanism's top, installs the positioning mechanism who is used for fixing a position the quartz boat on quartz boat moving mechanism's.
Specifically, the silicon wafer sinking mechanism comprises a first silicon wafer top plate group, a first connecting frame and a first connecting frame lifting linear module, wherein more than two first connecting frames are fixed on a sliding seat of the first connecting frame lifting linear module, a first silicon wafer top plate group is fixed on each first connecting frame, each first silicon wafer top plate group comprises a row of top plates which are parallel to each other and arranged linearly, and the end head of each top plate is provided with a sharp top.
Specifically, the first silicon wafer aligning mechanism comprises a second silicon wafer top plate group, a second connecting frame, a cylinder body, a motor, synchronizing wheels, a synchronous belt and sliding seats, wherein the cylinder body is fixed on a machine table, the cylinder body is connected with the two sliding seats in a sliding mode, the two sliding seats are respectively fixed with the two connecting frames, the second silicon wafer top plate group is fixed on the second connecting frame, the second silicon wafer top plate group comprises a row of top plates which are parallel to each other and arranged in a straight line, the end head of each top plate is provided with a pointed top, a machine body of the motor is fixed on the cylinder body, the cylinder body is rotatably connected with the two synchronizing wheels, an output shaft of the motor is fixed on one synchronizing wheel, the two synchronizing wheels are all meshed on.
Specifically, the linear module of two removal seats comprises module cylinder body, two slides, two lead screws, two lead screw rotating electrical machines, and the module cylinder body is fixed on the board, and two lead screw rotating electrical machines are fixed respectively at module cylinder body both ends, and the rotation is connected with two lead screws that are parallel to each other in the module cylinder body, and two lead screw ends are fixed respectively on two lead screw rotating electrical machines's output shaft, and equal threaded connection has ball nut on two lead screws, and two ball nut are fixed respectively on two slides.
Specifically, the silicon chip snatchs the mechanism and is fixed on the slide of the linear module of two removal seats by the linear module of suction plate lift, the linear module of suction plate level, the suction plate is constituteed, the cylinder body of the linear module of suction plate lift is fixed on the slide of the linear module of suction plate lift, be fixed with the linear module of suction plate level on the slide of the linear module of suction plate lift several suction plates that are parallel to each other and arrange and be sharp, be equipped with on the suction plate and inhale the hole, the suction plate bottom is fixed with protruding piece, protruding piece is fixed on the slide of the linear module of suction plate level, the protruding piece laminating of adjacent suction plate is in the same place.
Specifically, the quartz boat moving mechanism is a horizontal linear module.
Specifically, the second silicon wafer aligning mechanism comprises two horizontal cylinders which are symmetrical to each other and two silicon wafer top plate sets, the two horizontal cylinders which are symmetrical to each other are fixed on the machine table, the piston rods of the two horizontal cylinders are respectively fixed with the silicon wafer top plate sets, the silicon wafer top plate sets comprise a row of top plates which are parallel to each other and arranged in a straight line, and the end heads of the top plates are provided with sharp tops.
Specifically, the positioning mechanism consists of a pressing block driving cylinder and a pressing block, the cylinder body of the pressing block driving cylinder is fixed on the sliding seat of the quartz boat moving mechanism, and the pressing block is fixed on the piston rod of the pressing block driving cylinder.
The utility model has the advantages that: the utility model provides a silicon chip blowing device. The silicon wafers are carried by a movable quartz boat. And aligning the silicon wafer before grabbing through the first silicon wafer aligning mechanism. And aligning the silicon wafers which are overlapped together through a second silicon wafer aligning mechanism. And grabbing the silicon wafer through the silicon wafer grabbing mechanism. And the silicon wafer is sunk into the quartz boat through the silicon wafer sinking mechanism. This application has improved the efficiency that the quartz boat was packed into to silicon chip.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic structural view of the silicon wafer sinking mechanism of the present invention;
FIG. 3 is a schematic structural diagram of a first silicon wafer alignment mechanism of the present invention;
FIG. 4 is a schematic view of the structure of the suction plate of the present invention;
fig. 5 is a schematic structural diagram of a second silicon wafer alignment mechanism of the present invention;
in the figure, 1, a machine table, 2, a quartz boat, 3, a quartz boat moving mechanism, 4, a silicon wafer aligning mechanism I, 5, a double-moving-seat linear module, 6, a silicon wafer grabbing mechanism, 7, a silicon wafer sinking mechanism, 8, a silicon wafer aligning mechanism II, 9, a positioning mechanism, 41, a silicon wafer top plate group II, 42, a connecting frame II, 43, a cylinder body, 61, a suction plate lifting linear module, 62, a suction plate horizontal linear module, 63, a suction plate, 71, a silicon wafer top plate group I, 72, a connecting frame I, 73, a connecting frame I lifting linear module, 81, a horizontal cylinder and 82, and a silicon wafer top plate group III are shown.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.
Fig. 1 is the structural schematic diagram of the utility model, fig. 2 is the structural schematic diagram of the silicon wafer sinking mechanism of the utility model, fig. 3 is the structural schematic diagram of the silicon wafer aligning mechanism I, fig. 4 is the utility model discloses a suction plate structural schematic diagram, fig. 5 is the structural schematic diagram of the silicon wafer aligning mechanism II of the utility model.
As shown in the attached figure 1, the silicon wafer discharging device comprises a machine table 1, a quartz boat 2, a quartz boat moving mechanism 3, a silicon wafer aligning mechanism I4, a double-moving-seat linear module 5, a silicon wafer grabbing mechanism 6, a silicon wafer sinking mechanism 7, a silicon wafer aligning mechanism II 8 and a positioning mechanism 9, install quartz boat moving mechanism 3 on the board 1, silicon chip alignment mechanism 4, the linear module of two removal seats 5, the silicon chip mechanism 7 that sinks, silicon chip alignment mechanism two 8, the linear module of two removal seats 5 is located silicon chip alignment mechanism 4 and silicon chip alignment mechanism two 8 tops, it snatchs mechanism 6 to install the silicon chip on two slides of the linear module of two removal seats 5 respectively, be equipped with the perforation that is used for passing silicon chip mechanism 7 that sinks on board 1, silicon chip alignment mechanism two 8 are located quartz boat moving mechanism 3's top, install the positioning mechanism 9 that is used for fixing a position quartz boat 2 on quartz boat moving mechanism 3's the slide.
As shown in fig. 2, the silicon wafer sinking mechanism 7 comprises a silicon wafer top plate group 71, a connecting frame one 72, and a connecting frame one lifting linear module 73, wherein more than two connecting frames one 72 are fixed on a sliding seat of the connecting frame one lifting linear module 73, a silicon wafer top plate group 71 is fixed on each connecting frame one 72, the silicon wafer top plate group 71 comprises a row of top plates which are parallel to each other and arranged in a straight line, and the end of each top plate is provided with a sharp top.
On the silicon wafer top plate group 71 of the silicon wafer sinking mechanism 7, the sharp top of each top plate can jack up a silicon wafer, and one silicon wafer top plate group 71 can jack up a row of silicon wafers simultaneously.
As shown in fig. 3, the first silicon wafer aligning mechanism 4 comprises a second silicon wafer top plate group 41, a second connecting frame 42, a cylinder 43, a motor, synchronizing wheels, a synchronizing belt and sliding seats, wherein the cylinder is fixed on the machine table 1, the cylinder is connected with the two sliding seats in a sliding fit manner, the two connecting frame 42 are respectively fixed on the two sliding seats, the second silicon wafer top plate group 41 is fixed on the second connecting frame 42, the second silicon wafer top plate group 41 comprises a row of top plates which are parallel to each other and arranged in a straight line, a pointed top is arranged at the end of each top plate, a machine body of the motor is fixed on the cylinder, the cylinder body is rotatably connected with the two synchronizing wheels, an output shaft of the motor is fixed on one synchronizing wheel, the two synchronizing wheels are respectively meshed with.
The working mode of the first silicon wafer aligning mechanism 4 is that the motor drives the synchronizing wheel to rotate, the rotating synchronizing wheel drives the synchronous belt to transmit, and the two sliding seats are pulled by the transmitted synchronous belt to perform opposite or opposite linear movement along the cylinder body 43, so that the opening and closing of the two silicon wafer top plate groups 41 are realized. When the silicon wafer top plate group two 41 on the left side and the right side of the row of silicon wafers clamps the row of silicon wafers, the silicon wafers in the row are completely aligned.
The linear module 5 of two removal seats comprises the module cylinder body, two slides, two lead screws, two lead screw rotating electrical machines, the module cylinder body is fixed on board 1, two lead screw rotating electrical machines are fixed respectively at module cylinder body both ends, it is connected with two lead screws that are parallel to each other to rotate in the module cylinder body, two lead screw ends are fixed respectively on two lead screw rotating electrical machines's output shaft, equal threaded connection has ball nut on two lead screws, two ball nut fix respectively on two slides.
The two screw rods rotate independently, and the two sliding seats can be driven to move according to the required tracks respectively.
As shown in fig. 4, the silicon wafer grabbing mechanism 6 comprises a suction plate lifting linear module 61, a suction plate horizontal linear module 62 and a suction plate 63, a cylinder body of the suction plate lifting linear module 61 is fixed on a sliding seat of the double-moving-seat linear module 5, the suction plate lifting linear module 62 is fixed on the sliding seat of the suction plate lifting linear module 61, a plurality of suction plates 63 which are parallel to each other and arranged in a straight line are fixed on the sliding seat of the suction plate horizontal linear module 62, a suction hole is formed in the suction plate 63, a convex block is fixed at the bottom of the suction plate 63, the convex blocks of the adjacent suction plates 63 are attached together.
The suction plate lifting linear module 61 can drive the suction plate 63 to move up and down, and the suction plate horizontal linear module 62 can drive the suction plate 63 to move horizontally. With the convex pieces, it is possible to maintain the same interval distance between all the suction plates 63. The vacuum generator generates negative pressure suction force to the suction holes of the suction plates 63, and each suction plate 63 can suck a silicon wafer.
The quartz boat moving mechanism 3 is a horizontal linear module.
As shown in fig. 5, the second silicon wafer aligning mechanism 8 is composed of two symmetrical horizontal cylinders 81 and two silicon wafer top plate sets 82, the two symmetrical horizontal cylinders 81 are fixed on the machine table 1, the piston rods of the two horizontal cylinders 81 are respectively fixed with the silicon wafer top plate sets 82, the silicon wafer top plate sets 82 are composed of a row of top plates which are parallel to each other and arranged in a straight line, and the tips of the top plates are provided with sharp tops.
The piston rod of the horizontal cylinder 81 can drive the silicon wafer top plate group III 82 to horizontally and linearly move, and when the silicon wafer top plate group III 82 on the left side and the right side of a row of silicon wafers clamps the silicon wafers, the silicon wafers in the row can be completely aligned.
The positioning mechanism 9 is composed of a pressing block driving cylinder and a pressing block, the cylinder body of the pressing block driving cylinder is fixed on the sliding seat of the quartz boat moving mechanism 3, and the pressing block is fixed on the piston rod of the pressing block driving cylinder.
More than two positioning mechanisms 9 are fixed on the slide seat of the quartz boat moving mechanism 3, the positioning mechanism 9 is arranged behind the quartz boat 2, a baffle is arranged in front of the quartz boat, the positioning mechanism 9 is arranged on the right side of the quartz boat 2, and the baffle is arranged on the left side of the quartz boat. And a pressing block driving cylinder of the positioning mechanism 9 at the rear drives a pressing block to press the quartz boat onto the baffle at the front. And a pressing block driving cylinder of the positioning mechanism 9 on the right side drives a pressing block to press the quartz boat on the baffle on the left side.
The quartz boat 2 is composed of a plurality of supporting rods and two side plates, and the two parallel side plates are fixedly connected together through the supporting rods.
The working mode of this application is, on placing quartz boat 2 to quartz boat moving mechanism 3's slide, then fix a position quartz boat 2 by positioning mechanism 9. The empty quartz boat 2 is moved above the silicon wafer sinking mechanism 7 by the quartz boat moving mechanism 3. And then the first silicon chip top plate group 71 is driven by the first connecting frame lifting linear module 73 to move upwards, and the first silicon chip top plate group 71 penetrates out of the table board of the machine table 1 and then penetrates out of the quartz boat 2.
Firstly, a stack of silicon wafers are aligned by using a silicon wafer aligning mechanism I4, and then the aligned silicon wafers are grabbed by using a silicon wafer grabbing mechanism 6 on the double-moving-seat linear module 5. Then, the first silicon wafer aligning mechanism 4 beats another stack of silicon wafers, and then the other silicon wafer grabbing mechanism 6 on the double-moving-seat linear module 5 grabs the silicon wafers after beating. And then the double-moving-seat linear module 5 drives the two silicon wafer grabbing mechanisms 6 to move relatively until two stacks of silicon wafers are overlapped together (the suction plate groups of the two silicon wafer grabbing mechanisms 6 are arranged in a staggered mode). Then the two silicon wafer grabbing mechanisms 6 move in the same direction, and the superposed silicon wafers are placed on the second silicon wafer aligning mechanism 8 to be aligned. And then the silicon wafers after being beaten are placed on a silicon wafer top plate group 71 of the silicon wafer sinking mechanism 7. The link-lift linear module 73 then drives the silicon wafer down until the silicon wafer is placed on the support rods of the quartz boat. And finally, the quartz boat moving mechanism 3 drives the fully loaded quartz boat 2 to horizontally move to a discharging station, and the quartz boat 2 can be taken away after the positioning mechanism 9 releases the quartz boat 2.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (8)
1. The utility model provides a silicon chip blowing device which characterized in that: comprises a machine table (1), a quartz boat (2), a quartz boat moving mechanism (3), a silicon wafer aligning mechanism I (4), a double-moving-seat linear module (5), a silicon wafer grabbing mechanism (6), a silicon wafer sinking mechanism (7), a silicon wafer aligning mechanism II (8) and a positioning mechanism (9), wherein the machine table (1) is provided with the quartz boat moving mechanism (3), the silicon wafer aligning mechanism I (4), the double-moving-seat linear module (5), the silicon wafer sinking mechanism (7) and the silicon wafer aligning mechanism II (8), the double-moving-seat linear module (5) is positioned above the silicon wafer aligning mechanism I (4) and the silicon wafer aligning mechanism II (8), two sliding seats of the double-moving-seat linear module (5) are respectively provided with the silicon wafer grabbing mechanism (6), the machine table (1) is provided with a through hole for penetrating through the silicon wafer sinking mechanism (7), and the silicon wafer aligning mechanism II (8) is positioned above the quartz boat moving mechanism (, and a positioning mechanism (9) for positioning the quartz boat (2) is arranged on the sliding seat of the quartz boat moving mechanism (3).
2. The silicon wafer emptying device according to claim 1, characterized in that: the silicon wafer sinking mechanism (7) is composed of a silicon wafer top plate group I (71), a connecting frame I (72) and a connecting frame I lifting linear module (73), more than two connecting frame I (72) are fixed on a sliding seat of the connecting frame I lifting linear module (73), a silicon wafer top plate group I (71) is fixed on each connecting frame I (72), the silicon wafer top plate group I (71) is composed of a row of top plates which are parallel to each other and arranged linearly, and the end head of each top plate is provided with a sharp top.
3. The silicon wafer emptying device according to claim 1, characterized in that: the silicon chip aligning mechanism I (4) is composed of a silicon chip top plate group II (41), a connecting frame II (42), a cylinder body (43), a motor, synchronizing wheels, a synchronizing belt and sliding seats, the cylinder body is fixed on the machine table (1), the cylinder body is connected with two sliding seats in a sliding fit mode, the two sliding seats are respectively fixed with the two connecting frame II (42), the connecting frame II (42) is fixed with the silicon chip top plate group II (41), the silicon chip top plate group II (41) is composed of a row of top plates which are parallel to each other and arranged in a straight line, the end head of each top plate is provided with a sharp top, a machine body of the motor is fixed on the cylinder body, the cylinder body is rotatably connected with the two synchronizing wheels, an output shaft of the motor is fixed on one synchronizing wheel, the two synchronizing wheels.
4. The silicon wafer emptying device according to claim 1, characterized in that: two linear modules of removal seat (5) are by the module cylinder body, two slides, two lead screws, two lead screw rotating electrical machines are constituteed, the module cylinder body is fixed on board (1), two lead screw rotating electrical machines are fixed respectively at module cylinder body both ends, rotate in the module cylinder body and are connected with two lead screws that are parallel to each other, two lead screw ends are fixed respectively on two lead screw rotating electrical machines's output shaft, equal threaded connection has ball nut on two lead screws, two ball nut fix respectively on two slides.
5. The silicon wafer emptying device according to claim 1, characterized in that: silicon chip snatchs mechanism (6) and is fixed on the slide of the linear module of two removal seats (5) by the linear module of suction plate lift (61), the linear module of suction plate level (62), suction plate (63) are constituteed, the cylinder body of the linear module of suction plate lift (61) is fixed on the slide of the linear module of suction plate lift (61), be fixed with the linear module of suction plate level (62) on the slide of the linear module of suction plate level (62) several and be parallel to each other and arrange suction plate (63) that are sharp, be equipped with the suction hole on suction plate (63), suction plate (63) bottom is fixed with protruding piece, protruding piece is fixed on the slide of the linear module of suction plate level (62), the protruding piece laminating of adjacent suction plate (63) is in the same place.
6. The silicon wafer emptying device according to claim 1, characterized in that: the quartz boat moving mechanism (3) is a horizontal linear module.
7. The silicon wafer emptying device according to claim 1, characterized in that: the silicon wafer aligning mechanism II (8) is composed of two symmetrical horizontal cylinders (81) and two silicon wafer top plate sets III (82), the two symmetrical horizontal cylinders (81) are fixed on the machine table (1), the silicon wafer top plate sets III (82) are fixed on piston rods of the two horizontal cylinders (81) respectively, the silicon wafer top plate sets III (82) are composed of a row of top plates which are parallel to each other and arranged linearly, and the end heads of the top plates are provided with sharp tops.
8. The silicon wafer emptying device according to claim 1, characterized in that: the positioning mechanism (9) is composed of a pressing block driving cylinder and a pressing block, the cylinder body of the pressing block driving cylinder is fixed on the sliding seat of the quartz boat moving mechanism (3), and the pressing block is fixed on the piston rod of the pressing block driving cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022237073.6U CN213264578U (en) | 2020-10-10 | 2020-10-10 | Silicon chip discharging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022237073.6U CN213264578U (en) | 2020-10-10 | 2020-10-10 | Silicon chip discharging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213264578U true CN213264578U (en) | 2021-05-25 |
Family
ID=75948002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022237073.6U Active CN213264578U (en) | 2020-10-10 | 2020-10-10 | Silicon chip discharging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213264578U (en) |
-
2020
- 2020-10-10 CN CN202022237073.6U patent/CN213264578U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202138564U (en) | Stacking turning device of ceramic tile package line | |
| CN107662057B (en) | A kind of manipulator and laser process equipment | |
| CN109473726B (en) | Square lithium ion battery shaping device | |
| CN208970485U (en) | A kind of slice turning device | |
| CN113933681A (en) | Chip testing equipment | |
| CN217788428U (en) | Photovoltaic module chooses lead wire straightener and equipment | |
| CN113998457B (en) | Multi-chip detection system | |
| CN109786852B (en) | High-speed lamination machine and lamination method | |
| CN213264578U (en) | Silicon chip discharging device | |
| CN112078127A (en) | Automatic product film pasting equipment | |
| CN209127530U (en) | A kind of full material torr disk orientating and conveying mechanisms | |
| CN209199967U (en) | A kind of High Precision Automatic edge cutting machine | |
| CN109501229B (en) | Three-dimensional pad pasting equipment | |
| CN213445115U (en) | Silicon wafer feeding and grabbing device | |
| CN210214132U (en) | Single-table-face double-station sheet material machine | |
| CN216099249U (en) | Circuit board cutting machine | |
| CN216271777U (en) | Feeding and discharging lifting assembly line for solar tile-stacking assembly | |
| CN201614182U (en) | Lifting structure of automatic plane glass stacker | |
| CN109650085B (en) | Single-table-board double-station sheet material machine | |
| CN212328948U (en) | Feeding device for silicon wafer detection sorting machine | |
| CN211428188U (en) | Glass plate and battery chip adsorption equipment | |
| CN208585796U (en) | A kind of glass absorbing and hoisting machine | |
| CN213264577U (en) | Silicon chip taking and placing device | |
| CN207154181U (en) | A kind of fingerprint module test machine | |
| CN215467683U (en) | Lifting type blanking conveying device for plate bending center |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |