CN213093327U - Millimeter wave power divider - Google Patents
Millimeter wave power divider Download PDFInfo
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- CN213093327U CN213093327U CN202022436791.6U CN202022436791U CN213093327U CN 213093327 U CN213093327 U CN 213093327U CN 202022436791 U CN202022436791 U CN 202022436791U CN 213093327 U CN213093327 U CN 213093327U
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Abstract
The invention provides a millimeter wave power divider which is formed by stacking eight metal plates from a first layer to an eighth layer, wherein each metal plate is provided with a circular through hole array and a rectangular through hole, the circular through hole arrays are distributed around the rectangular through holes, the circular through holes are distributed at equal intervals according to the period of 1.86mm, the diameter of each circular through hole is 1mm, the circular through hole arrays of two adjacent layers are staggered with each other by half millimeter wave period of 0.93mm, and two rectangular through holes of a second layer metal plate and a third layer metal plate are stacked to form a waveguide cavity. The millimeter wave power divider is easy to process and low in cost, and due to the stop band characteristic of the electromagnetic band gap structure, the power divider is insensitive to assembly errors, effectively prevents electromagnetic wave leakage and reduces transmission loss.
Description
Technical Field
The invention belongs to the technical field of millimeter wave wireless communication, and particularly relates to a millimeter wave power divider based on an electromagnetic band gap structure.
Background
With the development of satellite communication and network technology and the alternation of communication systems, the demand of radio frequency devices with high-gain broadband is increasing day by day, the millimeter wave frequency band communication system which is developed vigorously at present is remarkably increased while the working bandwidth is widened along with the increase of the working frequency band, and the transmission loss is also increased remarkably.
In recent years, the industry proposes that leakage is reduced by layer-by-layer processing and welding between layers, but due to the unevenness of a welding surface, the surface roughness is too high, so that the electric connection between waveguide structures is influenced, a large amount of electromagnetic field leakage waves and reflection are caused, and ideal performance cannot be realized; in addition, a vacuum welding mode is proposed in Japan to improve the flatness of welding, but the technology is too expensive and the domestic processing technology is difficult to realize, and the gap still exists in large-scale production application.
In view of the foregoing, there is a need for a power divider of a millimeter wave band, which is made of pure metal, is easy to process, and effectively prevents leakage and reflection of electromagnetic waves.
Disclosure of Invention
In view of this, the present invention provides a millimeter wave power divider based on an electromagnetic band gap structure, which is formed by stacking multiple metal plates, is easy to process, and effectively prevents electromagnetic wave leakage, and the technical solution of the present invention is as follows:
in a first aspect, the invention provides a millimeter wave power divider, which is formed by stacking eight metal plates from a first layer to an eighth layer, wherein circular through hole arrays and rectangular through holes are arranged on the metal plates, the circular through holes are arranged at equal intervals according to a period of 1.86mm, the diameter of each circular through hole is 1mm, and the circular through hole arrays of two adjacent layers are staggered by half millimeter wave period of 0.93 mm.
Furthermore, a circular through hole array and a rectangular through hole are arranged on the first layer of metal plate; the second layer of metal plate and the third layer of metal plate are both provided with a circular through hole array and a rectangular through hole, and the two rectangular through holes of the second layer of metal plate and the third layer of metal plate are stacked to form a waveguide cavity; a circular through hole array and a rectangular through hole for electromagnetic wave coupling are arranged on the fourth layer of metal plate; a circular through hole array and a rectangular through hole are arranged on the fifth layer metal plate and the sixth layer metal plate; a circular through hole array and two rectangular through holes are formed in the seventh layer of metal plate; and a circular through hole array and two rectangular through holes are arranged on the eighth layer of metal plate.
Further, the circular through hole array is arranged around the rectangular through holes.
Furthermore, the length of the rectangular through hole of each of the first layer metal plate and the eighth layer metal plate is 2.032mm, and the width of the rectangular through hole is 1.016 mm.
Further, the working frequency band of the millimeter wave power divider is a W wave band of 95-204 GHz.
Further, the metal plate is made of any one of iron, aluminum and copper.
Further, the thicknesses of the metal plates of the first layer to the eighth layer are all 0.5 mm.
Further, the return loss bandwidth of the millimeter wave power divider is 10.3 GHz.
Further, the reflection coefficients S11 in the working frequency band of the millimeter wave power divider are both greater than 10dB, and the average transmission coefficients S21 and S31 in the working frequency band are both 3.1 dB.
The millimeter wave power divider is easy to process and low in cost, and due to the stop band characteristic of the electromagnetic band gap structure, the power divider is insensitive to assembly errors, effectively prevents electromagnetic wave leakage and reduces transmission loss.
Drawings
FIG. 1: the invention relates to a millimeter wave power divider assembly structure.
Fig. 2A-fig. 2H: top view of layers 1 to 8 of the millimeter wave power splitter of the present invention.
FIG. 3: the dispersion curve of the electromagnetic band gap structure of the invention.
FIG. 4: the reflection coefficient and transmission coefficient curve chart of the millimeter wave power divider is provided.
FIG. 5: the invention relates to a power divider assembly process flow.
Detailed Description
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, and while the invention will be described in connection with the preferred embodiments, it will be understood by those skilled in the art that these embodiments are not intended to limit the invention to these embodiments, but on the contrary, the invention is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the invention as defined by the appended claims. Furthermore, in the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, it will be apparent to those skilled in the art that the present invention may be practiced without these specific details.
Referring to fig. 1, an assembly structure diagram of a millimeter wave power divider according to the present invention is shown, in which a millimeter wave power divider according to the present invention is formed by stacking a plurality of metal plates, and is easy to process and capable of effectively preventing electromagnetic wave leakage, circular metal through holes on 8 metal plates are stacked in a staggered manner to form a periodic electromagnetic band gap structure, and the electromagnetic band gap structure can generate a W-band stopband of 95-204 GHz.
Fig. 2A to 2H are top views of first to eighth layers of the millimeter wave power divider according to the present invention, the millimeter wave power divider is composed of eight layers of metal plates having different structures, circular through hole arrays and rectangular through holes are disposed on the metal plates, the circular through holes are arranged at equal intervals according to a period of 1.86mm, the diameter of the circular through holes is 1mm, the circular through hole arrays of two adjacent layers are staggered by half a millimeter wave period of 0.93mm, and the circular through holes between the layers are stacked to form an electromagnetic band gap structure capable of suppressing electromagnetic wave leakage in a working frequency band.
The eight layers of metal plates are numbered from 1 to 8, a circular through hole array and a rectangular through hole with the length of 2.032mm and the width of 1.016mm are arranged on the first layer of metal plate, namely the circular through hole array corresponds to a national standard BJ1200 standard waveguide port, and the circular through hole array is arranged around the rectangular through hole; the second layer of metal plate and the third layer of metal plate are both provided with a circular through hole array and a long rectangular through hole, the two rectangular through holes are stacked to form a waveguide cavity, and the circular through hole arrays are arranged around the rectangular through holes; a circular through hole array and rectangular through holes for electromagnetic wave coupling are arranged on the fourth layer of metal plate, and the circular through hole array is arranged around the rectangular through holes; the fifth layer metal plate and the sixth layer metal plate are respectively provided with a circular through hole array and a long rectangular through hole, and the circular through hole arrays are distributed around the rectangular through holes; a circular through hole array and two rectangular through holes are arranged on the seventh layer, and the circular through hole array is arranged around the rectangular through holes; a circular through hole array and two rectangular through holes with the length of 2.032mm and the width of 1.016mm are arranged on the eighth layer of metal plate, namely the rectangular through holes correspond to the national standard BJ1200 standard waveguide port, and the circular through hole array is arranged around the rectangular through holes; the first to eighth layers of metal plates are stacked to form a one-to-two equal-proportion power divider, namely, the distribution loss is 3dB, the power divider is fed and input through a 1 st layer of standard waveguide port and is output through two 8 th layer of standard waveguide ports.
It can be understood by those skilled in the art that the size of the rectangular through hole corresponding to the standard waveguide port of the national standard BJ1200 in the above embodiments can be adjusted according to actual needs, and is not limited to the above embodiments.
Preferably, the material of the metal plate is a common metal material, such as iron, silver, and the like, and preferably aluminum or copper.
Preferably, the thickness of each metal plate is 0.5 mm.
Referring to fig. 3, which is a dispersion curve diagram of the electromagnetic bandgap structure of the present invention, an electromagnetic wave in a frequency range of 95-204GHz cannot propagate through a micro gap between each layer of metal plate, but can only normally propagate along a waveguide cavity in a rectangular through hole and perform power distribution; and each layer of metal plate does not need to be electrically connected and contacted through further process processing such as welding and the like, so that the effect of inhibiting electromagnetic wave leakage of non-contact type easy assembly and processing is achieved, the rectangular through holes in the metal plates are stacked to form a waveguide cavity, an electromagnetic wave propagation channel is formed, and a one-to-two equal-proportion millimeter wave power distributor is further formed.
Referring to fig. 4, the reflection coefficient and transmission coefficient curve of the millimeter wave power divider of the present invention shows good waveforms of the reflection coefficient of near end crosstalk of S31, the reflection coefficient of far end crosstalk of S41, and the transmission coefficient, so as to meet the design requirements.
Referring to fig. 5, a process flow for manufacturing the power divider of the present invention specifically includes the following steps:
step 101: firstly, selecting the length and width of the corresponding standard waveguide port size and the length and width of the rectangular through holes on the first layer metal plate and the eighth layer metal plate according to the required millimeter wave working frequency band.
Step 102: the electromagnetic band gap structure is designed according to the required working frequency band of the power divider, the size of the electromagnetic band gap structure is mainly determined by the diameter of the circular through hole, the diameter of the electromagnetic band gap structure affects the resonant frequency of a working mode appearing in a dispersion curve, and the distance, namely the arrangement period, of two adjacent circular holes on the same layer affects the electric field coupling condition between the two circular holes, so that the width of a stop band is affected.
Step 103: the input impedance matching is realized by adjusting the lengths of the rectangular through holes of the second layer and the third layer of the power divider.
Step 104: the width of a rectangular through hole of a fourth layer metal plate of the millimeter wave power distributor is adjusted to realize power coupling from a waveguide cavity formed by the second layer metal plate and the third layer metal plate to a waveguide cavity formed by the fifth layer metal plate, the sixth layer metal plate and the seventh layer metal plate;
step 105: and sequentially stacking and assembling the metal plates from the first layer to the eighth layer, wherein the metal plate on the first layer is connected with the input waveguide port, and the metal plate on the eighth layer is connected with the two output waveguide ports.
The millimeter wave power divider has the following performances:
(1) the stopband range generated by the electromagnetic band gap structure is 95 GHz-204 GHz, and the electromagnetic wave has no corresponding working mode in the stopband range, i.e. the electromagnetic wave in the working frequency band cannot be transmitted in the electromagnetic band gap structure, as shown in fig. 3.
(2) The return loss bandwidth of the millimeter wave power divider is 10.3GHz (84.5 GHz to 94.8 GHz), the reflection coefficients in the operating frequency band, i.e., S11, are all greater than 10dB, and the average transmission coefficients in the operating frequency band, i.e., S21 and S31, are both 3.1dB, as shown in fig. 4.
The millimeter wave power divider is easy to process and low in cost, and due to the stop band characteristic of the electromagnetic band gap structure, the power divider is insensitive to assembly errors, effectively prevents electromagnetic wave leakage and reduces transmission loss.
Claims (9)
1. The utility model provides a millimeter wave power divider, its characterized in that millimeter wave power divider is piled up by eight layers of metal sheets on first layer to eighth layer and forms, set up circular through-hole array and rectangle through-hole on the metal sheet, circular through-hole is arranged according to cycle 1.86mm equidistant, and circular through-hole diameter is 1mm, and adjacent two-layer circular through-hole array staggers half millimeter wave cycle 0.93mm each other.
2. The millimeter wave power splitter of claim 1, wherein the first layer of metal plate is provided with an array of circular vias and one rectangular via; the second layer of metal plate and the third layer of metal plate are both provided with a circular through hole array and a rectangular through hole, and the two rectangular through holes of the second layer of metal plate and the third layer of metal plate are stacked to form a waveguide cavity; a circular through hole array and a rectangular through hole for electromagnetic wave coupling are arranged on the fourth layer of metal plate; a circular through hole array and a rectangular through hole are arranged on the fifth layer metal plate and the sixth layer metal plate; a circular through hole array and two rectangular through holes are formed in the seventh layer of metal plate; and a circular through hole array and two rectangular through holes are arranged on the eighth layer of metal plate.
3. The millimeter-wave power splitter of claim 1, wherein the circular array of vias is arranged around a rectangular via.
4. The millimeter wave power divider of claim 1, wherein the rectangular through holes of the first layer metal plate and the eighth layer metal plate each have a length of 2.032mm and a width of 1.016 mm.
5. The millimeter wave power splitter of claim 1, wherein the operating frequency band of the millimeter wave power splitter is the W-band of 95-204 GHz.
6. The millimeter wave power divider according to claim 1, wherein the material of the metal plate is any one of iron, aluminum, or copper.
7. The millimeter wave power splitter of claim 1, wherein the metal plates of the first through eighth layers are each 0.5mm thick.
8. The millimeter wave power splitter of claim 1, wherein the return loss bandwidth of the millimeter wave power splitter is 10.3 GHz.
9. The millimeter wave power splitter of claim 1, wherein the reflection coefficients S11 in the operating band of the millimeter wave power splitter are each greater than 10dB, and the average transmission coefficients S21 and S31 in the operating band are each 3.1 dB.
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CN112151928A (en) * | 2020-10-28 | 2020-12-29 | 四川德骏智造科技有限公司 | Millimeter wave power divider and manufacturing process thereof |
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CN112151928A (en) * | 2020-10-28 | 2020-12-29 | 四川德骏智造科技有限公司 | Millimeter wave power divider and manufacturing process thereof |
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