CN213093187U - Wafer clamping device for cleaning after CMP - Google Patents

Abstract

The utility model relates to a wafer clamping device is used in washing behind CMP, include: a turntable; the supporting parts are arranged on the turntable; the clamping parts can be arranged on the turntable in a mutually approaching/separating manner, are positioned on the outer side of the supporting part and are provided with clamping grooves; when the clamping parts are close to each other to clamp the wafer, a gap is reserved between the supporting part and the wafer, and the clamping groove is contacted with the edge of the wafer; the clamping part is clamped at the position where the edge of the wafer is not larger than 0.5mm, no circuit exists at the position, and the use performance of the subsequent wafer is not influenced, so that the wafer can be cleaned and dried, the use performance of the wafer is ensured, the integral improvement is simple, and the improvement cost is low.

Description

Wafer clamping device for cleaning after CMP

Technical Field

The utility model belongs to the technical field of the wafer is made, in particular to wafer clamping device is used in washing behind CMP.

Background

In the existing post-CMP cleaning process of a wafer, the wafer needs to be cleaned and dried, and the wafer needs to be clamped and fixed firstly during cleaning and drying, the existing wafer clamping device is in a structure as shown in fig. 1, and mainly comprises a rotary table 1, two clamping blocks 10 which can be close to or far away from each other are arranged on the rotary table 1, when the wafer 5 needs to be clamped, the clamping blocks 10 clamp the wafer 5, and then the wafer is cleaned and dried.

However, after long-time cleaning, the clamping device has the defect that when the clamping block 10 clamps a wafer, a cleaning blind spot 11 exists between the clamping block 10 and the wafer 5, so that when the wafer is cleaned, liquid is remained on the cleaning blind spot 11 and is not easy to clean and spin-dry, the cleanliness of the wafer cannot be ensured, and adverse effects are brought to subsequent processing.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming prior art not enough and providing a wafer clamping device is used in washing behind CMP, it can avoid when wasing the wafer that spin-dries, has the washing blind spot on the wafer to lead to the not clean problem of wafer washing.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a wafer clamping device for cleaning after CMP comprises:

a turntable;

the supporting parts are arranged on the turntable and used for bearing wafers;

the clamping parts are arranged on the turntable and can move close to or away from each other, the clamping parts are positioned on the outer side of the supporting part, and clamping grooves are formed in the clamping parts;

when the clamping parts are close to each other to clamp the wafer, a gap is reserved between the supporting part and the wafer, and the clamping groove is in contact with the edge of the wafer.

Further, the clamping groove includes:

a first groove surface;

a second groove surface, one end of the second groove surface intersecting one end of the first groove surface at a point;

and the linear distance between the point of contact of the first groove surface, the second groove surface and the edge of the wafer is not more than 0.5 mm.

Further, the supporting part is a PIN needle, and the PIN needle is lower than the height of the clamping groove.

Further, the PIN needle is triangular.

Furthermore, the supporting part is a supporting block, the top of the supporting block is provided with a slope surface, and the height of the slope surface is lower than that of the clamping groove;

when the clamping part clamps the wafer, the wafer moves into the clamping groove from the slope surface.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

firstly, a sectional structure of a supporting part and a clamping part is adopted, the supporting part only plays a role of initial bearing, and when the clamping part is clamped at the edge part of the wafer, a gap is reserved between the supporting part and the wafer.

And secondly, the clamping part is clamped at the position where the edge of the wafer is not more than 0.5mm, no circuit exists at the position, and the use performance of the subsequent wafer is not influenced.

The whole improvement is simple, the improvement cost is low, and the practicability and the popularization value are higher.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

FIG. 1 is a schematic diagram of a prior art structure;

fig. 2 is a schematic structural diagram of the present invention in the first embodiment;

FIG. 3 is a schematic view of another structure of the usage state of FIG. 2;

fig. 4 is a schematic structural diagram of the present invention in the second embodiment;

FIG. 5 is a schematic view of another usage state structure of FIG. 4;

wherein: the wafer cleaning device comprises a turntable 1, a supporting part 2, a clamping part 3, a clamping groove 4, a wafer 5, a clamping block 10, a cleaning blind spot 11, a first groove surface 40 and a second groove surface 41.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Example one

Referring to fig. 2, the wafer clamping device for post-CMP cleaning according to the present invention includes a turntable 1, two supporting portions 2 are disposed on the turntable 1, the supporting portion 2 is a triangular PIN, a needle point is located at the bottom of a wafer 5, two clamping portions 3 are disposed outside the supporting portion 2, a clamping groove 4 is disposed on the clamping portions 3, and the clamping groove 4 is formed by a first groove surface 40 and a second groove surface 41 which are connected to each other.

In the operation of the present embodiment, after the wafer 5 is fed, the wafer is firstly supported by the two PIN PINs, and then the two clamping portions 3 approach each other by the corresponding driving mechanism (not shown in the figure), so that the wafer 5 is clamped between the two clamping grooves 4, please refer to fig. 3; because the height of the PIN needle is lower than that of the clamping groove, in the process that the wafer is clamped, the edge of the wafer firstly moves to the corresponding second groove surface 41 from the PIN needle respectively and is finally clamped in the clamping cavity formed by the first groove surface 40 and the second groove surface 41, a gap is reserved between the PIN needle and the wafer, and therefore when the wafer is cleaned and dried, a cleaning blind spot does not exist on the wafer, and the wafer can be cleaned.

Meanwhile, the distance between the contact point of the first groove surface 40 and the second groove surface 41 with the wafer 5 and the edge of the wafer is not more than 0.5mm, and the position of the edge of the wafer which is not more than 3mm is not provided with a circuit, so that the subsequent use performance of the wafer cannot be influenced even if the position clamped by the clamping groove is not cleaned.

Example two

Referring to fig. 4, the difference between the first embodiment and the second embodiment is that the shape of the supporting portion is different, the supporting portion in the first embodiment is a supporting block, the top of the supporting block has an inclined surface that inclines upward, and the top of the supporting block is lower than the height of the clamping groove.

After the wafer is fed, the wafer is firstly supported by the two supporting blocks, the clamping parts are close to each other by the corresponding driving mechanisms, and the wafer is clamped between the two clamping grooves, please refer to fig. 5; because the slope surface is lower than the height of the clamping groove, in the process of clamping the wafer by the clamping groove, the wafer firstly enters the second groove surface along the slope surface and is finally clamped in the clamping cavity formed by the first groove surface 40 and the second groove surface 41, and a gap is reserved between the supporting block and the wafer.

Meanwhile, the distance between the contact point of the first groove surface 40 and the second groove surface 41 with the wafer 5 and the edge of the wafer is not more than 0.5mm, and the position of the edge of the wafer which is not more than 3mm is not provided with a circuit, so that the subsequent use performance of the wafer cannot be influenced even if the position clamped by the clamping groove is not cleaned.

To sum up, the wafer clamping device for post-CMP cleaning of the present invention adopts a structure of a supporting portion and a clamping portion in a sectional type, the supporting portion only plays a role of initial bearing, and when the clamping portion is clamped at the edge portion of the wafer, a gap is left between the supporting portion and the wafer; the clamping part is clamped at the position where the edge of the wafer is not larger than 0.5mm, no circuit exists at the position, and the use performance of the follow-up wafer is not affected, so that the wafer can be guaranteed to be cleaned and dried, the use performance of the wafer is guaranteed, the whole improvement is simple, the improvement cost is low, and the wafer cleaning machine has high practicability and popularization value.

The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims (5)

1. A wafer clamping device for cleaning after CMP is characterized by comprising:

a turntable;

the supporting parts are arranged on the turntable and used for bearing wafers;

the clamping parts are arranged on the turntable and can move close to or away from each other, the clamping parts are positioned on the outer side of the supporting part, and clamping grooves are formed in the clamping parts;

when the clamping parts are close to each other to clamp the wafer, a gap is reserved between the supporting part and the wafer, and the clamping groove is in contact with the edge of the wafer.

2. The post-CMP cleaning wafer chucking apparatus according to claim 1, wherein: the clamping groove includes:

a first groove surface;

a second groove surface, one end of the second groove surface intersecting one end of the first groove surface at a point;

and the linear distance between the point of contact of the first groove surface, the second groove surface and the edge of the wafer is not more than 0.5 mm.

3. The wafer clamping device for post-CMP cleaning according to claim 1 or 2, wherein: the supporting part is a PIN needle, and the PIN needle is lower than the height of the clamping groove.

4. The post-CMP cleaning wafer chucking apparatus according to claim 3, wherein: the PIN needle is triangular.

5. The wafer clamping device for post-CMP cleaning according to claim 1 or 2, wherein: the supporting part is a supporting block, the top of the supporting block is provided with a slope surface, and the height of the slope surface is lower than that of the clamping groove;

when the clamping part clamps the wafer, the wafer moves into the clamping groove from the slope surface.

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