CN218526529U

CN218526529U - Apparatus for producing of multilayer HDI circuit board

Info

Publication number: CN218526529U
Application number: CN202221822861.4U
Authority: CN
Inventors: 刘泽军
Original assignee: Pingxiang Xinrui Electronic Technology Co ltd
Current assignee: Pingxiang Xinrui Electronic Technology Co ltd
Priority date: 2022-07-15
Filing date: 2022-07-15
Publication date: 2023-02-24
Anticipated expiration: 2032-07-15

Abstract

The utility model discloses a apparatus for producing of multilayer HDI circuit board, including device main part, connecting rod and center pin, device main part lower extreme is connected with the connecting rod, and is connected with the center pin on the connecting rod, the center pin outside is connected with removes the wheel, device main part upper end is connected with the bed die, the device main part outside is connected with the backup pad, install electric telescopic handle in the device main part, and the electric telescopic handle outside is connected with the movable plate, device main part upside is provided with the mould. This apparatus for producing of multilayer HDI circuit board is provided with the movable plate, drives the movable plate through electric telescopic handle and removes, makes the movable plate drive first connecting plate and remove with the second connecting plate to make spring and stopper contact the bed die, make it extrude the bed die, thereby can make the bed die move central point and put, carry out the centre gripping to it through the movable plate, make its convenience when carrying out the during operation, the bed die takes place the displacement, leads to influencing its work.

Description

Apparatus for producing of multilayer HDI circuit board

Technical Field

The utility model relates to a production technical field of HDI circuit specifically is a apparatus for producing of multilayer HDI circuit board.

Background

The HDI circuit board is also called a high-density interconnection board, is a circuit board with higher circuit distribution density by using a micro-blind buried via technology, and has the advantages of capability of reducing the production cost of a multilayer PCB (printed circuit board), increasing the circuit density, high reliability, good electrical property and the like. And HDI circuit board need use forming die in the production and processing process.

However, the mould of current production multilayer HDI circuit board is inconvenient in use spacing to it, and inconvenient to it removes, when removing it, need carry it through the shallow or to it, make it remove, thereby it is comparatively troublesome, chinese utility model CN201921782553.1 discloses a forming die is used in HDI circuit board production, this forming die is spacing to the mould through first clamp splice and second clamp splice, thereby prevent that it from taking place the skew, but this forming die in use need insert first clamp splice and second clamp splice in the groove structure in the mould, lead to difficult the inserting, thereby inconvenient use.

We have therefore proposed an apparatus for producing a multilayer HDI circuit board so as to solve the problems set forth above.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a apparatus for producing of multilayer HDI circuit board to solve the mould in use of the current production multilayer HDI circuit board that above-mentioned background art provided inconvenient spacing to it, inconvenient removing it moreover, when removing it, need pass through the shallow or carry it, make it remove, thereby comparatively troublesome problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a apparatus for producing of multilayer HDI circuit board, includes device main part, connecting rod and center pin, device main part lower extreme is connected with the connecting rod, and is connected with the center pin on the connecting rod, the center pin outside is connected with removes the wheel, be provided with the threaded rod on the connecting rod, device main part upper end is connected with the bed die, the device main part outside is connected with the backup pad, install electric telescopic handle in the device main part, and the electric telescopic handle outside is connected with the movable plate, device main part upside is provided with the mould.

Preferably, the device body and the connecting rod are fixedly connected, the connecting rod and the central shaft are fixedly connected, and the moving wheel forms a rotating structure on the central shaft.

Preferably, the connection mode of the threaded rod and the moving wheel is contact connection, the connection mode of the threaded rod and the connecting rod is movable connection, and the threaded rod forms a moving structure on the connecting rod.

Preferably, the connection mode of the electric telescopic rod and the device main body is fixed connection, the connection mode of the electric telescopic rod and the movable plate is fixed connection, and the movable plate forms a movable structure at the upper end of the device main body through the electric telescopic rod.

Preferably, the outer side of the moving plate is connected with a first connecting plate, the outer side of the first connecting plate is connected with a second connecting plate, the outer side of the second connecting plate is connected with a spring, and the outer side of the spring is connected with a limiting block.

Preferably, the movable plates are fixedly connected with the first connecting plates, the first connecting plates are fixedly connected with the second connecting plates, and the number of the first connecting plates is twice that of the movable plates.

Compared with the prior art, the beneficial effects of the utility model are that: the production device of the multilayer HDI circuit board;

(1) The movable plate is arranged and driven to move through the electric telescopic rod, the movable plate drives the first connecting plate and the second connecting plate to move, so that the spring and the limiting block are in contact with the lower die and extrude the lower die, the lower die can be moved to the central position and clamped through the movable plate, and the lower die is convenient to move when working, and the work of the lower die is influenced.

(2) Be provided with and remove the wheel, when needs remove the device, the accessible removes the wheel and removes it, after it removes suitable position, through rotating the threaded rod, makes it remove on the connecting rod, later makes the threaded rod contact and removes the wheel to the accessible threaded rod is spacing to removing the wheel, prevents that it from removing, prevents that it from taking place the displacement at the during operation, influences the working effect.

Drawings

FIG. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a schematic side view of the present invention;

FIG. 3 is a schematic top view of the present invention;

fig. 4 is a schematic structural view of the connection rod portion of the present invention.

In the figure: 1. a device main body; 2. a connecting rod; 3. a central shaft; 4. a moving wheel; 5. a threaded rod; 6. a lower die; 7. a support plate; 8. an electric telescopic rod; 9. moving the plate; 10. an upper die; 11. a first connecting plate; 12. a second connecting plate; 13. a spring; 14. and a limiting block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a apparatus for producing of multilayer HDI circuit board, including device main part 1, connecting rod 2, center pin 3, remove wheel 4, threaded rod 5, bed die 6, backup pad 7, electric telescopic handle 8, movable plate 9, go up mould 10, first connecting plate 11, second connecting plate 12, spring 13 and stopper 14, 1 lower extreme of device main part is connected with connecting rod 2, and be connected with center pin 3 on the connecting rod 2, the 3 outside of center pin is connected with removes wheel 4, be provided with threaded rod 5 on the

connecting rod

2, 1 upper end of device main part is connected with bed die 6, 1 outside of device main part is connected with backup pad 7, install electric telescopic handle 8 in the device

main part

1, and 8 outsides of electric telescopic handle are connected with

movable plate

9, 1 upside of device main part is provided with mould 10.

The connected mode of device main part 1 and connecting rod 2 is fixed connection, and the connected mode of connecting rod 2 and center pin 3 is fixed connection, and remove wheel 4 and constitute revolution mechanic on center pin 3, the connected mode of device main part 1 and connecting rod 2 makes device main part 1 and connecting rod 2 be connected more firm, thereby prevent that it from taking place to drop, and the connected mode of connecting rod 2 and center pin 3 makes connecting rod 2 and center pin 3 be connected more firm, make and remove wheel 4 and conveniently rotate on center pin 3, make it conveniently remove.

Threaded rod 5 is connected for the contact with the connected mode that removes wheel 4, and the connected mode of threaded rod 5 and connecting rod 2 is swing joint, and threaded rod 5 constitutes removal structure on connecting rod 2, threaded rod 5 conveniently makes threaded rod 5 and remove wheel 4 with the connected mode that removes wheel 4 and contacts, thereby it is convenient to carry on spacingly to removing wheel 4 through threaded rod 5, make its convenient use, and the connected mode of threaded rod 5 and connecting rod 2 makes threaded rod 5 can remove on connecting rod 2, make its convenient use.

The connected mode of electric telescopic handle 8 and device main part 1 is fixed connection, and the connected mode of electric telescopic handle 8 and movable plate 9 is fixed connection, and movable plate 9 passes through electric telescopic handle 8 and constitutes the removal structure in device main part 1 upper end, the connected mode of electric telescopic handle 8 and device main part 1 makes the installation of electric telescopic handle 8 more firm, and the connected mode of electric telescopic handle 8 and movable plate 9 conveniently makes electric telescopic handle 8 drive movable plate 9 and removes, make it conveniently carry out the centre gripping to bed die 6, prevent that it from taking place the skew at the during operation, influence the device and use.

The movable plate 9 outside is connected with first connecting plate 11, and the first connecting plate 11 outside is connected with second connecting plate 12, and the second connecting plate 12 outside is connected with spring 13, and the spring 13 outside is connected with stopper 14, can make the bed die 6 remove the center department of device main part 1 through stopper 14 to conveniently carry out the centre gripping to it, conveniently process production through last mould 10 to it, make its conveniently use.

The connection mode of the moving plate 9 and the first connection plate 11 is fixed connection, and the connection mode of the first connection plate 11 and the second connection plate 12 is fixed connection, and the number of the first connection plate 11 is twice that of the moving plate 9, the connection mode of the moving plate 9 and the first connection plate 11 makes the connection of the moving plate 9 and the first connection plate 11 more stable, so that the second connection plate 12 is conveniently supported, and therefore the spring 13 and the limiting block 14 are conveniently supported through the second connection plate 12, so that the lower die 6 is conveniently clamped, and the lower die is conveniently used.

The working principle is as follows: when the production device of the multilayer HDI circuit board is used, firstly, the integrity of the device is checked, then the device is transported to a corresponding working position and used, then the circuit board is placed in a lower die 6, then a movable plate 9 is driven to move through an electric telescopic rod 8, the movable plate 9 drives a first connecting plate 11 and a second connecting plate 12 to move, so that a limiting block 14 is contacted with the lower die 6 and extrudes the lower die 6 to move to the central position of a device main body 1, then the movable plate 9 clamps the lower die 6, then an upper die 10 is moved downwards through an air cylinder to work,

when the movable wheel needs to be moved, the movable wheel 4 can be moved through the movable wheel 4, after the movable wheel is moved to a proper working position, the threaded rod 5 is moved on the connecting rod 2 through the movable threaded rod 5, so that the threaded rod 5 is in contact with the movable wheel 4, the threaded rod 5 limits the movable wheel 4, the movable wheel can be prevented from being displaced, the movable wheel can be prevented from being moved during working, and the movable wheel is convenient to use, and the contents which are not described in detail in the specification, such as the movable wheel 4, belong to the prior art known by technicians in the field.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a production device of multilayer HDI circuit board, includes device main part (1), connecting rod (2) and central axle (3), its characterized in that: the device is characterized in that the lower end of the device body (1) is connected with a connecting rod (2), a central shaft (3) is connected to the connecting rod (2), a moving wheel (4) is connected to the outer side of the central shaft (3), a threaded rod (5) is arranged on the connecting rod (2), a lower die (6) is connected to the upper end of the device body (1), a supporting plate (7) is connected to the outer side of the device body (1), an electric telescopic rod (8) is installed on the device body (1), a moving plate (9) is connected to the outer side of the electric telescopic rod (8), and an upper die (10) is arranged on the upper side of the device body (1).

2. A multilayer HDI wiring board production apparatus according to claim 1 wherein: the device main body (1) is fixedly connected with the connecting rod (2), the connecting rod (2) is fixedly connected with the central shaft (3), and the moving wheel (4) forms a rotating structure on the central shaft (3).

3. A multilayer HDI wiring board production apparatus according to claim 1 wherein: the connection mode of threaded rod (5) and removal wheel (4) is the contact connection, and the connection mode of threaded rod (5) and connecting rod (2) is swing joint to threaded rod (5) constitutes on connecting rod (2) and removes the structure.

4. A multilayer HDI circuit board production apparatus according to claim 1, wherein: the electric telescopic rod (8) is fixedly connected with the device main body (1), the electric telescopic rod (8) is fixedly connected with the movable plate (9), and the movable plate (9) forms a movable structure at the upper end of the device main body (1) through the electric telescopic rod (8).

5. A multilayer HDI wiring board production apparatus according to claim 1 wherein: the outer side of the moving plate (9) is connected with a first connecting plate (11), the outer side of the first connecting plate (11) is connected with a second connecting plate (12), the outer side of the second connecting plate (12) is connected with a spring (13), and the outer side of the spring (13) is connected with a limiting block (14).

6. A multilayer HDI circuit board apparatus for producing of claim 5 characterized in that: the movable plates (9) are fixedly connected with the first connecting plates (11), the first connecting plates (11) are fixedly connected with the second connecting plates (12), and the number of the first connecting plates (11) is twice that of the movable plates (9).