CN213093179U

CN213093179U - Semiconductor packaging equipment

Info

Publication number: CN213093179U
Application number: CN202022679974.0U
Authority: CN
Inventors: 李月君; 周艳红
Original assignee: East China Jiaotong University
Current assignee: East China Jiaotong University
Priority date: 2020-11-18
Filing date: 2020-11-18
Publication date: 2021-04-30
Anticipated expiration: 2030-11-18

Abstract

The utility model discloses a semiconductor packaging device, which relates to the technical field of semiconductor packaging and comprises a machine table, a welding line mechanism, a plastic packaging mechanism and a first transmission arm, wherein the welding line mechanism, the plastic packaging mechanism and the first transmission arm are arranged on the machine table; the wire bonding mechanism comprises a first shell with a hollow structure, wherein a first bearing platform for bearing a wafer, a first temperature control unit for preheating the wafer and a wire bonding device for bonding wires on the preheated wafer are arranged in the first shell; the plastic packaging mechanism comprises a second shell with a hollow structure, a second bearing platform for bearing the wafer, a second temperature control unit for preheating the wafer and a plastic packaging appliance for plastic packaging the preheated wafer are arranged in the second shell. The utility model discloses can solve among the prior art because of bonding wire equipment and plastic packaging equipment mutual independence, lead to equipment output rate low, and cause the technical problem that the wafer pollutes and damages easily when manual operation shifts.

Description

Semiconductor packaging equipment

Technical Field

The utility model relates to a semiconductor package technical field, concretely relates to semiconductor package equipment.

Background

Wire bonding and molding are key processes in the semiconductor chip packaging process. The bonding wire is used for completing circuit connection between the chip and a packaging substrate or a lead frame and the like so as to enable the chip to realize the function of electronic signal transmission; the plastic package is to cover and protect part of the structure on the surface of the wafer by using organic materials such as epoxy resin.

In the prior art, the wire bonding process and the plastic packaging process are performed in different devices, and an operator is required to transfer a wafer subjected to the wire bonding process in the wire bonding device into the plastic packaging device for plastic packaging. The wire bonding process and the plastic packaging process are both high-temperature processing processes, the wafer needs to be preheated before the wire bonding process, and after the wire bonding process is completed, the wafer is generally cooled to room temperature and then is conveyed, so that the high-temperature wafer is prevented from damaging operators in the transfer process. The above processing methods have some problems: the wafer cooling time is too long, so that the production efficiency is reduced, and meanwhile, the wafer needs to be preheated before being transmitted into the plastic packaging equipment for plastic packaging, so that the yield of the plastic packaging equipment is low; secondly, the transfer of the wafer depends on the manual operation of the operator, the production efficiency is insufficient, and the wafer is very easy to be polluted and damaged.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to prior art not enough, the utility model is to provide a semiconductor package equipment aims at solving among the prior art because of bonding wire equipment and plastic packaging equipment mutual independence, leads to equipment output rate low, and causes the technical problem that the wafer pollutes and damages easily when manual operation shifts.

In order to achieve the above purpose, the present invention is realized by the following technical solution: the semiconductor packaging equipment comprises a machine table, and further comprises a welding line mechanism, a plastic packaging mechanism and a first conveying arm which are arranged on the machine table, wherein the first conveying arm is arranged between the welding line mechanism and the plastic packaging mechanism and is used for conveying wafers processed by the welding line mechanism into the plastic packaging mechanism;

the wire welding mechanism comprises a first shell with a hollow structure, wherein a first bearing platform for bearing the wafer, a first temperature control unit for preheating the wafer and a wire welding device for welding the preheated wafer are arranged in the first shell;

the plastic packaging mechanism comprises a second shell of a hollow structure, a second bearing platform used for bearing the wafer, a second temperature control unit used for preheating the wafer and a plastic packaging appliance used for carrying out plastic packaging on the preheated wafer are arranged in the second shell.

Compared with the prior art, the beneficial effects of the utility model reside in that: through setting up welding wire mechanism and plastic packaging mechanism simultaneously on the board, be equipped with the first transmission arm that is used for conveying the wafer between welding wire mechanism and the plastic packaging mechanism, this first transmission arm can replace manual operation to realize the automatic conveying of wafer, and the wafer after the bonding wire processing is accomplished can directly be carried out the plastic packaging by first transmission arm conveying in the plastic packaging mechanism, has avoided among the prior art just transferable technique not enough after the wafer cooling, consequently, adopts the utility model discloses middle shown semiconductor package equipment can effectively guarantee the output rate, can effectively avoid wafer pollution and damage simultaneously.

According to one aspect of the above technical solution, a bernoulli chuck is disposed at an end of the first transfer arm, and the first transfer arm sucks the wafer on the first stage and places the sucked wafer on the second stage.

According to one aspect of the above technical scheme, a transfer platform is arranged between the wire bonding mechanism and the plastic packaging mechanism, the first transfer arm sucks the wafer on the first bearing platform and then places the wafer on the transfer platform, and the first transfer arm sucks the wafer on the transfer platform and places the wafer on the second bearing platform.

According to one aspect of the above technical solution, a third temperature control unit for preheating the wafer is disposed at the bottom of the transfer platform.

According to one aspect of the above technical solution, the number of the bonding wire mechanisms is greater than the number of the plastic packaging mechanisms, the wafer on each first bearing platform is sucked and placed on the transfer platform by the first transfer arm, and the wafer on the transfer platform is sucked and placed on the second bearing platform by the first transfer arm.

According to one aspect of the above technical solution, the first temperature control unit is disposed inside the first bearing platform.

According to one aspect of the above technical solution, the second temperature control unit is disposed inside the second bearing platform.

According to an aspect of the above technical solution, the semiconductor package device further includes a protection cover covering the machine.

According to the one hand of above-mentioned technical scheme, the safety cover is closing on the side of welding wire mechanism is equipped with feedstock channel, the safety cover is closing on the side of plastic envelope mechanism is equipped with discharging channel.

According to one aspect of the above technical scheme, the semiconductor packaging equipment further comprises a second conveying arm and a third conveying arm which are arranged on the machine table, the second conveying arm is arranged between the feeding channel and the welding line mechanism, and the third conveying arm is arranged between the discharging channel and the plastic packaging mechanism.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic top view of a semiconductor package device according to an embodiment of the present invention.

Fig. 2 is a front view of the semiconductor package apparatus of fig. 1.

Fig. 3 is a schematic structural diagram of a bonding wire mechanism according to an embodiment of the present invention.

Description of main component symbols:

the semiconductor packaging device 100, the machine table 10, the wire bonding mechanism 20, the first housing 21, the first support table 22, the first temperature control unit 23, the plastic packaging mechanism 30, the second housing 31, the second support table 32, the first transfer arm 40, the second transfer arm 41, the third transfer arm 42, the transfer platform 50, the protective cover 60, the feeding channel 61, the discharging channel 62, and the wafer 200.

Detailed Description

In order to make the objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. Several embodiments of the invention are given in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "left," "right," "up," "down," and the like are for illustrative purposes only and do not indicate or imply that the referenced device or element must be in a particular orientation, constructed and operated, and should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-3, an embodiment of the present invention provides a semiconductor packaging device, which relates to the technical field of semiconductor packaging, wherein the semiconductor packaging device 100 includes a machine table 10, the semiconductor packaging device 100 further includes a bonding wire mechanism 20, a plastic package mechanism 30 and a first transfer arm 40, which are disposed on the machine table 10, the first transfer arm 40 is disposed between the bonding wire mechanism 20 and the plastic package mechanism 30, and is used for transferring a wafer 200 processed by the bonding wire mechanism 20 into the plastic package mechanism 30; the machine 10 is used for carrying the bonding wire mechanism 20, the plastic sealing mechanism 30 and the first transfer arm 40.

In the present embodiment, the wire bonding mechanism 20 includes a first housing 21 having a hollow structure, and a first stage 22 for carrying the wafer 200, a first temperature control unit 23 for preheating the wafer 200, and a wire bonding apparatus (not shown) for performing wire bonding on the preheated wafer 200 are disposed in the first housing 21. The wire bonding mechanism 20 shown in this embodiment is used for wire bonding the wafer 200, and generally, metal wires such as gold wires, copper wires, and aluminum wires are used to connect the contacts on the wafer 200 with external package substrates or leads of lead frames, so that the chips can realize the function of electronic signal transmission.

Before wire bonding, the wafer 200 needs to be preheated to a certain temperature, so that the wafer 200 can reach a certain temperature, and the normal operation of wire bonding is facilitated, therefore, in this embodiment, the first temperature control unit 23 capable of preheating the wafer 200 is arranged inside the wire bonding mechanism 20, and the operation of the first temperature control unit 23 can enable the temperature of the wafer 200 to meet the condition of wire bonding.

Specifically, the first temperature control unit 23 is disposed inside the first supporting platform 22, the wafer 200 is placed on the first supporting platform 22, the first temperature control unit 23 emits a large amount of heat during operation, and the heat is conducted into the wafer 200 through the first supporting platform 22, so as to increase the temperature of the wafer 200. The first temperature control unit 23 may be a heating device such as a resistance wire, and the temperature of the wafer 200 may be effectively controlled by controlling the opening and closing and the working time of the first temperature control unit 23, so as to ensure that the temperature of the wafer 200 meets the conditions for wire bonding processing.

In the present embodiment, the molding mechanism 30 includes a second housing 31 having a hollow structure, a second stage 32 for carrying the wafer 200, a second temperature control unit for preheating the wafer 200, and a molding tool (not shown) for molding the preheated wafer 200 are disposed in the second housing 31.

The plastic packaging mechanism 30 shown in this embodiment is used for plastic packaging and wrapping the wafer 200 after wire bonding, and generally, materials such as a polyimide layer, a silica gel layer, an epoxy resin layer, a curable polymer-based material layer, and a curable resin-based material layer are coated on the surface of a structure to be plastic packaged by using methods such as compression molding, transfer molding, liquid seal molding, mold underfill, capillary underfill, vacuum lamination, spin coating, and the like, so as to protect devices, and the bonding wires of the wafer 200 need to be plastic packaged to fix and protect the bonding wires.

Similarly, the wafer 200 needs to be preheated before plastic package processing, so that the wafer 200 reaches a certain temperature, and thus the wafer 200 can normally operate in the plastic package processing, in this embodiment, a second temperature control unit (not shown) capable of preheating the wafer 200 is disposed inside the plastic package mechanism 30, and the operation of the second temperature control unit can enable the temperature of the wafer 200 to meet the condition of the plastic package processing.

Specifically, the second temperature control unit is disposed inside the second supporting platform 32, and when the wafer 200 is placed on the second supporting platform 32, the second temperature control unit emits a large amount of heat during operation, and the heat is conducted to the inside of the wafer 200 through the second supporting platform 32, so as to increase the temperature of the wafer 200. The second temperature control unit can be a heating device such as a resistance wire, and the temperature of the wafer 200 can be effectively controlled by controlling the opening and closing and the working time of the second temperature control unit so as to ensure that the temperature of the wafer 200 can meet the conditions of plastic package processing.

In the present embodiment, the first transfer arm 40 disposed between the bonding wire mechanism 20 and the molding mechanism 30 transfers the wafer 200 as follows: the first transfer arm 40 has a bernoulli chuck at its end, and the first transfer arm 40 sucks the wafer 200 on the first stage 22 and places the sucked wafer 200 on the second stage 32.

After the wafer 200 on the first stage 22 is processed by wire bonding, the central controller controls the first transfer arm 40 to move and uses the bernoulli chuck to pick up the wafer 200 on the first stage 22, and the central controller controls the first transfer arm 40 to move and place the picked-up wafer 200 on the second stage 32, thereby completing the transfer of the wafer 200 from the wire bonding process to the molding process.

Further, a transfer platform 50 is disposed between the wire bonding mechanism 20 and the plastic packaging mechanism 30, wherein a third temperature control unit for preheating the wafer 200 is disposed at a bottom of the transfer platform 50, the first transfer arm 40 sucks the wafer 200 on the first stage 22 and then places the wafer on the transfer platform 50, and the first transfer arm 40 sucks the wafer 200 on the transfer platform 50 and places the wafer on the second stage 32.

The central controller controls the first transfer arm 40 to move, sucks the wafer 200 by using the bernoulli chuck, drives the first transfer arm 40 to place the sucked wafer 200 on the transfer platform 50, and can effectively maintain the temperature of the wafer 200 by the third temperature control unit at the bottom of the transfer platform 50, and controls the first transfer arm 40 to move, sucks the wafer 200 on the transfer platform 50 by using the bernoulli chuck, and controls the first transfer arm 40 to move to place the wafer 200 on the second stage 32.

Because the time spent in the wire bonding process is longer than that in the plastic packaging process, the number of the wire bonding mechanisms 20 is greater than that of the plastic packaging mechanisms 30 in consideration of different production beats of the wire bonding process and the plastic packaging process, for example: the bonding wire mechanisms 20 are provided with three sets, the plastic sealing mechanism 30 is provided with two sets, the wafer 200 on each first bearing platform 22 is sucked by the first transfer arm 40 and placed on the transfer platform 50, and the wafer 200 on the transfer platform 50 is sucked by the first transfer arm 40 and placed on the second bearing platform 32. By optimizing the number of the wire bonding mechanisms 20 and the plastic packaging mechanisms 30, stacking on the transfer platform 50 can be effectively avoided, so as to improve the packaging efficiency of the wafer 200.

In the present embodiment, in order to improve the cleanliness of the wafer 200 during the packaging process, the semiconductor packaging apparatus 100 further includes a protective cover 60 covering the machine 10. The protective cover 60 can effectively prevent impurities such as dust in a production workshop from being attached to the surface of the wafer 200, thereby ensuring the quality of the wafer 200.

Although the wire bonding process and the plastic packaging process are key processes in semiconductor packaging, the complete packaging process of the semiconductor also includes other processes, in order to facilitate the connection between the welding process and the previous process and the connection between the plastic packaging process and the subsequent process, the side surface of the protective cover 60 close to the wire bonding mechanism 20 is provided with a feeding channel 61, and the side surface of the protective cover 60 close to the plastic packaging mechanism 30 is provided with a discharging channel 62.

Further, the semiconductor packaging apparatus 100 further includes a second transfer arm 41 and a third transfer arm 42 disposed on the machine table 10, wherein the second transfer arm 41 is disposed between the feeding channel 61 and the wire bonding mechanism 20, and the second transfer arm 41 is used for placing the wafer 200 processed in the previous process on the first stage 22; the third transfer arm 42 is disposed between the discharge channel 62 and the plastic packaging mechanism 30, and the third transfer arm 42 is configured to transfer the packaged wafer 200 after the plastic packaging process is completed to a working area of a subsequent process; the semiconductor packaging apparatus 100 has the capability of being connected with the front and rear processes by the arrangement of the second transfer arm 41 and the third transfer arm 42.

The semiconductor package apparatus 100 shown in the present embodiment has the following advantageous effects: through setting up welding wire mechanism 20 and plastic packaging mechanism 30 simultaneously on board 10, be equipped with the first transmission arm 40 that is used for conveying wafer 200 between welding wire mechanism 20 and the plastic packaging mechanism 30, this first transmission arm 40 can replace manual operation to realize the automatic conveying of wafer 200, wafer 200 after the bonding wire processing is accomplished can directly be conveyed to the plastic packaging mechanism 30 by first transmission arm 40 and carry out the plastic packaging, the technique that just can shift after having avoided wafer 200 to cool off among the prior art is not enough, consequently, adopt the utility model discloses in the middle of shown semiconductor package equipment 100, can effectively guarantee the output rate, can effectively avoid wafer 200 to pollute and damage simultaneously.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several changes and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A semiconductor packaging device comprises a machine table, and is characterized in that: the semiconductor packaging equipment further comprises a welding line mechanism, a plastic packaging mechanism and a first conveying arm which are arranged on the machine table, wherein the first conveying arm is arranged between the welding line mechanism and the plastic packaging mechanism and is used for conveying the wafer processed by the welding line mechanism into the plastic packaging mechanism;

2. The semiconductor package device of claim 1, wherein: and the end part of the first conveying arm is provided with a Bernoulli sucker, the first conveying arm sucks the wafer on the first bearing platform and places the sucked wafer on the second bearing platform.

3. The semiconductor package device of claim 2, wherein: a transfer platform is arranged between the welding line mechanism and the plastic packaging mechanism, the first transfer arm absorbs the wafer on the first bearing platform and then places the wafer on the transfer platform, and the first transfer arm absorbs the wafer on the transfer platform and places the wafer on the second bearing platform.

4. The semiconductor package device of claim 3, wherein: and a third temperature control unit for preheating the wafer is arranged at the bottom of the transfer platform.

5. The semiconductor package device of claim 3, wherein: the number of the welding line mechanisms is more than that of the plastic packaging mechanisms, the wafer on each first bearing platform is sucked and placed on the transfer platform through the first conveying arm, and the wafer on the transfer platform is sucked and placed on the second bearing platform through the first conveying arm.

6. The semiconductor package device of claim 1, wherein: the first temperature control unit is arranged inside the first bearing platform.

7. The semiconductor package device of claim 1, wherein: the second temperature control unit is arranged in the second bearing platform.

8. The semiconductor package device of claim 1, wherein: the semiconductor packaging equipment further comprises a protective cover arranged on the machine table in a covering mode.

9. The semiconductor package device of claim 8, wherein: the protective cover is closing on the side face of the welding line mechanism is provided with a feeding channel, and the protective cover is closing on the side face of the plastic packaging mechanism is provided with a discharging channel.

10. The semiconductor package apparatus of claim 9, wherein: the semiconductor packaging equipment further comprises a second conveying arm and a third conveying arm which are arranged on the machine table, the second conveying arm is arranged between the feeding channel and the welding line mechanism, and the third conveying arm is arranged between the discharging channel and the plastic packaging mechanism.