CN105108258B - Vacuum reaction force welding method and device - Google Patents
Vacuum reaction force welding method and device Download PDFInfo
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- CN105108258B CN105108258B CN201510617638.4A CN201510617638A CN105108258B CN 105108258 B CN105108258 B CN 105108258B CN 201510617638 A CN201510617638 A CN 201510617638A CN 105108258 B CN105108258 B CN 105108258B
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- vacuum
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- vacuum eutectic
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- eutectic chamber
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a vacuum reaction force welding method, which comprises the following steps: the chip is fixed on the substrate through solder to form a semi-finished product; placing the semi-finished product into a vacuum eutectic cavity of a vacuum eutectic furnace; vacuumizing the vacuum eutectic cavity; preheating a vacuum eutectic cavity to slowly raise the temperature; rapidly heating the vacuum eutectic cavity to melt the solder; applying acting force to the vacuum eutectic cavity to enable the vacuum eutectic cavity to descend and then accelerate to rise; forcibly refrigerating the outside of the vacuum eutectic cavity, and introducing protective gas into the inside of the vacuum eutectic cavity; and releasing the vacuum state of the vacuum eutectic cavity after the solder is solidified. The invention also discloses a welding device adopting the vacuum reaction force welding method. The invention can apply acceleration reaction force to the chip on the premise of avoiding chip damage, and can effectively reduce the voidage of the welding spot.
Description
Technical field
The present invention relates to Vacuum Eutectic welder, more particularly to vacuum reaction force welding method and its device.
Background technology
Eutectic solder technology is used widely in microelectronics with field of optoelectronic packaging, such as chip it is bonding with substrate,
Substrate is bonding with shell, package lid is encapsulated etc..Solder joint as device connecting material, be responsible for machinery, circuit connection with
And the task such as heat exchange, compared to common conductive adhesive mode, eutectic solder technology has that thermal conductivity is high, resistance is small, can
By the advantage such as property is strong, the interconnection of all kinds of high-power or high frequency chip and substrate, substrate and shell is particularly well-suited to.It is higher to chip
The power device of cooling requirements or reliability requirement is welded using eutectic, such as IGBT encapsulation, microwave power device, high-power
LED chip, laser diode, multi-chip module, Aero-Space electronic device etc..Influenceing the principal element of eutectic welding quality has
Temperature rate, eutectic pressure, temperature homogeneity, protective atmosphere and solder matching etc..These factors are dealt with improperly and are easily produced
Intermetallic compounds layer (IMC) is blocked up, skewness, voidage is higher, triggers reliability hidden danger.
Eutectic welding equipment technique main at present has：Infrared reflow brazier, the eutectic machine with suction nozzle and tweezers, vacuum
Eutectic furnace etc., the said equipment and process have the following disadvantages：
(1) infrared reflow brazier has that warming and cooling rate is slow, warm area is uneven, transmit process is easily caused core in the presence of shake
Piece is shifted；
(2) existed using the eutectic machine with suction nozzle and tweezers and yielded poorly, easily chip especially photoelectricity class chip is caused to damage
Wound, influence product photoelectric properties, while because using chip eutectic one by one, if multi-chip module easily causes the preeutectic core in part
Length of a film time chip repeats to be heated to cause chip material performance degradation, and solder repeatedly melts life-span and the performance of influence welding；
(3) Vacuum Eutectic stove has temperature rate higher, but to ensure eutectic quality, the tool pair of normal usual additional
Chip applies pressure, is adapted to larger chip encapsulation, is not suitable for the fragile chip of small chip and surface.
The content of the invention
In order to overcome the deficiencies in the prior art, an object of the present invention is to provide vacuum reaction force welding method,
Acceleration reaction force can be applied to chip on the premise of avoiding chip from damaging, can effectively reduce solder joint voidage.
The second object of the present invention is to provide vacuum reaction force welder.
An object of the present invention is realized using following technical scheme：
Vacuum reaction force welding method, comprises the following steps：
S1. chip forms semi-finished product by solder die bond in substrate；
S2. semi-finished product are inserted in the Vacuum Eutectic chamber of Vacuum Eutectic stove；
S3. Vacuum Eutectic chamber is vacuumized；
S4. preheating Vacuum Eutectic chamber, makes temperature slowly rise；
S5. rapid heating, vacuum eutectic chamber, melts solder；
S6. active force is applied to Vacuum Eutectic chamber, Vacuum Eutectic chamber is accelerated after declining；
S7. to carrying out forced refrigeration outside Vacuum Eutectic chamber, inside is passed through protective gas；
S8. the vacuum state in Vacuum Eutectic chamber is released after solder solidification.
Preferably, in the step S6, Vacuum Eutectic chamber is driven by drive mechanism and first accelerates to decline with acceleration a1,
Then slowed down with acceleration a2, then accelerated with acceleration a3, finally being slowed down with acceleration a4 rises.
Preferably, acceleration a2>Acceleration a1, acceleration a3>Acceleration a4.
The second object of the present invention is realized using following technical scheme：
Using the vacuum reaction force welder of the vacuum reaction force welding method, including cabinet, for inserting
The Vacuum Eutectic chamber of semi-finished product to be welded, temperature elevation system, cooling system and shift drive mechanism, Vacuum Eutectic chamber are located in cabinet
And be vertically slidably matched with cabinet；Shift drive mechanism is installed in cabinet, is driven to be connected with Vacuum Eutectic chamber and is used in combination
In Vacuum Eutectic chamber is driven, vertically speed change is moved；In Vacuum Eutectic chamber, cooling system is located at cabinet to temperature elevation system
It is interior and outside Vacuum Eutectic chamber.
Preferably, Vacuum Eutectic chamber includes metallic cavity and vacuum extractor, and the cavity wall of metallic cavity is provided with stomata, the gas
Hole is connected through vacuum pipe with vacuum extractor.
Preferably, the bottom of chamber in Vacuum Eutectic chamber is provided with the draw-in groove for clamp semi-finished product to be welded, the vacuum on the outside of draw-in groove
Eutectic chamber bottom of chamber is bolted with the retaining washer for fixing semi-finished product to be welded.
Preferably, temperature elevation system includes heating plate and infrared heating pipe, and heating plate is embedded in the bottom of chamber in Vacuum Eutectic chamber, red
Pipe heater outside is fixed on the chamber top in Vacuum Eutectic chamber.
Preferably, the periphery in Vacuum Eutectic chamber is covered with retractable insulation shell.
Preferably, cooling system include radiator, for the air cooling equipment dried to Vacuum Eutectic chamber and for vacuum
The air-cooling apparatus of cryogenic gas are sprayed in eutectic chamber, and radiator is connected to the outer bottom in Vacuum Eutectic chamber, the gentle cold charge of air cooling equipment
Put and be mounted in cabinet and be located at outside Vacuum Eutectic chamber.
Preferably, support member, slide rail, sliding block are additionally provided with cabinet, shift drive mechanism is linear electric motors, linear electric motors
Output end is connected with support member, and Vacuum Eutectic chamber is connected by support member with sliding block, and sliding block is slidably matched with slide rail, and slide rail is fixed
In in cabinet.
Compared to existing technology, the beneficial effects of the present invention are：
The present invention is by rapid temperature rise and drop, vacuum, pressurization, formation and solder compositions and liter due to intermetallic compounds layer
Temperature lowering curve is closely related, therefore eutectic solder passes through to be rapidly heated and annealing can reach optimal welding effect.And solder joint is empty
Undischarged bubble formation when typically by the oxide-film of solder surface, dust particle, fusing, the present invention is by vacuum, to core
Piece applies the measures such as pressure, and overweight principle, i.e., the reaction force for being produced by acceleration are especially used in pressure process
To press semi-finished product, in the absence of the damage that ambient pressure is caused to chip, while good welds effect is realized, improve device
The reliability of part, can effectively reduce solder joint voidage.
In addition, traditional handicraft repeatedly must carry out heating cooling in welding process to chip, solder and substrate, for most
Early for the chip that is welded, this process must be welded until whole plate and completed repeatedly, exist in the process chip damage,
Solder produces the security risks such as cavity, chip displacement, and the present invention can realize once welding number simultaneously in Vacuum Eutectic chamber
Ten chips, compared with conventional press eutectic welding procedure must carry out welding chip one by one, production efficiency can be lifted
Decades of times, and the present invention can effectively solve problem above.
Brief description of the drawings
Fig. 1 is the cabinet schematic diagram of vacuum reaction force welder of the present invention；
Fig. 2 is the front schematic view in the cabinet of vacuum reaction force welder of the present invention；
Fig. 3 is the side schematic view in the cabinet of vacuum reaction force welder of the present invention；
Fig. 4 is Vacuum Eutectic chamber and the cooperation schematic diagram of insulation shell of vacuum reaction force welder of the present invention；
Fig. 5 is operating temperature, vacuum and the time relationship schematic diagram of vacuum reaction force welder of the present invention；
Fig. 6 is eutectic section solder temperature, chip and the substrate phase that the present invention is vacuum reaction force welder of the present invention
The relation schematic diagram of interreaction force；
Fig. 7 is that the present invention is the acceleration change schematic diagram of vacuum reaction force welder of the present invention.
In figure：1st, base；2nd, casing；3rd, safety door；4th, status indicator lamp；5th, touch-screen；6th, Vacuum Eutectic chamber；601st, block
Groove；602nd, retaining washer；603rd, stomata；7th, heating plate；8th, infrared heating pipe；9th, radiator；10th, air cooling system；11st, insulation cladding
Body；12nd, linear electric motors；13rd, slide rail；1301st, sliding block；14th, support frame；15th, support member；16th, semi-finished product.
Specific embodiment
Below, with reference to accompanying drawing and specific embodiment, the present invention is described further：
Vacuum reaction force welding method, comprises the following steps：
S1. chip forms semi-finished product by solder die bond in substrate；
S2. semi-finished product are inserted in the Vacuum Eutectic chamber of Vacuum Eutectic stove；
S3. Vacuum Eutectic chamber is vacuumized；
S4. preheating Vacuum Eutectic chamber, makes temperature slowly rise；
S5. rapid heating, vacuum eutectic chamber, melts solder；
S6. active force is applied to Vacuum Eutectic chamber, Vacuum Eutectic chamber is accelerated after declining；
S7. to carrying out forced refrigeration outside Vacuum Eutectic chamber, inside is passed through protective gas；
S8. the vacuum state in Vacuum Eutectic chamber is released after solder solidification.
Insulation shell can be set outside Vacuum Eutectic chamber, Vacuum Eutectic chamber during with to heating is incubated.Above-mentioned steps
In S3, can be determined whether to add protective atmosphere or reducing atmosphere according to actual conditions.In step s 4, by temperature elevation system at a slow speed
It is uniform to heat up, system temperature is evenly distributed, heating curve is as shown in figure 5, enter certain holding stage after heating up at a slow speed.In step
In rapid S5, this example is set when temperature is more than 180 DEG C, into rapid heat-up stage (the eutectic section shown in Fig. 5), Vacuum Eutectic
Cavity temperature is promoted to rapidly more than 300 DEG C, and solder melts and enters wetting state (definition：Fusion welding is by weldering metal watch
Face forms the process of uniform, smooth, continuous and adhesion-tight alloy, referred to as soaks), a solder joint for high-quality is obtained,
Whole weld gaps must be adequately filled up in liquid solder, it is ensured that welding quality.
In step s 6, the operation accelerated after declining to Vacuum Eutectic chamber, it is therefore an objective to make semi-finished product be in overweight shape
State, while semi-finished product are overweight, as shown in fig. 6, now temperature curve starts rapid decrease, while Vacuum Eutectic chamber is due to adding
Retarded motion produces chip to the reaction force of substrate, forms pressure, and in the temperature spot of solder solidification, chip is because of serious overweight product
The larger pressure of life is extruded to orientation substrate, connects chip, solder and substrates into intimate, while helping to reduce solder joint cavity
Rate, optimizes welding effect.In step S7, forced refrigeration can be carried out to Vacuum Eutectic chamber by cooling system.
As one preferred embodiment, in the step S6, by drive mechanism drive Vacuum Eutectic chamber first with
Acceleration a1 accelerates to decline, and is then slowed down with acceleration a2, then is accelerated with acceleration a3, is finally subtracted with acceleration a4
Speed rises.Wherein, acceleration a2>Acceleration a1, acceleration a3>Acceleration a4.
And the drive mechanism of this example drives the motion of Vacuum Eutectic chamber to produce acceleration, as shown in Figure 7.t0-t1Moment, vacuum
Eutectic chamber is with about 0.9g (g=9.8m/s2) acceleration accelerate downwards, chip is in slight state of weightlessness, but does not influence
The combination (chip is about 0.1mg to the pressure of solder and substrate, and m is chip weight) of chip and substrate；t1-t2Moment, vacuum is common
Slowed down with the acceleration of about 5g and moved downward until minimum point, in serious overweight state, chip is to solder and base for chip in brilliant chamber
Plate presses (chip is about 6mg to the pressure of solder and substrate)；t2-t3Moment, Vacuum Eutectic chamber with the acceleration of about 5g accelerate to
Upper motion, chip is in serious overweight state, and to solder and substrate pressure, (chip is about chip to the pressure of solder and substrate
6mg)；t3-t4At the moment, Vacuum Eutectic chamber is with the upward retarded motion of the acceleration of about 0.9g until returning to original position stop, chip is in
Slight state of weightlessness (chip is about 0.1mg to the pressure of solder and substrate).
Vacuum Eutectic chamber with 5g acceleration movements simultaneously, start cooling system fast cooling is carried out to Vacuum Eutectic chamber.
As shown in Fig. 1~5, using the vacuum reaction force welder of the vacuum reaction force welding method, including
Cabinet, Vacuum Eutectic chamber 6, temperature elevation system, cooling system and shift drive mechanism for inserting semi-finished product to be welded 16, vacuum
Eutectic chamber 6 is located in cabinet and is slidably matched vertically with cabinet；Shift drive mechanism is installed in cabinet, common with vacuum
Brilliant chamber 6 drives and is connected and for driving the vertically speed change movement of Vacuum Eutectic chamber 6；Temperature elevation system is located at Vacuum Eutectic chamber 6
Interior, cooling system is in cabinet and is located at outside Vacuum Eutectic chamber 6.
Vacuum Eutectic chamber 6 is driven to make variable motion in cabinet by shift drive mechanism, so that semi-finished product to be welded
Chip on 16 forms reaction force pressure to substrate, so as to chip, solder and substrates into intimate are connected, while helping to reduce
Solder joint voidage.During this period, in the presence of temperature elevation system, cooling system, solder passes through to be rapidly heated and annealing can reach
Optimal welding effect.
As shown in figure 1, the cabinet of this example includes base 1, casing 2, safety door 3, status indicator lamp 4, the base 1 of touch-screen 5
Positioned at the bottom of casing 2, for supporting whole welder.The casing 2 is located on base 1, for protecting in welder
Portion's structure, and isolation internal heat.Safety door 3 is located at the front of casing 2, can be by casing 2 described in push-pull fashion either on or off.
The status indicator lamp 4 is located on casing 2, for the working condition of instruction device.The touch-screen 5, positioned at the side of box body 2
Face, for input operation control instruction.The back of casing 2 can set up radiator fan, for being radiated to device inside.
As shown in figure 4, the Vacuum Eutectic chamber 6 of this example, including metallic cavity and vacuum extractor, the cavity wall of metallic cavity is opened
There is stomata 603, the stomata 603 is connected through vacuum pipe with vacuum extractor.Specifically, metallic cavity can be semiclosed using one
Cavity combination metallic sealed cover is constituted, and shape and the semi-enclosed cavity opening shape of metallic sealed cover coincide, for sealing vacuum
Eutectic chamber 6.Pumped vacuum systems specifically includes vavuum pump, vacuum pipe, air accumulator, vacuum valve, and the pumped vacuum systems is placed in very
Outside empty eutectic chamber 6, it is connected with stomata 603 by vacuum pipe, for being vacuumized to Vacuum Eutectic chamber 6.
As shown in figure 4, the bottom of chamber in Vacuum Eutectic chamber 6 is provided with the draw-in groove 601 for clamp semi-finished product 16 to be welded, draw-in groove
The bottom of chamber of Vacuum Eutectic chamber 6 in 601 outsides is bolted with the retaining washer 602 for fixing semi-finished product to be welded 16.The shape of draw-in groove 601
Shape size is coincide with the shape size of semi-finished product to be welded 16, and for being positioned to semi-finished product 16, retaining washer 602 can be locked
Semi-finished product to be welded 16.
As shown in figure 4, the temperature elevation system of this example includes heating plate 7 and infrared heating pipe 8, heating plate 7 is embedded in vacuum and is total to
The bottom of chamber in brilliant chamber 6, infrared heating pipe 8 is fixed on the chamber top in Vacuum Eutectic chamber 6.Heating plate 7 is set to generate heat by electric heating mode of heating,
And then Vacuum Eutectic chamber 6 quickly heated from the bottom up；By the infrared heating pipe 8 of infrared heating mode, from the bottom up
Vacuum Eutectic chamber 6 is quickly heated.
As shown in figure 4, to realize the insulation in heating process, the periphery in the Vacuum Eutectic chamber 6 of this example is covered with retractable
Insulation shell 11.When Vacuum Eutectic chamber 6 needs motion, insulation shell 11 is opened, and Vacuum Eutectic chamber 6 can be from insulation shell 11
Middle removal.Insulation shell 11 can be formed using two half-shell docking, ordered about by outside cylinder and opened or close.
As shown in Figure 2, Figure 4 shows, the cooling system of this example includes radiator 9, the air-cooled dress for being dried to Vacuum Eutectic chamber 6
Put and for the air-cooling apparatus to the injection of Vacuum Eutectic chamber 6 cryogenic gas, radiator 9 is connected to the outer bottom in Vacuum Eutectic chamber 6,
Air cooling equipment and air-cooling apparatus are mounted in cabinet and are located at outside Vacuum Eutectic chamber 6.Radiator 9 can directly to Vacuum Eutectic chamber
6 are radiated, and air cooling equipment can accelerate air flow to radiate Vacuum Eutectic chamber 6 using fan；Air-cooling apparatus can pass through
Cryogenic gas directly to vacuum chamber radiate by injection.
As shown in Figure 2 and Figure 3, moved to realize the stable speed change in Vacuum Eutectic chamber 6, support member 15 is additionally provided with cabinet, is slided
Rail 13, sliding block 1301, shift drive mechanism are linear electric motors 12, and the output end of linear electric motors 12 is connected with support member 15, vacuum
Eutectic chamber 6 is connected by support member 15 with sliding block 1301, and sliding block 1301 is slidably matched with slide rail 13, and slide rail 13 is fixed on cabinet
It is interior.Linear electric motors 12 are placed vertically, for producing acceleration upper and lower vertically.Slide rail 13 and sliding block 1301 are arranged at linear electric motors
12 left and right sides, with improving stability.Slide rail 13 can be fixed in cabinet by a support frame 14.
Additionally, PLC control system can be set up, by controlling the vavuum pump and switch valve of pumped vacuum systems, temperature elevation system, cold
But the servo-driver of the temperature controller of system and linear electric motors 12 realizes logic, the motion to vacuum reaction force welder
And process control.
It will be apparent to those skilled in the art that technical scheme that can be as described above and design, make other various
It is corresponding to change and deformation, and all these change and deformation should all belong to the protection domain of the claims in the present invention
Within.
Claims (10)
1. vacuum reaction force welding method, it is characterised in that comprise the following steps：
S1. chip forms semi-finished product by solder die bond in substrate；
S2. semi-finished product are inserted in the Vacuum Eutectic chamber of Vacuum Eutectic stove；
S3. Vacuum Eutectic chamber is vacuumized；
S4. preheating Vacuum Eutectic chamber, makes temperature slowly rise；
S5. rapid heating, vacuum eutectic chamber, melts solder；
S6. active force is applied to Vacuum Eutectic chamber, Vacuum Eutectic chamber is accelerated after declining；
S7. to carrying out forced refrigeration outside Vacuum Eutectic chamber, inside is passed through protective gas；
S8. the vacuum state in Vacuum Eutectic chamber is released after solder solidification.
2. vacuum reaction force welding method according to claim 1, it is characterised in that in the step S6, pass through
Drive mechanism is driven Vacuum Eutectic chamber and is first accelerated to decline with acceleration a1, is then slowed down with acceleration a2, then with acceleration
A3 accelerates, and finally being slowed down with acceleration a4 rises.
3. vacuum reaction force welding method according to claim 2, it is characterised in that acceleration a2>Acceleration a1, plus
Speed a3>Acceleration a4.
4. using the vacuum reaction force welder of vacuum reaction force welding method described in any one of claims 1 to 3, its
It is characterised by, including cabinet, the Vacuum Eutectic chamber for inserting semi-finished product to be welded, temperature elevation system, cooling system and speed change are driven
Motivation structure, Vacuum Eutectic chamber is located in cabinet and is slidably matched vertically with cabinet；Shift drive mechanism is installed on cabinet
It is interior, driven with Vacuum Eutectic chamber and be connected and for driving the vertically speed change movement of Vacuum Eutectic chamber；Temperature elevation system is located at true
In empty eutectic chamber, cooling system is in cabinet and is located at outside Vacuum Eutectic chamber.
5. vacuum reaction force welder according to claim 4, it is characterised in that Vacuum Eutectic chamber includes wire chamber
Body and vacuum extractor, the cavity wall of metallic cavity are provided with stomata, and the stomata is connected through vacuum pipe with vacuum extractor.
6. vacuum reaction force welder according to claim 5, it is characterised in that the bottom of chamber in Vacuum Eutectic chamber is provided with
For the draw-in groove of clamp semi-finished product to be welded, the Vacuum Eutectic chamber bottom of chamber on the outside of draw-in groove is bolted with for fixing semi-finished product to be welded
Retaining washer.
7. vacuum reaction force welder according to claim 4, it is characterised in that temperature elevation system include heating plate and
Infrared heating pipe, heating plate is embedded in the bottom of chamber in Vacuum Eutectic chamber, and infrared heating pipe is fixed on the chamber top in Vacuum Eutectic chamber.
8. vacuum reaction force welder according to claim 7, it is characterised in that the peripheral shroud in Vacuum Eutectic chamber
There is retractable insulation shell.
9. vacuum reaction force welder according to claim 4, it is characterised in that cooling system include radiator,
Air-cooling apparatus for the air cooling equipment dried to Vacuum Eutectic chamber and for spraying from cryogenic gas to Vacuum Eutectic chamber, radiator
The outer bottom in Vacuum Eutectic chamber is connected to, air cooling equipment and air-cooling apparatus are mounted in cabinet and are located at outside Vacuum Eutectic chamber.
10. the vacuum reaction force welder according to any one of claim 4~9, it is characterised in that is also set in cabinet
There are support member, slide rail, sliding block, shift drive mechanism is linear electric motors, and the output end of linear electric motors is connected with support member, and vacuum is common
Brilliant chamber is connected by support member with sliding block, and sliding block is slidably matched with slide rail, and slide rail is fixed in cabinet.
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| CN201510617638.4A CN105108258B (en) | 2015-09-23 | 2015-09-23 | Vacuum reaction force welding method and device |
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| CN201510617638.4A CN105108258B (en) | 2015-09-23 | 2015-09-23 | Vacuum reaction force welding method and device |
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| CN105108258B true CN105108258B (en) | 2017-07-07 |
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| CN109285816B (en) * | 2017-07-19 | 2020-09-22 | 成都鼎桥通信技术有限公司 | Thin film heating plate assembly and electronic equipment |
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| CN102528194A (en) * | 2010-12-15 | 2012-07-04 | 无锡华测电子系统有限公司 | Vacuum eutectic welding method |
| US8685833B2 (en) * | 2012-04-02 | 2014-04-01 | International Business Machines Corporation | Stress reduction means for warp control of substrates through clamping |
| CN104002003B (en) * | 2014-06-10 | 2016-01-13 | 北京时代民芯科技有限公司 | A kind of vacuum brazing load process without the need to the low voidage of load |
| CN104148759A (en) * | 2014-08-07 | 2014-11-19 | 托伦斯精密机械（上海）有限公司 | Vacuum brazing method |
| CN204954097U (en) * | 2015-09-23 | 2016-01-13 | 广州硅能照明有限公司 | Vacuum reaction force welding set |
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Address after: 510000 Room 201, building A4, No. 11, Kaiyuan Avenue, Huangpu District, Guangzhou, Guangdong Patentee after: Silicon energy photoelectric semiconductor (Guangzhou) Co.,Ltd. Address before: 510000 second floor, building A4, No. 11, Kaiyuan Avenue, Science City, Guangzhou high tech Industrial Development Zone, Guangzhou, Guangdong Province Patentee before: GUANGZHOU LEDTEEN OPTOELECTRONICS Co.,Ltd. |