CN213091016U - High-precision temperature measuring system component - Google Patents
High-precision temperature measuring system component Download PDFInfo
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- CN213091016U CN213091016U CN202022185181.3U CN202022185181U CN213091016U CN 213091016 U CN213091016 U CN 213091016U CN 202022185181 U CN202022185181 U CN 202022185181U CN 213091016 U CN213091016 U CN 213091016U
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Abstract
The utility model relates to a high-accuracy temperature measurement system component, including lower carrier, be located the circuit board of downloading the utensil below and be located the top board of downloading the utensil top, lower carrier on be provided with first recess, this first recess bottom central authorities are provided with the second recess, the second recess in install thermistor, the both sides that first recess is located the second recess respectively install at least one probe, every probe lower extreme all links to each other with the circuit board, the probe can stretch out and draw back from top to bottom, thermistor's electrode portion and probe correspond and be connected. The utility model discloses a thermistor comes the temperature of real-time response piece that awaits measuring, overcomes the unsafe problem of temperature that the temperature measurement board set for the temperature and the actual perception temperature difference of product lead to greatly, promotes the measuring accuracy of board greatly, especially in the application of multistation batch test, uses this structure to improve the effect and is showing.
Description
Technical Field
The utility model relates to a quartz crystal syntonizer test equipment technical field especially relates to a high accuracy temperature system component of measurationing.
Background
The quartz crystal resonator is a temperature sensitive element, and the frequency can deviate a certain amount at different temperatures, so that a temperature frequency curve is an important characteristic of the quartz crystal. Especially in the process of mass test, the temperature induced at different stations is different, which causes distortion of the test frequency curve and large dispersion difference, so the problem of temperature sampling needs to be improved.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a high-precision temperature measuring system component which can detect the sensing temperature of a piece to be measured at each station in real time and overcome the problem that the set temperature of a temperature measuring machine is different from the actual sensing temperature of the piece to be measured, thereby improving the distortion of a temperature frequency curve; meanwhile, the temperature sampling is carried out by using independent thermistors at different stations, so that the dispersion difference of temperature frequency curves is reduced, the frequency curves are more concentrated, and the testing precision is improved.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a high-accuracy temperature measuring system component, includes the lower carrier, is located the circuit board of downloading the utensil below and is located the top board that downloads the utensil top, the lower carrier on be provided with first recess, this first recess bottom center is provided with the second recess, the second recess in install thermistor, first recess be located the both sides of second recess and respectively install at least one probe, every probe lower extreme all links to each other with the circuit board, the probe can stretch out and draw back from top to bottom, thermistor's electrode portion and circuit board correspond and be connected.
As right technical scheme a supplement, the top board lower extreme be provided with the boss, the size of this boss is less than the size of first recess.
As a supplement to the technical solution of the present invention, the thermistor selects a negative temperature coefficient thermistor.
As a supplement to the technical solution of the present invention, the circuit board selects a printed circuit board for use.
As a supplement to the technical solution of the present invention, the length of the probe is h1, the length of the probe under pressure can be shortened to be less than h1, the pressure is cancelled to recover to the length h1, the distance from the upper surface of the thermistor to the lower surface of the lower carrier is h2, and h1 is greater than h 2.
As a supplement to the technical solution of the present invention, the distance from the upper surface of the thermistor to the lower surface of the second groove is h3, the distance from the lower surface of the first groove to the lower surface of the second groove is h4, h3 > h4 or h4-h3<200 μm.
As right technical scheme a supplement, first recess be located the both sides of second recess and respectively install two probes, the second recess in be provided with two internal electrodes, thermistor two electrode portion have, thermistor electrode portion correspond through soldering tin and two internal electrodes respectively and be connected, internal electrode be connected to respectively on two of them probes through the inside circuit of lower carrier, the probe correspond the electrode portion of intercommunication circuit board respectively.
Has the advantages that: the utility model relates to a high-accuracy temperature system component of measurationing makes thermistor directly paste dress to await measuring a surface through design top board and spring probe, utilizes thermistor to monitor the temperature variation of product, and the temperature of each station piece that awaits measuring of real-time induction has overcome the different problem of settlement temperature and the actual perception temperature of product among the temperature test, avoids the frequency curve distortion, and every station can adopt independent temperature monitoring, in the application of multistation batch test, this scheme improvement effect is showing.
Drawings
FIG. 1 is a sectional view of the structure of the present invention;
FIG. 2 is a cross-sectional view of the lower carrier structure of the present invention (without the probe installed);
fig. 3 is a cross-sectional view of the lower carrier structure of the present invention (mounting probe);
FIG. 4 is a sectional view of the application case of the present invention (placing the object to be tested);
fig. 5 is a structural sectional view (64 stations) of an application case of the present invention;
fig. 6 is a top view of the application case circuit board of the present invention (64 stations);
fig. 7 is a top view of the carrier under the application case of the present invention (64 stations);
fig. 8 is a cross-sectional view (64-station) of the upper platen of the present invention.
The figure is as follows: 1. the device comprises a circuit board, 2, a probe, 3, a lower carrier, 4, an upper pressure plate, 5, a thermistor, 31, a first groove, 32, a second groove, 33, a hole, 34, an internal electrode, 41, a boss, 100 and a piece to be detected.
Detailed Description
The present invention will be further described with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes and modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope of the appended claims.
The utility model discloses an embodiment relates to a high-accuracy temperature measurement system component, as shown in fig. 1-8, including lower carrier 3, be located circuit board 1 of lower carrier 3 below and be located the top board 4 of lower carrier 3 top, lower carrier 3 on be provided with first recess 31, this first recess 31 bottom central authorities are provided with second recess 32, second recess 32 in install thermistor 5, first recess 31 be located the both sides of second recess 32 and respectively install at least one probe 2, 2 lower extremes of every probe all link to each other with circuit board 1, probe 2 can stretch out and draw back from top to bottom, thermistor 5 electrode portion and circuit board 1 correspond and be connected.
The lower end of the upper pressure plate 4 is provided with a boss 41, and the size of the boss 41 is smaller than that of the first groove 31, so that the boss 41 can extend into the first groove 31.
The thermistor 5 is a negative temperature coefficient thermistor.
The circuit board 1 is a printed circuit board.
The length of the probe 2 is h1, a spring is designed in the probe 2, the length of the probe 2 under pressure can be shortened to be less than h1, the pressure is cancelled to be restored to the length h1, the distance from the upper surface of the thermistor 5 to the lower surface of the lower carrier 3 is h2, and h1 is greater than h 2.
The distance between the upper surface of the thermistor 5 and the lower surface of the second groove 32 is h3, the distance between the lower surface of the first groove 31 and the lower surface of the second groove 32 is h4, and h3 is more than h4 or h4-h3 is less than 200 μm.
The first groove 31 is located at two sides of the second groove 32 and is respectively provided with two probes 2, two internal electrodes 34 are arranged in the second groove 32, the thermistor 5 is provided with two electrode parts, the electrode parts of the thermistor 5 are respectively correspondingly connected with the two internal electrodes 34 through soldering tin, the internal electrodes 34 are respectively connected to the two probes 2 through a circuit inside the lower carrier 3, the probes 2 are respectively correspondingly connected with the electrode parts of the circuit board 1, and the electrode parts of the thermistor 5 and the circuit board 1 are electrically conducted.
Preferably, the upper surface of the thermistor 5 protrudes from the lower surface of the first groove 31, and the upper top of the probe 2 is higher than the upper surface of the thermistor 5.
The quartz crystal resonator is taken as the to-be-measured object 100 for application description, and the lower surface of the boss 41 of the upper press plate 4 is in contact with the upper surface of the to-be-measured object 100. The lower surface of the to-be-tested part 100 is provided with two electrode parts which are respectively contacted with the upper tops of the two probes 2, the lower bottoms 2b of the two probes 2 are respectively correspondingly contacted with the two electrode parts of the circuit board 1, and the electrode parts of the to-be-tested part 100 are connected with the electrode parts of the circuit board 1 through the probes 2. The probe 2 is provided with a spring which is telescopic, the upper pressing plate 4 is contacted with the piece to be detected 100 and then continuously pressed down to compress the probe 2, so that the lower surface of the piece to be detected 100 is contacted with the thermistor 5, the upper surface of the thermistor 5 is attached to the lower surface of the piece to be detected 100, and the temperature of the piece to be detected 100 can be directly transmitted to the thermistor 5.
In the second groove 32 mentioned in this case, the upper surface of the thermistor 5 protrudes out of the lower surface of the first groove 31, when the lower surface of the device 100 to be tested is uneven and the strength of the bottom plate is not sufficient, the device 100 to be tested is easily damaged, and at this time, the thickness h3 and the thickness h4 are changed to make h3 slightly smaller than or equal to h4, that is, h3 is not greater than h 4. At this time, when the upper press plate 4 is pressed down, the lower surface of the device under test 100 contacts the lower surface of the first groove 31, and it is recommended that the distance between the lower surface of the device under test 100 and the upper surface of the thermistor 5 is designed to be less than 200 μm, i.e., h4-h3<200 μm.
The lower carrier 3 is provided with at least two holes 33, and the probes 2 are respectively installed in the holes 33. As shown in fig. 7, the lower carrier 3 is provided with four holes 33(33a, 33b, 33c, 33 d). The lower carrier 3 in this case has four holes for installing four probes 2, wherein two probes 2 are connected to the quartz crystal resonator and the circuit board 1, and the other two probes 2 are connected to the thermistor 5 and the circuit board 1, and the two probes 2 connected to the thermistor 5 can be directly designed as an internal printed circuit, so that the lower carrier 3 should have at least two holes 33 for installing two probes 2 for testing the frequency of the quartz crystal resonator.
The embodiment mainly describes the implementation of one station, and the embodiment is designed to be 64 stations, and can also be designed to be other multi-station designs.
Claims (7)
1. A high-precision temperature measurement system component is characterized in that: including lower carrier (3), be located circuit board (1) of lower carrier (3) below and be located top board (4) of lower carrier (3) top, lower carrier (3) on be provided with first recess (31), this first recess (31) bottom central authorities are provided with second recess (32), second recess (32) in install thermistor (5), first recess (31) both sides that are located second recess (32) respectively install at least one probe (2), every probe (2) lower extreme all links to each other with circuit board (1), probe (2) can stretch out and draw back from top to bottom, the electrode portion of thermistor (5) correspond with circuit board (1) and be connected.
2. A high precision temperature measurement system component according to claim 1, wherein: the lower end of the upper pressure plate (4) is provided with a boss (41), and the size of the boss (41) is smaller than that of the first groove (31).
3. A high precision temperature measurement system component according to claim 1, wherein: the thermistor (5) is a negative temperature coefficient thermistor.
4. A high precision temperature measurement system component according to claim 1, wherein: the circuit board (1) is a printed circuit board.
5. A high precision temperature measurement system component according to claim 1, wherein: the length of the probe (2) is h1, the length of the probe (2) under pressure can be shortened to be less than h1, the pressure is cancelled to be restored to the length h1, the distance from the upper surface of the thermistor (5) to the lower surface of the lower carrier (3) is h2, and h1 is greater than h 2.
6. A high precision temperature measurement system component according to claim 1, wherein: the distance from the upper surface of the thermistor (5) to the lower surface of the second groove (32) is h3, the distance from the lower surface of the first groove (31) to the lower surface of the second groove (32) is h4, and h3 is greater than h4 or h4-h3 is less than 200 mu m.
7. A high precision temperature measurement system component according to claim 1, wherein: the first groove (31) is located two sides of the second groove (32) and is respectively provided with two probes (2), two internal electrodes (34) are arranged in the second groove (32), the thermistor (5) is provided with two electrode parts, the electrode parts of the thermistor (5) are respectively and correspondingly connected with the two internal electrodes (34) through soldering tin, the internal electrodes (34) are respectively connected to the two probes (2) through a circuit inside the lower carrier (3), and the probes (2) are respectively and correspondingly connected with the electrode parts of the communication circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022185181.3U CN213091016U (en) | 2020-09-29 | 2020-09-29 | High-precision temperature measuring system component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022185181.3U CN213091016U (en) | 2020-09-29 | 2020-09-29 | High-precision temperature measuring system component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213091016U true CN213091016U (en) | 2021-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022185181.3U Active CN213091016U (en) | 2020-09-29 | 2020-09-29 | High-precision temperature measuring system component |
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| Country | Link |
|---|---|
| CN (1) | CN213091016U (en) |
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2020
- 2020-09-29 CN CN202022185181.3U patent/CN213091016U/en active Active
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