CN212992702U - Upper and lower synchronous hot melting pressing device of circuit board electromagnetic hot melting pressing equipment - Google Patents
Upper and lower synchronous hot melting pressing device of circuit board electromagnetic hot melting pressing equipment Download PDFInfo
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- CN212992702U CN212992702U CN202021925835.5U CN202021925835U CN212992702U CN 212992702 U CN212992702 U CN 212992702U CN 202021925835 U CN202021925835 U CN 202021925835U CN 212992702 U CN212992702 U CN 212992702U
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Abstract
The utility model discloses a circuit board electromagnetism hot melt lamination equipment's synchronous hot melt compression fittings from top to bottom, it is including the frame, be equipped with hot melt pressing mechanism in the frame, hot melt pressing mechanism and preformer construct down, it slides support and last hot pressing head on including at least one to go up hot melt pressing mechanism, hot melt pressing mechanism is including at least one support and the hot pressing head of sliding down, it with hot pressing head one-to-one down to go up hot pressing head, be fixed with at least one smooth rod and at least one smooth rod that slides up in the frame, the smooth rod that slides down is located down to the smooth rod down and the two sliding fit, be equipped with the linkage actuating mechanism in the frame, the linkage actuating mechanism is used for ordering about and slides support and the synchronous motion of lower sliding support, and then drive hot pressing head and the synchronous translation of. The utility model discloses can guarantee to go up hot pressing processing head and hot pressing processing head simultaneous movement down and guarantee accurate counterpoint, and then promote the hot pressing processing quality.
Description
Technical Field
The utility model relates to a circuit board electromagnetism hot melt lamination equipment especially relates to a circuit board electromagnetism hot melt lamination equipment's synchronous hot melt compression fittings from top to bottom.
Background
At present, in the circuit board industry, hot melt riveting equipment for laminating multilayer boards generally has a hot pressing mechanism and a feeding and discharging mechanism, and in practical application, for circuit boards of different models and sizes, the hot melt laminating positions are different, so that the hot pressing head positions in the feeding and discharging hot melt laminating mechanisms are generally set to be adjustable structures, before processing, the hot pressing head positions are firstly adjusted, and after the hot pressing positions are positioned, hot pressing can be carried out. However, the existing adjusting mode is generally manual adjustment, the upper hot melting head and the lower hot melting head need to be adjusted independently, the adjusting position of the hot melting head is inaccurate due to the mode, and the upper hot melting head and the lower hot melting head are difficult to be accurately aligned, so that the hot melting processing quality is influenced, and the production requirement is difficult to meet.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to prior art's not enough, provide one kind can guarantee go up the hot pressing processing head with hot pressing processing head simultaneous movement down guarantees accurate counterpoint, and then promotes the upper and lower synchronous hot melt compression fittings of hot pressing processing quality.
In order to solve the technical problem, the utility model adopts the following technical scheme.
An up-down synchronous hot melting and pressing device of electromagnetic hot melting and pressing equipment for a circuit board comprises a machine frame, wherein an upper hot melting and pressing mechanism, a lower hot melting and pressing mechanism and a prepressing mechanism are arranged on the machine frame, a hot melting and pressing station is formed between the upper hot melting and pressing mechanism and the lower hot melting and pressing mechanism, the prepressing mechanism is used for prepressing a platform entering the hot melting and pressing station so as to press the circuit board to be processed between the prepressing mechanism and the platform, the upper hot melting and pressing mechanism comprises at least one upper sliding support and an upper hot pressing head, the lower hot melting and pressing mechanism comprises at least one lower sliding support and a lower hot pressing head, the upper hot pressing head and the lower hot pressing head are in one-to-one correspondence, at least one upper sliding polish rod and at least one lower sliding polish rod are fixed on the machine frame, the upper sliding support is arranged on the upper sliding polish rod and is in sliding fit with the, the lower sliding support is arranged on the lower sliding feed bar and is in sliding fit with the lower sliding feed bar, a linkage driving mechanism is arranged on the rack and used for driving the upper sliding support and the lower sliding support to move synchronously, and then the upper hot pressing head and the lower hot pressing head are driven to move synchronously.
Preferably, the upper hot-melting pressing mechanism comprises an upper lifting frame and an upper pressing cylinder, the upper pressing cylinder is fixedly connected with the upper sliding support, the upper lifting frame is fixed at the driving end of the upper pressing cylinder, and the upper hot-pressing processing head is fixed on the upper lifting frame.
Preferably, the lower hot-melting pressing mechanism comprises a lower lifting frame and a lower pressing cylinder, the lower pressing cylinder is fixedly connected with the lower sliding support, the lower lifting frame is fixed at the driving end of the lower pressing cylinder, and the lower hot-pressing processing head is fixed on the lower lifting frame.
Preferably, the prepressing mechanism comprises a prepressing plate and a prepressing lifting mechanism, the prepressing plate is located between the upper hot-melt pressing mechanism and the lower hot-melt pressing mechanism, the prepressing plate is connected to the lifting end of the prepressing lifting mechanism, and the prepressing plate is driven to ascend or descend by the prepressing lifting mechanism.
Preferably, the pre-pressing lifting mechanism comprises a U-shaped support, a first-stage lifting cylinder is fixed on the U-shaped support, a second-stage lifting cylinder is fixed at the driving end of the first-stage lifting cylinder, a pre-pressing supporting plate is fixed at the driving end of the second-stage lifting cylinder, and the pre-pressing plate is arranged below the pre-pressing supporting plate.
Preferably, the bottom of pre-compaction fagging is fixed with a plurality of buffering slide bars, the buffering slide bar passes pre-compaction board, just pre-compaction board can be relative the buffering slide bar slides and predetermines the distance, the cover is equipped with buffer spring on the buffering slide bar, buffer spring presss from both sides and locates pre-compaction board with between the pre-compaction fagging.
Preferably, the linkage driving mechanism comprises at least one upper driving lead screw and at least one lower driving lead screw, an upper lead screw pair is fixed on the upper sliding support, the upper driving lead screw passes through the upper lead screw pair and the two screw-thread fit, a lower lead screw pair is fixed on the lower sliding support, the lower driving lead screw passes through the lower lead screw pair and the two screw-thread fit, the upper driving lead screw and the lower driving lead screw are connected through a belt linkage mechanism, and a sliding driving motor which is used for driving the upper driving lead screw and the lower driving lead screw to run synchronously is arranged on the rack.
Preferably, a hand wheel is arranged at the end part of the upper driving screw rod.
The utility model discloses an upper and lower synchronous hot melt compression fittings of circuit board electromagnetism hot melt lamination equipment, utilize and go up the smooth support that moves and drive hot pressing processing head translation, utilize the smooth support that moves down to drive hot pressing processing head translation down, on this basis, the utility model discloses set up linkage actuating mechanism in the frame under linkage actuating mechanism's effect, can drive go up the hot pressing processing head with the synchronous translation of hot pressing processing head down makes go up the hot pressing processing head with the hot pressing processing head can guarantee accurate counterpoint in the simultaneous movement in-process down, and then promotes the hot pressing processing quality, has satisfied the production requirement betterly.
Drawings
FIG. 1 is a perspective view of an electromagnetic hot-melting laminating device for a circuit board;
FIG. 2 is a side view of the electromagnetic hot-melting laminating device for circuit boards;
FIG. 3 is a block diagram of the transfer mechanism;
FIG. 4 is a structural diagram of an upper hot-melt laminating mechanism, a lower hot-melt laminating mechanism and a pre-pressing mechanism;
FIG. 5 is a partial structure view of an upper hot-melt laminating mechanism and a lower hot-melt laminating mechanism;
FIG. 6 is a block diagram of the linkage drive mechanism;
FIG. 7 is a partial structure diagram I of the electromagnetic hot melting and laminating device for the circuit board;
fig. 8 is a partial structure diagram of the electromagnetic hot melting and laminating device for the circuit board.
Detailed Description
The present invention will be described in more detail with reference to the accompanying drawings and examples.
Example one
To this end, the embodiment provides an up-and-down synchronous hot-melting and pressing device of a circuit board electromagnetic hot-melting and pressing device, which is shown in fig. 1, fig. 2, and fig. 5 to fig. 8, and includes a frame 1, where an upper hot-melting and pressing mechanism 3, a lower hot-melting and pressing mechanism 4, and a prepressing mechanism 5 are arranged on the frame 1, a hot-melting and pressing station is formed between the upper hot-melting and pressing mechanism 3 and the lower hot-melting and pressing mechanism 4, the prepressing mechanism 5 is used to prepress a stage 23 entering the hot-melting and pressing station, so as to press a circuit board to be processed between the prepressing mechanism 5 and the stage 23, the upper hot-melting and pressing mechanism 3 includes at least one upper sliding support 30 and an upper hot-pressing head 31, the lower hot-melting and pressing mechanism 4 includes at least one lower sliding support 40 and a lower hot-pressing head 41, the upper hot-pressing heads, it slides polished rod 100 and at least one gliding polish rod 101 to be fixed with on at least one on frame 1, upward the support 30 that slides locates on the smooth rod 100 that slides and the two sliding fit, gliding support 40 locates down on the smooth rod 101 that slides and the two sliding fit down, be equipped with linkage actuating mechanism 6 on the frame 1, linkage actuating mechanism 6 is used for ordering about upward the support 30 that slides with gliding support 40 simultaneous movement down, and then drive go up processing head hot pressing 31 with the synchronous translation of hot pressing processing head 41 down.
In the structure, utilize and go up smooth support 30 and drive the translation of hot pressing processing head 31, utilize lower smooth support 40 to drive the translation of hot pressing processing head 41 down, on this basis, the utility model discloses set up linkage actuating mechanism 6 in the frame 1 under linkage actuating mechanism 6's the effect, can drive go up hot pressing processing head 31 with hot pressing processing head 41 synchronous translation down makes go up hot pressing processing head 31 with hot pressing processing head 41 can guarantee accurate counterpoint down in the simultaneous movement in-process, and then promotes hot pressing processing quality, has satisfied the production requirement betterly.
In order to realize the upper hot-pressing action, in this embodiment, the upper hot-melting pressing mechanism 3 includes an upper lifting frame 32 and an upper pressing cylinder 33, the upper pressing cylinder 33 is fixedly connected to the upper sliding support 30, the upper lifting frame 32 is fixed to a driving end of the upper pressing cylinder 33, and the upper hot-pressing processing head 31 is fixed to the upper lifting frame 32.
Similarly, the lower hot-melting pressing mechanism 4 comprises a lower lifting frame 42 and a lower pressing cylinder 43, the lower pressing cylinder 43 is fixedly connected with the lower sliding support 40, the lower lifting frame 42 is fixed at the driving end of the lower pressing cylinder 43, and the lower hot-pressing processing head 41 is fixed on the lower lifting frame 42.
In order to better compress the circuit board, the embodiment includes a pre-pressing mechanism, specifically, the pre-pressing mechanism 5 includes a pre-pressing plate 50 and a pre-pressing lifting mechanism 51, the pre-pressing plate 50 is located between the upper hot-melting pressing mechanism 3 and the lower hot-melting pressing mechanism 4, and the pre-pressing plate 50 is connected to a lifting end of the pre-pressing lifting mechanism 51, and the pre-pressing plate 50 is driven to ascend or descend by the pre-pressing lifting mechanism 51.
In order to ensure the reliability and stability of the pre-pressing action, the embodiment adopts a two-stage pressing mode, specifically, the pre-pressing lifting mechanism 51 includes a U-shaped support 510, a first-stage lifting cylinder 511 is fixed on the U-shaped support 510, a second-stage lifting cylinder 512 is fixed at the driving end of the first-stage lifting cylinder 511, a pre-pressing support plate 513 is fixed at the driving end of the second-stage lifting cylinder 512, and the pre-pressing plate 50 is arranged below the pre-pressing support plate 513.
In order to play a role in buffering in the pre-pressing process, in this embodiment, a plurality of buffer slide rods 52 are fixed at the bottom of the pre-pressing supporting plate 513, the buffer slide rods 52 pass through the pre-pressing plate 50, the pre-pressing plate 50 can slide relative to the buffer slide rods 52 for a preset distance, a buffer spring 53 is sleeved on the buffer slide rods 52, and the buffer spring 53 is clamped between the pre-pressing plate 50 and the pre-pressing supporting plate 513.
Regarding the concrete structure of linkage actuating mechanism 6, in this embodiment, linkage actuating mechanism 6 is including at least one upper drive lead screw 60 and at least one lower drive lead screw 61, it is fixed with upper screw pair 35 on the support 30 to go up to slide, upper drive lead screw 60 passes upper screw pair 35 and two screw-thread fit, be fixed with lower screw pair 45 on the support 40 that slides down, lower drive lead screw 61 passes lower screw pair 45 and two screw-thread fit, upper drive lead screw 60 with connect through belt link gear 62 between the lower drive lead screw 61, be equipped with on the frame 1 and be used for driving about upper drive lead screw 60 with drive lead screw 61 synchronous operation's slip driving motor down.
In order to facilitate manual adjustment, in the present embodiment, a hand wheel 63 is disposed at an end of the upper driving screw 60.
Example two
The embodiment provides an electromagnetic hot-melting laminating device for circuit boards fed by upper and lower double stations, which is shown in fig. 1 to 4 and comprises a frame 1, wherein a conveying mechanism 2, an upper hot-melting laminating mechanism 3 and a lower hot-melting laminating mechanism 4 are arranged on the frame 1, a feeding station and a discharging station and a hot-melting laminating station are formed on the frame 1, the upper hot-melting laminating mechanism 3 and the lower hot-melting laminating mechanism 4 are symmetrically arranged on the upper side and the lower side of the hot-melting laminating station, the conveying mechanism 2 comprises a front belt wheel 20, a rear belt wheel 21 and a conveying belt 22, the conveying belt 22 is wound on the outer sides of the front belt wheel 20 and the rear belt wheel 21, the conveying belt 22 penetrates through the feeding station and the hot-melting laminating station, carrying platforms 23 are respectively fixed on belt bodies on the upper side and the lower side of the conveying belt 22, and the upper and lower carrying platforms 23, the machine frame 1 is provided with a driving motor 24, the driving motor 24 is used for driving the rear belt wheel 21 to rotate in a reciprocating manner, further driving the carrying platform 23 to move alternately between the feeding and discharging station and the hot melting and laminating station, and when the carrying platform 23 moves to the hot melting and laminating station, the circuit board on the carrying platform 23 is subjected to hot melting and laminating processing by the upper hot melting and laminating mechanism 3 and the lower hot melting and laminating mechanism 4.
In the structure, the two carriers 23 arranged in a staggered manner are arranged on the conveying belt 22, and the two carriers 23 alternately move between the feeding and discharging station and the hot-melting pressing station, so that when the upper hot-melting pressing mechanism 3 and the lower hot-melting pressing mechanism 4 perform hot-melting pressing processing on a circuit board on one carrier 23, the other carrier 3 can simultaneously perform feeding and discharging processes, and through linkage cooperation of the two carriers 23, the waiting time of the hot-melting pressing mechanism can be effectively shortened, so that the production efficiency is improved, and the production requirements are better met.
In order to fix the stage 23 better, in this embodiment, a supporting plate 230 is fixed at the bottom of the stage 23, a fastening block 231 is fixed on the supporting plate 230, and the belt body of the conveyor belt 22 is clamped between the fastening block 231 and the supporting plate 230.
As a preferable mode, 4 slats 232 are fixed at the bottom of the carrier 23, the 4 slats 232 are distributed in a cross shape, a sliding groove 233 is formed in the top surface of the slat 232, a sliding block is arranged in the sliding groove 233 and is slidably connected with the sliding groove 233, a vertically arranged limit stop lever 234 is fixed on the sliding block, 4 slotted holes 235 are formed in the carrier 23, the slotted holes 235 are aligned with the sliding groove 233 one by one, and the limit stop lever 234 penetrates through the slotted holes 235 and is in sliding fit with the slotted holes 235. Under the cooperation of the 4 limit stop levers 234, the circuit board on the carrier 23 can be positioned.
In order to make the supporting plate 230 stably translate, in this embodiment, an auxiliary sliding rod 25 is fixed on the frame 1, the auxiliary sliding rod 25 extends along the length direction of the conveying belt 22, a sliding rod sleeve 250 is fixed at the bottom of the supporting plate 230, and the sliding rod sleeve 250 is sleeved on the auxiliary sliding rod 25 and is in sliding fit with the auxiliary sliding rod 25.
Preferably, the number of the front belt pulleys 20, the number of the rear belt pulleys 21 and the number of the conveyor belts 22 are two, the two conveyor belts 22 are parallel to each other, and the two rear belt pulleys 21 are connected through a linkage shaft.
The above is only the embodiment of the present invention, and is not intended to limit the present invention, and all modifications, equivalent replacements or improvements made within the technical scope of the present invention should be included within the protection scope of the present invention.
Claims (8)
1. An up-down synchronous hot melting and laminating device of electromagnetic hot melting and laminating equipment for circuit boards is characterized by comprising a rack (1), wherein an upper hot melting and laminating mechanism (3), a lower hot melting and laminating mechanism (4) and a prepressing mechanism (5) are arranged on the rack (1), a hot melting and laminating station is formed between the upper hot melting and laminating mechanism (3) and the lower hot melting and laminating mechanism (4), the prepressing mechanism (5) is used for prepressing a carrying platform (23) entering the hot melting and laminating station so as to tightly press a circuit board to be processed between the prepressing mechanism (5) and the carrying platform (23), the upper hot melting and laminating mechanism (3) comprises at least one upper sliding support (30) and an upper hot pressing head (31), the lower hot melting and laminating mechanism (4) comprises at least one lower sliding support (40) and a lower hot pressing head (41), go up hot pressing processing head (31) with hot pressing processing head (41) one-to-one down, be fixed with at least one on the frame (1) and slide down feed rod (100) and at least one feed rod (101) that slides down, go up slide bracket (30) and locate on the last feed rod (100) that slides and the two sliding fit, lower slide bracket (40) are located slide down on feed rod (101) and the two sliding fit, be equipped with linkage actuating mechanism (6) on frame (1), linkage actuating mechanism (6) are used for ordering about go up slide bracket (30) with lower slide bracket (40) simultaneous movement, and then drive go up hot pressing processing head (31) with lower hot pressing processing head (41) simultaneous translation.
2. The upper and lower synchronous hot melting and laminating device of the electromagnetic hot melting and laminating equipment for the circuit board as claimed in claim 1, wherein the upper hot melting and laminating mechanism (3) comprises an upper lifting frame (32) and an upper laminating cylinder (33), the upper laminating cylinder (33) is fixedly connected with the upper sliding support (30), the upper lifting frame (32) is fixed at the driving end of the upper laminating cylinder (33), and the upper hot pressing head (31) is fixed on the upper lifting frame (32).
3. The upper and lower synchronous hot melting and laminating device of the electromagnetic hot melting and laminating equipment for the circuit board as claimed in claim 2, wherein the lower hot melting and laminating mechanism (4) comprises a lower lifting frame (42) and a lower laminating cylinder (43), the lower laminating cylinder (43) is fixedly connected with the lower sliding support (40), the lower lifting frame (42) is fixed at the driving end of the lower laminating cylinder (43), and the lower hot pressing processing head (41) is fixed on the lower lifting frame (42).
4. The upper and lower synchronous hot melting and laminating device of the electromagnetic hot melting and laminating equipment for the circuit board according to claim 1, wherein the prepressing mechanism (5) comprises a prepressing plate (50) and a prepressing lifting mechanism (51), the prepressing plate (50) is located between the upper hot melting and laminating mechanism (3) and the lower hot melting and laminating mechanism (4), the prepressing plate (50) is connected to a lifting end of the prepressing lifting mechanism (51), and the prepressing plate (50) is driven to ascend or descend by the prepressing lifting mechanism (51).
5. The upper and lower synchronous hot melting and laminating device of the electromagnetic hot melting and laminating equipment for the circuit board according to claim 4, wherein the pre-pressing lifting mechanism (51) comprises a U-shaped support (510), a first-stage lifting cylinder (511) is fixed on the U-shaped support (510), a second-stage lifting cylinder (512) is fixed at the driving end of the first-stage lifting cylinder (511), a pre-pressing supporting plate (513) is fixed at the driving end of the second-stage lifting cylinder (512), and the pre-pressing plate (50) is arranged below the pre-pressing supporting plate (513).
6. The upper and lower synchronous hot melting and laminating device of the electromagnetic hot melting and laminating equipment for the circuit board according to claim 5, wherein a plurality of buffer slide rods (52) are fixed at the bottom of the pre-pressing supporting plate (513), the buffer slide rods (52) penetrate through the pre-pressing plate (50), the pre-pressing plate (50) can slide relative to the buffer slide rods (52) for a preset distance, a buffer spring (53) is sleeved on the buffer slide rods (52), and the buffer spring (53) is clamped between the pre-pressing plate (50) and the pre-pressing supporting plate (513).
7. The upper and lower synchronous hot melting and laminating device of the electromagnetic hot melting and laminating equipment for the circuit board as claimed in claim 3, characterized in that the linkage driving mechanism (6) comprises at least one upper driving lead screw (60) and at least one lower driving lead screw (61), an upper screw pair (35) is fixed on the upper sliding support (30), an upper driving screw (60) penetrates through the upper screw pair (35) and is in threaded fit with the upper screw pair, a lower screw pair (45) is fixed on the lower sliding support (40), the lower driving screw (61) passes through the lower screw pair (45) and is in threaded fit with the lower screw pair, the upper driving screw rod (60) is connected with the lower driving screw rod (61) through a belt linkage mechanism (62), and a sliding driving motor for driving the upper driving lead screw (60) and the lower driving lead screw (61) to synchronously run is arranged on the rack (1).
8. The vertical synchronous hot melting and laminating device of the electromagnetic hot melting and laminating equipment for the circuit board as claimed in claim 7, wherein a hand wheel (63) is arranged at the end part of the upper driving screw rod (60).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021925835.5U CN212992702U (en) | 2020-09-04 | 2020-09-04 | Upper and lower synchronous hot melting pressing device of circuit board electromagnetic hot melting pressing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021925835.5U CN212992702U (en) | 2020-09-04 | 2020-09-04 | Upper and lower synchronous hot melting pressing device of circuit board electromagnetic hot melting pressing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212992702U true CN212992702U (en) | 2021-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021925835.5U Active CN212992702U (en) | 2020-09-04 | 2020-09-04 | Upper and lower synchronous hot melting pressing device of circuit board electromagnetic hot melting pressing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212992702U (en) |
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2020
- 2020-09-04 CN CN202021925835.5U patent/CN212992702U/en active Active
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