CN212992701U - Circuit board electromagnetism hot melt lamination equipment of duplex position pay-off from top to bottom - Google Patents
Circuit board electromagnetism hot melt lamination equipment of duplex position pay-off from top to bottom Download PDFInfo
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- CN212992701U CN212992701U CN202021922862.7U CN202021922862U CN212992701U CN 212992701 U CN212992701 U CN 212992701U CN 202021922862 U CN202021922862 U CN 202021922862U CN 212992701 U CN212992701 U CN 212992701U
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Abstract
The utility model discloses a circuit board electromagnetism hot melt lamination equipment of duplex position pay-off from top to bottom, which comprises a frame, be equipped with transport mechanism in the frame, go up hot melt pressing mechanism and hot melt pressing mechanism down, transport mechanism is including preceding band pulley, back band pulley and conveyer belt, the conveyer belt is around the outside of preceding band pulley and back band pulley, be fixed with the microscope carrier on the area body of both sides about the conveyer belt respectively, and two microscope carriers are located unloading station and hot melt pressing station respectively from top to bottom, be equipped with driving motor in the frame, driving motor is used for ordering about the reciprocal rotation of back band pulley, and then order about the microscope carrier and go up between unloading station and the hot melt pressing station alternate motion, and when the microscope carrier moves to hot melt pressing station, borrow by last hot melt pressing mechanism and down hot melt pressing mechanism and. The utility model discloses can go up the unloading action in turn, can effectively shorten hot melt pressing mechanism's latency to improve production efficiency.
Description
Technical Field
The utility model relates to a circuit board electromagnetism hot melt lamination equipment especially relates to a circuit board electromagnetism hot melt lamination equipment of duplex position pay-off from top to bottom.
Background
At present, in the circuit board industry, hot melt riveting equipment for laminating multilayer boards generally comprises a hot pressing mechanism and a feeding and discharging mechanism, in practical application, each hot melt pressing mechanism generally corresponds to one feeding and discharging mechanism, the circuit board to be processed is conveyed to a hot melt laminating processing station by using the feeding and discharging mechanism, the circuit board is subjected to hot pressing by using the hot melt pressing mechanism, when the processing is finished, the feeding and discharging mechanisms are waited to perform feeding and discharging actions, and then the processes are repeatedly performed.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to prior art not enough, provide one kind and can carry out in turn and go up the unloading action, can effectively shorten hot melt pressing mechanism's latency to improve production efficiency, based on circuit board electromagnetism hot melt lamination equipment of upper and lower duplex position pay-off.
In order to solve the technical problem, the utility model adopts the following technical scheme.
An electromagnetic hot-melting laminating device for circuit boards fed by upper and lower double stations comprises a frame, wherein a conveying mechanism, an upper hot-melting laminating mechanism and a lower hot-melting laminating mechanism are arranged on the frame, a feeding and discharging station and a hot-melting laminating station are formed on the frame, the upper hot-melting laminating mechanism and the lower hot-melting laminating mechanism are symmetrically arranged on the upper side and the lower side of the hot-melting laminating station, the conveying mechanism comprises a front belt wheel, a rear belt wheel and a conveying belt, the conveying belt is wound on the outer sides of the front belt wheel and the rear belt wheel and penetrates through the feeding and discharging station and the hot-melting laminating station, carrying platforms are respectively fixed on belt bodies on the upper side and the lower side of the conveying belt, the upper carrying platform and the lower carrying platform are respectively positioned on the feeding and discharging station and the hot-melting laminating station, a driving, and then the carrying platform is driven to alternately move between the feeding and discharging station and the hot melting pressing station, and when the carrying platform moves to the hot melting pressing station, the circuit board on the carrying platform is subjected to hot melting pressing processing by the upper hot melting pressing mechanism and the lower hot melting pressing mechanism.
Preferably, a supporting plate is fixed at the bottom of the carrying platform, a fastening block is fixed on the supporting plate, and a belt body of the conveying belt is clamped between the fastening block and the supporting plate.
Preferably, the bottom of the carrier is fixed with 4 slats, the 4 slats are distributed in a cross shape, the top surface of each slat is provided with a sliding groove, each sliding groove is internally provided with a sliding block which is connected with the sliding block in a sliding manner, the sliding block is fixed with a vertically arranged limiting stop lever, the carrier is provided with 4 slotted holes, the slotted holes are aligned with the sliding grooves one by one, and the limiting stop levers penetrate through the slotted holes and are in sliding fit with the slotted holes.
Preferably, an auxiliary sliding rod is fixed on the rack, the auxiliary sliding rod extends along the length direction of the conveying belt, a sliding rod sleeve is fixed at the bottom of the supporting plate, and the auxiliary sliding rod is sleeved with the sliding rod sleeve in a sliding fit manner.
Preferably, the number of the front belt wheels, the number of the rear belt wheels and the number of the conveying belts are two, the two conveying belts are parallel to each other, and the two rear belt wheels are connected through a linkage shaft.
The utility model discloses an among circuit board electromagnetism hot melt lamination equipment of upper and lower duplex position pay-off set up two microscope carriers that crisscross set up on the conveyer belt, utilize two microscope carriers to be in go up the unloading station with alternate motion between the hot melt pressfitting station makes go up hot melt pressfitting mechanism with circuit board on a microscope carrier down carries out hot melt pressfitting man-hour, and unloading process can be gone up in the simultaneous execution of another microscope carrier, through the linkage cooperation of two microscope carriers, can effectively shorten hot melt pressfitting mechanism's latency to improve production efficiency, satisfied the production requirement betterly.
Drawings
FIG. 1 is a perspective view of an electromagnetic hot-melting laminating device for a circuit board;
FIG. 2 is a side view of the electromagnetic hot-melting laminating device for circuit boards;
FIG. 3 is a block diagram of the transfer mechanism;
FIG. 4 is a structural diagram of an upper hot-melt laminating mechanism, a lower hot-melt laminating mechanism and a pre-pressing mechanism;
FIG. 5 is a partial structure view of an upper hot-melt laminating mechanism and a lower hot-melt laminating mechanism;
FIG. 6 is a block diagram of the linkage drive mechanism;
FIG. 7 is a partial structure diagram I of the electromagnetic hot melting and laminating device for the circuit board;
fig. 8 is a partial structure diagram of the electromagnetic hot melting and laminating device for the circuit board.
Detailed Description
The present invention will be described in more detail with reference to the accompanying drawings and examples.
Example one
The embodiment provides an electromagnetic hot-melting laminating device for circuit boards fed by upper and lower double stations, which is shown in fig. 1 to 4 and comprises a frame 1, wherein a conveying mechanism 2, an upper hot-melting laminating mechanism 3 and a lower hot-melting laminating mechanism 4 are arranged on the frame 1, a feeding station and a discharging station and a hot-melting laminating station are formed on the frame 1, the upper hot-melting laminating mechanism 3 and the lower hot-melting laminating mechanism 4 are symmetrically arranged on the upper side and the lower side of the hot-melting laminating station, the conveying mechanism 2 comprises a front belt wheel 20, a rear belt wheel 21 and a conveying belt 22, the conveying belt 22 is wound on the outer sides of the front belt wheel 20 and the rear belt wheel 21, the conveying belt 22 penetrates through the feeding station and the hot-melting laminating station, carrying platforms 23 are respectively fixed on belt bodies on the upper side and the lower side of the conveying belt 22, and the upper and lower carrying platforms 23, the machine frame 1 is provided with a driving motor 24, the driving motor 24 is used for driving the rear belt wheel 21 to rotate in a reciprocating manner, further driving the carrying platform 23 to move alternately between the feeding and discharging station and the hot melting and laminating station, and when the carrying platform 23 moves to the hot melting and laminating station, the circuit board on the carrying platform 23 is subjected to hot melting and laminating processing by the upper hot melting and laminating mechanism 3 and the lower hot melting and laminating mechanism 4.
In the structure, the two carriers 23 arranged in a staggered manner are arranged on the conveying belt 22, and the two carriers 23 alternately move between the feeding and discharging station and the hot-melting pressing station, so that when the upper hot-melting pressing mechanism 3 and the lower hot-melting pressing mechanism 4 perform hot-melting pressing processing on a circuit board on one carrier 23, the other carrier 3 can simultaneously perform feeding and discharging processes, and through linkage cooperation of the two carriers 23, the waiting time of the hot-melting pressing mechanism can be effectively shortened, so that the production efficiency is improved, and the production requirements are better met.
In order to fix the stage 23 better, in this embodiment, a supporting plate 230 is fixed at the bottom of the stage 23, a fastening block 231 is fixed on the supporting plate 230, and the belt body of the conveyor belt 22 is clamped between the fastening block 231 and the supporting plate 230.
As a preferable mode, 4 slats 232 are fixed at the bottom of the carrier 23, the 4 slats 232 are distributed in a cross shape, a sliding groove 233 is formed in the top surface of the slat 232, a sliding block is arranged in the sliding groove 233 and is slidably connected with the sliding groove 233, a vertically arranged limit stop lever 234 is fixed on the sliding block, 4 slotted holes 235 are formed in the carrier 23, the slotted holes 235 are aligned with the sliding groove 233 one by one, and the limit stop lever 234 penetrates through the slotted holes 235 and is in sliding fit with the slotted holes 235. Under the cooperation of the 4 limit stop levers 234, the circuit board on the carrier 23 can be positioned.
In order to make the supporting plate 230 stably translate, in this embodiment, an auxiliary sliding rod 25 is fixed on the frame 1, the auxiliary sliding rod 25 extends along the length direction of the conveying belt 22, a sliding rod sleeve 250 is fixed at the bottom of the supporting plate 230, and the sliding rod sleeve 250 is sleeved on the auxiliary sliding rod 25 and is in sliding fit with the auxiliary sliding rod 25.
Preferably, the number of the front belt pulleys 20, the number of the rear belt pulleys 21 and the number of the conveyor belts 22 are two, the two conveyor belts 22 are parallel to each other, and the two rear belt pulleys 21 are connected through a linkage shaft.
Example two
In practical application, the hot melting pressing positions of circuit boards of different models and sizes are different, so that the hot pressing head positions in the upper and lower hot melting pressing mechanisms are generally set to be adjustable structures, the hot pressing head positions are adjusted before processing, and hot pressing processing can be performed after the hot pressing positions are positioned. However, the existing adjusting mode is generally manual adjustment, the upper hot melting head and the lower hot melting head need to be adjusted independently, the adjusting position of the hot melting head is inaccurate due to the mode, and the upper hot melting head and the lower hot melting head are difficult to be accurately aligned, so that the hot melting processing quality is influenced, and the production requirement is difficult to meet.
To this end, the embodiment provides an up-and-down synchronous hot-melting and pressing device of a circuit board electromagnetic hot-melting and pressing device, which is shown in fig. 1, fig. 2, and fig. 5 to fig. 8, and includes a frame 1, where an upper hot-melting and pressing mechanism 3, a lower hot-melting and pressing mechanism 4, and a prepressing mechanism 5 are arranged on the frame 1, a hot-melting and pressing station is formed between the upper hot-melting and pressing mechanism 3 and the lower hot-melting and pressing mechanism 4, the prepressing mechanism 5 is used to prepress a stage 23 entering the hot-melting and pressing station, so as to press a circuit board to be processed between the prepressing mechanism 5 and the stage 23, the upper hot-melting and pressing mechanism 3 includes at least one upper sliding support 30 and an upper hot-pressing head 31, the lower hot-melting and pressing mechanism 4 includes at least one lower sliding support 40 and a lower hot-pressing head 41, the upper hot-pressing heads, it slides polished rod 100 and at least one gliding polish rod 101 to be fixed with on at least one on frame 1, upward the support 30 that slides locates on the smooth rod 100 that slides and the two sliding fit, gliding support 40 locates down on the smooth rod 101 that slides and the two sliding fit down, be equipped with linkage actuating mechanism 6 on the frame 1, linkage actuating mechanism 6 is used for ordering about upward the support 30 that slides with gliding support 40 simultaneous movement down, and then drive go up processing head hot pressing 31 with the synchronous translation of hot pressing processing head 41 down.
In the structure, utilize and go up smooth support 30 and drive the translation of hot pressing processing head 31, utilize lower smooth support 40 to drive the translation of hot pressing processing head 41 down, on this basis, the utility model discloses set up linkage actuating mechanism 6 in the frame 1 under linkage actuating mechanism 6's the effect, can drive go up hot pressing processing head 31 with hot pressing processing head 41 synchronous translation down makes go up hot pressing processing head 31 with hot pressing processing head 41 can guarantee accurate counterpoint down in the simultaneous movement in-process, and then promotes hot pressing processing quality, has satisfied the production requirement betterly.
In order to realize the upper hot-pressing action, in this embodiment, the upper hot-melting pressing mechanism 3 includes an upper lifting frame 32 and an upper pressing cylinder 33, the upper pressing cylinder 33 is fixedly connected to the upper sliding support 30, the upper lifting frame 32 is fixed to a driving end of the upper pressing cylinder 33, and the upper hot-pressing processing head 31 is fixed to the upper lifting frame 32.
Similarly, the lower hot-melting pressing mechanism 4 comprises a lower lifting frame 42 and a lower pressing cylinder 43, the lower pressing cylinder 43 is fixedly connected with the lower sliding support 40, the lower lifting frame 42 is fixed at the driving end of the lower pressing cylinder 43, and the lower hot-pressing processing head 41 is fixed on the lower lifting frame 42.
In order to better compress the circuit board, the embodiment includes a pre-pressing mechanism, specifically, the pre-pressing mechanism 5 includes a pre-pressing plate 50 and a pre-pressing lifting mechanism 51, the pre-pressing plate 50 is located between the upper hot-melting pressing mechanism 3 and the lower hot-melting pressing mechanism 4, and the pre-pressing plate 50 is connected to a lifting end of the pre-pressing lifting mechanism 51, and the pre-pressing plate 50 is driven to ascend or descend by the pre-pressing lifting mechanism 51.
In order to ensure the reliability and stability of the pre-pressing action, the embodiment adopts a two-stage pressing mode, specifically, the pre-pressing lifting mechanism 51 includes a U-shaped support 510, a first-stage lifting cylinder 511 is fixed on the U-shaped support 510, a second-stage lifting cylinder 512 is fixed at the driving end of the first-stage lifting cylinder 511, a pre-pressing support plate 513 is fixed at the driving end of the second-stage lifting cylinder 512, and the pre-pressing plate 50 is arranged below the pre-pressing support plate 513.
In order to play a role in buffering in the pre-pressing process, in this embodiment, a plurality of buffer slide rods 52 are fixed at the bottom of the pre-pressing supporting plate 513, the buffer slide rods 52 pass through the pre-pressing plate 50, the pre-pressing plate 50 can slide relative to the buffer slide rods 52 for a preset distance, a buffer spring 53 is sleeved on the buffer slide rods 52, and the buffer spring 53 is clamped between the pre-pressing plate 50 and the pre-pressing supporting plate 513.
Regarding the concrete structure of linkage actuating mechanism 6, in this embodiment, linkage actuating mechanism 6 is including at least one upper drive lead screw 60 and at least one lower drive lead screw 61, it is fixed with upper screw pair 35 on the support 30 to go up to slide, upper drive lead screw 60 passes upper screw pair 35 and two screw-thread fit, be fixed with lower screw pair 45 on the support 40 that slides down, lower drive lead screw 61 passes lower screw pair 45 and two screw-thread fit, upper drive lead screw 60 with connect through belt link gear 62 between the lower drive lead screw 61, be equipped with on the frame 1 and be used for driving about upper drive lead screw 60 with drive lead screw 61 synchronous operation's slip driving motor down.
In order to facilitate manual adjustment, in the present embodiment, a hand wheel 63 is disposed at an end of the upper driving screw 60.
The above is only the embodiment of the present invention, and is not intended to limit the present invention, and all modifications, equivalent replacements or improvements made within the technical scope of the present invention should be included within the protection scope of the present invention.
Claims (5)
1. The electromagnetic hot-melting laminating equipment for the circuit board fed by the upper and lower double stations is characterized by comprising a rack (1), wherein a conveying mechanism (2), an upper hot-melting laminating mechanism (3) and a lower hot-melting laminating mechanism (4) are arranged on the rack (1), a feeding and discharging station and a hot-melting laminating station are formed on the rack (1), the upper hot-melting laminating mechanism (3) and the lower hot-melting laminating mechanism (4) are symmetrically arranged on the upper side and the lower side of the hot-melting laminating station, the conveying mechanism (2) comprises a front belt wheel (20), a rear belt wheel (21) and a conveying belt (22), the conveying belt (22) is wound on the outer sides of the front belt wheel (20) and the rear belt wheel (21), the conveying belt (22) penetrates through the feeding and discharging station and the hot-melting laminating station, bearing platforms (23) are respectively fixed on the upper side and the lower side of the conveying, and an upper carrying platform (23) and a lower carrying platform (23) are respectively positioned at the feeding and discharging station and the hot melting pressing station, a driving motor (24) is arranged on the frame (1), the driving motor (24) is used for driving the rear belt wheel (21) to rotate in a reciprocating manner, further driving the carrying platforms (23) to move alternately between the feeding and discharging station and the hot melting pressing station, and when the carrying platforms (23) move to the hot melting pressing station, the circuit boards on the carrying platforms (23) are subjected to hot melting pressing processing by means of the upper hot melting pressing mechanism (3) and the lower hot melting pressing mechanism (4).
2. The electromagnetic hot melting laminating equipment for the circuit board fed by the upper and lower double stations as claimed in claim 1, wherein a supporting plate (230) is fixed at the bottom of the carrying platform (23), a fastening block (231) is fixed on the supporting plate (230), and a belt body of the conveying belt (22) is clamped between the fastening block (231) and the supporting plate (230).
3. The electromagnetic hot-melting laminating equipment for the circuit board fed by the upper and lower double stations as claimed in claim 1, wherein 4 strips (232) are fixed at the bottom of the carrier (23), the 4 strips (232) are distributed in a cross shape, a sliding groove (233) is formed in the top surface of each strip (232), a sliding block is arranged in each sliding groove (233) and is in sliding connection with the corresponding sliding block, a vertically arranged limiting stop lever (234) is fixed on each sliding block, 4 slotted holes (235) are formed in the carrier (23), the slotted holes (235) are aligned with the sliding grooves (233) one by one, and the limiting stop levers (234) penetrate through the slotted holes (235) and are in sliding fit with the slotted holes (235).
4. The electromagnetic hot melting and laminating device for the circuit board fed by the upper and lower double stations as claimed in claim 2, wherein an auxiliary sliding rod (25) is fixed on the frame (1), the auxiliary sliding rod (25) extends along the length direction of the conveying belt (22), a sliding rod sleeve (250) is fixed at the bottom of the supporting plate (230), and the sliding rod sleeve (250) is sleeved on the auxiliary sliding rod (25) and is in sliding fit with the auxiliary sliding rod (25).
5. The electromagnetic hot melting and laminating equipment for the circuit board fed by the upper and lower double stations as claimed in claim 1, wherein the number of the front belt wheels (20), the number of the rear belt wheels (21) and the number of the conveyor belts (22) are two, the two conveyor belts (22) are parallel to each other, and the two rear belt wheels (21) are connected through a linkage shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021922862.7U CN212992701U (en) | 2020-09-04 | 2020-09-04 | Circuit board electromagnetism hot melt lamination equipment of duplex position pay-off from top to bottom |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021922862.7U CN212992701U (en) | 2020-09-04 | 2020-09-04 | Circuit board electromagnetism hot melt lamination equipment of duplex position pay-off from top to bottom |
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| Publication Number | Publication Date |
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| CN212992701U true CN212992701U (en) | 2021-04-16 |
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| CN202021922862.7U Active CN212992701U (en) | 2020-09-04 | 2020-09-04 | Circuit board electromagnetism hot melt lamination equipment of duplex position pay-off from top to bottom |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051335A (en) * | 2021-11-19 | 2022-02-15 | 苏州如辉机电设备有限公司 | PCB hot melting machine and using method thereof |
| CN114340163A (en) * | 2021-12-28 | 2022-04-12 | 珠海奇川精密设备有限公司 | Variable-pitch pressing machine |
-
2020
- 2020-09-04 CN CN202021922862.7U patent/CN212992701U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051335A (en) * | 2021-11-19 | 2022-02-15 | 苏州如辉机电设备有限公司 | PCB hot melting machine and using method thereof |
| CN114051335B (en) * | 2021-11-19 | 2024-03-05 | 苏州如辉机电设备有限公司 | PCB (printed circuit board) hot melting machine and using method thereof |
| CN114340163A (en) * | 2021-12-28 | 2022-04-12 | 珠海奇川精密设备有限公司 | Variable-pitch pressing machine |
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