CN213280277U - Double-station transverse-moving loading and unloading mechanism of circuit board hot melting pressing equipment - Google Patents

Double-station transverse-moving loading and unloading mechanism of circuit board hot melting pressing equipment Download PDF

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Publication number
CN213280277U
CN213280277U CN202021934054.2U CN202021934054U CN213280277U CN 213280277 U CN213280277 U CN 213280277U CN 202021934054 U CN202021934054 U CN 202021934054U CN 213280277 U CN213280277 U CN 213280277U
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station
transverse
carrying platform
circuit board
moving
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杨海涛
汪冰川
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Dingqin Technology Shenzhen Co ltd
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Dingqin Technology Shenzhen Co ltd
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Abstract

The utility model discloses a double-station transverse feeding and discharging mechanism of circuit board hot melting pressing equipment, the hot melting pressing equipment comprises a frame, a feeding and discharging station is formed between a left pressing station and a right pressing station, the double-station transverse feeding and discharging mechanism comprises a conveying slide rail, the conveying slide rail is fixed on the frame, a first transverse loading platform and a second transverse loading platform which are distributed left and right are arranged on the conveying slide rail, the first transverse loading platform is fixedly connected with the second transverse loading platform, a first material carrying plate for placing a circuit board is fixed on the first transverse loading platform, a second material carrying plate for placing the circuit board is fixed on the second transverse loading platform, when the first horizontal moving carrying platform is translated to the left pressing station and is subjected to hot melting pressing processing, the second horizontal moving carrying platform is positioned at the feeding and discharging station for feeding and discharging, when the first transverse moving carrying platform is translated to the feeding and discharging station to carry out feeding and discharging, the second transverse moving carrying platform is positioned at the right pressing station to carry out hot melting pressing processing. The utility model discloses production efficiency and machining precision can be guaranteed.

Description

Double-station transverse-moving loading and unloading mechanism of circuit board hot melting pressing equipment
Technical Field
The utility model relates to a circuit board processing equipment especially relates to a unloading mechanism in duplex position sideslip of circuit board hot melt lamination equipment.
Background
At present, in the circuit board industry, the hot melt riveting equipment of pressfitting multiply wood generally has hot pressing machine to construct and goes up unloading mechanism, and among the practical application, to circuit board hot melt pressing equipment, unloading mechanism generally realizes unloading one to one with hot melt pressing mechanism on it, and the inefficiency of this kind of unloading mode of going up, in addition, how can also carry out hot melt pressing process in last unloading to guarantee production efficiency and machining precision, be the technical problem that prior art waited to solve urgently.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to prior art's not enough, provide one kind and can also carry out hot melt pressfitting processing when unloading on circuit board hot melt lamination equipment to the unloading mechanism in the duplex position sideslip of guaranteeing production efficiency and machining precision.
In order to solve the technical problem, the utility model adopts the following technical scheme.
A double-station transverse-moving feeding and discharging mechanism of circuit board hot-melting laminating equipment comprises a rack, wherein a left laminating station and a right laminating station are arranged on the rack, a feeding and discharging station is formed between the left laminating station and the right laminating station, the double-station transverse-moving feeding and discharging mechanism comprises a conveying slide rail, the conveying slide rail is fixed on the rack, a first transverse-moving carrying platform and a second transverse-moving carrying platform which are distributed leftwards and rightwards are arranged on the conveying slide rail, the first transverse-moving carrying platform is fixedly connected with the second transverse-moving carrying platform, the first transverse-moving carrying platform and the second transverse-moving platform are both connected with the conveying slide rail in a sliding manner, a first material carrying plate for placing a circuit board is fixed on the first transverse-moving platform, a second material carrying plate for placing the circuit board is fixed on the second transverse-moving platform, and when the first transverse-moving platform is translated to the left laminating station and hot, and the second transverse moving carrying platform is positioned on the feeding and discharging station for feeding and discharging, and when the first transverse moving carrying platform is translated to the feeding and discharging station for feeding and discharging, the second transverse moving carrying platform is positioned on the right pressing station for hot melting pressing processing.
Preferably, an intermediate platen is included, the intermediate platen being fixed between the first and second traverse stages.
Preferably, the first material carrying plate is positioned above the first transverse moving carrying platform, and a preset distance exists between the first material carrying plate and the first transverse moving carrying platform.
Preferably, the second material carrying plate is positioned above the second traverse carrier, and a preset distance exists between the second material carrying plate and the second traverse carrier.
Preferably, two conveying slide rails are fixed on the rack, 4 first slide seats are fixed at the bottom of the first transverse moving carrying platform, the 4 first slide seats are respectively arranged on the two conveying slide rails, and the first slide seats are in sliding fit with the conveying slide rails.
Preferably, 4 second sliding seats are fixed at the bottom of the second traverse carrying platform, the 4 second sliding seats are respectively arranged on the two conveying sliding rails, and the second sliding seats are in sliding fit with the conveying sliding rails.
Preferably, a belt wheel support is fixed at the bottom of the first transverse moving platform, a belt wheel is arranged on the belt wheel support, a driving motor is installed on the rack, the driving motor is connected with the belt wheel through a belt, the driving motor drives the belt wheel to rotate in the forward and reverse directions through the belt, and then the first transverse moving platform and the second transverse moving platform are driven to reciprocate along the conveying slide rail.
The utility model discloses an among circuit board hot melt lamination equipment's unloading mechanism in duplex position sideslip first sideslip microscope carrier and the second sideslip microscope carrier of synchronous motion have been set up simultaneously on the transport slide rail, in two sideslip microscope carrier motion processes, work as first sideslip microscope carrier translation extremely during left side pressfitting station, execution hot melt pressfitting processing, meanwhile, second sideslip microscope carrier is located go up unloading, work as first sideslip microscope carrier translation extremely go up unloading station time, go up unloading, meanwhile, second sideslip microscope carrier is located right side pressfitting station carries out hot melt pressfitting processing. Based on the above structure is visible, the utility model discloses it is preferred to have set up two pressfitting stations in the frame, utilizes two sideslip microscope carriers of synchronous motion to convey the circuit board, compares the mode of unloading on one-to-one, the utility model provides a machining efficiency has been improved greatly, moreover the utility model discloses a sideslip mode transmission circuit board material compares the mode of unloading on the drawer type, the utility model discloses can avoid piece, greasy dirt to cause the pollution to the product, and then guarantee the product yield, in addition, the utility model provides a first sideslip microscope carrier and second sideslip microscope carrier horizontal position are unanimous, push down hot melt mechanism and need not whole rising or descend in the executive process, have not only simplified the action process, still can avoid influencing the machining precision because of pushing down hot melt mechanism overall movement, have satisfied the production requirement betterly.
Drawings
Fig. 1 is a perspective view of the hot melt laminating apparatus of the present invention;
fig. 2 is a top view of the hot melt laminating apparatus of the present invention;
fig. 3 is a side view of the hot melt laminating apparatus of the present invention;
FIG. 4 is a first structural view of the first material-loading hot-pressing mechanism, the second material-loading hot-pressing mechanism and the frame;
FIG. 5 is a second structural view of the first material-loading hot-pressing mechanism, the second material-loading hot-pressing mechanism and the frame;
FIG. 6 is a first structural diagram of the first and second carrier hot-pressing mechanisms;
FIG. 7 is a second structural diagram of the first and second material-loading hot-pressing mechanisms;
FIG. 8 is an exploded view of the first carrier hot press mechanism;
FIG. 9 is a block diagram of the left hold-down fuse mechanism and the left side bracket;
FIG. 10 is a first view of the structure of the left push down fuse mechanism;
FIG. 11 is a second view of the construction of the left push down fuse mechanism;
fig. 12 is an exploded view of the left push down fuse mechanism.
Detailed Description
The present invention will be described in more detail with reference to the accompanying drawings and examples.
Example one
The embodiment provides a double-station transverse-moving loading and unloading mechanism of a circuit board hot-melting laminating device, which is shown in fig. 3 to 8, and the hot-melting laminating device comprises a frame 1, a left laminating station 10 and a right laminating station 11 are arranged on the frame 1, a loading and unloading station 12 is formed between the left laminating station 10 and the right laminating station 11, the double-station transverse-moving loading and unloading mechanism comprises a conveying slide rail 100, the conveying slide rail 100 is fixed on the frame 1, a first transverse-moving carrying platform 20 and a second transverse-moving platform 30 which are distributed left and right are arranged on the conveying slide rail 100, the first transverse-moving platform 20 and the second transverse-moving platform 30 are fixedly connected, the first transverse-moving platform 20 and the second transverse-moving platform 30 are both connected with the conveying slide rail 100 in a sliding manner, a first material carrying plate 21 for placing a circuit board is fixed on the first transverse-moving platform 20, a second material carrying plate 31 for placing a circuit board is fixed on the second traverse carrier 30, when the first traverse carrier 20 translates to the left pressing station 10 and performs hot-melt pressing processing, the second traverse carrier 30 is located at the feeding and discharging station 12 for feeding and discharging, and when the first traverse carrier 20 translates to the feeding and discharging station 12 for feeding and discharging, the second traverse carrier 30 is located at the right pressing station 11 for hot-melt pressing processing.
In the above mechanism, the conveying slide rail 100 is provided with a first traverse carrier 20 and a second traverse carrier 30 which move synchronously, in the moving process of the two traverse carriers, when the first traverse carrier 20 moves horizontally to the left press-fitting station 10, the hot-melting press-fitting process is performed, meanwhile, the second traverse carrier 30 is located at the feeding and discharging station 12 for feeding and discharging, when the first traverse carrier 20 moves horizontally to the feeding and discharging station 12, the feeding and discharging are performed, and meanwhile, the second traverse carrier 30 is located at the right press-fitting station 11 for the hot-melting press-fitting process. Based on the above structure is visible, the utility model discloses it is preferred to have set up two pressfitting stations in frame 1, utilizes two sideslip microscope carriers of synchronous motion to convey the circuit board, compares the mode of unloading on one-to-one, the utility model discloses processing efficiency is greatly improved, moreover the utility model discloses a sideslip mode transmission line plate material compares the mode of unloading on the drawer type, the utility model discloses can avoid piece, greasy dirt to cause the pollution to the product, and then guarantee the product yield, in addition, the utility model provides a first sideslip microscope carrier 20 and second sideslip microscope carrier 30 horizontal position are unanimous, and it need not whole rising or descend to push down hot melt mechanism in the execution process, has not only simplified the action process, still can avoid influencing the machining precision because of pushing down hot melt mechanism overall movement, has satisfied the production requirement betterly.
In order to fix the first and second side shift stages 20 and 30 to each other, the present embodiment includes an intermediate platen 22, and the intermediate platen 22 is fixed between the first and second side shift stages 20 and 30.
Preferably, the first material carrying plate 21 is located above the first traverse stage 20 with a predetermined distance therebetween.
Accordingly, the second material carrying plate 31 is located above the second traverse stage 30 with a predetermined distance therebetween.
In order to realize reliable lateral movement, in this embodiment, two conveying slide rails 100 are fixed on the rack 1, 4 first slide bases 230 are fixed at the bottom of the first lateral movement stage 20, the 4 first slide bases 230 are respectively arranged on the two conveying slide rails 100, and the first slide bases 230 are in sliding fit with the conveying slide rails 100.
Further, 4 second sliding seats 32 are fixed at the bottom of the second traverse stage 30, the 4 second sliding seats 32 are respectively disposed on the two conveying slide rails 100, and the second sliding seats 32 are in sliding fit with the conveying slide rails 100.
In order to facilitate driving the first and second traverse stages 20 and 30 to traverse, in this embodiment, a belt pulley support 23 is fixed at the bottom of the first traverse stage 20, a belt pulley 24 is arranged on the belt pulley support 23, a driving motor is installed on the rack 1, the driving motor is connected with the belt pulley 24 through a belt, the driving motor drives the belt pulley 24 to run forward and backward through the belt, and further drives the first and second traverse stages 20 and 30 to reciprocate along the conveying slide rail 100.
Example two
With reference to fig. 1 to 12, this embodiment provides a left-right double-station circuit board hot melting and laminating device, which includes a frame 1, wherein a left laminating station 10 and a right laminating station 11 are disposed on the frame 1, a feeding and discharging station 12 is formed between the left laminating station 10 and the right laminating station 11, a conveying slide rail 100 is fixed on the frame 1, the conveying slide rail 100 sequentially penetrates through the left laminating station 10, the feeding and discharging station 12 and the right laminating station 11, a first material-carrying hot pressing mechanism 2 and a second material-carrying hot pressing mechanism 3 are disposed on the conveying slide rail 100, a left downward pressing hot melting mechanism 15 and a right downward pressing hot melting mechanism 16 are fixed on the frame 1, the first material-carrying hot pressing mechanism 2 is used for taking a circuit board from the feeding and discharging station 12 and transmitting the circuit board to the left downward pressing hot melting mechanism 15, and the left downward pressing hot melting mechanism 15 and the first material-carrying hot pressing mechanism 2 are matched with each other to align the circuit board on the first material-carrying hot pressing mechanism 2 And carrying out hot melting and laminating, wherein the second material-carrying hot-pressing mechanism 3 is used for taking the circuit board from the feeding and discharging station 12 and transmitting the circuit board to the right downward pressing hot-melting mechanism 16, and carrying out hot melting and laminating on the circuit board on the second material-carrying hot-pressing mechanism 3 by means of the cooperation of the right downward pressing hot-melting mechanism 16 and the second material-carrying hot-pressing mechanism 3.
Among the above-mentioned equipment, first year material hot press mechanism 2 and second year material hot press mechanism 3 can be used to go up unloading, can press hot melt mechanism 15 and right side down again and press hot melt mechanism 16 mutually to cooperate and accomplish the hot pressing, works as promptly during unloading in first year material hot press mechanism 2, second year material hot press mechanism 3 can carry out the hot melt pressfitting operation at right pressing station 11, works as during unloading in second year material hot press mechanism 3, first year material hot press mechanism 2 can carry out the hot melt pressfitting operation at left pressing station 10, compares prior art, the utility model discloses production efficiency has been guaranteed betterly, simultaneously, compares the processing mode of drawer type, the utility model discloses can effectively reduce wearing and tearing and avoid producing the greasy dirt to the product yield has been guaranteed and the improvement machining precision.
In order to support and fix, in this embodiment, a left bracket 13 and a right bracket 14 are fixed on the frame 1, the left push-down fuse mechanism 15 is fixed on the left bracket 13, and the right push-down fuse mechanism 16 is fixed on the right bracket 14.
Further, the first material-loading hot-pressing mechanism 2 is fixedly connected with the second material-loading hot-pressing mechanism 3, so that the first material-loading hot-pressing mechanism 2 and the second material-loading hot-pressing mechanism 3 move synchronously.
In order to realize the downward hot melting operation, in this embodiment, the left downward hot melting mechanism 15 includes a top plate 150, a first transverse adjusting slide rail 151 and a first longitudinal adjusting slide rail 152 are fixed on the top plate 150, a first transverse translation vertical plate 153 is arranged on the first transverse adjusting slide rail 151 and is slidably connected with the first transverse adjusting slide rail, a first longitudinal translation vertical plate 154 is arranged on the first longitudinal adjusting slide rail 152 and is slidably connected with the first longitudinal translation vertical plate 154, a plurality of upward hot melting mechanisms 155 arranged downward are respectively fixed on the first transverse translation vertical plate 153 and the first longitudinal adjusting slide rail 152, a pre-pressing lifting mechanism 156 is fixed on the top plate 150, a pre-pressing plate 157 is fixed on a lifting end of the pre-pressing lifting mechanism 156, a plurality of upper notches 158 are arranged on the pre-pressing plate 157, the upper notches 158 are aligned with the upper hot melting mechanisms 155 one by one, when the first material-loading hot pressing mechanism 2 transfers the circuit board to the lower portion of the left downward hot melting mechanism 15, the pre-pressing lifting mechanism 156 drives the pre-pressing plate 157 to descend and pre-press the circuit board, and then the upper hot-melting mechanism 155 performs hot-melting and pressing on the circuit board.
Preferably, the upper fuse mechanism 155 includes an upper fuse cylinder 1550 and an upper fuse head 1551, the upper fuse cylinder 1550 is fixedly connected to the first transverse translation vertical plate 153 or the first longitudinal adjustment sliding rail 152, the upper fuse head 1551 is aligned with the upper notch 158, and the upper fuse head 1551 can pass through the upper notch 158.
In this embodiment, the top plate 150 is a cross-shaped top plate. The preload lifter 156 is fixed to the center of the top plate 150.
Correspondingly, a cross-shaped connecting plate 159 is fixed at the lower end of the prepressing lifting mechanism 156, and the bottom of the connecting plate 159 is fixedly connected with the prepressing plate 157 through a plurality of upright posts 1590.
In order to achieve reliable lifting, in this embodiment, two upwardly extending bumpers 1591 are fixed to the connecting plate 159, two sliding sleeves 1500 are fixed to the top plate 150, the two bumpers 1591 respectively pass through the two sliding sleeves 1500, and the bumpers 1591 are slidably connected to the sliding sleeves 1500.
Further, the structure of the right push down fuse mechanism 16 is the same as that of the left push down fuse mechanism 15.
EXAMPLE III
In practical application, among circuit board hot melt lamination equipment's sideslip microscope carrier mechanism, it generally only has the function of placing circuit board material, and the notice is offered the notch on the microscope carrier and is come hot pressing action about convenient the execution, but because of the overall dimension of circuit board is different to and receive the influence of artifical blowing, hardly guarantee that multilayer circuit board aligns each other, consequently, how guarantee that the circuit board is accurate to the position, thereby improve machining precision and product yield, be the technical problem that prior art awaits the solution urgently.
To this end, the embodiment provides a jacking hot-melt alignment mechanism of a circuit board hot-melt pressing device, which is shown in fig. 3 to 10, and includes a first traverse stage 20, a cross-shaped supporting plate 200 is fixed above the first traverse stage 20, a preset distance exists between the supporting plate 200 and the first traverse stage 20, a first material-carrying plate 21 is fixed on the supporting plate 200, a second transverse adjusting slide rail 201 and a second longitudinal adjusting slide rail 202 are fixed on the first traverse stage 20, a second transverse translation vertical plate 203 is arranged on the second transverse adjusting slide rail 201 and slidably connected with the second transverse translation vertical plate, a second longitudinal translation vertical plate 204 is arranged on the second longitudinal adjusting slide rail 202, a plurality of lower hot-melt mechanisms 205 arranged upward are respectively fixed on the second transverse translation vertical plate 203 and the second transverse translation vertical plate 203, a plurality of lower notches 206 are arranged on the first material-carrying plate 21, the lower hot melting mechanism 205 is aligned with the lower notches 206 one by one, 4 sliding grooves 210 are formed in the supporting plate 200, the 4 sliding grooves 210 are distributed in a cross shape, sliding blocks 211 and sliding connections of the sliding blocks 211 are arranged in the sliding grooves 210, vertically arranged limiting rods 212 are fixed on the sliding blocks 211, 4 limiting slotted holes 213 with preset lengths are formed in the first material carrying plate 21, the limiting slotted holes 213 are aligned with the sliding grooves 210 one by one, and the limiting rods 212 penetrate through the limiting slotted holes 213 and the sliding connections of the limiting slotted holes 213.
In the structure, through the horizontal position of adjustment second horizontal translation riser 203 and the vertical translation riser 204 of second, can adjust a plurality of hot pressing position of hot melt mechanism 205 down, on this basis, the utility model discloses set up slider 211 in 4 spouts 210 of fagging 200 respectively, realize the position control to gag lever post 212 through the position of adjustment slider, utilize 4 gag lever posts 212 not to advance can be with the circuit board restriction in relevant position, can also guarantee to adjust well each other between the multilayer circuit board to machining precision and product yield have been improved, have satisfied the production requirement betterly.
In order to better match the sliding block 211 with the sliding groove 210 and prevent the sliding block 211 from jumping out, in this embodiment, the sliding groove 210 is a sliding groove with an inverted "T" shaped cross section, and the sliding block 211 is a sliding block with an inverted "T" shaped cross section.
In order to further limit the sliding block 211 and enable the sliding block 211 to move smoothly, in this embodiment, a square plate 214 is formed at the top of the sliding block 211, a step groove 215 is formed at an opening at the top of the sliding groove 210, the square plate 214 is clamped in the step groove 215 and is in sliding connection with the step groove 215, and the limiting rod 212 is fixed on the square plate 214.
As a preferable mode, the lower heat-melting mechanism 205 includes a lower heat-melting supporting block 2050 and a lower heat-melting head 2051, the lower heat-melting head 2051 is fixed on the top of the lower heat-melting supporting block 2050, and the lower heat-melting supporting block 2050 is fixedly connected to the second horizontal translation vertical plate 203 or the second vertical translation vertical plate 204.
In this embodiment, the relative position between the lower thermal melting head 2051 and the first material carrying plate 21 is fixed, specifically, the lower thermal melting head 2051 is inserted into the lower notch 206, and the top surface of the lower thermal melting head 2051 is flush with the top surface of the first material carrying plate 21. With the structure, the hot melting mechanism positioned above the hot melting mechanism is only required to execute hot pressing movement.
In order to better support the supporting plate 200, in this embodiment, 4U-shaped frames 207 are fixed on the first traverse stage 20, and the supporting plate 200 is fixed on the 4U-shaped frames 207.
As a preferable mode, at least two liftout cylinders 208 are fixed at the bottom of the supporting plate 200, a push rod 209 capable of passing through the first material carrying plate 21 is arranged at the driving end of the liftout cylinder 208, and the lift force is applied to the circuit board placed on the first material carrying plate 21 by driving the push rod 209 to move up and down through the liftout cylinder 208. The effect of the liftout cylinder 208 and the ejector rod 209 is that after hot melt pressing processing is performed, the circuit board can be lifted upwards through the cooperation of the liftout cylinder 208 and the ejector rod 209, and therefore the circuit board can be taken down conveniently.
The above is only the embodiment of the present invention, and is not intended to limit the present invention, and all modifications, equivalent replacements or improvements made within the technical scope of the present invention should be included within the protection scope of the present invention.

Claims (7)

1. A double-station transverse moving loading and unloading mechanism of circuit board hot melting laminating equipment comprises a rack (1), wherein a left laminating station (10) and a right laminating station (11) are arranged on the rack (1), and a loading and unloading station (12) is formed between the left laminating station (10) and the right laminating station (11), and is characterized in that the double-station transverse moving loading and unloading mechanism comprises a conveying slide rail (100), the conveying slide rail (100) is fixed on the rack (1), a first transverse moving carrying platform (20) and a second transverse moving carrying platform (30) which are distributed leftwards and rightwards are arranged on the conveying slide rail (100), the first transverse moving carrying platform (20) is fixedly connected with the second transverse moving carrying platform (30), and the first transverse moving carrying platform (20) and the second transverse moving carrying platform (30) are both in sliding connection with the conveying slide rail (100), the first transverse moving carrying platform (20) is fixedly provided with a first material carrying plate (21) used for placing a circuit board, the second transverse moving carrying platform (30) is fixedly provided with a second material carrying plate (31) used for placing the circuit board, when the first transverse moving carrying platform (20) is translated to the left pressing station (10) and hot melting pressing processing is carried out, the second transverse moving carrying platform (30) is located at the feeding and discharging station (12) for feeding and discharging, and when the first transverse moving carrying platform (20) is translated to the feeding and discharging station (12) for feeding and discharging, the second transverse moving carrying platform (30) is located at the right pressing station (11) for hot melting pressing processing.
2. The double-station transverse-moving loading and unloading mechanism of the circuit board hot melting laminating device as claimed in claim 1, characterized by comprising an intermediate platen (22), wherein the intermediate platen (22) is fixed between the first transverse-moving carrier (20) and the second transverse-moving carrier (30).
3. The double-station traverse feeding and discharging mechanism of the circuit board hot melt laminating device as claimed in claim 1, wherein the first material carrying plate (21) is located above the first traverse carrying platform (20) and a preset distance exists between the first material carrying plate and the first traverse carrying platform.
4. The double-station traverse feeding and discharging mechanism of the circuit board hot melt laminating device according to claim 1, wherein the second material carrying plate (31) is located above the second traverse carrying platform (30) and a preset distance exists between the second material carrying plate and the second traverse carrying platform.
5. The double-station transverse-moving loading and unloading mechanism of the circuit board hot-melting laminating device according to claim 1, wherein two conveying slide rails (100) are fixed on the frame (1), 4 first slide carriages (230) are fixed at the bottom of the first transverse-moving carrying platform (20), the 4 first slide carriages (230) are respectively arranged on the two conveying slide rails (100), and the first slide carriages (230) are in sliding fit with the conveying slide rails (100).
6. The double-station horizontal moving loading and unloading mechanism of the circuit board hot melting laminating device of claim 5, wherein 4 second sliding seats (32) are fixed at the bottom of the second horizontal moving carrying platform (30), the 4 second sliding seats (32) are respectively arranged on two conveying sliding rails (100), and the second sliding seats (32) are in sliding fit with the conveying sliding rails (100).
7. The double-station transverse-moving loading and unloading mechanism of the circuit board hot-melting laminating device as claimed in claim 1, wherein a belt wheel support (23) is fixed at the bottom of the first transverse-moving carrying platform (20), a belt wheel (24) is arranged on the belt wheel support (23), a driving motor is mounted on the rack (1), the driving motor is connected with the belt wheel (24) through a belt, the driving motor drives the belt wheel (24) to rotate forward and backward through the belt, and further drives the first transverse-moving carrying platform (20) and the second transverse-moving carrying platform (30) to reciprocate along the conveying slide rail (100).
CN202021934054.2U 2020-09-04 2020-09-04 Double-station transverse-moving loading and unloading mechanism of circuit board hot melting pressing equipment Active CN213280277U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021934054.2U CN213280277U (en) 2020-09-04 2020-09-04 Double-station transverse-moving loading and unloading mechanism of circuit board hot melting pressing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021934054.2U CN213280277U (en) 2020-09-04 2020-09-04 Double-station transverse-moving loading and unloading mechanism of circuit board hot melting pressing equipment

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CN213280277U true CN213280277U (en) 2021-05-25

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114158206A (en) * 2021-11-02 2022-03-08 深圳市方泰设备技术有限公司 Laminating machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114158206A (en) * 2021-11-02 2022-03-08 深圳市方泰设备技术有限公司 Laminating machine
CN114158206B (en) * 2021-11-02 2022-06-21 深圳市方泰设备技术有限公司 Laminating machine

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