CN112087868A - Control duplex position circuit board hot melt lamination equipment - Google Patents
Control duplex position circuit board hot melt lamination equipment Download PDFInfo
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- CN112087868A CN112087868A CN202010920054.5A CN202010920054A CN112087868A CN 112087868 A CN112087868 A CN 112087868A CN 202010920054 A CN202010920054 A CN 202010920054A CN 112087868 A CN112087868 A CN 112087868A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a left-right double-station circuit board hot melting laminating device which comprises a frame, wherein a left laminating station and a right laminating station are arranged on the frame, the hot-melting press-fit device comprises a feeding and discharging station, a conveying slide rail is fixed on a rack, a first material-carrying hot-pressing mechanism and a second material-carrying hot-pressing mechanism are arranged on the conveying slide rail, a left downward hot-melting mechanism and a right downward hot-melting mechanism are fixed on the rack, the first material-carrying hot-pressing mechanism is used for taking a circuit board from the feeding and discharging station and transmitting the circuit board to the left downward hot-melting mechanism, the circuit board on the first material-carrying hot-pressing mechanism is subjected to hot-melting press-fit through the cooperation of the left downward hot-melting mechanism and the first material-carrying hot-pressing mechanism, the second material-carrying hot-pressing mechanism is used for taking the circuit board from the feeding and discharging station and transmitting the circuit board to the right downward hot-melting mechanism, and the circuit board on. The invention can ensure the production efficiency, improve the product yield and improve the processing precision.
Description
Technical Field
The invention relates to circuit board processing equipment, in particular to left and right double-station circuit board hot melting and laminating equipment.
Background
At present, in the circuit board industry, hot melting riveting equipment for laminating multilayer boards generally comprises a hot pressing processing mechanism and a feeding and discharging mechanism, in practical application, each hot-pressing processing mechanism generally corresponds to one feeding and discharging mechanism, so that the problems of low efficiency and the like exist in the execution process, in addition, a drawer type feeding and discharging mode can also be adopted, namely, the hot melting and pressing are completed by arranging the upper and lower layers of feeding and discharging mechanisms and simultaneously matching with the lifting motion of the hot pressing mechanism, although the drawer-type feeding and discharging mode can improve the feeding and discharging efficiency, the mechanical moving mechanism is worn, in addition, foreign matters and lubricating oil generated in the movement process easily drop on products, so that the products are scrapped more, and in addition, in order to realize the alternate movement of the upper table surface and the lower table surface, an actuating mechanism where the hot melting head is located needs to be lifted integrally to avoid, so that the product processing precision is difficult to meet ideal requirements.
Disclosure of Invention
The invention aims to solve the technical problem of providing a left-right double-station circuit board hot melting laminating device which can ensure the production efficiency, improve the product yield and improve the processing precision aiming at the defects of the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme.
The left and right double-station circuit board hot melting and laminating equipment comprises a frame, wherein a left laminating station and a right laminating station are arranged on the frame, a feeding and discharging station is formed between the left laminating station and the right laminating station, a conveying slide rail is fixed on the frame and sequentially penetrates through the left laminating station, the feeding and discharging station and the right laminating station, a first material loading hot pressing mechanism and a second material loading hot pressing mechanism are arranged on the conveying slide rail, a left downward pressing hot melting mechanism and a right downward pressing hot melting mechanism are fixed on the frame, the first material loading hot pressing mechanism is used for taking a circuit board from the feeding and discharging station and transmitting the circuit board to the left downward pressing hot melting mechanism, the circuit board on the first material loading hot pressing mechanism is subjected to hot melting and laminating through the cooperation of the left downward pressing mechanism and the first material loading hot melting mechanism, and the second material loading hot pressing mechanism is used for taking the circuit board from the feeding and transmitting the circuit board to the right downward pressing hot melting machine And the circuit board on the second material-carrying hot-pressing mechanism is subjected to hot-melting pressing by means of the matching of the right downward-pressing hot-melting mechanism and the second material-carrying hot-pressing mechanism.
Preferably, a left side support and a right side support are fixed on the rack, the left downward pressing hot melting mechanism is fixed on the left side support, and the right downward pressing hot melting mechanism is fixed on the right side support.
Preferably, the first material-carrying hot-pressing mechanism is fixedly connected with the second material-carrying hot-pressing mechanism, so that the first material-carrying hot-pressing mechanism and the second material-carrying hot-pressing mechanism move synchronously.
Preferably, the left downward pressing hot melting mechanism comprises a top plate, a first transverse adjusting slide rail and a first longitudinal adjusting slide rail are fixed on the top plate, a first transverse translation vertical plate is arranged on the first transverse adjusting slide rail and is slidably connected with the first transverse translation vertical plate, a first longitudinal translation vertical plate is arranged on the first longitudinal adjusting slide rail and is slidably connected with the first longitudinal adjusting slide rail, a plurality of upward hot melting mechanisms arranged downwards are respectively fixed on the first transverse translation vertical plate and the first longitudinal adjusting slide rail, a prepressing lifting mechanism is fixed on the top plate, a prepressing plate is fixed at the lifting end of the prepressing lifting mechanism, a plurality of upper notches are arranged on the prepressing plate, the upper notches are aligned with the upward hot melting mechanisms one by one, and when the first material-carrying hot pressing mechanism transmits the circuit board to the position below the left downward pressing hot melting mechanism, the prepressing lifting mechanism drives the prepressing plate to descend and prepress the circuit board, and then the circuit board is subjected to hot melting and laminating by the upper hot melting mechanism.
Preferably, the upper hot melting mechanism comprises an upper hot melting cylinder and an upper hot melting head, the upper hot melting cylinder is fixedly connected with the first transverse translation vertical plate or the first longitudinal adjusting sliding rail, the upper hot melting head is aligned with the upper notch, and the upper hot melting head can pass through the upper notch.
Preferably, the top plate is a "ten" shaped top plate.
Preferably, the preload lifting mechanism is fixed at the center of the top plate.
Preferably, the lower end of the prepressing lifting mechanism is fixed with a cross-shaped connecting plate, and the bottom of the connecting plate is fixedly connected with the prepressing plate through a plurality of stand columns.
Preferably, be fixed with two polished rods that upwards extend on the connecting plate, be fixed with two sliding sleeves on the roof, two polished rods pass two sliding sleeves respectively, just the polished rod with sliding sleeve sliding connection.
Preferably, the structure of the right downward pressing hot melting mechanism is the same as that of the left downward pressing hot melting mechanism.
In the left and right double-station circuit board hot melting and laminating equipment disclosed by the invention, the first material-carrying hot pressing mechanism and the second material-carrying hot pressing mechanism can be used for feeding and discharging, and can be matched with the left downward hot melting mechanism and the right downward hot melting mechanism to complete hot pressing, namely when the first material-carrying hot pressing mechanism feeds and discharges materials, the second material-carrying hot pressing mechanism can perform hot melting and laminating operation on the right laminating station, and when the second material-carrying hot pressing mechanism feeds and discharges materials, the first material-carrying hot pressing mechanism can perform hot melting and laminating operation on the left laminating station.
Drawings
FIG. 1 is a perspective view of a hot melt lamination apparatus of the present invention;
FIG. 2 is a top view of the hot melt lamination apparatus of the present invention;
FIG. 3 is a side view of the hot melt lamination apparatus of the present invention;
FIG. 4 is a first structural view of the first material-loading hot-pressing mechanism, the second material-loading hot-pressing mechanism and the frame;
FIG. 5 is a second structural view of the first material-loading hot-pressing mechanism, the second material-loading hot-pressing mechanism and the frame;
FIG. 6 is a first structural diagram of the first and second carrier hot-pressing mechanisms;
FIG. 7 is a second structural diagram of the first and second material-loading hot-pressing mechanisms;
FIG. 8 is an exploded view of the first carrier hot press mechanism;
FIG. 9 is a block diagram of the left hold-down fuse mechanism and the left side bracket;
FIG. 10 is a first view of the structure of the left push down fuse mechanism;
FIG. 11 is a second view of the construction of the left push down fuse mechanism;
fig. 12 is an exploded view of the left push down fuse mechanism.
Detailed Description
The invention is described in more detail below with reference to the figures and examples.
Example one
With reference to fig. 1 to 12, this embodiment provides a left-right double-station circuit board hot melting and laminating device, which includes a frame 1, wherein a left laminating station 10 and a right laminating station 11 are disposed on the frame 1, a feeding and discharging station 12 is formed between the left laminating station 10 and the right laminating station 11, a conveying slide rail 100 is fixed on the frame 1, the conveying slide rail 100 sequentially penetrates through the left laminating station 10, the feeding and discharging station 12 and the right laminating station 11, a first material-carrying hot pressing mechanism 2 and a second material-carrying hot pressing mechanism 3 are disposed on the conveying slide rail 100, a left downward pressing hot melting mechanism 15 and a right downward pressing hot melting mechanism 16 are fixed on the frame 1, the first material-carrying hot pressing mechanism 2 is used for taking a circuit board from the feeding and discharging station 12 and transmitting the circuit board to the left downward pressing hot melting mechanism 15, and the left downward pressing hot melting mechanism 15 and the first material-carrying hot pressing mechanism 2 are matched with each other to align the circuit board feeding and discharging hot melting mechanism 2 on the first material- And the second material-carrying hot-pressing mechanism 3 is used for taking the circuit board from the feeding and discharging station 12 and transmitting the circuit board to the right downward pressing hot-melting mechanism 16, and the circuit board on the second material-carrying hot-pressing mechanism 3 is subjected to hot-melting pressing through the cooperation of the right downward pressing hot-melting mechanism 16 and the second material-carrying hot-pressing mechanism 3.
In the above device, the first material-carrying hot-pressing mechanism 2 and the second material-carrying hot-pressing mechanism 3 can be used for loading and unloading, and can also be matched with the left downward hot-melting mechanism 15 and the right downward hot-melting mechanism 16 to complete hot pressing, that is, when the first material-carrying hot-pressing mechanism 2 is used for loading and unloading, the second material-carrying hot-pressing mechanism 3 can perform hot-melting pressing operation at the right pressing station 11, and when the second material-carrying hot-pressing mechanism 3 is used for loading and unloading, the first material-carrying hot-pressing mechanism 2 can perform hot-melting pressing operation at the left pressing station 10.
In order to support and fix, in this embodiment, a left bracket 13 and a right bracket 14 are fixed on the frame 1, the left push-down fuse mechanism 15 is fixed on the left bracket 13, and the right push-down fuse mechanism 16 is fixed on the right bracket 14.
Further, the first material-loading hot-pressing mechanism 2 is fixedly connected with the second material-loading hot-pressing mechanism 3, so that the first material-loading hot-pressing mechanism 2 and the second material-loading hot-pressing mechanism 3 move synchronously.
In order to realize the downward hot melting operation, in this embodiment, the left downward hot melting mechanism 15 includes a top plate 150, a first transverse adjusting slide rail 151 and a first longitudinal adjusting slide rail 152 are fixed on the top plate 150, a first transverse translation vertical plate 153 is arranged on the first transverse adjusting slide rail 151 and is slidably connected with the first transverse adjusting slide rail, a first longitudinal translation vertical plate 154 is arranged on the first longitudinal adjusting slide rail 152 and is slidably connected with the first longitudinal translation vertical plate 154, a plurality of upward hot melting mechanisms 155 arranged downward are respectively fixed on the first transverse translation vertical plate 153 and the first longitudinal adjusting slide rail 152, a pre-pressing lifting mechanism 156 is fixed on the top plate 150, a pre-pressing plate 157 is fixed on a lifting end of the pre-pressing lifting mechanism 156, a plurality of upper notches 158 are arranged on the pre-pressing plate 157, the upper notches 158 are aligned with the upper hot melting mechanisms 155 one by one, when the first material-loading hot pressing mechanism 2 transfers the circuit board to the lower portion of the left downward hot melting mechanism 15, the pre-pressing lifting mechanism 156 drives the pre-pressing plate 157 to descend and pre-press the circuit board, and then the upper hot-melting mechanism 155 performs hot-melting and pressing on the circuit board.
Preferably, the upper fuse mechanism 155 includes an upper fuse cylinder 1550 and an upper fuse head 1551, the upper fuse cylinder 1550 is fixedly connected to the first transverse translation vertical plate 153 or the first longitudinal adjustment sliding rail 152, the upper fuse head 1551 is aligned with the upper notch 158, and the upper fuse head 1551 can pass through the upper notch 158.
In this embodiment, the top plate 150 is a cross-shaped top plate. The preload lifter 156 is fixed to the center of the top plate 150.
Correspondingly, a cross-shaped connecting plate 159 is fixed at the lower end of the prepressing lifting mechanism 156, and the bottom of the connecting plate 159 is fixedly connected with the prepressing plate 157 through a plurality of upright posts 1590.
In order to achieve reliable lifting, in this embodiment, two upwardly extending bumpers 1591 are fixed to the connecting plate 159, two sliding sleeves 1500 are fixed to the top plate 150, the two bumpers 1591 respectively pass through the two sliding sleeves 1500, and the bumpers 1591 are slidably connected to the sliding sleeves 1500.
Further, the structure of the right push down fuse mechanism 16 is the same as that of the left push down fuse mechanism 15.
Example two
In practical application, for circuit board hot melt lamination equipment, unloading mechanism generally realizes unloading with hot melt lamination mechanism one to one on its upper and lower unloading mechanism, and the inefficiency of this kind of unloading mode of going up in addition, how can also carry out hot melt lamination processing in the time of unloading on the upper and lower unloading to guarantee production efficiency and machining precision, be the technical problem that prior art waited to solve urgently.
To this end, the embodiment provides a double-station traverse loading and unloading mechanism of a circuit board hot-melt laminating device, which is shown in fig. 3 to 8, and the hot-melt laminating device includes a frame 1, a left laminating station 10 and a right laminating station 11 are arranged on the frame 1, a loading and unloading station 12 is formed between the left laminating station 10 and the right laminating station 11, the double-station traverse loading and unloading mechanism includes a conveying slide rail 100, the conveying slide rail 100 is fixed on the frame 1, a first traverse platform 20 and a second traverse platform 30 which are distributed left and right are arranged on the conveying slide rail 100, the first traverse platform 20 is fixedly connected with the second traverse platform 30, the first traverse platform 20 and the second traverse platform 30 are both slidably connected with the conveying slide rail 100, a first material carrying plate 21 for placing a circuit board is fixed on the first traverse platform 20, a second material carrying plate 31 for placing a circuit board is fixed on the second traverse carrier 30, when the first traverse carrier 20 translates to the left pressing station 10 and performs hot-melt pressing processing, the second traverse carrier 30 is located at the feeding and discharging station 12 for feeding and discharging, and when the first traverse carrier 20 translates to the feeding and discharging station 12 for feeding and discharging, the second traverse carrier 30 is located at the right pressing station 11 for hot-melt pressing processing.
In the above mechanism, the conveying slide rail 100 is provided with a first traverse carrier 20 and a second traverse carrier 30 which move synchronously, in the moving process of the two traverse carriers, when the first traverse carrier 20 moves horizontally to the left press-fitting station 10, the hot-melting press-fitting process is performed, meanwhile, the second traverse carrier 30 is located at the feeding and discharging station 12 for feeding and discharging, when the first traverse carrier 20 moves horizontally to the feeding and discharging station 12, the feeding and discharging are performed, and meanwhile, the second traverse carrier 30 is located at the right press-fitting station 11 for the hot-melting press-fitting process. Based on the structure, the two pressing stations are preferably arranged on the frame 1, the circuit board is conveyed by the two transverse moving carrying platforms which move synchronously, compared with a one-to-one loading and unloading mode, the processing efficiency is greatly improved, the circuit board material is conveyed by the transverse moving mode, compared with a drawer type loading and unloading mode, the circuit board material conveying device can avoid pollution of scraps and oil stains to products, and further ensure the product yield, in addition, the horizontal positions of the first transverse moving carrying platform 20 and the second transverse moving carrying platform 30 are consistent, and the whole lifting or descending of the downward pressing hot melting mechanism is not needed in the execution process, so that the action process is simplified, the influence on the processing precision due to the whole movement of the downward pressing hot melting mechanism can be avoided, and the production requirement is well met.
In order to fix the first and second side shift stages 20 and 30 to each other, the present embodiment includes an intermediate platen 22, and the intermediate platen 22 is fixed between the first and second side shift stages 20 and 30.
Preferably, the first material carrying plate 21 is located above the first traverse stage 20 with a predetermined distance therebetween.
Accordingly, the second material carrying plate 31 is located above the second traverse stage 30 with a predetermined distance therebetween.
In order to realize reliable lateral movement, in this embodiment, two conveying slide rails 100 are fixed on the frame 1, 4 first slides 22 are fixed at the bottom of the first lateral movement stage 20, the 4 first slides 22 are respectively arranged on the two conveying slide rails 100, and the first slides 22 are in sliding fit with the conveying slide rails 100.
Further, 4 second sliding seats 32 are fixed at the bottom of the second traverse stage 30, the 4 second sliding seats 32 are respectively disposed on the two conveying slide rails 100, and the second sliding seats 32 are in sliding fit with the conveying slide rails 100.
In order to facilitate driving the first and second traverse stages 20 and 30 to traverse, in this embodiment, a belt pulley support 23 is fixed at the bottom of the first traverse stage 20, a belt pulley 24 is arranged on the belt pulley support 23, a driving motor is installed on the rack 1, the driving motor is connected with the belt pulley 24 through a belt, the driving motor drives the belt pulley 24 to run forward and backward through the belt, and further drives the first and second traverse stages 20 and 30 to reciprocate along the conveying slide rail 100.
EXAMPLE III
In practical application, among circuit board hot melt lamination equipment's sideslip microscope carrier mechanism, it generally only has the function of placing circuit board material, and the notice is offered the notch on the microscope carrier and is come hot pressing action about convenient the execution, but because of the overall dimension of circuit board is different to and receive the influence of artifical blowing, hardly guarantee that multilayer circuit board aligns each other, consequently, how guarantee that the circuit board is accurate to the position, thereby improve machining precision and product yield, be the technical problem that prior art awaits the solution urgently.
To this end, the embodiment provides a jacking hot-melt alignment mechanism of a circuit board hot-melt pressing device, which is shown in fig. 3 to 10, and includes a first traverse stage 20, a cross-shaped supporting plate 200 is fixed above the first traverse stage 20, a preset distance exists between the supporting plate 200 and the first traverse stage 20, a first material-carrying plate 21 is fixed on the supporting plate 200, a second transverse adjusting slide rail 201 and a second longitudinal adjusting slide rail 202 are fixed on the first traverse stage 20, a second transverse translation vertical plate 203 is arranged on the second transverse adjusting slide rail 201 and slidably connected with the second transverse translation vertical plate, a second longitudinal translation vertical plate 204 is arranged on the second longitudinal adjusting slide rail 202, a plurality of lower hot-melt mechanisms 205 arranged upward are respectively fixed on the second transverse translation vertical plate 203 and the second transverse translation vertical plate 203, a plurality of lower notches 206 are arranged on the first material-carrying plate 21, the lower hot melting mechanism 205 is aligned with the lower notches 206 one by one, 4 sliding grooves 210 are formed in the supporting plate 200, the 4 sliding grooves 210 are distributed in a cross shape, sliding blocks 211 and sliding connections of the sliding blocks 211 are arranged in the sliding grooves 210, vertically arranged limiting rods 212 are fixed on the sliding blocks 211, 4 limiting slotted holes 213 with preset lengths are formed in the first material carrying plate 21, the limiting slotted holes 213 are aligned with the sliding grooves 210 one by one, and the limiting rods 212 penetrate through the limiting slotted holes 213 and the sliding connections of the limiting slotted holes 213.
In the structure, the hot pressing positions of the lower hot melting mechanisms 205 can be adjusted by adjusting the horizontal positions of the second transverse translation vertical plate 203 and the second longitudinal translation vertical plate 204, on the basis, the sliding blocks 211 are respectively arranged in the 4 sliding grooves 210 of the supporting plate 200, the position of the limiting rods 212 is adjusted by adjusting the positions of the sliding blocks, the circuit boards can be limited at corresponding positions without using the 4 limiting rods 212, and the mutual alignment among the multilayer circuit boards can be ensured, so that the processing precision and the product yield are improved, and the production requirement is better met.
In order to better match the sliding block 211 with the sliding groove 210 and prevent the sliding block 211 from jumping out, in this embodiment, the sliding groove 210 is a sliding groove with an inverted "T" shaped cross section, and the sliding block 211 is a sliding block with an inverted "T" shaped cross section.
In order to further limit the sliding block 211 and enable the sliding block 211 to move smoothly, in this embodiment, a square plate 214 is formed at the top of the sliding block 211, a step groove 215 is formed at an opening at the top of the sliding groove 210, the square plate 214 is clamped in the step groove 215 and is in sliding connection with the step groove 215, and the limiting rod 212 is fixed on the square plate 214.
As a preferable mode, the lower heat-melting mechanism 205 includes a lower heat-melting supporting block 2050 and a lower heat-melting head 2051, the lower heat-melting head 2051 is fixed on the top of the lower heat-melting supporting block 2050, and the lower heat-melting supporting block 2050 is fixedly connected to the second horizontal translation vertical plate 203 or the second vertical translation vertical plate 204.
In this embodiment, the relative position between the lower thermal melting head 2051 and the first material carrying plate 21 is fixed, specifically, the lower thermal melting head 2051 is inserted into the lower notch 206, and the top surface of the lower thermal melting head 2051 is flush with the top surface of the first material carrying plate 21. With the structure, the hot melting mechanism positioned above the hot melting mechanism is only required to execute hot pressing movement.
In order to better support the supporting plate 200, in this embodiment, 4U-shaped frames 207 are fixed on the first traverse stage 20, and the supporting plate 200 is fixed on the 4U-shaped frames 207.
As a preferable mode, at least two liftout cylinders 208 are fixed at the bottom of the supporting plate 200, a push rod 209 capable of passing through the first material carrying plate 21 is arranged at the driving end of the liftout cylinder 208, and the lift force is applied to the circuit board placed on the first material carrying plate 21 by driving the push rod 209 to move up and down through the liftout cylinder 208. The effect of the liftout cylinder 208 and the ejector rod 209 is that after hot melt pressing processing is performed, the circuit board can be lifted upwards through the cooperation of the liftout cylinder 208 and the ejector rod 209, and therefore the circuit board can be taken down conveniently.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the technical scope of the present invention should be included in the scope of the present invention.
Claims (10)
1. The left and right double-station circuit board hot melting laminating equipment is characterized by comprising a rack (1), wherein a left laminating station (10) and a right laminating station (11) are arranged on the rack (1), a feeding and discharging station (12) is formed between the left laminating station (10) and the right laminating station (11), a conveying slide rail (100) is fixed on the rack (1), the conveying slide rail (100) sequentially penetrates through the left laminating station (10), the feeding and discharging station (12) and the right laminating station (11), a first material-carrying hot pressing mechanism (2) and a second material-carrying hot pressing mechanism (3) are arranged on the conveying slide rail (100), a left downward pressing hot melting mechanism (15) and a right downward pressing hot melting mechanism (16) are fixed on the rack (1), the first material-carrying hot pressing mechanism (2) is used for taking a circuit board from the feeding and discharging station (12) and transmitting the circuit board to the left downward pressing hot melting mechanism (15), the circuit board on the first material-carrying hot-pressing mechanism (2) is subjected to hot-melting pressing through the cooperation of the left downward hot-melting mechanism (15) and the first material-carrying hot-pressing mechanism (2), the second material-carrying hot-pressing mechanism (3) is used for taking the circuit board from the feeding and discharging station (12) and transmitting the circuit board to the right downward hot-melting mechanism (16), and the circuit board on the second material-carrying hot-pressing mechanism (3) is subjected to hot-melting pressing through the cooperation of the right downward hot-melting mechanism (16) and the second material-carrying hot-pressing mechanism (3).
2. The left and right double-station circuit board hot melting and laminating equipment as claimed in claim 1, wherein a left side bracket (13) and a right side bracket (14) are fixed on the rack (1), the left downward pressing hot melting mechanism (15) is fixed on the left side bracket (13), and the right downward pressing hot melting mechanism (16) is fixed on the right side bracket (14).
3. The left-right double-station circuit board hot melting laminating equipment according to claim 1, wherein the first material-carrying hot pressing mechanism (2) is fixedly connected with the second material-carrying hot pressing mechanism (3) so that the first material-carrying hot pressing mechanism (2) and the second material-carrying hot pressing mechanism (3) move synchronously.
4. The left-right double-station circuit board hot melting and laminating equipment according to claim 1, wherein the left downward pressing hot melting mechanism (15) comprises a top plate (150), a first transverse adjusting slide rail (151) and a first longitudinal adjusting slide rail (152) are fixed on the top plate (150), a first transverse translation vertical plate (153) is arranged on the first transverse adjusting slide rail (151) and is connected with the first transverse translation vertical plate in a sliding manner, a first longitudinal translation vertical plate (154) is arranged on the first longitudinal adjusting slide rail (152) and is connected with the first longitudinal translation vertical plate in a sliding manner, a plurality of upward hot melting mechanisms (155) are respectively fixed on the first transverse translation vertical plate (153) and the first longitudinal adjusting slide rail (152), a prepressing lifting mechanism (156) is fixed on the top plate (150), a prepressing plate (157) is fixed on a lifting end of the prepressing lifting mechanism (156), and a plurality of upper notches (158) are formed on the prepressing plate (157), the upper notches (158) are aligned with the upper hot melting mechanisms (155) one by one, when the first material-carrying hot pressing mechanism (2) transmits the circuit board to the position below the left lower pressing hot melting mechanism (15), the pre-pressing lifting mechanism (156) drives the pre-pressing plate (157) to descend and pre-press the circuit board, and then the upper hot melting mechanism (155) performs hot melting and pressing on the circuit board.
5. The left-right double-station circuit board hot melting laminating equipment according to claim 4, wherein the upper hot melting mechanism (155) comprises an upper hot melting cylinder (1550) and an upper hot melting head (1551), the upper hot melting cylinder (1550) is fixedly connected with the first transverse translation vertical plate (153) or the first longitudinal adjusting slide rail (152), the upper hot melting head (1551) is aligned with the upper notch (158), and the upper hot melting head (1551) can penetrate through the upper notch (158).
6. The left and right double-station circuit board hot melt laminating equipment of claim 4, wherein the top plate (150) is a cross-shaped top plate.
7. The left-right double-station circuit board hot melt laminating equipment of claim 4, wherein the pre-pressing lifting mechanism (156) is fixed at the center of the top plate (150).
8. The left and right double-station circuit board hot melt laminating equipment according to claim 4, wherein a cross-shaped connecting plate (159) is fixed at the lower end of the prepressing lifting mechanism (156), and the bottom of the connecting plate (159) is fixedly connected with the prepressing plate (157) through a plurality of upright posts (1590).
9. The hot-melting laminating equipment for the circuit board with the left and the right double stations as claimed in claim 8, wherein two polish rods (1591) extending upwards are fixed on the connecting plate (159), two sliding sleeves (1500) are fixed on the top plate (150), the two polish rods (1591) respectively penetrate through the two sliding sleeves (1500), and the polish rod (1591) is connected with the sliding sleeves (1500) in a sliding manner.
10. The left-right double-station circuit board hot melting laminating equipment as claimed in claim 1, wherein the structure of the right downward pressing hot melting mechanism (16) is the same as that of the left downward pressing hot melting mechanism (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010920054.5A CN112087868A (en) | 2020-09-04 | 2020-09-04 | Control duplex position circuit board hot melt lamination equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010920054.5A CN112087868A (en) | 2020-09-04 | 2020-09-04 | Control duplex position circuit board hot melt lamination equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112087868A true CN112087868A (en) | 2020-12-15 |
Family
ID=73733105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010920054.5A Pending CN112087868A (en) | 2020-09-04 | 2020-09-04 | Control duplex position circuit board hot melt lamination equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112087868A (en) |
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2020
- 2020-09-04 CN CN202010920054.5A patent/CN112087868A/en active Pending
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