CN212933445U

CN212933445U - Heat dissipation device for computer

Info

Publication number: CN212933445U
Application number: CN202022035210.8U
Authority: CN
Inventors: 李皓宸
Original assignee: Haoyu Chenxing Tianjin Technology Development Co ltd
Current assignee: Haoyu Chenxing Tianjin Technology Development Co ltd
Priority date: 2020-09-17
Filing date: 2020-09-17
Publication date: 2021-04-09
Anticipated expiration: 2030-09-17

Abstract

The utility model discloses a heat dissipation device for a computer, which comprises a computer shell, wherein a computer element installation bin is arranged in an inner cavity of the computer shell, a frame body is fixedly arranged in the inner cavity of the computer element installation bin, a heat absorption plate is arranged in the frame body, and the bottom of the frame body is provided with a heat conducting fin, the top end of the heat conducting fin extends into the frame body and is contacted with the heat absorbing plate, the heat radiating device for the computer of the utility model can be used for a mini computer with compact inner space through the arrangement of the heat absorbing plate and the through pipe, the heat can be fine through heat-dissipating structure such as conducting strip, heat dissipation metal sheet radiator fan with the heat, derive the outside to computer case from computer element installation storehouse, overall structure sets up compactly, and the heat conduction effect is good has fine heat conduction and heat dissipation function, is favorable to thermal transmission and gives off, has ensured its inside electronic component's normal work.

Description

Heat dissipation device for computer

Technical Field

The utility model relates to a computer heat dissipation technical field especially relates to a be used for heat abstractor for computer.

Background

The computer is spread over general schools, enterprises and public institutions, enters common families and becomes an essential tool in the information society, the computer is generally composed of a host and a display screen, with the development of the society, a mini-type case is popular at present, the mini-type case is popular for young people, electronic components in the mini-type host can generate a large amount of heat during working, the heat cannot form a good air channel due to the limitation of an internal space, and the heat is difficult to be discharged in time, so that the running speed of the host can be influenced. To this end, we propose a heat sink for computers.

SUMMERY OF THE UTILITY MODEL

The utility model provides a be used for heat abstractor for the computer, this heat abstractor for computer of aim at has fine heat conduction and heat dissipation function to the compact mini computer of inner space, is favorable to thermal transmission and gives off, has ensured its inside electronic component's normal work, has improved the result of use to the computer, has fine practicality.

In order to realize the technical purpose, the technical effect is achieved, the utility model discloses a realize through following technical scheme:

the utility model provides a heat abstractor for computer, includes the computer casing, be provided with computer element installation storehouse in the inner chamber of computer casing, fixed mounting has the framework in the inner chamber in computer element installation storehouse, install the absorber plate in the framework, and the bottom of framework installs the conducting strip, the top of conducting strip extends to in the framework and contacts each other with the absorber plate, install out the tuber pipe on the bottom outer wall of computer casing, the bottom of conducting strip extends to out in the tuber pipe, the top fixed mounting of computer casing has a storehouse, install the fan in the storehouse of top, the air outlet department of fan is connected with the shunt tubes, and the fan passes through the inner chamber that the shunt tubes put through the computer casing.

Preferably, in the heat dissipation device for a computer, an air duct is arranged between the computer component mounting bin and the inner wall of the computer housing, and the shunt pipe is arranged at the top of the air duct.

Preferably, in the heat dissipation device for a computer, heat dissipation metal plates are fixedly mounted on both left and right side walls of the computer housing, and the heat dissipation metal plates are mounted on the side walls of the computer housing in a penetrating manner.

Preferably, in the above heat dissipation device for a computer, a power supply heat dissipation dustproof net is installed in a hole at the bottom of the computer housing, and a support foot pad is fixedly installed on the outer wall of the bottom of the computer housing.

Preferably, in the heat dissipation device for a computer, a through pipe is installed on the side wall of the frame through a hole, the through pipes are sequentially installed on the side wall of the frame in equal intervals from top to bottom, and another of each through pipe extends into the inner cavity of the air duct.

Preferably, in the heat dissipating device for a computer, a heat dissipating fan is fixedly mounted on a front wall of the computer housing, and the heat dissipating fan is disposed in front of the heat absorbing plate.

The utility model has the advantages that: the utility model discloses a heat abstractor for computer is to the compact mini computer of inner space, through the setting of absorber plate and siphunculus, can be fine pass through the heat conduction piece with the heat, heat radiation structure such as heat dissipation metal sheet radiator fan, derive to the outside of computer housing from computer component installation storehouse, overall structure sets up compactly, the heat conduction effect is good has fine heat conduction and heat dissipation function, be favorable to thermal transmission and give off, its inside electronic component's normal work has been ensured, the result of use to the computer has been improved, and the practicality is fine.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall external structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

fig. 3 is an enlarged view of a portion a of fig. 2 according to the present invention.

1. A computer housing; 2. a computer component mounting bin; 3. a frame body; 4. a heat absorbing plate; 5. pipe passing; 6. A heat-dissipating metal plate; 7. carrying out top bin; 8. a fan; 9. a shunt tube; 10. an air duct; 11. a heat conductive sheet; 12. an air outlet pipe; 13. a power supply heat dissipation dustproof net; 14. a heat radiation fan; 15. supporting the foot pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-3, the present embodiment is a heat dissipation device for a computer, including a computer housing 1, a computer component installation bin 2 is disposed in an inner cavity of the computer housing 1, a frame 3 is fixedly installed in the inner cavity of the computer component installation bin 2, a heat absorption plate 4 is installed in the frame 3, a heat conduction fin 11 is installed at the bottom of the frame 3, a top end of the heat conduction fin 11 extends into the frame 3 and contacts with the heat absorption plate 4, an air outlet pipe 12 is installed on an outer wall of the bottom of the computer housing 1, a bottom end of the heat conduction fin 11 extends into the air outlet pipe 12, a top bin 7 is fixedly installed at the top of the computer housing 1, a fan 8 is installed in the top bin 7, a shunt pipe 9 is connected to an air outlet of the fan 8, the fan 8 is communicated with the inner cavity of the computer housing 1 through the shunt pipe 9, an air duct 10 is disposed between the computer component installation bin, shunt tubes 9 sets up the top at wind channel 10, equal fixed mounting has heat dissipation metal sheet 6 on the lateral wall about computer housing 1, heat dissipation metal sheet 6 is the installation of run-through on computer housing 1's lateral wall, power heat dissipation dust screen 13 is installed to computer housing 1's bottom trompil, and fixed mounting has support callus on the sole 15 on computer housing 1's the bottom outer wall, siphunculus 5 is installed to the trompil on frame 3's the lateral wall, siphunculus 5 is from last to being the partition installation down in proper order on frame 3's lateral wall, another of every siphunculus 5 all extends to in the inner chamber of wind channel 10, fixed mounting has radiator fan 14 on computer housing 1's the antetheca, radiator fan 14 sets up the.

The utility model relates to a concrete implementation, the heat abstractor for computer of the utility model has reasonable overall structure, obvious heat dissipation effect, especially when the mini computer with compact inner space is used, the computer element installation bin 2 in the inner cavity of the computer shell 1 is provided with a computer mainboard, the computer element installation bin 2 emits heat when the computer works, at the moment, an air duct 10 is arranged between the computer element installation bin 2 and the inner wall of the computer shell 1, the fan 8 can be installed through the shunt tubes 9, the fan is well formed in the air duct 10 and is discharged from the air outlet pipe 12 at the bottom, the supporting foot pad 15 is fixedly arranged on the outer wall at the bottom of the computer shell 1, the heat dissipation effect at the bottom of the computer shell 1 is obvious, meanwhile, through the arrangement of the heat absorbing plate 4 and the through pipe 5, the heat can be well conducted through the heat conducting structures such as the heat conducting fins 11 and the heat dissipation metal plate 6, derive to computer casing 1's outside from computer element installation storehouse 2, holistic heat conduction effect is good has fine heat conduction and heat dissipation function, is favorable to thermal transmission and gives off, has ensured its inside electronic component's normal work, has improved the result of use to the computer, has fine practicality.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A heat sink for a computer, comprising a computer case (1), characterized in that: a computer element mounting bin (2) is arranged in the inner cavity of the computer shell (1), a frame body (3) is fixedly arranged in the inner cavity of the computer element installation bin (2), a heat absorption plate (4) is arranged in the frame body (3), and the bottom of the frame body (3) is provided with a heat conducting fin (11), the top end of the heat conducting fin (11) extends into the frame body (3) and is contacted with the heat absorbing plate (4), an air outlet pipe (12) is arranged on the outer wall of the bottom of the computer shell (1), the bottom end of the heat conducting fin (11) extends into the air outlet pipe (12), the top of the computer shell (1) is fixedly provided with a top bin (7), a fan (8) is arranged in the top bin (7), the air outlet of the fan (8) is connected with a shunt pipe (9), and the fan (8) is communicated with the inner cavity of the computer shell (1) through the shunt pipe (9).

2. The heat dissipating device for a computer as claimed in claim 1, wherein: an air duct (10) is arranged between the inner wall of the computer element installation bin (2) and the inner wall of the computer shell (1), and the shunt pipe (9) is arranged at the top of the air duct (10).

3. The heat dissipating device for a computer as claimed in claim 1, wherein: all fixed mounting has heat dissipation metal sheet (6) on the lateral wall about computer casing (1), heat dissipation metal sheet (6) are the installation of running through on the lateral wall of computer casing (1).

4. The heat dissipating device for a computer as claimed in claim 1, wherein: the bottom trompil of computer housing (1) is installed power heat dissipation dust screen (13), and fixed mounting has support callus on the sole (15) on the bottom outer wall of computer housing (1).

5. The heat dissipating device for a computer as claimed in claim 1, wherein: siphunculus (5) are installed to the trompil on the lateral wall of framework (3), siphunculus (5) are the equipartition installation from last to down in proper order on the lateral wall of framework (3), every another of siphunculus (5) all extends to in the inner chamber of wind channel (10).

6. The heat dissipating device for a computer as claimed in claim 1, wherein: a heat radiation fan (14) is fixedly installed on the front wall of the computer shell (1), and the heat radiation fan (14) is arranged in front of the heat absorption plate (4).