CN218039174U

CN218039174U - Integrated circuit heat dissipation device with stability

Info

Publication number: CN218039174U
Application number: CN202221983102.6U
Authority: CN
Inventors: 柯美延
Original assignee: Shenzhen Jiahangxin Electronics Co ltd
Current assignee: Shenzhen Jiahangxin Electronics Co ltd
Priority date: 2022-07-29
Filing date: 2022-07-29
Publication date: 2022-12-13
Anticipated expiration: 2032-07-29

Abstract

The utility model discloses a stable integrated circuit heat dissipation device, which comprises a heat dissipation substrate, wherein the surface of the heat dissipation substrate is provided with an integrated circuit board, the bottom of the heat dissipation substrate is provided with a protective cover plate, the protective cover plate and the heat dissipation substrate form a heat dissipation channel with both ends being open, the bottom of the integrated circuit board is provided with a metal heat dissipation block positioned in the heat dissipation channel, the metal heat dissipation block is provided with a plurality of heat dissipation fins which are arranged in parallel with the heat dissipation channel, and one end of the heat dissipation channel is internally provided with a heat dissipation fan blowing towards the metal heat dissipation block; and L-shaped positioning edge strips are arranged on the periphery of the heat dissipation substrate. The utility model discloses a radiator fan lets in gas to heat dissipation channel, and then the gas of heat dissipation channel of flowing through is then dispelled the heat to the metal radiating block to the steam that produces among the heat dissipation process blows to the outside, thereby avoids radiator fan to inhale steam once more, thereby has better radiating effect.

Description

Integrated circuit heat dissipation device with stability

Technical Field

The utility model relates to a circuit heat dissipation technical field specifically is a stability integrated circuit heat abstractor.

Background

The integrated circuit can generate heat during working, particularly, components such as a power amplifier tube and the like emit more heat during working, if the heat is not dissipated in time, the working performance of the components is greatly influenced, and therefore, the heat dissipation is required in some integrated circuits with larger output power. The existing circuit board generally dispels the heat at the independent radiating mode of circuit board installation exhaust fan to electron device, but the circuit board is installed in comparatively inclosed installation intracavity, when radiator fan dispels the heat, can only carry out the vortex to the air of installation intracavity, and the air of installation intracavity can not circulate with outside air well, leads to the heat to pile up in the installation intracavity, recycles radiator fan and dispels the heat, then does not have better radiating effect to the circuit board for the circuit board is burnt out easily. In the daily use process, the PVC layer is easy to crack. We have therefore developed an improved, stable integrated circuit heat sink.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model relates to a stable integrated circuit heat abstractor, including the heat dissipation base plate, the surface mounting of heat dissipation base plate has integrated circuit board, and the heat dissipation base plate bottom is equipped with the protective cover board, and the protective cover board forms the heat dissipation channel that both ends are the open-ended with the heat dissipation base plate, and the bottom of integrated circuit board is equipped with the metal radiating block that is located the heat dissipation channel, and be equipped with a plurality of radiating fins that are parallel arrangement with the heat dissipation channel on the metal radiating block, install the radiator fan that bloies towards metal radiating block in one end of heat dissipation channel; and L-shaped positioning edge strips are arranged on the periphery of the heat dissipation substrate.

As a preferred technical scheme of the utility model, the guard plate is connected with the heat dissipation base plate through detaching mechanism.

As a preferred technical scheme of the utility model, disassembly body is including setting up the location screw on the heat dissipation base plate, just the side of protective housing plate is equipped with the location slat, be equipped with on the location slat with the corresponding positioning hole of location screw, just install positioning bolt between positioning hole and the location screw.

As a preferred technical scheme of the utility model, heat dissipation channel's both ends are equipped with the dust filter screen.

As a preferred technical scheme of the utility model, the dust filter screen sets up the both ends at the guard shield board.

As an optimized technical scheme of the utility model, the guard shield plate is made for the metal material.

As an optimized technical scheme of the utility model, be equipped with the through-hole that supplies the metal radiating block to pass on the heat dissipation base plate.

As an optimal technical scheme of the utility model, be equipped with adiabatic heat-conducting layer between metal radiating block and the integrated circuit board.

The beneficial effects of the utility model are that:

this kind of stability integrated circuit heat abstractor is through installing integrated circuit board on the surface of heat dissipation base plate, and hot base plate bottom sets up the guard shield board, make guard shield board and heat dissipation base plate form both ends and be open-ended heat dissipation channel, then integrated circuit board's bottom is equipped with the metal radiating block that is located heat dissipation channel, let in gas to heat dissipation channel through radiator fan when dispelling the heat to integrated circuit board, the gas that then flows through heat dissipation channel then dispels the heat to the metal radiating block, and blow the steam that produces to the outside among the heat dissipation process, thereby avoid radiator fan to inhale steam once more, and lead to reducing the radiating effect to the metal radiating block. Wherein the utility model provides a heat dissipation channel should communicate with the outside air to effectively avoided the heat to pile up in the cavity that is used for protecting integrated circuit board.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of a stable integrated circuit heat dissipation device according to the present invention;

fig. 2 is a schematic view of the installation of a protective cover plate of a heat dissipation device for a stable integrated circuit according to the present invention;

fig. 3 is a schematic view of a stable ic heat dissipation device according to the present invention.

In the figure: 1. a heat-dissipating substrate; 2. an integrated circuit board; 3. a shield plate; 4. a heat dissipation channel; 5. a metal heat dissipation block; 6. a heat dissipating fin; 7. a heat radiation fan; 8. an L-shaped positioning edge strip; 9. positioning the screw hole; 10. positioning the lath; 11. positioning the through hole; 12. positioning the bolt; 13. a dust filter screen; 14. and a through hole.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Example (b): as shown in fig. 1, fig. 2 and fig. 3, the heat dissipation device for a stable integrated circuit of the present invention comprises a heat dissipation substrate 1, wherein an integrated circuit board 2 is mounted on the surface of the heat dissipation substrate 1, a protective cover plate 3 is disposed at the bottom of the heat dissipation substrate 1, the protective cover plate 3 and the heat dissipation substrate 1 form a heat dissipation channel 4 with both ends open, a metal heat dissipation block 5 located in the heat dissipation channel 4 is disposed at the bottom of the integrated circuit board 2, a plurality of heat dissipation fins 6 parallel to the heat dissipation channel 4 are disposed on the metal heat dissipation block 5, and a heat dissipation fan 7 blowing air toward the metal heat dissipation block 5 is mounted in one end of the heat dissipation channel 4; an L-shaped positioning edge strip 8 is arranged on the periphery of the heat dissipation substrate 1. The utility model provides a heat dissipation channel should communicate with the outside air to effectively avoided the heat to pile up in the cavity that is used for protecting integrated circuit. Through installing integrated circuit board 2 on the surface of radiating basal plate 1, and hot basal plate bottom sets up protective cover plate 3, make protective cover plate 3 and radiating basal plate 1 form both ends and be open-ended heat dissipation channel 4, then integrated circuit board 2's bottom is equipped with the metal radiating block 5 that is located heat dissipation channel 4, let in gas to heat dissipation channel 4 through radiator fan 7 when dispelling the heat to integrated circuit board 2, then the gas of heat dissipation channel 4 of flowing through then dispels the heat to metal radiating block 5, and blow the steam that produces to the outside among the heat dissipation process, thereby avoid radiator fan 7 to inhale steam once more, and lead to reducing the radiating effect to metal radiating block 5.

The shielding plate 3 is connected with the heat dissipation substrate 1 through a dismounting mechanism. The disassembly body is including setting up the location screw 9 on heat dissipation base plate 1, just the side of protection cover plate 3 is equipped with location slat 10, be equipped with on the location slat 10 with the corresponding positioning hole 11 of location screw 9, just install positioning bolt 12 between positioning hole 11 and the location screw 9, conveniently install and dismantle protection cover plate 3, be convenient for carry out the deashing to metal radiating block 5 and radiating fin's surface.

The two ends of the heat dissipation channel 4 are provided with dust filter screens 13, the dust filter screens 13 are arranged at the two ends of the protective cover plate 3, and a large amount of dust is prevented from being attached to the surfaces of the metal heat dissipation block 5 and the heat dissipation fins, so that the heat dissipation effect is reduced.

The shielding plate 3 is made of metal. The heat dissipation substrate 1 is provided with a through hole 14 for the metal heat dissipation block 3 to pass through. And a heat insulation and conduction layer is arranged between the metal heat dissipation block 5 and the integrated circuit board 2, so that the heat insulation and conduction effects are achieved.

The working principle is as follows: through installing integrated circuit board 2 on the surface of radiating basal plate 1, and hot base plate bottom sets up protective cover plate 3, make protective cover plate 3 and radiating basal plate 1 form both ends and be open-ended heat dissipation channel 4, then integrated circuit board 2's bottom is equipped with the metal radiating block 5 that is located heat dissipation channel 4, let in gas to heat dissipation channel 4 through radiator fan 7 when dispelling the heat to integrated circuit board 2, then the gas of flowing through heat dissipation channel 4 then dispels the heat to metal radiating block 5, and blow the steam that produces to the outside among the heat dissipation process, thereby avoid radiator fan 7 to inhale steam once more, and lead to reducing the radiating effect to metal radiating block 5.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A stable integrated circuit heat sink, comprising: the heat dissipation structure comprises a heat dissipation substrate (1), wherein an integrated circuit board (2) is mounted on the surface of the heat dissipation substrate (1), a protective cover plate (3) is arranged at the bottom of the heat dissipation substrate (1), heat dissipation channels (4) with two ends both open are formed by the protective cover plate (3) and the heat dissipation substrate (1), a metal heat dissipation block (5) located in the heat dissipation channel (4) is arranged at the bottom of the integrated circuit board (2), a plurality of heat dissipation fins (6) parallel to the heat dissipation channel (4) are arranged on the metal heat dissipation block (5), and a heat dissipation fan (7) blowing towards the metal heat dissipation block (5) is mounted in one end of the heat dissipation channel (4); the periphery of the heat dissipation substrate (1) is provided with an L-shaped positioning edge strip (8).

2. The device of claim 1, wherein the shield plate (3) is connected to the heat-dissipating substrate (1) via a detaching mechanism.

3. The heat sink for the stable integrated circuit according to claim 2, wherein the detaching mechanism comprises a positioning screw hole (9) disposed on the heat sink substrate (1), and a positioning strip plate (10) is disposed on a side of the shield plate (3), a positioning through hole (11) corresponding to the positioning screw hole (9) is disposed on the positioning strip plate (10), and a positioning bolt (12) is disposed between the positioning through hole (11) and the positioning screw hole (9).

4. The heat sink for stabilization IC according to claim 1, wherein the heat dissipation channel (4) has dust filter net (13) at its two ends.

5. A stable integrated circuit heat sink according to claim 4, characterized in that the dust filter (13) is arranged at both ends of the shield plate (3).

6. A stable integrated circuit heat sink according to claim 3, wherein the shielding plate (3) is made of metal.

7. The device as claimed in claim 1, wherein the heat-dissipating substrate (1) is provided with a through hole (14) for passing the metal heat-dissipating block (5).

8. A stable integrated circuit heat sink according to claim 1, wherein a heat insulating and conducting layer is provided between the metal heat sink (5) and the integrated circuit board (2).