CN212918097U - Laser processing equipment - Google Patents
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- CN212918097U CN212918097U CN202020944905.5U CN202020944905U CN212918097U CN 212918097 U CN212918097 U CN 212918097U CN 202020944905 U CN202020944905 U CN 202020944905U CN 212918097 U CN212918097 U CN 212918097U
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Abstract
The utility model belongs to the technical field of semiconductor processing, and relates to a laser processing device, which comprises a frame, a jig component, a support frame, a cutting component and a visual positioning component; the jig assembly is movably arranged on the rack and can move on the rack along a first direction and/or a second direction; the support frame is arranged on the frame; the cutting assembly is movably arranged on the support frame, is positioned at the top end of the jig assembly and can move on the support frame along a third direction, and the cutting assembly is used for cutting and/or etching the sheet loaded on the jig assembly; the visual positioning assembly is movably arranged on the support frame and located at the top end of the jig assembly, can move on the support frame along a third direction and is used for acquiring spatial position information of a sheet on the jig assembly. The technical scheme provided by the laser processing equipment can be used for cutting the sheet and etching the surface of the sheet; the sheet loaded on the jig component can be firmly fixed in the moving process.
Description
Technical Field
The utility model relates to a semiconductor processing technology field especially relates to a laser processing equipment.
Background
The development of third generation semiconductor materials and devices, represented by gallium nitride, is the core and foundation of the emerging semiconductor industry. Gallium nitride is a compound of nitrogen and gallium, and has the properties of wide direct band gap, strong atomic bond, high thermal conductivity, good chemical stability (hardly corroded by any acid), strong radiation resistance and the like.
At present, the semiconductor industry in China is just in the beginning stage of rising, processing equipment for name plate marking of semiconductors is not enough, and name plate marking processing of gallium nitride is more called phoenix hair unicorn.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a solve in the semiconductor industry of present china not have the technical problem who has the processing equipment that comparatively is applicable to the name card mark yet.
In order to solve the technical problem, an embodiment of the utility model provides a laser processing equipment has adopted following technical scheme:
the laser processing equipment comprises a rack, a jig assembly, a supporting frame, a cutting assembly and a visual positioning assembly;
the jig assembly is movably arranged on the rack and can move on the rack along a first direction and/or a second direction, and the first direction and the second direction are perpendicular to each other and are coplanar;
the support frame is arranged on the rack;
the cutting assembly is movably arranged on the support frame, is positioned at the top end of the jig assembly and can move on the support frame along a third direction, the third direction is perpendicular to the first direction and the second direction, and the cutting assembly is used for cutting and/or etching the sheet loaded on the jig assembly;
the visual positioning assembly is movably arranged on the support frame and located at the top end of the jig assembly and can move on the support frame along the third direction, and the visual positioning assembly is used for acquiring spatial position information of a sheet loaded on the jig assembly so as to enable the jig assembly and the cutting assembly to cut the sheet according to the spatial position information of the sheet.
Optionally, the cutting assembly comprises a laser, a collimator and a focusing assembly;
the laser is arranged on the frame and used for providing a laser beam;
the collimator is movably arranged on the support frame and can move on the support frame along a third direction;
the focusing assembly is connected to the bottom end of the collimator;
the light spots of the laser beams emitted by the laser are converged by the focusing assembly to form light spot energy beams, and the converged light spot energy beams can cut and/or etch the sheet.
Optionally, the visual positioning assembly comprises a lifting adjusting piece and a camera, and the camera comprises a camera body, a light source and a lens;
the lifting adjusting piece is movably arranged on the supporting frame, can move on the supporting frame along the third direction and is used for adjusting the distance between the camera and the jig component;
the camera body is arranged on the lifting adjusting piece and used for acquiring the spatial position information of the sheet and storing and/or transmitting the spatial position information to external equipment;
the light source is arranged on the side part of the camera body and used for polishing during shooting;
the lens is arranged at the bottom end of the camera body and used for magnifying or reducing the shot image.
Optionally, the laser processing apparatus further comprises a lifting mechanism;
the lifting mechanism is movably arranged on the support frame, is vertically connected with the collimator and/or the lifting adjusting piece, and is used for driving the collimator and/or the lifting adjusting piece to move on the support frame along the third direction.
Optionally, the jig assembly includes a main body, and a first station and a second station disposed on the main body;
the first station is provided with a closed-loop groove with a set size, and the closed-loop groove is used for processing the sheets loaded on the first station by the cutting assembly;
the second station is provided with a right-angle edge groove and used for enabling the cutting assembly to process the sheet loaded on the second station along the right-angle edge groove;
the main body is internally provided with a cavity, the main body is provided with a vent, and the vent is communicated with the cavity; the main part is also provided with a plurality of adsorption holes, and the adsorption holes are communicated with the cavity and are positioned at the first station and the second station.
Optionally, the closed loop groove is circular or quadrilateral.
Optionally, the first station has at least two closed-loop grooves of different sizes, and the closed-loop groove of a larger size is arranged around the closed-loop groove of a smaller size.
Optionally, the number of the second stations is greater than or equal to the number of the closed-loop grooves, and each second station is provided with a right-angle groove;
the side length of each side of each right-angle side groove corresponds to the closed-loop grooves with different sizes in the first station, and the side length of each side of each right-angle side groove is larger than or equal to the width of the closed-loop groove in the direction corresponding to each side of the right-angle side groove.
Optionally, the laser processing apparatus further comprises a horizontal moving mechanism,
the horizontal moving mechanism is arranged on the top end of the rack, is connected with the main body of the jig assembly and is used for driving the main body to move along the first direction and/or the second direction.
Optionally, the sheet is a gallium nitride sheet.
Compared with the prior art, the embodiment of the utility model provides a laser processing equipment mainly has following beneficial effect:
the laser processing equipment comprises a rack, a jig assembly, a supporting frame, a cutting assembly and a visual positioning assembly, wherein the cutting assembly can cut a sheet and etch the surface of the sheet; the jig component can firmly fix the sheet loaded on the jig component in the moving process, prevents displacement, and effectively improves the cutting precision of the sheet and the surface etching precision of the sheet.
Namely, the embodiment of the utility model provides a laser processing equipment is a comparatively be applicable to the semiconductor industry of china and can mark the product of processing to the name card.
Drawings
In order to illustrate the embodiments of the present invention more clearly, the drawings needed for describing the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
fig. 1 is a schematic perspective view of a laser processing apparatus according to an embodiment of the present invention;
FIG. 2 is a front view of a visual positioning assembly of the laser machining apparatus of FIG. 1;
fig. 3 is a top view of a jig assembly in the laser processing apparatus of fig. 1.
The reference numbers in the drawings are as follows:
100. laser processing apparatus
1. A cutting assembly; 11. a focusing assembly; 12. a collimator;
2. a visual positioning assembly; 21. a camera; 211. a camera body; 212. a lens; 213. a light source; 22. a lifting adjustment member;
3. a jig component; 31. a main body; 311. an adsorption hole; 312. a vent; 32. a first station; 321. a closed loop recess; 33. a second station; 331. a right-angle edge groove;
4. a frame; 5. a support frame; 6. a lifting mechanism; 7. a horizontal moving mechanism.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, for example, the terms "length," "horizontal," "vertical," "top," "bottom," "inner," "large," "small," "deep," "shallow," and the like, refer to an orientation or position based on that shown in the drawings, which is for convenience of description only and is not to be construed as limiting the present teachings.
The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the description of the above figures are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. The meaning of "plurality" is two or more unless specifically limited otherwise.
In the description and claims of the present invention and in the description of the above figures, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it can be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The embodiment of the utility model provides a laser processing device 100, as shown in fig. 1 to 3, the laser processing device 100 comprises a frame 4, a jig component 3, a support frame 5, a cutting component 1 and a visual positioning component 2;
the jig component 3 is movably arranged on the frame 4 and can move on the frame 4 along the first direction and/or the second direction, namely, during processing, the jig component 3 can drive the sheet to feed on the frame 4 along the first direction and/or the second direction, so that the sheet can be processed in the first direction and/or the second direction.
The support frame 5 may be disposed on the frame 4.
The cutting assembly 1 can be movably arranged on the support frame 5 and is positioned at the top end of the jig assembly 3, the cutting assembly 1 can move on the support frame 5 along the third direction, and the cutting assembly 1 can be used for cutting and/or etching the sheet loaded on the jig assembly 3.
Visual positioning component 2 can movably set up on support frame 5, and is located the top of tool subassembly 3 to can move along the third direction on support frame 5, this visual positioning component 2 can be used to obtain the spatial position information of loading on tool subassembly 3 sheet, carries out accurate processing to the sheet according to the spatial position information of this sheet for cutting component 1. Specifically, the visual positioning assembly 2 obtains spatial position information of the sheet, that is, spatial coordinates of each position of the sheet, and then according to a preset processing pattern, the jig assembly 3 and the cutting assembly 1 are matched to run on an X axis, a Y axis and a Z axis, so that the cutting assembly 1 can precisely process the sheet at the corresponding spatial coordinates according to the preset processing pattern.
It will be appreciated that the working principle of the laser machining apparatus 100 is substantially as follows: firstly, a sheet to be processed is placed on the jig component 3, the visual positioning component 2 acquires the sheet to be processed on the jig component 3 so as to determine the spatial position of the sheet, and the spatial position information is transmitted to the cutting component 1; the cutting assembly 1 cuts and/or etches the sheet material according to preset conditions after obtaining the spatial position information of the sheet material.
In summary, compared with the prior art, the laser processing apparatus 100 has at least the following beneficial effects: the laser processing equipment 100 comprises a machine frame 4, a jig component 3, a supporting frame 5, a cutting component 1 and a visual positioning component 2, wherein the cutting component 1 can cut a sheet and etch the surface of the sheet; the jig component 3 can firmly fix the sheet loaded on the jig component 3 in the moving process, so that the sheet is prevented from shifting, and the cutting precision and the surface etching precision of the sheet are effectively improved. That is, the laser processing apparatus 100 provides a product that is suitable for processing nameplate marks in the semiconductor industry of our country.
It should be noted that, the specific relationship among the first direction, the second direction and the third direction in the embodiment of the present invention is: the first direction and the second direction are in a coplanar vertical relationship, and the third direction is perpendicular to both the first direction and the second direction.
For easy understanding, the embodiment of the present invention refers to a three-dimensional coordinate system, and is described in conjunction with the first direction, the second direction, and the third direction, specifically:
the first direction may be defined as an X-axis direction, the second direction may be defined as a Y-axis direction, and the third direction may be defined as a Z-axis direction.
More specifically, in this embodiment, the X-axis direction may be a direction in which a long side of the rack 4 is located, the Y-axis direction may be a direction in which a short side of the rack 4 is located, and the Z-axis direction may be a direction perpendicular to a top end or a bottom end of the rack 4.
In order to make the technical solution of the present invention better understood, the technical solution of the embodiment of the present invention will be clearly and completely described below with reference to fig. 1 to 3.
Alternatively, the sheet may be a gallium nitride sheet, that is, the laser processing apparatus 100 of the embodiment of the present invention may be used to process a semiconductor sheet.
Alternatively, as shown in fig. 1, the cutting assembly 1 comprises a laser (not shown), a collimator 12 and a focusing assembly 11,
the laser may be arranged in the frame 4, in particular in this embodiment, the laser is arranged in the frame 4, does not occupy space on the frame 4, and is used for providing a laser beam. In this embodiment, the laser may specifically be an IPG laser.
The collimator 12 is movably disposed on the support frame 5 and can move on the support frame 5 along the Z-axis direction.
The focusing assembly 11 may be attached to the bottom end of the laser.
The light spots of the laser beams emitted by the laser are converged by the focusing assembly 11 to form light spot energy beams, and the converged light plate energy beams can cut and/or etch the sheet materials loaded on the jig assembly 3. It can be understood that the beam of the spot energy is in a beam waist shape with a thin middle part and thick two ends, the energy is concentrated on the very thin spot in the middle, the beam waist-shaped spot has a certain depth, the length in the Z-axis direction is about 0.1mm, and the diameter of the spot acting on the surface of the sheet material can be changed by moving in the Z-axis direction, and the energy of the spot is changed accordingly. When the depth to be processed is shallow, the focusing assembly 11 can be lifted away from the surface of the sheet material to reduce the energy applied to the surface of the sheet material; when the depth to be machined is greater, the focusing assembly 11 can be lowered to reduce the energy applied to the surface of the sheet. The size of a light spot focused by a laser beam is adjusted by lifting a condenser lens, the sheet is cut and/or the surface of the sheet is etched by high-energy peak energy, and the etching depth can be effectively controlled.
Alternatively, as shown in fig. 1 and 2, the visual positioning assembly 2 includes a lifting adjustment member 22 and a camera 21, the camera 21 includes a camera body 211, a lens 212 and a light source 213,
the lifting adjusting part 22 is movably disposed on the supporting frame, can move on the supporting frame 5 along the Z-axis direction, and can be used to adjust the distance between the camera 21 and the jig component 3, so that the camera 21 can adjust the optimal shooting distance.
The camera body 211 may be disposed on the lifting adjusting member 22, have a photographing function, and store and/or transmit data of a sheet obtained by photographing (e.g., spatial position information of the sheet) to an external device.
The side of the camera body 211 may be provided with a light source 213 for lighting at the time of photographing to enable a brightness developing function.
The bottom of the camera body 211 may be provided with a lens 212 having a function of enlarging and/or reducing the image magnification.
Alternatively, as shown in fig. 1 and 2, the laser processing apparatus 100 further includes an elevating mechanism 6,
the lifting mechanism 6 is movably arranged on the support frame 5, and is vertically connected with the collimator 12 and/or the lifting adjusting piece 22, and is used for driving the collimator 12 and/or the lifting adjusting piece 22 to move on the support frame 5 along the Z-axis direction, namely, the lifting mechanism 6 can enable the cutting assembly 1 and/or the visual positioning assembly 2 to be adjusted in the Z-axis direction.
It will be appreciated that the operating principle of the visual positioning assembly 2 is substantially as follows: the camera 21 can perform edge-tracking positioning on the sheets on the jig assembly 3, select a coordinate value for each sheet (if the sheet is a circle, a coordinate value of a certain 3 points on the circumference can be selected), calculate a coordinate value of a center coordinate (if the sheet is a circle, a coordinate value of a circle center can be calculated), and then establish a visual positioning coordinate system of the sheet and identify the real-time coordinate of the sheet.
Alternatively, as shown in fig. 1 and 3, the jig assembly 3 includes a main body 31, and a first station 32 and a second station 33 provided on the main body 31;
the first station 32 may have a closed loop groove 321 sized for the cutting assembly 1 to process the sheet to be processed loaded on the first station 32 along the closed loop groove 321. That is, when the sheet material is cut, the cutting assembly 1 injects the laser beam into the closed-loop groove 321 and feeds the laser beam along the track of the closed-loop groove 321, so that the sheet material can have a desired shape. As can be appreciated, the first and second electrodes,
the second station 33 may have square edge notches 331 for the cutting assembly 1 to process the sheet material carried on the second station 33 along the square edge notches 331. That is, when cutting the sheet, the cutting assembly 1 injects a laser beam into the leg recess 331 and feeds the laser beam along the path of the leg recess 331 to cut legs on the sheet having a desired shape, based on the processing of the sheet at the first station 32 and further cutting at the second station 33.
The main body 31 may have a cavity (not shown), the main body 31 is provided with a vent 312, the vent 312 may be externally connected with a dust extractor, and the vent 312 may be communicated with the cavity. The main body 31 may further have a plurality of suction holes 311, and the suction holes 311 may be communicated with the cavity and located at the first station 32 and the second station 33. When the sheet material is processed, the sheet material is loaded at the first station 32 or the second station 33, the dust extractor is started, so that the sheet material arranged at the first station 32 or the second station 33 is adsorbed (the unused station can adopt the masking tape to seal the adsorption hole 311 at the station), the sheet material can be firmly fixed in the moving process, the displacement is prevented, and the cutting precision and the surface etching precision of the sheet material are effectively improved.
Further, as shown in FIG. 3, the closed-loop groove 321 may be circular or quadrilateral, but may have other suitable shapes.
Further, as shown in FIG. 3, the first station 32 may have at least two closed-loop grooves 321 of different sizes, and the closed-loop groove 321 of a larger size may be looped around the closed-loop groove 321 of a smaller size. In this embodiment, the first station 32 has three circular closed-loop grooves 321, each having the following dimensions: 3 cun, 4 cun and 5 cun. Of course, in practical design, the shape and size of the closed-loop groove 321 is not limited thereto.
Correspondingly, as shown in FIG. 3, the second stations 33 may be provided with a number of closed-loop recesses 321 that is greater than or equal to the number of closed-loop recesses 321 in the first station 32, and each second station 33 may be provided with one square recess 331. The length of each of the sides of right-angle notches 331 may correspond to the configuration of the closed-loop notches 321 of different sizes in first station 32, and specifically, the length of each side of right-angle notches 331 is greater than or equal to the width of closed-loop notch 321 in the direction of each side of right-angle notches 331.
Alternatively, as shown in fig. 1, the laser processing apparatus 100 further includes a horizontal movement mechanism 7,
the horizontal moving mechanism 7 may be disposed on the frame 4, and is connected to the main body 31 for driving the main body 31 to move along the X-axis direction and/or the Y-axis direction. When processing the sheet, the horizontal moving mechanism 7 can make the jig component 3 move along the X-axis direction and/or the Y-axis direction to drive the sheet on the jig component 3 to move along the X-axis direction and/or the Y-axis direction.
In summary, compared with the prior art, the laser processing apparatus 100 has at least the following beneficial effects: the laser processing equipment 100 comprises a frame 4, a jig component 3, a support frame 5, a cutting component 1 and a visual positioning component 2;
the cutting assembly 1 can cut the sheet and etch the surface of the sheet, and can effectively control the etching depth; the jig component 3 can firmly fix the sheet loaded on the jig component 3 in the moving process, prevent the sheet from shifting and effectively improve the precision of cutting and surface etching of the sheet; even if the coordinate origin and the laser center of the visual positioning component 2 are not coaxial, the functions of visual positioning and marking can be realized, and the precision is high. That is, the laser processing apparatus 100 provides a product that is suitable for processing nameplate marks in the semiconductor industry of our country.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A laser processing device is characterized by comprising a rack, a jig assembly, a supporting frame, a cutting assembly and a visual positioning assembly;
the jig assembly is movably arranged on the rack and can move on the rack along a first direction and/or a second direction, and the first direction and the second direction are perpendicular to each other and are coplanar;
the support frame is arranged on the rack;
the cutting assembly is movably arranged on the support frame, is positioned at the top end of the jig assembly and can move on the support frame along a third direction, the third direction is perpendicular to the first direction and the second direction, and the cutting assembly is used for cutting and/or etching the sheet loaded on the jig assembly;
the visual positioning assembly is movably arranged on the support frame and located at the top end of the jig assembly and can move on the support frame along the third direction, and the visual positioning assembly is used for acquiring spatial position information of a sheet loaded on the jig assembly so as to enable the jig assembly and the cutting assembly to cut the sheet according to the spatial position information of the sheet.
2. The laser machining apparatus of claim 1, wherein the cutting assembly includes a laser, a collimator, and a focusing assembly;
the laser is arranged on the frame and used for providing a laser beam;
the collimator is movably arranged on the support frame and can move on the support frame along a third direction;
the focusing assembly is connected to the bottom end of the collimator;
the light spots of the laser beams emitted by the laser are converged by the focusing assembly to form light spot energy beams, and the converged light spot energy beams can cut and/or etch the sheet.
3. The laser processing apparatus of claim 2, wherein the visual positioning assembly comprises a lift adjustment and a camera, the camera comprising a camera body, a light source, and a lens;
the lifting adjusting piece is movably arranged on the supporting frame, can move on the supporting frame along the third direction and is used for adjusting the distance between the camera and the jig component;
the camera body is arranged on the lifting adjusting piece and used for acquiring the spatial position information of the sheet and storing and/or transmitting the spatial position information to external equipment;
the light source is arranged on the side part of the camera body and used for polishing during shooting;
the lens is arranged at the bottom end of the camera body and used for magnifying or reducing the shot image.
4. The laser processing apparatus according to claim 3, further comprising an elevating mechanism;
the lifting mechanism is movably arranged on the support frame, is vertically connected with the collimator and/or the lifting adjusting piece, and is used for driving the collimator and/or the lifting adjusting piece to move on the support frame along the third direction.
5. The laser processing apparatus of claim 1, wherein the jig assembly includes a main body and a first station and a second station disposed on the main body;
the first station is provided with a closed-loop groove with a set size, and the closed-loop groove is used for processing the sheets loaded on the first station by the cutting assembly;
the second station is provided with a right-angle edge groove and used for enabling the cutting assembly to process the sheet loaded on the second station along the right-angle edge groove;
the main body is internally provided with a cavity, the main body is provided with a vent, and the vent is communicated with the cavity; the main part is also provided with a plurality of adsorption holes, and the adsorption holes are communicated with the cavity and are positioned at the first station and the second station.
6. The laser processing apparatus of claim 5, wherein the closed-loop groove is circular or quadrilateral.
7. The laser machining apparatus of claim 5 wherein the first station has at least two different sizes of the closed loop grooves, the larger sized closed loop grooves being formed around the smaller sized closed loop grooves.
8. The laser processing apparatus of claim 7, wherein the number of second station settings is greater than or equal to the number of closed loop groove settings, and each second station is provided with one right-angled groove;
the side length of each side of each right-angle side groove corresponds to the closed-loop grooves with different sizes in the first station, and the side length of each side of each right-angle side groove is larger than or equal to the width of the closed-loop groove in the direction corresponding to each side of the right-angle side groove.
9. The laser processing apparatus according to any one of claims 5 to 8, further comprising a horizontal moving mechanism,
the horizontal moving mechanism is arranged on the top end of the rack, is connected with the main body of the jig assembly and is used for driving the main body to move along the first direction and/or the second direction.
10. The laser processing apparatus of claim 1, wherein the sheet material is a gallium nitride sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020944905.5U CN212918097U (en) | 2020-05-27 | 2020-05-27 | Laser processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020944905.5U CN212918097U (en) | 2020-05-27 | 2020-05-27 | Laser processing equipment |
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| CN212918097U true CN212918097U (en) | 2021-04-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116727879A (en) * | 2023-04-06 | 2023-09-12 | 武汉华俄激光工程有限公司 | Six-axis linkage three-dimensional laser cutting equipment |
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2020
- 2020-05-27 CN CN202020944905.5U patent/CN212918097U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116727879A (en) * | 2023-04-06 | 2023-09-12 | 武汉华俄激光工程有限公司 | Six-axis linkage three-dimensional laser cutting equipment |
| CN116727879B (en) * | 2023-04-06 | 2024-03-08 | 武汉华俄激光工程有限公司 | Six-axis linkage three-dimensional laser cutting equipment |
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Effective date of registration: 20220803 Address after: 518000 101, building 6, Wanyan Industrial Zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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