CN117161563A - Laser processing device for processing micro group deep holes of thin-wall part - Google Patents
Laser processing device for processing micro group deep holes of thin-wall part Download PDFInfo
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- CN117161563A CN117161563A CN202311006693.0A CN202311006693A CN117161563A CN 117161563 A CN117161563 A CN 117161563A CN 202311006693 A CN202311006693 A CN 202311006693A CN 117161563 A CN117161563 A CN 117161563A
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- 238000012545 processing Methods 0.000 title claims abstract description 61
- 230000000007 visual effect Effects 0.000 claims abstract description 19
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- 238000013519 translation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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Abstract
The application relates to a laser processing device for processing micro group deep holes of a thin-wall part, which comprises a dielectric medium, wherein a thin-wall part to be processed is placed in the dielectric medium and is fixedly connected with the dielectric medium through a fixed connection assembly; the laser comprises a laser head for emitting light beams into the dielectric medium and a visual directional tracking system connected to one side of the laser head, wherein the visual directional tracking system is used for identifying the distance between the laser head and a surface to be processed of a thin-wall workpiece; in some embodiments, the laser is a picosecond or femtosecond laser; the manipulator is connected to the top end of the laser and used for driving the laser head to move to a target coordinate; the computer control end is connected with the manipulator and the visual directional tracking system; and the magnetic component is arranged around the dielectric medium and generates a magnetic field with variable magnetic field intensity around the dielectric medium. The application has high efficiency, high precision and high quality processing.
Description
Technical Field
The application relates to the technical field of laser processing machinery, in particular to a laser processing device for processing micro group deep holes of a thin-wall part.
Background
In the processing process of the micro-holes of the aviation thin-wall parts, the problems of deformation, instability, vibration and the like are extremely easy to generate in the machining process due to poor rigidity and low strength. And a plurality of superfine micropores are distributed on the curved surface of a complex high-precision thin-wall part such as a turbine blade (aviation thin-wall part), and the conventional processing equipment cannot meet the requirements. The special processing of the laser lamp is easy to generate a great amount of heat, so that the thin-wall part is deformed, and the processing conditions are complex. Therefore, development of a new technology is urgently required to improve the precision and the processing efficiency of fine group holes of thin-walled members.
Disclosure of Invention
Therefore, the application aims to solve the technical problems of low precision and low machining efficiency of micro group holes of the thin-wall part in the prior art.
In order to solve the technical problems, the application provides a laser processing device for processing deep holes of micro groups of thin-wall parts, which comprises:
a thin-wall workpiece is placed in the dielectric medium, and the thin-wall workpiece is fixedly connected with the dielectric medium through a fixed connection assembly;
the laser comprises a laser head for emitting light beams into the dielectric medium and a visual orientation tracking system connected to one side of the laser head, wherein the visual orientation tracking system is used for identifying the distance between the laser head and a surface to be processed of a thin-wall workpiece in the Z direction;
the manipulator is connected to the top end of the laser and used for driving the laser head to move to a target coordinate;
the computer control end is connected with the manipulator and the visual directional tracking system;
and the magnetic component is arranged around the dielectric medium and generates a magnetic field with variable magnetic field intensity around the dielectric medium.
In one embodiment of the application, the magnetic assembly includes a plurality of electromagnets spaced around the periphery of the dielectric.
In one embodiment of the application, the electromagnets are an even number; the even number of electromagnets are pairwise pairs of electromagnets, and the electromagnets of the pairs are symmetrically arranged relative to the dielectric medium.
In one embodiment of the application, the electromagnet comprises a magnetic core and a coil wound on the magnetic core, and the coil is supplied with a current-variable power supply.
In one embodiment of the application, the application further comprises a three-axis mobile platform on which the dielectric is placed, the three-axis mobile platform translating in the X-direction, Y-direction and Z-direction, the X-direction, Y-direction and Z-direction establishing a three-dimensional rectangular coordinate system.
In one embodiment of the application, the manipulator has the freedom to translate in the X, Y and Z directions.
In one embodiment of the application, the fixed connection assembly comprises a lifting component and a sucker connected to the top end of the lifting component, wherein the sucker has an adsorption force for adsorbing a thin-wall workpiece, and the size of the adsorption force is adjustable.
In one embodiment of the application, the lifting component comprises a fixed part and a telescopic part, one end of the telescopic part is connected to the top of the fixed part, and the other end of the telescopic part is connected to the bottom end of the telescopic part; the top end of the telescopic part is connected with the sucker.
In one embodiment of the application, the fixed connection assembly further comprises an air pump, a pressure detector and a control part, wherein the air pump is connected with the sucker, the pressure detector is connected with the sucker, and the air pump and the pressure detector are connected with the control part.
In one embodiment of the application, the dielectric is a liquid.
Compared with the prior art, the technical scheme of the application has the following advantages:
the application relates to a laser processing device for processing a micro group deep hole of a thin-wall workpiece, which is provided with a dielectric medium for placing a thin-wall workpiece to be processed, a laser and a magnetic component arranged around the dielectric medium, wherein the laser comprises a laser head and a visual orientation tracking system, and the magnetic component generates a magnetic field with variable magnetic field intensity around the thin-wall workpiece to be processed. When the thin-wall workpiece is processed, plasma is induced in a dielectric medium by a light beam emitted by the laser head, then the plasma is accelerated by a magnetic field B, and then the accelerated plasma and a material of the thin-wall workpiece are used for carrying out high-speed impact to generate material removal, so that a micro deep hole is prepared with high efficiency and high quality; in addition, the visual directional tracking system is utilized to extract the actual position coordinates of each punching hole in the surface to be processed of the thin-wall workpiece in real time (the surface to be processed of the thin-wall workpiece is uneven), the coordinate values are transmitted to the computer control end, and at the moment, the computer control end controls the manipulator to drive the laser to move, so that the distance from the laser head to the surface to be processed (namely, the defocus amount) is adjusted, and high-precision punching is further achieved.
Drawings
In order that the application may be more readily understood, a more particular description of the application will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings, in which
FIG. 1 is a schematic structural view of a laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to a preferred embodiment of the present application;
FIG. 2 is a schematic view of a laser processing a thin-walled workpiece with uneven surface in the laser processing device for processing the micro-group deep holes of the thin-walled workpiece shown in FIG. 1;
fig. 3 is a schematic diagram of a laser scanning a thin-walled workpiece in the laser processing device for processing a micro-cluster deep hole of the thin-walled workpiece shown in fig. 1.
Description of the specification reference numerals: 100. a dielectric;
200. a laser; 210. a laser head; 220. a visual orientation tracking system;
300. a manipulator;
400. a computer control end;
500. a magnetic assembly; 510. an electromagnet; 511. a magnetic core; 512. a coil;
600. thin-wall to-be-machined piece;
700. a fixed connection assembly; 710. a lifting member; 720. a suction cup; 730. an air pump; 740. a pressure detector;
800. a light beam.
Detailed Description
The application will be further described in connection with the accompanying drawings and specific examples which are set forth so that those skilled in the art will better understand the application and will be able to practice it, but the examples are not intended to be limiting of the application.
The X direction is the longitudinal direction of the thin-walled material, the Y direction is the width direction of the thin-walled material, and the Z direction is the thickness direction of the thin-walled material.
Referring to fig. 1 to 2, the present application provides a laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces, comprising:
a dielectric 100 in which a thin-walled workpiece 600 is placed, the thin-walled workpiece 600 being fixedly connected to the dielectric 100 by a fixed connection assembly 700;
the laser 200 comprises a laser head 210 for emitting a light beam 800 into the dielectric 100 and a visual orientation tracking system 220 connected to one side of the laser head 210, wherein the visual orientation tracking system 220 is used for identifying the distance between the laser head 210 and the surface to be processed of the thin-wall workpiece 600; in some embodiments, laser 200 is a picosecond or femtosecond laser;
the manipulator 300 is connected to the top end of the laser 200 and is used for driving the laser head 210 to move to the target coordinates;
the computer control end 400 is connected with the manipulator 300 and the visual orientation tracking system 220;
the magnetic component 500 is disposed around the dielectric 100, and the magnetic component 500 generates a magnetic field B having a variable magnetic field strength around the dielectric 100.
Specifically, the present embodiment provides a dielectric 100 on which a thin-walled workpiece 600 is placed, a laser 200, and a magnetic assembly 500 disposed around the dielectric 100, wherein the laser 200 includes a laser head 210 and a visual orientation tracking system 220, and the magnetic assembly 500 generates a magnetic field with a variable magnetic field strength around the thin-walled workpiece 600. When the thin-wall workpiece 600 is processed, the light beam 800 emitted by the laser head 210 induces plasma in the dielectric 100, then the magnetic field B accelerates the motion of the plasma, and then the accelerated plasma and the material of the thin-wall workpiece 600 are used for high-speed impact to generate material removal, so that a micro deep hole is prepared with high efficiency, high precision and high quality; in addition, the visual orientation tracking system 220 is utilized to extract the actual position coordinates of each hole in the surface to be processed of the thin-wall workpiece 600 in real time (the surface to be processed of the thin-wall workpiece 600 is uneven, the surface of the thin-wall workpiece 600 is wavy), and the coordinate values are transmitted to the computer control end 400, at the moment, the computer control end 400 controls the manipulator 300 to drive the laser 200 to move, so that the distance (i.e. the defocus amount) from the laser head 210 to the surface to be processed is adjusted, and high-precision hole punching is realized; secondly, the application can accelerate the movement of the plasma to different degrees by adjusting the magnetic field intensity of the magnetic field B, thereby facilitating the processing of deep holes.
It should be noted that, the present application uses the accelerated plasma to perform high-speed impact with the material of the thin-wall workpiece 600 to generate material removal, so that the material removal rate is high; in addition, the laser 200 is driven to move back and forth by the manipulator 300, so that the laser 200 can be conveniently moved to the corresponding coordinate position, and the deep hole processing of the micro group is conveniently performed.
In some embodiments, the distance of the laser head 210 from the surface to be processed in the Z direction is constant, i.e., the defocus amount is constant.
Specifically, the manipulator 300 and the computer control end 400 are provided in this embodiment, and the manipulator 300 and the visual orientation tracking system 220 are both connected to the computer control end 400. Thus, the visual orientation tracking system 220 can detect the distance between the laser head 210 and the surface to be processed in real time and transmit the distance data to the computer control end 400, and then the computer control end 400 controls the manipulator 300 to drive the laser head 210 to move, so that the distance between the laser head 210 and the surface to be processed is conveniently kept to be a fixed value, namely, the defocus amount is kept to be a fixed value, thus the material removal rate can be kept unchanged, the processing is more stable, and the processing quality is further improved.
Further, the magnetic assembly 500 includes a plurality of electromagnets 510, the plurality of electromagnets 510 being spaced around the circumference of the dielectric 100.
Specifically, the magnetic assembly 500 of the present embodiment includes a plurality of electromagnets 510, and the magnetic field strength can be changed by changing the current value of the electromagnets 510, the plasma generated in the dielectric 100 is accelerated by the magnetic field B, and the material removal is achieved by the high-speed impact of the accelerated plasma on the surface of the thin-walled workpiece. Simple structure, low manufacturing cost and good economical efficiency. In addition, the number of the electromagnets 510 to which current is supplied may be selected according to the condition of the surface to be processed of the thin-wall workpiece 600, that is, current may be selectively supplied to one of the electromagnets 510, or current may be supplied to several of the electromagnets 510, or current may be supplied to all of the electromagnets 510; the direction and the magnetic field strength of the magnetic field are changed by selecting different positions or different numbers of electromagnets 510 to supply current, so that the electromagnetic machine is applicable to different positions to be machined and machining quantities, and the application range is wider.
Further, the number of electromagnets 510 is even; the even number of electromagnets 510 is two by two, and the electromagnets 510 are arranged symmetrically with respect to the dielectric 100.
Specifically, in this embodiment, the number of electromagnets 510 is an even number, wherein two electromagnets 510 are paired, and two electromagnets 510 in a pair are symmetrically disposed with respect to the dielectric 100, so that a pair of electromagnets 510 can form a regular magnetic field in the dielectric 100, and the regular magnetic field can uniformly accelerate the plasma, so that the material removal rate can be controlled, and the processing precision and the processing efficiency can be further improved.
Further, the electromagnet 510 includes a magnetic core 511 and a coil 512 wound around the magnetic core 511, and the coil 512 is supplied with a variable current power source.
Specifically, the present embodiment adjusts the magnetic field strength of the magnetic field generated by the magnetic assembly 500 by changing the current of the power supply to the coil 512, which is convenient to operate and control, simple in structure, and low in manufacturing cost.
Further, the present application also includes a three-axis moving platform on which the dielectric 100 is placed, the three-axis moving platform translating in the X-direction, Y-direction, and Z-direction, and the X-direction, Y-direction, and Z-direction establishing a three-dimensional rectangular coordinate system.
Specifically, the embodiment sets a triaxial moving platform capable of translating in the X direction, the Y direction and the Z direction, and the dielectric medium 100 is placed on the triaxial moving platform, so that the processing position of the thin-wall workpiece 600 to be processed can be accurately controlled, and meanwhile, the workpiece is ensured to be in a uniform and stable magnetic field, so that acceleration of the magnetic field on the plasma and uniform and stable change of the motion of the magnetic field in the processing process are facilitated, and further uniform and stable processing quality is ensured.
Further, the robot 300 has degrees of freedom for translation in the X direction, the Y direction, and the Z direction, and degrees of freedom for swinging.
Further, the fixed connection assembly 700 comprises a lifting part 710 and a sucker 720 connected to the top end of the lifting part 710, wherein the sucker 720 has an adsorption force for adsorbing the thin-wall workpiece 600, and the size of the adsorption force is adjustable. The thin-walled workpiece 600 is sucked onto the suction cup 720.
Specifically, the present embodiment implements clamping and fixing of the thin-walled workpiece 600 by the lifting member 710 and the suction cup 720. In addition, the lifting member 710 can be adjusted up and down in height, so that the thin-walled workpiece 600 with uneven surface can be fixed such that the surface to be processed is horizontal; in addition, the top of the lifting component 710 is connected with the sucker 720, and the thin-wall workpiece 600 can be fixed without deforming the thin-wall workpiece 600 due to too large suction force by adjusting the suction force of the sucker 720, so that the sucker 720 can accurately adsorb and fix the thin-wall workpiece 600, and micro deformation and inaccurate positioning caused by too large force of the thin-wall workpiece are avoided; thereby further improving the processing precision.
Further, the lifting member 710 includes a fixing portion and a telescopic portion, one end of the telescopic portion is connected to the top of the fixing portion, and the other end is connected to the bottom end of the telescopic portion; the top end of the telescoping portion is connected to a suction cup 720. In some embodiments, lifting member 710 is an electric cylinder, hydraulic cylinder, or the like.
Further, the fixed connection assembly 700 further includes an air pump 730, a pressure detector 740 and a control portion, the air pump 730 is connected with the suction cup 720, the pressure detector 740 is connected with the suction cup 720, and the air pump 730 and the pressure detector 740 are connected with the control portion. In some embodiments, the control portion is integrated into the computer control terminal 400.
Specifically, the air pump 730, the pressure detector 740 and the control part are provided in this embodiment, the pressure detector 740 can monitor the pressure of the sucker 720 in real time, so that the pressure value is fed back to the control part, and the control part controls the air pump 730 to adjust the suction force of the sucker 720 according to the pressure value, so as to adjust the suction force of the sucker 720 in real time according to the actual situation. Thereby further ensuring that the suction force of the suction cup 720 can fix the thin-wall workpiece 600 and simultaneously avoid deformation of the thin-wall workpiece 600 caused by too large suction force. Simple structure, stability and reliability and low cost.
Further, the dielectric 100 is a liquid.
Specifically, the liquid dielectric 100 has good heat conduction characteristics, can reduce the influence of a processing heat source on the unprocessed surface and the processed holes, reduces the participation of heat stress in a heat affected zone, and further improves the processing quality.
Referring to fig. 3, in some embodiments, the parameters of the magnetic field B are set as: the magnetic field strength is 0-3T. The distribution direction of the magnetic field B is perpendicular to the machine direction. The parameters of the laser 200 are: scanning for one time along the scanning direction S, wherein the scanning speed is less than 0.2mm/S, the focusing light spot is 10.5 mu m, and the pulse frequency is 10-80 KHz. The micron-sized hole parameters of the thin-walled workpiece prepared by the method are as follows: the diameter of the hole is 10-80 mu m, and the depth of the hole is 30-200 mu m.
It should be noted that the present application can improve the quality of group hole processing, reduce thermal stress, accurately determine the distance between the laser head 210 and the surface of the thin-wall workpiece 600 at different positions, maintain a specified defocus amount, and improve the precision of group hole processing.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present application will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious changes and modifications which are extended therefrom are still within the scope of the application.
Claims (10)
1. A laser beam machining device for processing of fine crowd deep holes of thin-walled workpieces is characterized in that: comprising the following steps:
a dielectric medium in which a thin-wall workpiece is placed, wherein the thin-wall workpiece is fixedly connected with the dielectric medium through a fixed connection assembly;
the laser comprises a laser head for emitting light beams into the dielectric medium and a visual orientation tracking system connected to one side of the laser head, wherein the visual orientation tracking system is used for identifying the distance between the laser head and a surface to be processed of the thin-wall workpiece in the Z direction;
the manipulator is connected to the top end of the laser and used for driving the laser head to move to a target coordinate;
the computer control end is connected with the manipulator and the visual directional tracking system;
and the magnetic component is arranged around the dielectric medium and generates a magnetic field with variable magnetic field intensity around the dielectric medium.
2. The laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to claim 1, wherein: the magnetic assembly comprises a plurality of electromagnets which are arranged around the dielectric medium at intervals.
3. The laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to claim 2, wherein: the number of the electromagnets is even; and the electromagnets are arranged in pairs in an even number, and the electromagnets are symmetrically arranged relative to the dielectric medium.
4. The laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to claim 3, wherein: the electromagnet comprises a magnetic core and a coil wound on the magnetic core, and the coil is supplied with a current-variable power supply.
5. The laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to claim 1, wherein: the dielectric medium is placed on the triaxial mobile platform, the triaxial mobile platform translates in the X direction, the Y direction and the Z direction, and a three-dimensional rectangular coordinate system is established in the X direction, the Y direction and the Z direction.
6. The laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to claim 1, wherein: the manipulator has degrees of freedom for translation in the X, Y and Z directions.
7. The laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to claim 1, wherein: the fixed connection assembly comprises a lifting component and a sucker connected to the top end of the lifting component, wherein the sucker has an adsorption force for adsorbing the thin-wall workpiece to be machined, and the size of the adsorption force is adjustable.
8. The laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to claim 7, wherein: the lifting component comprises a fixed part and a telescopic part, one end of the telescopic part is connected to the top of the fixed part, and the other end of the telescopic part is connected to the bottom end of the telescopic part; the top end of the telescopic part is connected with the sucker.
9. The laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to claim 8, wherein: the fixed connection assembly further comprises an air pump, a pressure detector and a control part, wherein the air pump is connected with the sucker, the pressure detector is connected with the sucker, and the air pump and the pressure detector are connected with the control part.
10. The laser processing apparatus for deep hole processing of a fine group of thin-walled workpieces according to claim 9, wherein: the dielectric is a liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311006693.0A CN117161563A (en) | 2023-08-10 | 2023-08-10 | Laser processing device for processing micro group deep holes of thin-wall part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311006693.0A CN117161563A (en) | 2023-08-10 | 2023-08-10 | Laser processing device for processing micro group deep holes of thin-wall part |
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| Publication Number | Publication Date |
|---|---|
| CN117161563A true CN117161563A (en) | 2023-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311006693.0A Withdrawn CN117161563A (en) | 2023-08-10 | 2023-08-10 | Laser processing device for processing micro group deep holes of thin-wall part |
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| Country | Link |
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| CN (1) | CN117161563A (en) |
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- 2023-08-10 CN CN202311006693.0A patent/CN117161563A/en not_active Withdrawn
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Application publication date: 20231205 |
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