CN205305346U - Self -correcting chip mounter suction nozzle structure and use its high accuracy chip mounter - Google Patents
Self -correcting chip mounter suction nozzle structure and use its high accuracy chip mounter Download PDFInfo
- Publication number
- CN205305346U CN205305346U CN201520988871.9U CN201520988871U CN205305346U CN 205305346 U CN205305346 U CN 205305346U CN 201520988871 U CN201520988871 U CN 201520988871U CN 205305346 U CN205305346 U CN 205305346U
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- axis
- suction nozzle
- inching gear
- voice coil
- fixture
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Abstract
The utility model belongs to the electronic information field provides a self -correcting chip mounter suction nozzle structure and use its high accuracy chip mounter, the suction nozzle structure includes: a plurality of fine setting suction nozzles, every fine setting suction nozzle includes: suction nozzle, vacuum passageway, X axle vernier arrangement and Y axle vernier arrangement, wherein, X axle vernier arrangement and Y axle vernier arrangement set up on the upper portion of suction nozzle, and X axle vernier arrangement and Y axle vernier arrangement are the quadrature setting, and X axle vernier arrangement and Y axle vernier arrangement can drive the suction nozzle fine motion, and X axle vernier arrangement and Y axle vernier arrangement all set up porosely, the vacuum passageway passes X axle vernier arrangement and Y axle vernier arrangement goes up the hole that sets up. The utility model provides a technical scheme has efficient advantage.
Description
Technical field
This utility model belongs to electronic information field, particularly relates to a kind of self-correcting chip mounter suction nozzle structure and applies its high precision die bonder.
Background technology
Chip mounter suction nozzle structure the earliest is capstan head mode, it is simply that absorbing material, while attachment, capstan head rotates but center is motionless, but the disadvantage of so attachment is exactly when the device on pcb board is too many, or time too heavy, it is impossible to quickly mount; In order to solve the problems referred to above, prior art have employed bull (i.e. many suction nozzles) absorbing material, the mode then mounted respectively again, and it is stable that the advantage of bull attachment is exactly the material mounted to pcb board, and positional precision is high. As it is shown in figure 1, be existing mounting position schematic diagram, both attaching methods, it is necessary to by the position deviation occurred in optical correction suction process. In mathematical analysis it can be seen that, capstan head mode is continuously delivered to material pcb board from feeding position, and bull draws the mode of attachment, is then that the mode of discrete (or dispersion) is delivered on pcb board material, mounting from the absorption of single, it is high that the efficiency of bull never has capstan head mode. How to improve the efficiency of bull? let us first sets up the paster formula of a swivel head, then also sets up the attachment effectiveness formula of a bull:
The effectiveness formula of swivel head: the angle of each suction nozzle is multiplied by the maximum attachment quantity of rotating speed=each second,
Such as 24 suction nozzles of certain equipment, A=360/24=15, maximum (top) speed 60rpm, the maximum attachment quantity of each second is 15 devices. All of absorption, attachment action, all it is synchronously performed. Single efficiency a=1/ (the angle X rotating speed of each suction nozzle)
Many suction nozzles draw effectiveness formula: suction nozzle quantity * single suction device time+go to time+nozzle section quantity * single Mount Device time+the feed back station time. It is evident that overall mounting time=(suction nozzle quantity * single time of drawing+go to time+suction nozzle quantity * single mounting time+feed back station time)/suction nozzle quantity
Arrange formula can obtain:
Single efficiency time=single time of drawing+(go to time+feed back station time)/suction nozzle quantity+single mounting time.
Draw quantity by improving head, reduce and draw, mounting time, it is possible to improve efficiency.
But suction nozzle quantity is subject to place machine size limitation, it is impossible to unrestrictedly increase. So, according to formula, if we adopt absorbing material simultaneously, mount material simultaneously, then overall mounting time=single time of drawing+go to time+single mounting time+feed back station time. Efficiency is greatly improved. Maximum of which difficult point mounts material at the same time, because when the location gap between different materials is unequal with suction nozzle interval, can cause and cannot mount material simultaneously. Maximum of which problem is that every the material drawn deviation post on suction nozzle is different, after optical alignment, it is necessary to do small adjustment.
Utility model content
The purpose of this utility model embodiment is in that to provide a kind of self-correcting chip mounter suction nozzle structure, it is intended to solve the problem that existing technical scheme needs material is carried out small adjustment.
On the one hand, it is provided that a kind of self-correcting chip mounter suction nozzle structure, described nozzle structure includes: multiple fine setting suction nozzles; Each fine setting suction nozzle includes: suction nozzle, vacuum passage, X-axis inching gear and Y-axis inching gear;
Wherein, it is orthogonal setting that X-axis inching gear and Y-axis inching gear are arranged on the top of suction nozzle, X-axis inching gear and Y-axis inching gear, and X-axis inching gear and Y-axis inching gear can drive suction nozzle fine motion, X-axis inching gear and Y-axis inching gear to be respectively provided with porose; The hole that vacuum passage is arranged on X-axis inching gear and Y-axis inching gear.
Optionally, described X-axis inching gear and Y-axis inching gear are: ceramic motor or voice coil motor.
Optionally, when described X-axis inching gear and Y-axis inching gear are voice coil motor, described structure is concrete, including:
Y-axis voice coil motor, the first fixture, X-axis voice coil motor, the second fixture, suction nozzle, vacuum passage and installing plate; Wherein, one end of X-axis voice coil motor and installing plate are fixed, the other end of X-axis voice coil motor and the one side of the second fixture are fixed, one end of the another side of the second fixture and Y-axis voice coil motor is fixed, wherein, the angle between one side and the another side of the second fixture of the second fixture is right angle, and the other end of Y-axis voice coil motor and one end of the first fixture are fixed, the middle part of the first fixture is provided with suction nozzle, suction nozzle be internally provided with vacuum passage.
On the other hand, it is provided that a kind of high precision die bonder, described chip mounter includes self-correcting chip mounter suction nozzle structure; Described self-correcting chip mounter suction nozzle structure includes: multiple fine setting suction nozzles; Each fine setting suction nozzle includes: suction nozzle, vacuum passage, X-axis inching gear and Y-axis inching gear;
Wherein, it is orthogonal setting that X-axis inching gear and Y-axis inching gear are arranged on the top of suction nozzle, X-axis inching gear and Y-axis inching gear, and X-axis inching gear and Y-axis inching gear can drive suction nozzle fine motion, X-axis inching gear and Y-axis inching gear to be respectively provided with porose; The hole that vacuum passage is arranged on X-axis inching gear and Y-axis inching gear.
Optionally, described X-axis inching gear and Y-axis inching gear are: ceramic motor or voice coil motor;
Optionally, when described X-axis inching gear and Y-axis inching gear are voice coil motor, described self-correcting chip mounter suction nozzle structure is concrete, including:
Y-axis voice coil motor, the first fixture, X-axis voice coil motor, the second fixture, suction nozzle, vacuum passage and installing plate; Wherein, one end of X-axis voice coil motor and installing plate are fixed, the other end of X-axis voice coil motor and the one side of the second fixture are fixed, one end of the another side of the second fixture and Y-axis voice coil motor is fixed, wherein, the angle between one side and the another side of the second fixture of the second fixture is right angle, and the other end of Y-axis voice coil motor and one end of the first fixture are fixed, the middle part of the first fixture is provided with suction nozzle, suction nozzle be internally provided with vacuum passage.
Further aspect, also provides for the method for correcting position of a kind of many suction nozzles chip mounter, and described method includes:
201, by the suction nozzle of self-correcting chip mounter suction nozzle structure after absorbing material, through optical correction;
202, material attachment is carried out after suction nozzle being finely tuned by self-correcting chip mounter suction nozzle structure according to the result of described optical correction;
Described self-correcting chip mounter suction nozzle structure includes: multiple fine setting suction nozzles; Each fine setting suction nozzle includes: suction nozzle, vacuum passage, X-axis inching gear and Y-axis inching gear;
Wherein, it is orthogonal setting that X-axis inching gear and Y-axis inching gear are arranged on the top of suction nozzle, X-axis inching gear and Y-axis inching gear, and X-axis inching gear and Y-axis inching gear can drive suction nozzle fine motion, X-axis inching gear and Y-axis inching gear to be respectively provided with porose; The hole that vacuum passage is arranged on X-axis inching gear and Y-axis inching gear.
Optionally, described X-axis inching gear and Y-axis inching gear are: ceramic motor or voice coil motor.
Optionally, when described X-axis inching gear and Y-axis inching gear are voice coil motor, described self-correcting chip mounter suction nozzle structure is concrete, including:
Y-axis voice coil motor, the first fixture, X-axis voice coil motor, the second fixture, suction nozzle, vacuum passage and installing plate; Wherein, one end of X-axis voice coil motor and installing plate are fixed, the other end of X-axis voice coil motor and the one side of the second fixture are fixed, one end of the another side of the second fixture and Y-axis voice coil motor is fixed, wherein, the angle between one side and the another side of the second fixture of the second fixture is right angle, and the other end of Y-axis voice coil motor and one end of the first fixture are fixed, the middle part of the first fixture is provided with suction nozzle, suction nozzle be internally provided with vacuum passage.
In this utility model embodiment, what the technical scheme that this utility model provides provided has the advantage that paster efficiency is high.
Accompanying drawing explanation
The mounting position schematic diagram that Fig. 1 provides for prior art;
The self-correcting chip mounter suction nozzle structure chart that Fig. 2 provides for this utility model the first better embodiment;
The flow chart of the method for correcting position of many suction nozzles chip mounter that Fig. 3 provides for this utility model the 3rd better embodiment;
The self-correcting chip mounter suction nozzle structure chart that Fig. 4 provides for this utility model the 4th better embodiment.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, this utility model is further elaborated. Should be appreciated that specific embodiment described herein is only in order to explain this utility model, be not used to limit this utility model.
This utility model the first better embodiment provides a kind of self-correcting chip mounter suction nozzle structure, this structure may apply on chip mounter, its installation site having can on the top of the suction nozzle of chip mounter, as shown in Figure 1, said suction nozzle structure includes: multiple fine setting suction nozzles, each fine setting suction nozzle is as in figure 2 it is shown, include: suction nozzle 1, vacuum passage 2, X-axis inching gear 3 and Y-axis inching gear 4;
Wherein, X-axis inching gear 3 and Y-axis inching gear 4 are arranged on the top of suction nozzle 1, X-axis inching gear 3 and Y-axis inching gear 4 are orthogonal setting, X-axis inching gear 3 drives suction nozzle 1 along X-direction fine motion, Y-axis inching gear 4 can drive suction nozzle 1 to be respectively provided with porose 5 along Y direction fine motion, X-axis inching gear 3 and Y-axis inching gear 4; The hole 5 that vacuum passage 2 is arranged on X-axis inching gear 3 and Y-axis inching gear 4.
The nozzle structure that this utility model the first better embodiment provides makes many suction nozzles after absorbing material, after optical correction, then according to the result of optical correction, the attachment material under suction nozzle can be carried out attachment to adjust, and X-axis inching gear and Y-axis inching gear it is provided with due to each suction nozzle, so the fine setting of each suction nozzle all can be different, so when carrying out small adjustment, each suction nozzle can be finely tuned according to the position of its correspondence respectively, this makes it possible to adapt to multiple suction nozzle run simultaneously, then mount material simultaneously, thus improving the efficiency of attachment.
Optionally, above-mentioned X-axis inching gear and Y-axis inching gear can be all: ceramic motor or voice coil motor.
Consult Fig. 4, Fig. 4 provides self-correcting chip mounter suction nozzle structure for what this utility model the 4th better embodiment provided, as shown in Figure 4, this self-correcting chip mounter suction nozzle structure includes: Y-axis voice coil motor the 40, first fixture 41, X-axis voice coil motor the 42, second fixture 43, suction nozzle 44, vacuum passage 45 and installing plate 46; Wherein, one end of X-axis voice coil motor 42 is fixed with installing plate 46, the other end of X-axis voice coil motor 42 and the one side of the second fixture 43 are fixed, the another side of the second fixture 43 and one end of Y-axis voice coil motor 40 are fixed, wherein, the angle between one side and the another side of the second fixture 43 of the second fixture 43 is right angle, and the other end of Y-axis voice coil motor 40 and one end of the first fixture 41 are fixed, the middle part of the first fixture 41 is provided with suction nozzle 44, suction nozzle 44 be internally provided with vacuum passage 45.
The operation principle of this utility model the 4th better embodiment can be: owing to installing plate 46 and chip mounter are fixed, so the movement of voice coil motor is all be mounted opposite plate 46 to move, namely the position of suction nozzle is finely tuned, when needs move in X-axis, X-axis voice coil motor 42 is inputted one and controls electric current, thus can change the magnetic flux of X-axis voice coil motor, so that one end of X-axis voice coil motor is moved in X-direction, in like manner, when needs move in Y-axis, Y-axis voice coil motor 40 is inputted another and controls electric current, thus can change the magnetic flux of Y-axis voice coil motor, the one end making Y-axis voice coil motor is moved in Y direction, this makes it possible to reach the purpose of fine setting, and because voice coil motor has high acceleration, at high speed, the quickly advantage of response, so using especially conveniently on chip mounter, it also is able to the speed of response chip mounter.
The detailed description of the invention that this utility model provides specifically has following feature:
1, the material equal for once mounting multiple spacing, if needing high accuracy to correct position, then can distinguish the fine motion XY in single suction nozzle and correct;
2, can individually mounting after needing to make optical device respectively for multiple suction nozzles of current chip mounter, become, multiple suction nozzles can mount simultaneously. (mounting position is equal with suction nozzle position. )
3, can in the chip mounter suction nozzle structure having had at present, it is achieved draw, the high efficiency production beat simultaneously mounted simultaneously.
This utility model the second better embodiment provides a kind of high precision die bonder, this chip mounter includes self-correcting chip mounter suction nozzle structure, as shown in Figure 2, this structure may apply on chip mounter, its installation site having can on the top of the suction nozzle of chip mounter, as it is shown in figure 1, said suction nozzle structure includes: multiple fine setting suction nozzles, each fine setting suction nozzle is as in figure 2 it is shown, include: suction nozzle 1, vacuum passage 2, X-axis inching gear 3 and Y-axis inching gear 4;
Wherein, X-axis inching gear 3 and Y-axis inching gear 4 are arranged on the top of suction nozzle 1, X-axis inching gear 3 and Y-axis inching gear 4 are orthogonal setting, X-axis inching gear 3 drives suction nozzle 1 along X-direction fine motion, Y-axis inching gear 4 can drive suction nozzle 1 to be respectively provided with porose 5 along Y direction fine motion, X-axis inching gear 3 and Y-axis inching gear 4; The hole 5 that vacuum passage 2 is arranged on X-axis inching gear 3 and Y-axis inching gear 4.
In an embodiment of this utility model the second better embodiment, above-mentioned X-axis inching gear 3 and Y-axis inching gear 4 can be voice coil motor, when the structure for voice coil motor may refer to the description of this utility model the 4th better embodiment, do not repeating here. In another embodiment of this utility model the second better embodiment, X-axis inching gear 3 and Y-axis inching gear 4 can be ceramic motor. The concrete manifestation form of above-mentioned inching gear is not limited by this utility model the second better embodiment, as long as it is capable of fine motion.
As it is shown on figure 3, this utility model the 3rd better embodiment also provides for the method for correcting position of a kind of many suction nozzles chip mounter, the method is also provided for the method for correcting position of a kind of many suction nozzles chip mounter by this utility model, and the method is as it is shown on figure 3, include:
Step S201, by the suction nozzle of self-correcting chip mounter suction nozzle structure after absorbing material, through optical correction;
In above-mentioned steps, the method for optical correction can adopt the antidote of prior art, is not repeating here.
Step S202, according to described optical correction result by self-correcting chip mounter suction nozzle structure to suction nozzle finely tune after carry out material attachment;
Described self-correcting chip mounter suction nozzle structure includes: multiple fine setting suction nozzles; Each fine setting suction nozzle includes: suction nozzle, vacuum passage, X-axis inching gear and Y-axis inching gear;
Wherein, it is orthogonal setting that X-axis inching gear and Y-axis inching gear are arranged on the top of suction nozzle, X-axis inching gear and Y-axis inching gear, and X-axis inching gear and Y-axis inching gear can drive suction nozzle fine motion, X-axis inching gear and Y-axis inching gear to be respectively provided with porose; The hole that vacuum passage is arranged on X-axis inching gear and Y-axis inching gear.
State X-axis inching gear 3 and Y-axis inching gear 4 can be voice coil motor or ceramic motor, when the structure for voice coil motor may refer to the description of this utility model the 4th better embodiment, do not repeating here.
The method that this utility model provides has the advantage improving chip mounter efficiency.
The foregoing is only preferred embodiment of the present utility model; not in order to limit this utility model; all any amendment, equivalent replacement and improvement etc. made within spirit of the present utility model and principle, should be included within protection domain of the present utility model.
Claims (6)
1. a self-correcting chip mounter suction nozzle structure, described nozzle structure includes: multiple fine setting suction nozzles; It is characterized in that, each fine setting suction nozzle includes: suction nozzle, vacuum passage, X-axis inching gear and Y-axis inching gear;
Wherein, it is orthogonal setting that X-axis inching gear and Y-axis inching gear are arranged on the top of suction nozzle, X-axis inching gear and Y-axis inching gear, and X-axis inching gear and Y-axis inching gear can drive suction nozzle fine motion, X-axis inching gear and Y-axis inching gear to be respectively provided with porose; The hole that vacuum passage is arranged on X-axis inching gear and Y-axis inching gear.
2. structure according to claim 1, it is characterised in that described X-axis inching gear and Y-axis inching gear are: ceramic motor or voice coil motor.
3. structure according to claim 2, it is characterised in that when described X-axis inching gear and Y-axis inching gear are voice coil motor, described structure is concrete, including:
Y-axis voice coil motor, the first fixture, X-axis voice coil motor, the second fixture, suction nozzle, vacuum passage and installing plate; Wherein, one end of X-axis voice coil motor and installing plate are fixed, the other end of X-axis voice coil motor and the one side of the second fixture are fixed, one end of the another side of the second fixture and Y-axis voice coil motor is fixed, wherein, the angle between one side and the another side of the second fixture of the second fixture is right angle, and the other end of Y-axis voice coil motor and one end of the first fixture are fixed, the middle part of the first fixture is provided with suction nozzle, suction nozzle be internally provided with vacuum passage.
4. a high precision die bonder, it is characterised in that described chip mounter includes self-correcting chip mounter suction nozzle structure; Described self-correcting chip mounter suction nozzle structure includes: multiple fine setting suction nozzles; Each fine setting suction nozzle includes: suction nozzle, vacuum passage, X-axis inching gear and Y-axis inching gear;
Wherein, it is orthogonal setting that X-axis inching gear and Y-axis inching gear are arranged on the top of suction nozzle, X-axis inching gear and Y-axis inching gear, and X-axis inching gear and Y-axis inching gear can drive suction nozzle fine motion, X-axis inching gear and Y-axis inching gear to be respectively provided with porose; The hole that vacuum passage is arranged on X-axis inching gear and Y-axis inching gear.
5. high precision die bonder according to claim 4, it is characterised in that described X-axis inching gear and Y-axis inching gear are: ceramic motor or voice coil motor.
6. high precision die bonder according to claim 5, it is characterised in that when described X-axis inching gear and Y-axis inching gear are voice coil motor, described self-correcting chip mounter suction nozzle structure is concrete, including:
Y-axis voice coil motor, the first fixture, X-axis voice coil motor, the second fixture, suction nozzle, vacuum passage and installing plate; Wherein, one end of X-axis voice coil motor and installing plate are fixed, the other end of X-axis voice coil motor and the one side of the second fixture are fixed, one end of the another side of the second fixture and Y-axis voice coil motor is fixed, wherein, the angle between one side and the another side of the second fixture of the second fixture is right angle, and the other end of Y-axis voice coil motor and one end of the first fixture are fixed, the middle part of the first fixture is provided with suction nozzle, suction nozzle be internally provided with vacuum passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520988871.9U CN205305346U (en) | 2015-12-03 | 2015-12-03 | Self -correcting chip mounter suction nozzle structure and use its high accuracy chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520988871.9U CN205305346U (en) | 2015-12-03 | 2015-12-03 | Self -correcting chip mounter suction nozzle structure and use its high accuracy chip mounter |
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| Publication Number | Publication Date |
|---|---|
| CN205305346U true CN205305346U (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520988871.9U Withdrawn - After Issue CN205305346U (en) | 2015-12-03 | 2015-12-03 | Self -correcting chip mounter suction nozzle structure and use its high accuracy chip mounter |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307472A (en) * | 2015-12-03 | 2016-02-03 | 深圳市兴华炜科技有限公司 | Suction nozzle structure for a self-correcting chip mounter, and position correcting method for multi-suction-nozzle chip mounter |
| WO2017091995A1 (en) * | 2015-12-03 | 2017-06-08 | 深圳市兴华炜科技有限公司 | Nozzle structure for self-correcting mounter and position correction method for multi-nozzle mounter |
| CN113993296A (en) * | 2020-11-25 | 2022-01-28 | 深圳市安泰自动化设备有限公司 | LED patch calibration method |
-
2015
- 2015-12-03 CN CN201520988871.9U patent/CN205305346U/en not_active Withdrawn - After Issue
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307472A (en) * | 2015-12-03 | 2016-02-03 | 深圳市兴华炜科技有限公司 | Suction nozzle structure for a self-correcting chip mounter, and position correcting method for multi-suction-nozzle chip mounter |
| WO2017091995A1 (en) * | 2015-12-03 | 2017-06-08 | 深圳市兴华炜科技有限公司 | Nozzle structure for self-correcting mounter and position correction method for multi-nozzle mounter |
| CN105307472B (en) * | 2015-12-03 | 2018-10-09 | 苏州鑫铭电子科技有限公司 | The method for correcting position of self-correcting chip mounter suction nozzle structure and more suction nozzle chip mounters |
| CN113993296A (en) * | 2020-11-25 | 2022-01-28 | 深圳市安泰自动化设备有限公司 | LED patch calibration method |
| CN113993296B (en) * | 2020-11-25 | 2023-06-30 | 深圳市安泰自动化设备有限公司 | LED patch calibration method |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160608 Effective date of abandoning: 20181009 |
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| AV01 | Patent right actively abandoned |