CN212859042U - Semiconductor silicon wafer centering and V-shaped groove finding device - Google Patents
Semiconductor silicon wafer centering and V-shaped groove finding device Download PDFInfo
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- CN212859042U CN212859042U CN202020853608.XU CN202020853608U CN212859042U CN 212859042 U CN212859042 U CN 212859042U CN 202020853608 U CN202020853608 U CN 202020853608U CN 212859042 U CN212859042 U CN 212859042U
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Abstract
The utility model belongs to wafer grinding and polishing equipment field, concretely relates to V type groove device is looked for to semiconductor silicon wafer centering. The device comprises a mounting base, wherein a hole is formed in the center of the upper end surface of the mounting base; the wafer lifting and rotating assembly comprises a mounting seat, and the rotating shaft is arranged in the central hole through a bearing; the rotating plate is fixedly arranged at the top end of the rotating shaft, and three wafer rotating handgrips are uniformly distributed on the outer edge of the upper end face of the rotating plate in the circumferential direction; a motor shaft of the servo motor is connected with a rotating shaft through a coupler; the telescopic rod of the cylinder is connected with the mounting seat through a plurality of optical axes; the wafer centering assembly comprises a wafer centering plate, the centering plate is arranged below the rotating plate, the mounting rod is arranged on the upper end face of the mounting base, the outer edge of the upper end face of the centering plate is uniformly provided with three centering claws, and the C-shaped sensor mounting plate is arranged on the upper end face of the mounting base beside the rotating plate; two laser correlation sensors are oppositely arranged at the upper end and the lower end of the sensor mounting plate. The utility model discloses simple structure, the operation is rapid, only needs three steps can accomplish simultaneously the centering and look for the V groove.
Description
Technical Field
The utility model belongs to wafer grinding and polishing equipment field, concretely relates to V type groove device is looked for to semiconductor silicon wafer centering, can realize silicon chip central positioning and V type groove alignment fast and accurately.
Background
With the rapid development of the semiconductor industry, the surface requirements of wafers, which are the main substrate materials for manufacturing integrated circuits, are higher and higher, and the requirements on the sizes of the wafers are also higher and higher. At present, foreign semiconductor silicon wafer processing equipment and processing technology are mature, and domestic semiconductor manufacturers also accelerate the development towards large-size wafers, but at present, domestic semiconductor silicon wafer processing equipment and processing technology are not mature enough.
Almost all semiconductor processing equipment has a wafer centering link which directly affects all subsequent processing links of wafers, and the V-shaped groove is used as a positioning point for subsequent processing of the wafers, and the position accuracy of the V-shaped groove is very important for the wafer production process. Therefore, a wafer centering and V-groove finding device is needed to meet the processing requirements of semiconductor silicon wafers.
SUMMERY OF THE UTILITY MODEL
In order to fill the blank that no V groove device for centering the semiconductor silicon wafer is arranged in China, the stability of processing the semiconductor silicon wafer is improved, and the purchase cost of the existing processing equipment is reduced. The utility model provides a V type groove device is looked for to semiconductor silicon wafer centering.
The utility model provides a technical scheme that its technical problem adopted is:
a semiconductor silicon wafer centering and V-shaped groove finding device is provided, and comprises a mounting base, a wafer lifting and rotating assembly, a wafer centering assembly and a positioning sensor assembly.
The center of the upper end surface of the mounting base is provided with a hole;
the wafer lifting and rotating assembly comprises a mounting seat, the rotating shaft is arranged in the bearing seat through a bearing, a spacer bush and a locking nut, the bearing is fixedly arranged in the mounting seat, and the bottom of the bearing is arranged in a central hole of the mounting base; the circular rotating plate is fixedly arranged at the top end of the rotating shaft, the size of the rotating plate is smaller than that of the wafer, and three wafer rotating handgrips are uniformly distributed on the outer edge of the upper end face of the rotating plate in the circumferential direction; a servo motor and an air cylinder are arranged in the mounting base, the servo motor is arranged in a motor base, and the motor base is connected with the bottom end of the bearing; a motor shaft of the servo motor is connected with a rotating shaft through a coupler; the telescopic rod of the air cylinder moves vertically and is connected with the upper end surface of a guide rod mounting plate horizontally arranged in the mounting base through a floating joint, the upper end surface of the guide rod mounting plate is also connected with the mounting base through a plurality of optical axes, and each optical axis is fixedly arranged in the mounting base through a sliding bearing;
the wafer centering assembly comprises a wafer centering plate, the centering plate is arranged below the rotating plate, the mounting rod is arranged on the upper end face of the mounting base, the center of the centering plate is provided with a hole for the rotating shaft to pass through, the outer edge of the upper end face of the centering plate is uniformly provided with three centering grips, the three centering grips are uniformly distributed by taking the rotating shaft as the center, and the mounting rod can adjust the level of the centering plate;
the positioning sensor assembly comprises a C-shaped sensor mounting plate, and the sensor mounting plate is arranged on the upper end surface of the mounting base beside the rotating plate; two laser correlation sensors are oppositely arranged at the upper end and the lower end of the sensor mounting plate and used for detecting a V-shaped groove of a wafer arranged on the rotating plate and transmitting a signal to the servo motor.
As an improvement, the sensor mounting block at the lower end of the sensor mounting plate is internally provided with an airtight sealing joint, and the laser correlation sensor can not be interfered by dust and impurities by continuously blowing air into the hole of the sensor mounting block.
As an improvement, the bearing is a centering angular contact bearing and is used for ensuring the rotation precision.
As an improvement, the device also comprises an outer cover protection assembly, wherein the outer cover protection assembly comprises an upper protection cover and a lower protection cover, and the upper protection cover is fixed on the rotating shaft and can move up and down and rotate along with the rotating shaft; the lower protective cover is arranged around the mounting seat to play a role in four-side protection.
As an improvement, four supporting rods with positioning functions are uniformly distributed on the lower end face of the mounting base and used for fixing the mounting base on an equipment rack.
As an improvement, the hand grab is provided with a positioning pin for preventing the hand grab from shifting.
As an improvement, the wafer rotating hand grab and the centering hand grab are hand grabs with self-centering functions.
The principle of the utility model is that: the whole is that the V groove is searched for through the rotation of wafer, correlation laser sensor's break-make, realizes the self-centering function of wafer through suitable whereabouts angle and three point location structure. Three rotary hand grips with self-centering function are arranged on a rotary plate of the wafer lifting rotary assembly, and the hand grips can enable the semiconductor silicon wafer to automatically move to the center of the device and then to be static under the action of gravity in the process of falling in a short distance. Three centering grab handles with self-centering function are arranged on a centering plate of the wafer centering assembly, the three centering grab handles are uniformly distributed by taking the rotating shaft as the center and have certain inclination, and the wafer automatically and accurately falls to the center of the centering grab handles under the action of gravity.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the structure is simple, and the centering of the wafer and the V-shaped groove can be realized by one motor, one cylinder and one laser correlation sensor.
2. The operation is rapid, and only three steps are needed to complete centering and V groove finding simultaneously.
3. The cost is low, and compared with a foreign device, the cost can be reduced by 50%.
Drawings
Fig. 1 is a sectional view of the present invention;
FIG. 2 is a front view of the present invention;
fig. 3 is a top view of the present invention.
Reference numerals: 1-lower shield, 2-mounting base, 3-optical axis, 4-motor base, 5-sliding bearing, 6-coupling, 7-servomotor, 8-guide bar mounting plate, 9-floating joint, 10-cylinder, 11-mounting base, 12-sensor lower mounting block, 13-sensor mounting plate, 14-sensor upper mounting block, 15-laser correlation sensor, 16-locking nut, 17-bearing base, 18-centering angular contact bearing, 19-bearing end cap, 20-sealing ring, 21-rotating shaft, 22-upper shield, 23-rotating plate, 24-positioning pin, 25-positioning pin, 26-rotating hand, 27-centering hand, 28-centering plate, 29-mounting block, 30-positioning pin, 31-mounting rod, 32-lower protective cover and 33-supporting rod.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.
As shown in fig. 1-3, a semiconductor silicon wafer centering V-groove finding device comprises a positioning sensor assembly, a wafer lifting rotating assembly, a wafer centering assembly and a housing protection assembly.
The center of the upper end face of the mounting base 11 is provided with a hole, and four supporting rods 33 with positioning function are uniformly distributed on the lower end face of the mounting base 11 and used for fixing the mounting base 11 on an equipment rack.
The wafer lifting and rotating assembly comprises a mounting seat 2, a rotating shaft 21 is arranged in a bearing seat 17 through a bearing, a spacer bush, a sealing ring and a locking nut 16, the bearing is fixedly arranged in the mounting seat 2, the bottom of the bearing is arranged in a central hole of a mounting base 11, the bearing is a centering angular contact bearing 18 and used for guaranteeing rotating precision, and a bearing end cover 19 and a sealing ring 20 are arranged at the end part of the bearing. The circular rotating plate 23 is fixedly arranged at the top end of the rotating shaft 21, and three wafer rotating handgrips 26 are uniformly distributed on the outer edge of the upper end face of the rotating plate 23 in the circumferential direction.
Be equipped with servo motor 7 and cylinder 10 in the mounting base 11, servo motor 7 is located in motor cabinet 4, and motor cabinet 4 is connected with the bottom of bearing. The servo motor 7 motor shaft is connected with a rotating shaft 21 through a coupling 6. The cylinder 10 telescopic link is along vertical motion and connect the 8 up end of guide arm mounting panel that the level was located in mounting base 11 through floating joint 9, and 8 up end of guide arm mounting panel still connect mount pad 2 through many optical axis 3, and each optical axis 3 sets firmly in mounting base 11 through slide bearing 5. This structure allows the wafer rotating portion to move up and down by the cylinder 10.
Wafer centering subassembly includes wafer centering plate 28, centering plate 28 is located rotor plate 23 below and the mounting rod is located the mounting base 11 up end, centering plate 28 center is equipped with the trompil and is used for supplying rotation axis 21 to pass, centering plate 28 up end outer fringe evenly is equipped with three centering and holds 27, three centering is held 27 and is used rotation axis 21 as center evenly distributed, the level that mounting rod 31 is used for adjusting centering plate 28, be equipped with locating pin 25 on centering is held 27 for prevent to hold the aversion by hand.
The positioning sensor assembly comprises a C-shaped sensor mounting plate 13, the sensor mounting plate 13 is arranged on the upper end face of the mounting base 11 beside the rotating plate 23 through bolts, a high-precision long groove is formed in the upper end face of the mounting base 11 and used for mounting a positioning pin 30, and the positioning pin 30 is arranged on a mounting block 29. Two laser correlation sensors 15 are oppositely arranged at the upper end and the lower end of the sensor mounting plate 13, and are used for detecting the V-shaped groove of the wafer arranged on the rotating plate 23 and transmitting signals to the servo motor 7. The two laser correlation sensors 15 are respectively arranged at the upper end and the lower end of the sensor mounting plate 13 through the sensor upper mounting block 14 and the sensor lower mounting block 12. An airtight sealing joint is arranged in the sensor lower mounting block 12, and the laser correlation sensor 15 can not be interfered by dust and impurities by uninterruptedly blowing air into the sensor mounting block hole.
The housing protection assembly includes an upper shield 22, and the upper shield 22 is fixed to the rotation shaft 21 for protecting the rotation shaft 21 and moving up and down and rotating therewith. The lower shield 1 is fixed on the mounting base 11 and forms a labyrinth seal in cooperation with the upper shield 22 for blocking dust and chemical liquid. A lower shield 32 is secured to the mounting base 11 to protect the lower middle portion of the device.
The whole working flow of the device is as follows: the wafer is placed on the centering grab 27 through the manipulator, the air cylinder 10 drives the rotating plate 23 to ascend, the rotating grab 26 holds the wafer, when the wafer ascends to a certain position, the servo motor 7 drives the rotating plate 23 to rotate, when the laser correlation sensor 15 detects a wafer V groove, the servo motor 7 stops, the air cylinder 10 ascends to drive the wafer to move downwards, and the wafer is received by the centering grab 27 on the way. At this time, the wafer is in a state of locating and centering the V-groove, and waits for the next process.
Finally, it is to be noted that the above-mentioned embodiments are only specific embodiments of the present invention. Obviously, the present invention is not limited to the above embodiments, and many variations are possible. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the invention should be considered as within the scope of the invention.
Claims (7)
1. A semiconductor silicon wafer centering and V-shaped groove finding device is characterized by comprising a mounting base, a wafer lifting and rotating assembly, a wafer centering assembly and a positioning sensor assembly;
the center of the upper end face of the mounting base is provided with a hole;
the wafer lifting and rotating assembly comprises a mounting seat, the rotating shaft is arranged in a bearing seat through a bearing, the bearing seat is fixedly arranged in the mounting seat, and the bottom of the bearing seat is arranged in a central hole of the mounting base; the circular rotating plate is fixedly arranged at the top end of the rotating shaft, three wafer rotating handgrips are uniformly distributed on the outer edge of the upper end face of the rotating plate in the circumferential direction, and the size of the rotating plate is smaller than that of the silicon wafer; a servo motor and an air cylinder are arranged in the mounting base, the servo motor is arranged in a motor base, and the motor base is connected with the bottom end of the bearing; a motor shaft of the servo motor is connected with a rotating shaft through a coupler; the telescopic rod of the air cylinder moves vertically and is connected with the upper end surface of a guide rod mounting plate horizontally arranged in the mounting base through a floating joint, the upper end surface of the guide rod mounting plate is also connected with the mounting base through a plurality of optical axes, and each optical axis is fixedly arranged in the mounting base through a sliding bearing;
the wafer centering assembly comprises a wafer centering plate, the centering plate is arranged below the rotating plate, the mounting rod is arranged on the upper end face of the mounting base, the center of the centering plate is provided with a hole for a rotating shaft to pass through, the outer edge of the upper end face of the centering plate is uniformly provided with three centering grips, the three centering grips are uniformly distributed by taking the rotating shaft as the center, and the mounting rod can adjust the level of the centering plate;
the positioning sensor assembly comprises a C-shaped sensor mounting plate, and the sensor mounting plate is arranged on the upper end surface of the mounting base beside the rotating plate; two laser correlation sensors are oppositely arranged at the upper end and the lower end of the sensor mounting plate and used for detecting a V-shaped groove of a wafer arranged on the rotating plate and transmitting a signal to the servo motor.
2. A semiconductor silicon wafer centering and V-groove finding device as claimed in claim 1, wherein the laser correlation sensor is arranged on the sensor mounting plate through a sensor mounting block, an airtight sealing joint is arranged in the sensor mounting block at the lower end of the sensor mounting plate, and the laser correlation sensor can not be interfered by dust and impurities by continuously blowing air into the hole of the sensor mounting block.
3. A semiconductor silicon wafer centering and V-groove finding device as claimed in claim 1, wherein said bearing is a centering angular contact bearing for ensuring rotational accuracy.
4. A semiconductor silicon wafer centering and V-groove finding device as claimed in claim 1, further comprising a housing protection assembly, wherein the housing protection assembly comprises an upper shield and a lower shield, the upper shield is fixed on the rotating shaft and can move up and down and rotate along with the rotating shaft; the lower shield is arranged around the mounting seat and the mounting base.
5. A semiconductor silicon wafer centering and V-groove finding device as claimed in claim 1, wherein the lower end face of the mounting base is uniformly provided with four supporting rods with positioning function for fixing the mounting base on the equipment rack.
6. A semiconductor silicon wafer centering V-groove finding device as claimed in claim 1 wherein the centering gripper is provided with a positioning pin for preventing the gripper from shifting.
7. A semiconductor silicon wafer centering V-groove finding device as claimed in claim 1, wherein said wafer rotating hand and centering hand are self-centering ones.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020853608.XU CN212859042U (en) | 2020-05-20 | 2020-05-20 | Semiconductor silicon wafer centering and V-shaped groove finding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020853608.XU CN212859042U (en) | 2020-05-20 | 2020-05-20 | Semiconductor silicon wafer centering and V-shaped groove finding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212859042U true CN212859042U (en) | 2021-04-02 |
Family
ID=75205235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020853608.XU Active CN212859042U (en) | 2020-05-20 | 2020-05-20 | Semiconductor silicon wafer centering and V-shaped groove finding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212859042U (en) |
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2020
- 2020-05-20 CN CN202020853608.XU patent/CN212859042U/en active Active
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