CN212851193U

CN212851193U - Single-sided circuit board

Info

Publication number: CN212851193U
Application number: CN202022067995.7U
Authority: CN
Inventors: 邝明; 汤立宏
Original assignee: Zhejiang Liushi Circuit Board Co ltd
Current assignee: Zhejiang Liushi Circuit Board Co ltd
Priority date: 2020-09-19
Filing date: 2020-09-19
Publication date: 2021-03-30
Anticipated expiration: 2030-09-19

Abstract

The utility model relates to a single face circuit board relates to the technical field of electron electrical apparatus, and it includes the base plate, it has a plurality of wiring holes to run through on the base plate, the up end of base plate seted up with wiring hole equivalent guiding gutter, every the guiding gutter all with corresponding the wiring hole is linked together. Through setting up the guiding gutter, utilize the guiding gutter to destroy the tensile force on soldering tin liquid surface for the quick wiring hole that enters into of soldering tin liquid, and fully cover the copper layer, and then can improve the tin effect of hanging on the copper layer.

Description

Single-sided circuit board

Technical Field

The application relates to the field of electronic appliances, in particular to a single-sided circuit board.

Background

A wiring board is an important electronic component in an electronic device, and is a support for the electronic component. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances.

In the production of the circuit board in the related art, it is usually necessary to cover the copper layer on the inner wall of the via hole with solder so as to prevent the copper layer from being oxidized. In the related art, the circuit board is usually directly immersed in the solder liquid, and the solder liquid is allowed to enter the wiring holes. However, the solder liquid cannot sufficiently enter the wiring hole due to the tension of the solder liquid, thereby affecting the tin-hanging effect of the copper layer.

In view of the above-mentioned related art, the inventors believe that the circuit board has the defect that the copper layer has poor tin coating effect.

SUMMERY OF THE UTILITY MODEL

In order to make the soldering tin liquid can enter into the wiring hole as far as, this application provides a single face circuit board, has the advantage that improves the copper layer and hang the tin effect.

The application provides a single-sided circuit board adopts following technical scheme:

the single-sided circuit board comprises a substrate, wherein a plurality of wiring holes penetrate through the substrate, guide grooves which are equal to the wiring holes in quantity are formed in the upper end face of the substrate, and each guide groove is communicated with the corresponding wiring hole.

Through adopting above-mentioned technical scheme, through setting up the guiding gutter, when hanging tin operation to the base plate, the guiding gutter can be with wiring hole and soldering tin liquid intercommunication. Utilize the guiding gutter to destroy the tensile force on soldering tin liquid surface for the quick wiring hole that enters into of soldering tin liquid, and fully cover the copper layer, and then can improve the tin effect of hanging on copper layer.

Preferably, the lower end surface of the substrate is provided with a plurality of heat dissipation grooves.

Through adopting above-mentioned technical scheme, through setting up the radiating groove for the heat of base plate can enter into the outside air through the radiating groove fast. Therefore, the heat exchange efficiency between the substrate and the outside air is improved, and the heat dissipation effect of the heat dissipation plate is further improved.

Preferably, the heat dissipation groove is arranged in a conical shape, and the inner diameter of the groove bottom of the heat dissipation groove is larger than that of the groove opening.

By adopting the technical scheme, the inner diameter of the bottom of the heat dissipation groove is larger than that of the notch, so that the heat dissipation groove has a good guiding effect. The heat in the radiating groove can be quickly discharged from the notch, so that the radiating effect of the circuit board is further improved.

Preferably, a plurality of arc extinguishing holes penetrate through the substrate between the high current area and the low current area.

Through adopting above-mentioned technical scheme, through setting up the arc-extinguishing hole, have good arc extinguishing effect. The problem of short circuit of the circuit board caused by mutual contact of electric arcs of the high current area and the low current area is avoided, and the use safety of the circuit board is further improved.

Preferably, the lower end face of the substrate is provided with an insulating layer, and the insulating layer is formed by coating and molding insulating paint.

By adopting the technical scheme, the insulating property between the substrate and the electrical appliance element is improved by arranging the insulating layer. Thereby preventing the electric leakage of the electric appliance element and further improving the use safety of the circuit board.

Preferably, an activated carbon plate is arranged on the lower end face of the insulating layer.

By adopting the technical scheme, the external water vapor of the electrical appliance element is absorbed by arranging the activated carbon plate. The problem that the metal elements on the circuit board are oxidized and corroded due to the fact that water vapor enters the circuit board is avoided, and the service life of the circuit board is further prolonged.

Preferably, a hollowed-out silica gel plate is arranged between the insulating layer and the activated carbon plate.

Through adopting above-mentioned technical scheme, through setting up the silica gel board, utilize the good heat conductivility of silica gel board for the heat of circuit board can be through the quick effluvium of silica gel board, further improves the radiating effect of circuit board. Simultaneously, the heat on the silica gel board can also dry the active carbon board to guaranteed the water-absorbing capacity of active carbon board, thereby improved the practicality of circuit board.

Preferably, a plurality of elastic shock absorption blocks are uniformly distributed at the periphery of the lower end face of the activated carbon plate.

By adopting the technical scheme, the damping block is arranged, so that the circuit board has good damping capacity. The problem that the circuit board is damaged or broken due to external impact is avoided, and the use stability of the circuit board is further improved.

In summary, the present application includes at least one of the following beneficial technical effects:

1. by arranging the diversion trench, the diversion trench is utilized to destroy the tension on the surface of the soldering tin liquid, so that the soldering tin liquid quickly enters the wiring hole and fully covers the copper layer, and the tin hanging effect of the copper layer can be improved;

2. through setting up the arc extinguishing hole, have good arc extinguishing effect. The problem of short circuit of the circuit board caused by mutual contact of electric arcs of a high current area and a low current area is avoided, and the use safety of the circuit board is improved;

3. through setting up the silica gel board, utilize the good heat conductivility of silica gel board for the heat of circuit board can be through the quick effluvium of silica gel board, further improves the radiating effect of circuit board.

Drawings

Fig. 1 is a schematic overall structure diagram of an embodiment of the present application.

Fig. 2 is a cross-sectional view of an embodiment of the present application.

Description of reference numerals: 1. a substrate; 2. a wiring hole; 3. an arc extinguishing hole; 4. a diversion trench; 5. a heat sink; 6. an insulating layer; 7. a silica gel plate; 8. an activated carbon plate; 9. a damper block.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses a single-sided circuit board. Referring to fig. 1, the single-sided wiring board includes a substrate 1 horizontally disposed, and a plurality of wiring holes 2 are formed through the substrate 1. Meanwhile, a plurality of arc extinguishing holes 3 penetrate between the high current area and the low current area of the substrate 1.

When the above-mentioned wiring board is applied, the lead wires are passed through the wiring holes 2. The wires can then be connected to the conductive strips on the wiring board by solder. Immediately thereafter. The circuit board can be conducted with an external circuit.

Referring to fig. 1 and 2, the upper end surface of the substrate 1 is provided with flow guide grooves 4 equal to the wiring holes 2, and each flow guide groove 4 is communicated with the corresponding wiring hole 2. A plurality of radiating grooves 5 are formed in the lower end face of the base plate 1, the radiating grooves 5 are arranged in a conical mode, and the inner diameter of the bottoms of the radiating grooves 5 is larger than that of the notches.

When the substrate 1 is subjected to tin hanging operation, the diversion trench 4 communicates the wiring hole 2 with the soldering liquid, and the tension on the surface of the soldering liquid is damaged. Meanwhile, the soldering tin liquid rapidly enters the wiring hole 2 through the diversion trench 4 and fully covers the copper layer, so that the tin hanging operation of the copper layer is realized.

Referring to fig. 2, the lower end surface of the substrate 1 is coated and molded by insulating paint to form a layer of insulating layer 6, the lower end surface of the insulating layer 6 is provided with a hollowed-out silica gel plate 7, and the insulating layer 6 and the silica gel plate 7 are bonded by epoxy resin glue.

Referring to fig. 2, an activated carbon plate 8 is disposed on a lower end surface of the silicone plate 7, and the silicone plate 7 and the activated carbon plate 8 are bonded by an epoxy resin adhesive. Meanwhile, the positions around the lower end face of the activated carbon plate 8 are uniformly provided with a plurality of damping blocks 9 made of rubber.

When the circuit board is applied, the insulating layer 6 can perform insulation protection on the substrate 1 and the electrical element, so that electric leakage of the electrical element is prevented. The activated carbon plate 8 can absorb moisture outside the electrical element to prevent the metal element on the circuit board from being oxidized.

The silica gel plate 7 can rapidly dissipate the heat of the circuit board, and the normal use of the circuit board is ensured. Simultaneously, the heat on the silica gel board 7 can also dry the active carbon board 8, guarantees the absorptive capacity of active carbon board 8 to the aqueous vapor. The shock absorption block 9 can protect the circuit board and prevent the circuit board from being broken.

The implementation principle of the single-sided circuit board in the embodiment of the application is as follows: the substrate 1 is immersed into the soldering tin liquid, at the moment, the diversion trench 4 communicates the wiring hole 2 with the soldering tin liquid, and the tension on the surface of the soldering tin liquid is damaged. Meanwhile, the soldering tin liquid rapidly enters the wiring hole 2 through the diversion trench 4 and fully covers the copper layer, so that the tin hanging operation of the copper layer is realized.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a single-sided circuit board, includes base plate (1), run through on base plate (1) and have a plurality of wiring holes (2), its characterized in that: the upper end face of the base plate (1) is provided with guide grooves (4) which are equal to the wiring holes (2), and each guide groove (4) is communicated with the corresponding wiring hole (2).

2. The single-sided wiring board of claim 1, wherein: the lower end face of the base plate (1) is provided with a plurality of radiating grooves (5).

3. The single-sided wiring board of claim 2, wherein: the heat dissipation groove (5) is arranged in a conical shape, and the inner diameter of the groove bottom of the heat dissipation groove (5) is larger than that of the groove opening.

4. The single-sided wiring board of claim 1, wherein: a plurality of arc extinguishing holes (3) penetrate between the high current area and the low current area of the substrate (1).

5. The single-sided wiring board of claim 1, wherein: the insulating layer (6) is arranged on the lower end face of the substrate (1), and the insulating layer (6) is formed by coating insulating paint.

6. The single-sided wiring board of claim 5, wherein: and an activated carbon plate (8) is arranged on the lower end surface of the insulating layer (6).

7. The single-sided wiring board of claim 6, wherein: and a hollowed-out silica gel plate (7) is arranged between the insulating layer (6) and the activated carbon plate (8).

8. The single-sided wiring board of claim 7, wherein: and a plurality of elastic shock absorption blocks (9) are uniformly distributed at the periphery of the lower end surface of the activated carbon plate (8).