CN219843775U - Circuit board structure of Bluetooth headset - Google Patents
Circuit board structure of Bluetooth headset Download PDFInfo
- Publication number
- CN219843775U CN219843775U CN202321057337.7U CN202321057337U CN219843775U CN 219843775 U CN219843775 U CN 219843775U CN 202321057337 U CN202321057337 U CN 202321057337U CN 219843775 U CN219843775 U CN 219843775U
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- circuit board
- layer
- board body
- bluetooth headset
- base plate
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 20
- 238000005260 corrosion Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000012856 packing Methods 0.000 claims description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses a circuit board structure of a Bluetooth headset, which comprises a circuit board body, wherein a guard plate is fixedly connected to the side wall of the circuit board body, a central hole is formed in the outer wall of the top of the circuit board body, a circular gasket is fixedly connected to the inner wall of the central hole, a plurality of clamping grooves are formed in the side wall of the circuit board body, an arc-shaped gasket is fixedly connected to the inner wall of each clamping groove, the circuit board body comprises a base plate, a power layer is arranged above the base plate, a signal layer is arranged on the lower surface of the power layer, and a heat dissipation plate is arranged above the base plate. According to the utility model, the arc-shaped gasket and the circular gasket are adopted to enable the circuit board body to be fixed more stably, so that noise generated by the Bluetooth headset is avoided, the circuit board body is protected by the guard plate, when the circuit board body is loosened or falls, the guard plate can collide with foreign objects preferentially, the impact force generated by collision is reduced by the guard plate, the circuit board body is prevented from being damaged, and the service life of the Bluetooth headset is prolonged.
Description
Technical Field
The utility model relates to the technical field of Bluetooth headphones, in particular to a circuit board structure of a Bluetooth headphone.
Background
The bluetooth headset is a hands-free headset using bluetooth technology, which can enable a user to avoid the wire snagging and use the headset in various ways. Bluetooth headset has been a good tool for improving efficiency for mobile commerce, and an important component in bluetooth headset is a circuit board.
The utility model provides a building waste recovery unit for bluetooth headset, an electronic circuit board for bluetooth headset relates to circuit board technical field, including circuit board, annular board and apron, the inside lower extreme of annular board is fixed to be provided with the circuit board, and the annular board top is provided with the apron, and slot has all been seted up to the top four corners department of annular board, and the limiting groove has been seted up around the inner wall side middle part of slot.
The circuit board of bluetooth headset is usually through the direct chucking of earphone shell, and is not fine to the safeguard measure of circuit board, and bluetooth headset carelessly falls behind, leads to the circuit board to become flexible or damage easily, and the circuit board becomes flexible can make earphone production noise, and the circuit board is impaired seriously can lead to bluetooth headset to be unable to use, shortens bluetooth headset's life-span. Therefore, there is a need to design a circuit board structure of a bluetooth headset to solve the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide a circuit board structure of a Bluetooth headset, which solves the defects in the prior art.
In order to achieve the above object, the present utility model provides the following technical solutions:
the utility model provides a bluetooth headset's circuit board structure, includes the circuit board body, the lateral wall fixedly connected with backplate of circuit board body, the centre bore has been seted up to the top outer wall of circuit board body, the circular packing ring of inner wall fixedly connected with of centre bore, a plurality of draw-in groove has been seted up to the lateral wall of circuit board body, the inner wall fixedly connected with arc packing ring of draw-in groove, the circuit board body includes the base plate, the top of base plate is provided with the power layer, the lower surface of power layer is provided with the signal layer, the top of base plate is provided with the heating panel, the inside grafting of base plate has a plurality of heat conduction post.
Further, the signal layer comprises a wiring layer, an ink screen plate and a green oil layer, wherein the ink screen plate is arranged on the lower surface of the wiring layer, and the green oil layer is arranged on the lower surface of the ink screen plate.
Further, an upper pressing layer is arranged on the upper surface of the substrate, and the upper pressing layer is positioned on the lower surface of the heat dissipation plate.
Further, a lower pressing layer is arranged on the lower surface of the substrate, and the lower pressing layer is positioned on the upper surface of the power supply layer.
Further, an upper waterproof layer is arranged on the upper surface of the heat dissipation plate, and a lower waterproof layer is arranged below the signal layer.
Further, the lower surface of the signal layer is provided with an anti-corrosion layer, and the anti-corrosion layer is positioned on the upper surface of the lower waterproof layer.
In the technical scheme, the circuit board structure of the Bluetooth headset provided by the utility model has the advantages that the circuit board body is fixed more stably through the arc-shaped gasket and the circular gasket, so that the Bluetooth headset is prevented from generating noise easily due to loosening of the circuit board body, the circuit board body is protected by the guard board, when the circuit board body is loosened or falls down, the guard board can collide with foreign objects preferentially, the impact force generated by collision is reduced by the guard board, the circuit board body is prevented from being damaged, and the service life of the Bluetooth headset is prolonged; the heat conduction column penetrates through the substrate, and the heat conduction column timely transfers heat generated by the power supply layer to the heat dissipation plate, so that the heat dissipation plate can quickly dissipate heat, the heat dissipation of the circuit board body is facilitated, and the circuit board body is prevented from being damaged due to overhigh temperature; the upper waterproof layer and the lower waterproof layer have waterproof effect, so that the phenomena of electric leakage, short circuit and the like caused by moisture of the circuit board body are avoided; the corrosion resistance of the circuit board body is improved by uniformly coating the lower surface of the signal layer with the arranged corrosion-resistant layer.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
Fig. 1 is a schematic perspective view of a circuit board structure of a bluetooth headset according to the present utility model.
Fig. 2 is a schematic diagram of the top structure of a circuit board structure of a bluetooth headset according to the present utility model.
Fig. 3 is a schematic diagram of a layered structure of a circuit board body of a circuit board structure of a bluetooth headset according to the present utility model.
Reference numerals illustrate:
the circuit board comprises a circuit board body 1, a protective plate 2, a central hole 3, a round gasket 4, a clamping groove 5, an arc gasket 6, a substrate 7, a power supply layer 8, a signal layer 9, a heat dissipation plate 10, a heat conduction column 11, a trend layer 12, an ink screen 13, a green oil layer 14, an upper pressing layer 15, a lower pressing layer 16, an upper waterproof layer 17, a lower waterproof layer 18 and an anti-corrosion layer 19.
Detailed Description
In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1-3, the circuit board structure of the bluetooth headset provided by the embodiment of the utility model comprises a circuit board body 1, wherein a guard board 2 is fixedly connected to the side wall of the circuit board body 1, a central hole 3 is formed in the outer wall of the top of the circuit board body 1, a circular gasket 4 is fixedly connected to the inner wall of the central hole 3, a plurality of clamping grooves 5 are formed in the side wall of the circuit board body 1, an arc gasket 6 is fixedly connected to the inner wall of the clamping grooves 5, the circuit board body 1 comprises a substrate 7, a power layer 8 is arranged above the substrate 7, a signal layer 9 is arranged on the lower surface of the power layer 8, a heat dissipation plate 10 is arranged above the substrate 7, and a plurality of heat conduction columns 11 are inserted into the substrate 7.
Specifically, in this embodiment, the Bluetooth headset comprises a circuit board body 1, a protection board 2 is adhered to the side wall of the circuit board body 1, the protection board 2 protects the circuit board body 1, the protection board 2 is made of rubber material, certain elasticity and insulation are provided, when the Bluetooth headset falls, even if the circuit board body 1 loosens or falls, the protection board 2 can collide with foreign objects preferentially, the protection board 2 can reduce the impact force generated by collision, the circuit board body 1 is prevented from being damaged, the service life of the Bluetooth headset is prolonged, the top outer wall of the circuit board body 1 is provided with a central hole 3, the inner wall of the central hole 3 is fixedly connected with a circular gasket 4, a central rod on the headset housing passes through the central hole 3, the circular gasket 4 clings to the central rod, the central hole 3 is matched with the central rod on the headset housing to position the circuit board body 1, the side wall of the circuit board body 1 is provided with a plurality of clamping grooves 5, the clamping groove 5 is formed in an arc-shaped equidistant manner, the clamping groove 5 can also be formed according to the position of a limiting rod on the earphone shell, the arc-shaped gasket 6 is fixedly connected to the inner wall of the clamping groove 5, the limiting rod on the earphone shell is clamped in the clamping groove 5, the arc-shaped gasket 6 can be tightly attached to the limiting rod, the clamping groove 5 is matched with the limiting rod on the earphone shell to fix the position of the circuit board body 1, the arc-shaped gasket 6 and the circular gasket 4 are made of rubber materials, the arc-shaped gasket 6 and the circular gasket 4 enable the circuit board body 1 to be fixed more stably, the circuit board body 1 is prevented from loosening easily, noise is generated by a Bluetooth earphone, the circuit board body 1 comprises a base plate 7, the base plate 7 is made of PET materials, the circuit board has the advantages of air temperature resistance, good chemical resistance stability, low water absorption rate, weak acid resistance, organic solvent resistance and the like, a power supply layer 8 is arranged above the base plate 7, the power layer 8 is the copper foil, the lower surface of power layer 8 is provided with signal layer 9, the top of base plate 7 is provided with heating panel 10, heating panel 10 can the heat dissipation, the inside grafting of base plate 7 has a plurality of heat conduction post 11, heat conduction post 11 is the equidistance setting, heat conduction post 11 runs through base plate 7, and the top of heat conduction post 11 contacts with heating panel 10, the bottom of heat conduction post 11 contacts with power layer 8, heat conduction post 11 can in time transmit the heating panel 10 with power layer 8 production heat, by heating panel 10 quick heat dissipation, be favorable to the heat dissipation of circuit board body 1, prevent that circuit board body 1 from damaging because of the high temperature.
The circuit board structure of the Bluetooth headset provided by the utility model adopts the arc gasket 6 and the round gasket 4 to ensure that the circuit board body 1 is more stable, thereby avoiding the circuit board body 1 from easily loosening to cause noise of the Bluetooth headset, and utilizing the guard plate 2 to protect the circuit board body 1, when the circuit board body 1 loosens or falls, the guard plate 2 can collide with foreign objects preferentially, the guard plate 2 reduces the impact force generated by collision, avoids the circuit board body 1 from being damaged, improves the service life of the Bluetooth headset,
in one embodiment of the present utility model, as shown in fig. 3, the signal layer 9 includes a trace layer 12, an ink screen 13 and a green oil layer 14, the ink screen 13 is disposed on the lower surface of the trace layer 12, the green oil layer 14 is disposed on the lower surface of the ink screen 13, the trace layer 12 is made of copper foil, the ink screen 13 is printed on the surface of the trace layer 12 where the trace is required, the trace is protected during etching, and the green oil layer 14 covers the lower surface of the whole trace layer 12 to prevent soldering.
In another embodiment of the present utility model, as shown in fig. 3, an upper pressing layer 15 is disposed on an upper surface of the substrate 7, and the upper pressing layer 15 is located on a lower surface of the heat dissipation plate 10; as shown in fig. 3, the lower surface of the substrate 7 is provided with a lower bonding layer 16, and the lower bonding layer 16 is located on the upper surface of the power layer 8, and the upper bonding layer 6 and the lower bonding layer 7 are made of a semi-solidified material, and are an insulating medium and an adhesive, so that the strength of the substrate 7 can be improved after the upper bonding layer 6 and the lower bonding layer 7 are solidified.
In still another embodiment provided by the utility model, as shown in fig. 3, an upper waterproof layer 17 is arranged on the upper surface of the heat dissipation plate 10, a lower waterproof layer 18 is arranged below the signal layer 9, the upper waterproof layer 17 and the lower waterproof layer 18 are both made of PCB waterproof glue, the upper waterproof layer 17 is uniformly coated on the upper surface of the heat dissipation plate 10, the lower waterproof layer 18 is uniformly coated on the lower surface of the signal layer 9, the upper waterproof layer 17 and the lower waterproof layer 18 have waterproof effects, and phenomena such as leakage, short circuit and the like caused by moisture of the circuit board body 1 are avoided; as shown in fig. 3, the lower surface of the signal layer 9 is provided with an anti-corrosion layer 19, the anti-corrosion layer 19 is positioned on the upper surface of the lower waterproof layer 18, the anti-corrosion layer 19 is made of polyvinylidene fluoride material, so that the anti-corrosion layer 19 is uniformly coated on the lower surface of the signal layer 9, and the corrosion resistance of the circuit board body 1 is improved.
Working principle: when in use, the circuit board body 1 comprises a substrate 7, a power layer 8 is arranged above the substrate 7, a signal layer 9 is arranged on the lower surface of the power layer 8, a heat radiation plate 10 is arranged above the substrate 7, a plurality of heat conduction columns 11 are inserted in the substrate 7, the top ends of the heat conduction columns 11 are contacted with the heat radiation plate 10, the bottom ends of the heat conduction columns 11 are contacted with the power layer 8, the heat conduction columns 11 can timely transfer heat generated by the power layer 8 to the heat radiation plate 10, the heat radiation plate 10 rapidly radiates heat, an upper pressing layer 15 is arranged on the upper surface of the substrate 7, a lower pressing layer 16 is arranged on the lower surface of the substrate 7, the strength of the substrate 7 can be improved after the upper pressing layer 6 and the lower pressing layer 7 are solidified, an upper waterproof layer 17 is arranged on the upper surface of the heat radiation plate 10, a lower waterproof layer 18 is arranged below the signal layer 9, the upper waterproof layer 17 and the lower waterproof layer 18 play a waterproof effect, the circuit board body 1 is prevented from being leaked, short-circuited and the like due to damp, the corrosion resistance of the circuit board body 1 is improved by the corrosion resistance layer 19, the circuit board body 1 is arranged in the earphone shell by a user, the central rod on the earphone shell passes through the central hole 3, the round gasket 4 is tightly attached to the central rod, the limiting rod on the earphone shell is clamped in the clamping groove 5, the arc gasket 6 is tightly attached to the limiting rod, the arc gasket 6 and the round gasket 4 enable the circuit board body 1 to be fixed more stably, the circuit board body 1 is prevented from being loosened easily, noise is generated by Bluetooth earphones, when the Bluetooth earphones fall down, even if the circuit board body 1 is loosened or falls down, the protecting plate 2 can collide with an external object preferentially, the protecting plate 2 can reduce the impact force generated by collision, the circuit board body 1 is prevented from being damaged, the service life of the Bluetooth headset is prolonged.
While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.
Claims (6)
1. The utility model provides a circuit board structure of bluetooth headset, includes circuit board body (1), its characterized in that, lateral wall fixedly connected with backplate (2) of circuit board body (1), centre bore (3) have been seted up to the top outer wall of circuit board body (1), circular packing ring (4) of inner wall fixedly connected with of centre bore (3), a plurality of draw-in groove (5) have been seted up to the lateral wall of circuit board body (1), the inner wall fixedly connected with arc packing ring (6) of draw-in groove (5), circuit board body (1) include base plate (7), the top of base plate (7) is provided with power layer (8), the lower surface of power layer (8) is provided with signal layer (9), the top of base plate (7) is provided with heating panel (10), the inside grafting of base plate (7) has a plurality of heat conduction post (11).
2. The circuit board structure of a bluetooth headset according to claim 1, wherein the signal layer (9) comprises a wiring layer (12), an ink screen (13) and a green oil layer (14), the ink screen (13) is arranged on the lower surface of the wiring layer (12), and the green oil layer (14) is arranged on the lower surface of the ink screen (13).
3. The circuit board structure of the bluetooth headset according to claim 1, wherein an upper pressing layer (15) is arranged on the upper surface of the substrate (7), and the upper pressing layer (15) is located on the lower surface of the heat dissipation plate (10).
4. The circuit board structure of the bluetooth headset according to claim 1, wherein the lower surface of the substrate (7) is provided with a lower bonding layer (16), and the lower bonding layer (16) is located on the upper surface of the power layer (8).
5. The circuit board structure of the bluetooth headset according to claim 1, wherein an upper waterproof layer (17) is arranged on the upper surface of the heat dissipation plate (10), and a lower waterproof layer (18) is arranged below the signal layer (9).
6. The circuit board structure of a bluetooth headset according to claim 5, wherein the lower surface of the signal layer (9) is provided with an anti-corrosion layer (19), and the anti-corrosion layer (19) is located on the upper surface of the lower waterproof layer (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321057337.7U CN219843775U (en) | 2023-05-05 | 2023-05-05 | Circuit board structure of Bluetooth headset |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321057337.7U CN219843775U (en) | 2023-05-05 | 2023-05-05 | Circuit board structure of Bluetooth headset |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219843775U true CN219843775U (en) | 2023-10-17 |
Family
ID=88301431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321057337.7U Active CN219843775U (en) | 2023-05-05 | 2023-05-05 | Circuit board structure of Bluetooth headset |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219843775U (en) |
-
2023
- 2023-05-05 CN CN202321057337.7U patent/CN219843775U/en active Active
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