CN212851174U - PCB structure for improving through flow and voltage drop - Google Patents
PCB structure for improving through flow and voltage drop Download PDFInfo
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- CN212851174U CN212851174U CN202021856155.2U CN202021856155U CN212851174U CN 212851174 U CN212851174 U CN 212851174U CN 202021856155 U CN202021856155 U CN 202021856155U CN 212851174 U CN212851174 U CN 212851174U
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Abstract
The utility model discloses an improve through-flow and pressure drop's PCB structure, including power plane layer, the number of piles on power plane layer is not less than power through-flow and the through-flow ratio of individual layer copper sheet, and/or, the thickness on power plane layer is not less than power through-flow and the through-flow ratio of individual layer copper sheet half. The utility model discloses an increase the number of piles of power plane layer and/or the thickness of thickening power plane layer for individual layer PCB board is under the condition of limited size, can improve the through-current capacity of electric current and improve the too big problem of pressure drop, with can handle bigger, the higher electric current of frequency, satisfy the demand that improves the power ability, make individual layer PCB board possess the development trend that can satisfy complicacy, small-size, frivolous PCB board, in order to adapt to the development of era better, accomplish more extensive application.
Description
Technical Field
The utility model relates to a PCB designs technical field, and more specifically says, relates to a PCB structure who improves through-flow and pressure drop.
Background
Printed Circuit Board (PCB), or printed circuit board for short, is one of the important components in the electronic industry, and implements the electrical connection between each component in the electronic product.
When the area of the PCB is fixed, the width of the copper sheet may not increase or decrease due to the development trend of the PCB to be complicated, small, light and thin. If the power supply requirement is increased under the condition of not changing the width of the copper sheet, the single-layer copper sheet cannot meet the requirements of through current and voltage drop which are required by power supply increase, and therefore a new mode needs to be considered to improve the structure of the PCB with the through current and the voltage drop.
The above disadvantages need to be improved.
Disclosure of Invention
In order to overcome the deficiencies of the prior art, the utility model provides an improve through-flow and PCB structure of pressure drop.
The utility model discloses technical scheme as follows:
a PCB structure for improving through-current and voltage drop comprises a power supply plane layer, wherein the number of layers of the power supply plane layer is not less than the ratio of the through-current of a power supply to the through-current of a single-layer copper sheet, and/or the thickness of the power supply plane layer is not less than half of the ratio of the through-current of the power supply to the through-current of the single-layer copper sheet.
The PCB structure for improving through current and voltage drop comprises a plurality of power plane layers, wherein the thickness of one power plane layer is not less than half of the ratio of the through current of a power supply to the through current of a single-layer copper sheet.
According to the PCB structure for improving the through-current and the voltage drop, the width of the copper sheet is 1000 mils, the through-current of the single-layer copper sheet is 17.2 amperes, the through-current of the power supply is 30 amperes, and the number of layers of the plane layer of the power supply is 2.
According to the PCB structure for improving the through-current and the voltage drop, the width of the copper sheet is 1000 mils, the through-current of the single-layer copper sheet is 17.2 amperes, the through-current of the power supply is 30 amperes, and the number of layers of the plane layer of the power supply is 3.
According to the PCB structure for improving the through-current and the voltage drop, the width of the copper sheet is 1000 mils, the through-current of the single-layer copper sheet is 17.2 amperes, the through-current of the power supply is 30 amperes, and the thickness of the power supply plane layer is 1.0 ounce.
According to the PCB structure for improving the through-current and the voltage drop, the width of the copper sheet is 1000 mils, the through-current of the single-layer copper sheet is 17.2 amperes, the through-current of the power supply is 30 amperes, and the thickness of the power supply plane layer is 2.0 ounces.
According to the PCB structure for improving the through-current and the voltage drop, the width of the copper sheet is 1000 mils, the through-current of the single-layer copper sheet is 17.2 amperes, the through-current of the power supply is 30 amperes, and the thickness of the power supply plane layer is 3.0 ounces.
According to the PCB structure for improving the through current and the voltage drop, the thickness of the ground plane layer adjacent to the power plane layer is not less than half of the ratio of the power through current to the single-layer copper sheet through current.
Further, the thickness of the ground plane layer adjacent to the power plane layer is the same as the thickness of the power plane layer.
According to the above scheme the utility model discloses, its beneficial effect lies in, the utility model discloses an increase the number of piles of power plane layer and/or the thickness of thickening power plane layer for individual layer PCB board is under the condition of limited size, can improve the through-current capacity of electric current and improve the too big problem of pressure drop, with can handle bigger, the higher electric current of frequency, satisfy the demand that improves the power ability, make individual layer PCB board possess the development trend that can satisfy complicacy, small-size, frivolous PCB board, in order to adapt to the development of epoch better, accomplish more extensive application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of a first embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a second embodiment of the present invention.
FIG. 4 is a table of parameters of a layer structure of a PCB.
Fig. 5 is a partially enlarged view of fig. 4.
Wherein, in the figures, the respective reference numerals:
1. a power plane layer; 11. a first power plane layer; 12. a second power plane layer; 13. a third power plane layer.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "fixed" or "disposed" or "connected" to another element, it can be directly or indirectly located on the other element. The terms "upper", "lower", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are only for convenience of description and not to be construed as limiting the technical solution. The meaning of "plurality" is two or more unless specifically limited otherwise.
A PCB structure for improving through current and voltage drop comprises a power supply plane layer 1, as shown in figure 1, the number of layers of the power supply plane layer 1 is not less than the ratio of the through current of a power supply to the through current of a single-layer copper sheet, and/or the thickness of the power supply plane layer 1 is not less than half of the ratio of the through current of the power supply to the through current of the single-layer copper sheet.
With the development of miniaturization, complication and functionalization of electronic equipment, the area of a PCB is fixed, and even smaller, the circuit is more complex, and meanwhile, the power supply requirement is gradually increased. Under this condition, the width of copper sheet probably does not increase anti-the subtracting, can't take the method that increases the copper sheet width to satisfy the requirement of individual layer PCB board power through-flow and voltage drop, consequently, need improve the thickness of copper sheet the utility model discloses in, through the copper sheet thickness that increases on power plane layer 1 and/or the power plane layer 1 to increase the total copper sheet's of PCB board thickness, improve the through-flow of PCB board.
If the unsatisfied power demand of the 1 number of piles of original power plane layer, if only one deck power plane layer 1, can refer to the utility model discloses a parameter, the number of piles of power plane layer 1 is not less than power through-flow and the through-flow ratio of individual layer copper skin promptly, increases the number of piles of power plane layer 1, changes into two-layer power plane layer 1, three-layer power plane layer 1, as shown in fig. 2. In fig. 2, a second power plane layer 12 and a third power plane layer 13 are added to the first power plane layer 11 to improve the current capacity.
In one embodiment, the copper sheet width is 1000 mils, the single layer copper sheet current is 17.2 amps, the power supply current is 30 amps, and the number of power plane layers 1 is 2.
In one embodiment, the copper sheet width is 1000 mils, the single layer copper sheet current is 17.2 amps, the power supply current is 30 amps, and the number of power plane layers 1 is 3.
If the copper sheet thickness on original power plane layer 1 does not satisfy the power demand, if only 1/2 ounces are thick, can refer to the utility model discloses a parameter, power plane layer 1's thickness is not less than power through-flow and the half of individual layer copper sheet through-flow ratio promptly, thickens the copper sheet thickness on the power plane layer 1, as shown in fig. 3, 4, 5, changes power plane layer 1's thickness into 1.0 ounce, 2.0 ounces, 3.0 ounces, as shown in fig. 4, 5. In fig. 3, the dotted line portion represents the thickness of the original power plane layer 1, and the solid line represents the thickness of the existing power plane layer 1.
In one embodiment, the power plane layer comprises a plurality of power plane layers 1, wherein the thickness of one power plane layer 1 is not less than half of the ratio of the power through current to the single-layer copper sheet through current. In a PCB board containing a plurality of power plane layers 1, the thickness of the copper skin on only one of the power plane layers 1 may be increased. Under the condition, due to the fact that the power plane layers 1 are arranged, the total thickness of the copper sheets of the PCB is increased, the total thickness of the copper sheets of the PCB can still be increased by increasing the thickness of the copper sheets on one of the power plane layers 1, the effect of improving the influence of through current and voltage drop is achieved, and the requirement of the circuit board for increasing the power supply is met.
In one embodiment, the copper sheet width is 1000 mils, the single sheet copper sheet current is 17.2 amps, the power supply current is 30 amps, and the thickness of the power plane layer 1 is 1.0 ounce.
In one embodiment, the copper sheet width is 1000 mils, the single sheet copper sheet current is 17.2 amps, the power supply current is 30 amps, and the thickness of the power plane layer 1 is 2.0 ounces.
In one embodiment, the copper sheet width is 1000 mils, the single sheet copper sheet current is 17.2 amps, the power supply current is 30 amps, and the thickness of the power plane layer 1 is 3.0 ounces.
In an embodiment, the PCB is a multi-layer structure, which includes two adjacent power plane layers 1, and both upper and lower ends of the two power plane layers 1 are ground plane layers, as shown in fig. 4 and 5, the thicknesses of the two ground plane layers are not less than half of the ratio of the power through current to the single copper sheet through current, that is, the thickness of the ground plane layer adjacent to the power plane layer 1 is the same as the thickness of the power plane layer 1. In the PCB with more ground plane layers, the thickness of the ground plane layer adjacent to the power supply plane layer 1 can be reduced relative to the power supply plane layer 1 so as to reduce the overall thickness of the PCB.
Under general conditions, the number of layers of the power plane layer 1 is not less than the ratio of power through current to single-layer copper sheet through current, and the thickness of the power plane layer 1 is not less than half of the ratio of power through current to single-layer copper sheet through current, the two modes can be used independently to improve through current and voltage drop under the condition of limited PCB size and copper sheet width, power requirements are met, but under the condition of more limitation on PCB clamping plates, the two modes can be used in a superposed mode, better improvement effect is achieved, and product requirements are met.
The utility model discloses an increase the number of piles of power plane layer 1 and/or thicken power plane layer 1's thickness, make individual layer PCB board under the condition of limited size, can improve the through-current capacity of electric current and improve the too big problem of pressure drop, with can handle bigger, the higher electric current of frequency, satisfy the demand that improves the power ability, make individual layer PCB board possess the development trend that can satisfy complicacy, small-size, frivolous PCB board, in order to adapt to the development of times better, accomplish more extensive application.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. The PCB structure is characterized by comprising a power supply plane layer, wherein the number of the power supply plane layer is not less than the ratio of the power supply through current to the single-layer copper sheet through current, and/or the thickness of the power supply plane layer is not less than half of the ratio of the power supply through current to the single-layer copper sheet through current.
2. The PCB structure for improving current and voltage drop according to claim 1, comprising a plurality of said power plane layers, wherein a thickness of one of said power plane layers is not less than half of a ratio of a power current to a single copper sheet current.
3. The PCB structure for improving through-current and voltage drop according to claim 1, wherein the width of the copper sheet is 1000 mils, the through-current of the single copper sheet is 17.2 amps, the through-current of the power supply is 30 amps, and the number of layers of the power supply plane layer is 2.
4. The PCB structure for improving through-current and voltage drop according to claim 1, wherein the width of the copper sheet is 1000 mils, the through-current of the single copper sheet is 17.2 amps, the through-current of the power supply is 30 amps, and the number of layers of the power supply plane layer is 3.
5. A PCB structure with improved current and voltage drop as in claim 1, wherein the copper sheet width is 1000 mils, the single copper sheet current is 17.2 amps, the power current is 30 amps, and the power plane layer thickness is 1.0 ounce.
6. A PCB structure with improved current and voltage drop as in claim 1, wherein the copper sheet width is 1000 mils, the single copper sheet current is 17.2 amps, the power current is 30 amps, and the power plane layer thickness is 2.0 ounces.
7. A PCB structure with improved current and voltage drop as in claim 1, wherein the copper sheet width is 1000 mils, the single copper sheet current is 17.2 amps, the power current is 30 amps, and the power plane layer thickness is 3.0 ounces.
8. The PCB structure for improving current and voltage drop according to claim 1, wherein the thickness of the ground plane layer adjacent to the power plane layer is not less than half of the ratio of the power current to the single copper sheet current.
9. A PCB structure with improved current and voltage drop according to claim 8, wherein the ground plane layer adjacent to the power plane layer has the same thickness as the power plane layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021856155.2U CN212851174U (en) | 2020-08-31 | 2020-08-31 | PCB structure for improving through flow and voltage drop |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021856155.2U CN212851174U (en) | 2020-08-31 | 2020-08-31 | PCB structure for improving through flow and voltage drop |
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| CN212851174U true CN212851174U (en) | 2021-03-30 |
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| CN202021856155.2U Active CN212851174U (en) | 2020-08-31 | 2020-08-31 | PCB structure for improving through flow and voltage drop |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116705756A (en) * | 2023-08-03 | 2023-09-05 | 之江实验室 | Wafer integrated system substrate and direct current voltage drop optimization method |
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2020
- 2020-08-31 CN CN202021856155.2U patent/CN212851174U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116705756A (en) * | 2023-08-03 | 2023-09-05 | 之江实验室 | Wafer integrated system substrate and direct current voltage drop optimization method |
| CN116705756B (en) * | 2023-08-03 | 2023-12-12 | 之江实验室 | Wafer integrated system substrate and direct current voltage drop optimization method |
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