CN114071863A

CN114071863A - Flexible circuit board with sampling terminal

Info

Publication number: CN114071863A
Application number: CN202111430880.2A
Authority: CN
Inventors: 林卓奇; 林卓群
Original assignee: Huizhou Dingfengtai Technology Co ltd
Current assignee: Huizhou Dingfengtai Technology Co ltd
Priority date: 2021-11-29
Filing date: 2021-11-29
Publication date: 2022-02-18

Abstract

The invention discloses a flexible circuit board with a sampling terminal, which comprises: a plurality of sampling terminals, a plurality of conductive lines, and an insulating film. The sampling terminals are electrically connected with the conducting circuits respectively, the conducting circuits are arranged between the two insulating films, and one ends of the sampling terminals are clamped between the two insulating films. According to the flexible circuit board with the sampling terminal, the welding point between the sampling terminal and the conducting circuit is eliminated, and the integrated connection structure of the sampling terminal and the corresponding conducting circuit is formed in an integrated forming mode, so that the manufacturing efficiency of the flexible circuit board is effectively improved, the reject ratio of the flexible circuit board caused by the welding process is reduced, and the production cost of enterprises is effectively reduced.

Description

Flexible circuit board with sampling terminal

Technical Field

The present invention relates to the field of flexible printed circuit, and more particularly to a flexible printed circuit having a sampling terminal.

Background

A Flexible Printed Circuit (FPC), which is a circuit board mainly composed of cu (copper foil), a (adhesive) and PI (Polyimide film), has many advantages such as space saving, weight reduction, and high flexibility, and is widely used in production and life, and the market is expanding. When the flexible printed circuit board is used for collecting the voltage of the battery post, the flexible printed circuit board is generally connected with the conductive circuit of the flexible printed circuit board and the battery post through the wiring terminal.

However, referring to fig. 1 of the present specification, in a conventional flexible printed circuit having a sampling terminal, as shown in a portion L in fig. 1, a soldering method is generally adopted to solder a nickel tab terminal L1 into the flexible printed circuit, so that the nickel tab terminal L1 is conducted with a conductive circuit L3 in the flexible printed circuit through a solder joint L2, and the other end of the nickel tab terminal L1 is connected to a battery post, so as to collect a battery post voltage. The welding type nickel terminal L1 not only causes the low manufacturing efficiency of the flexible circuit board, but also easily produces defective products in the welding process of the nickel terminal L1, thereby improving the production cost of enterprises.

Disclosure of Invention

Therefore, it is necessary to provide a flexible printed circuit board with a sampling terminal, which is directed to the technical problems of low production efficiency and high cost of the conventional flexible printed circuit board caused by the welding of nickel terminals.

A flexible circuit board with sampling terminals comprises a plurality of sampling terminals, a plurality of conductive circuits and an insulating film. The sampling terminals are electrically connected with the conducting circuits respectively, the conducting circuits are arranged between the two insulating films, and one ends of the sampling terminals are clamped between the two insulating films.

In one embodiment, each of the sampling terminals includes a conductive substrate, a first composite layer, and a second composite layer. The conductive substrate is electrically connected with the corresponding conductive circuit, the first composite layer is arranged on one side surface of the conductive substrate, and the second composite layer is arranged on the other side surface of the conductive substrate.

In one embodiment, the conductive substrate is made of one of copper, aluminum, copper alloy, stainless steel, conductive graphite, and conductive graphite fiber.

In one embodiment, the first composite layer is made of one of nickel, gold and copper.

In one embodiment, the second composite layer is made of one of nickel, gold and copper.

In summary, the flexible printed circuit with the sampling terminal according to the present invention eliminates the soldering point between the sampling terminal and the conductive circuit in the prior art, and the integrated connection structure of the sampling terminal and the corresponding conductive circuit is formed by an integrated molding manner, so as to effectively improve the manufacturing efficiency of the flexible printed circuit, reduce the reject ratio of the flexible printed circuit due to the soldering process, and effectively reduce the production cost of the enterprise.

Drawings

FIG. 1 is a schematic diagram of a flexible printed circuit in the prior art;

FIG. 2 is a schematic diagram of an embodiment of a flexible printed circuit board with a sampling terminal;

FIG. 3 is a schematic diagram of an embodiment of a flexible printed circuit board with a sampling terminal;

fig. 4 is an enlarged schematic diagram of part M of the flexible printed circuit having the sampling terminal in fig. 3.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 2, the present invention discloses a flexible printed circuit with sampling terminals, which includes a plurality of sampling terminals 1, a plurality of conductive traces 2 and an insulating film 3. Wherein, a plurality of sampling terminals 1 are connected with a plurality of conducting circuits 2 electrically respectively, a plurality of conducting circuits 2 all set up between two insulating films 3, and the one end centre gripping of a plurality of sampling terminals 1 is between two insulating films 3. Compared with the existing flexible circuit board, the flexible circuit board provided by the invention has the advantages that the existing welding point between the sampling terminal 1 and the conducting circuit 2 is omitted, the sampling terminal 1 is formed in an integrated forming mode by die cutting and etching the tail end of the conducting circuit 2, so that the integrated structure of the conducting circuit 2 and the sampling terminal 1 is obtained, the welding process of the flexible circuit board is reduced, the manufacturing efficiency of the flexible circuit board is improved, the condition that the sampling terminal 1 is easy to generate defective products in the welding process is avoided, and the production cost of enterprises is effectively reduced.

Further, each sampling terminal 1 includes a conductive substrate 11, a first composite layer 12, and a second composite layer 13. The conductive substrate 11 is electrically connected to the corresponding conductive traces 2, the first composite layer 12 is disposed on one side surface of the conductive substrate 11, and the second composite layer 13 is disposed on the other side surface of the conductive substrate 11. Compared with the existing sampling terminal 1, the sampling terminal of the invention is additionally provided with the first composite layer 12 and the second composite layer 13 on the surfaces of the two sides of the conductive substrate 11, so that a multi-layer composite structure is formed, and the conductive substrate 11 serving as a forming foundation of the sampling terminal 1 can ensure the conductivity and the structural strength of the sampling terminal 1; and first composite bed 12 and second composite bed 13 then can keep apart electrically conductive substrate 11 and external environment, avoid the contact of the corrosive substance in electrically conductive substrate 11 and the air to a certain extent to effectively prolong sampling terminal 1's life, guaranteed the stability of being connected between sampling terminal 1 and the battery utmost point post simultaneously.

Further, the conductive substrate 11 is made of one of copper, aluminum, copper alloy, stainless steel, conductive graphite, and conductive graphite fiber. In the present embodiment, the conductive substrate 11 is made of copper-zinc alloy. In practical application, the conductive base material 11 supported by the copper-zinc alloy has the characteristics of good conductivity, good ductility, high plasticity and the like, so that the conductivity and connection stability of the sampling terminal 1 when being connected with a battery pole can be ensured.

Further, the first composite layer 12 and the second composite layer 13 are made of one material selected from nickel, gold, and copper. In the present embodiment, the first composite layer 12 and the second composite layer 13 are made of nickel. In practical applications, the first composite layer 12 and the second composite layer 13 are attached to both side surfaces of the conductive substrate 11 by electroplating to form a nickel plating layer. The nickel plating layer has high stability in air and strong passivation capability, and when the sampling terminal 1 is in air, the outer surfaces of the first composite layer 12 and the second composite layer 13 can rapidly generate a very thin passivation film, so that corrosion of alkaline matters and acidic matters in the atmosphere is avoided. In addition, the electroplated nickel has fine crystals, good polishing performance and high hardness, so that the electroplated nickel has good wear resistance, and the sampling terminal 1 has higher corrosion resistance and wear resistance while the surface is smooth. When the sampling terminal 1 is connected with the battery post, it can form a more stable connection structure.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A flexible circuit board with a sampling terminal is characterized by comprising: a plurality of sampling terminal, a plurality of conducting wire and insulating film, it is a plurality of the sampling terminal respectively with a plurality of the conducting wire electricity is connected, and is a plurality of the conducting wire all sets up in two between the insulating film, a plurality of the one end centre gripping of sampling terminal is in two between the insulating film.

2. The FPC of claim 1, wherein each of the sampling terminals comprises a conductive substrate, a first composite layer and a second composite layer, the conductive substrate is electrically connected to the corresponding conductive traces, the first composite layer is disposed on one side surface of the conductive substrate, and the second composite layer is disposed on the other side surface of the conductive substrate.

3. The flexible printed circuit board with a sampling terminal of claim 2, wherein the conductive substrate is made of one of copper, aluminum, copper alloy, stainless steel, conductive graphite, and conductive graphite fiber.

4. The FPC of claim 2, wherein the first composite layer is made of one of Ni, Au, and Cu.

5. The flexible printed circuit board with sampling terminals of claim 2, wherein the second composite layer is made of one of nickel, gold and copper.