CN212848392U - Plastic package lead frame for discrete device - Google Patents
Plastic package lead frame for discrete device Download PDFInfo
- Publication number
- CN212848392U CN212848392U CN202022343701.9U CN202022343701U CN212848392U CN 212848392 U CN212848392 U CN 212848392U CN 202022343701 U CN202022343701 U CN 202022343701U CN 212848392 U CN212848392 U CN 212848392U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- frame body
- heat
- opened
- pin hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a lead frame technical field just discloses a discrete device plastic envelope lead frame, including the lead frame body, the rear side of lead frame body is opened and is equipped with the locating hole, the front side of lead frame body is opened and is equipped with the pin hole, the front side at lead frame body top is opened and is equipped with the square groove that is located the pin hole outside, the rear side at lead frame body top is opened and is equipped with the ring channel that is located the locating hole outside. This discrete device plastic envelope lead frame is equipped with ring channel and square groove respectively through the outside of locating hole and the outside in pin hole, and the lead frame body of being convenient for is when carrying out the glue dripping and handling, and when the volume of gluing was too much, glue can overflow respectively in the inner chamber of square groove and ring channel, can absorb unnecessary glue for glue can not overflow in the inner chamber in locating hole and pin hole, thereby can not lead to the fact the influence to hou mian technology.
Description
Technical Field
The utility model relates to a lead frame technical field specifically is a discrete device plastic envelope lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.
When the discrete device plastic package lead frame adopts the glue dripping process, the used glue amount is strictly controlled, less glue is used, the protection effect cannot be achieved, and a large amount of glue can overflow into the inner cavity of the positioning hole and the inner cavity of the pin hole on the lead frame, so that the subsequent process is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a to prior art not enough, the utility model provides a discrete device plastic envelope lead frame possesses the advantage of having avoided glue to overflow in the inner chamber of locating hole and pin hole, has solved the problem that proposes among the above-mentioned background art.
The utility model provides a following technical scheme: the utility model provides a discrete device plastic envelope lead frame, includes the lead frame body, the rear side of lead frame body is opened and is equipped with the locating hole, the front side of lead frame body is opened and is equipped with the pin hole, the front side at lead frame body top is opened and is equipped with the square groove that is located the pin hole outside, the rear side at lead frame body top is opened and is equipped with the ring channel that is located the locating hole outside.
Carefully, the fixed heat-conducting plate that has cup jointed in bottom of lead frame body, one side fixed mounting of heat-conducting plate has the heating panel, one side fixed mounting of heating panel has the radiating block.
Carefully, the both sides of heat-conducting plate all are equipped with the heating panel, the even eight radiating blocks that are equipped with of one side of heating panel.
And carefully selecting, wherein the distance from the inner side of the inner cavity of the square groove to the inner wall of the pin hole is one millimeter, and the distance from the inner side of the inner cavity of the annular groove to the inner wall of the positioning hole is one millimeter.
Compared with the prior art, the utility model discloses possess following beneficial effect:
1. this discrete device plastic envelope lead frame is equipped with ring channel and square groove respectively through the outside of locating hole and the outside in pin hole, and the lead frame body of being convenient for is when carrying out the glue dripping and handling, and when the volume of gluing was too much, glue can overflow respectively in the inner chamber of square groove and ring channel, can absorb unnecessary glue for glue can not overflow in the inner chamber in locating hole and pin hole, thereby can not lead to the fact the influence to hou mian technology.
2. This discrete device plastic envelope lead frame is equipped with heat-conducting plate, heating panel and radiating block respectively through the bottom of lead frame body, is convenient for carry out quick heat conduction and heat dissipation processing to the lead frame body when the lead frame body uses, has avoided the heat of lead frame body too high to influence its life.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the bottom three-dimensional structure of the lead frame body of the present invention;
fig. 3 is a schematic view of the three-dimensional structure of the heat dissipation block of the present invention.
In the figure: 1. a lead frame body; 2. positioning holes; 3. a pin hole; 4. a square groove; 5. an annular groove; 6. a heat conducting plate; 7. a heat dissipation plate; 8. and a heat dissipation block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a plastic package lead frame for discrete devices, includes a lead frame body 1, a heat conducting plate 6 is fixedly sleeved at the bottom of the lead frame body 1, a heat dissipating plate 7 is fixedly installed at one side of the heat conducting plate 6, a heat dissipating block 8 is fixedly installed at one side of the heat dissipating plate 7, the heat conducting plate 6, the heat dissipating plate 7 and the heat dissipating block 8 are respectively arranged at the bottom of the lead frame body 1, so as to facilitate rapid heat conduction and heat dissipation treatment of the lead frame body 1 when the lead frame body 1 is in use, thereby avoiding the influence of overhigh heat quantity of the lead frame body 1 on the service life thereof, the heat dissipating plates 7 are respectively arranged at both sides of the heat conducting plate 6, the eight heat dissipating blocks 8 are uniformly arranged at one side of the heat dissipating plate 7, the heat dissipating plates 7 are respectively arranged at both, the heat dissipation efficiency is accelerated, the rear side of the lead frame body 1 is provided with a positioning hole 2, the front side of the lead frame body 1 is provided with a pin hole 3, the front side of the top of the lead frame body 1 is provided with a square groove 4 positioned outside the pin hole 3, the distance from the inner side of the inner cavity of the square groove 4 to the inner wall of the pin hole 3 is one millimeter, the distance from the inner side of the inner cavity of the annular groove 5 to the inner wall of the positioning hole 2 is one millimeter, the distance from the inner side of the inner cavity of the square groove 4 to the inner wall of the pin hole 3 is one millimeter, the distance from the inner side of the inner cavity of the annular groove 5 to the inner wall of the positioning hole 2 is one millimeter, so that the square groove 4 and the annular groove 5 respectively leave gaps with the pin hole 3 and the positioning hole 2, glue in the inner cavities of the square groove 4 and the annular groove 5 cannot flow into the inner cavities of the pin hole 3 and the positioning hole 2 respectively, and the annular groove 5 positioned outside the positioning hole 2 is arranged on the rear side of the top of the lead frame body 1.
The working principle is as follows: during the use, when carrying out the rubber coating to lead frame body 1, fall glue on lead frame body 1's surface, when glue was too much, glue can enter into the inner chamber of square groove 4 and ring channel 5 respectively, when lead frame body 1 when putting into use, utilize heat-conducting plate 6, heating panel 7 and radiating block 8 of lead frame body 1 bottom to carry out heat conduction and heat dissipation processing to it, can.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Simultaneously in the utility model discloses an in the drawing, fill the pattern and just do not do any other injecions for distinguishing the picture layer.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a discrete device plastic envelope lead frame, includes lead frame body (1), its characterized in that: locating hole (2) are opened to the rear side of lead frame body (1), lead frame body (1)'s front side is opened and is equipped with pin hole (3), square groove (4) that are located pin hole (3) outside are opened to the front side at lead frame body (1) top, the rear side at lead frame body (1) top is opened and is equipped with ring channel (5) that are located locating hole (2) outside.
2. The discrete device plastic package lead frame according to claim 1, wherein: the bottom of the lead frame body (1) is fixedly sleeved with a heat conducting plate (6), one side of the heat conducting plate (6) is fixedly provided with a heat radiating plate (7), and one side of the heat radiating plate (7) is fixedly provided with a heat radiating block (8).
3. The discrete device plastic package lead frame according to claim 2, wherein: the heat-conducting plate is characterized in that heat-radiating plates (7) are arranged on two sides of the heat-conducting plate (6), and eight heat-radiating blocks (8) are uniformly arranged on one side of each heat-radiating plate (7).
4. The discrete device plastic package lead frame according to claim 1, wherein: the distance between the inner side of the inner cavity of the square groove (4) and the inner wall of the pin hole (3) is one millimeter, and the distance between the inner side of the inner cavity of the annular groove (5) and the inner wall of the positioning hole (2) is one millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022343701.9U CN212848392U (en) | 2020-10-20 | 2020-10-20 | Plastic package lead frame for discrete device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022343701.9U CN212848392U (en) | 2020-10-20 | 2020-10-20 | Plastic package lead frame for discrete device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212848392U true CN212848392U (en) | 2021-03-30 |
Family
ID=75154066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022343701.9U Active CN212848392U (en) | 2020-10-20 | 2020-10-20 | Plastic package lead frame for discrete device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212848392U (en) |
-
2020
- 2020-10-20 CN CN202022343701.9U patent/CN212848392U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7196403B2 (en) | Semiconductor package with heat spreader | |
| EP2426711A2 (en) | Heat sink for a protrusion-type ic package | |
| US10529652B2 (en) | Integrated circuit (IC) package with a solder receiving area and associated methods | |
| US10276472B2 (en) | Heat transfer plate having small cavities for taking up a thermal transfer material | |
| US10211140B2 (en) | Electronic device with die being sunk in substate | |
| CN110571201A (en) | high-heat-dissipation fan-out type three-dimensional heterogeneous double-sided plastic package structure and preparation method thereof | |
| KR100730626B1 (en) | Method of fabricating substrate for package of semiconductor light-emitting device | |
| CN101150098B (en) | Semiconductor device | |
| CN212848392U (en) | Plastic package lead frame for discrete device | |
| CN101740528B (en) | Radiating-enhanced outer pin-free semiconductor packaging structure and combination thereof | |
| CN212434579U (en) | Die assembly for soft solder loading | |
| CN210182410U (en) | High temperature resistant LED packaging structure based on ceramic substrate | |
| CN216288420U (en) | Chip holding device | |
| CN114420664B (en) | Packaging structure of multi-base island high-power module QFN | |
| CN110634819A (en) | Storage product packaging structure with radiating fins and manufacturing method | |
| CN1153285C (en) | Semiconductor package with heat dissipating structure | |
| CN220041875U (en) | Optoelectronic device packaging structure | |
| CN218442205U (en) | LED packaging module with good sealing performance | |
| CN210575916U (en) | Fingerprint identification chip heat radiation structure | |
| CN209929290U (en) | Waterproof connecting chip | |
| CN220821557U (en) | Lead frame convenient to cut list | |
| CN211980602U (en) | High-heat-dissipation semiconductor product with bottom heat dissipation plate and electronic product | |
| TWI729453B (en) | Structure improvement of power module | |
| CN218918858U (en) | Chip packaging structure and electronic equipment | |
| CN220233144U (en) | Steel sheet strippable chip packaging chassis |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |