CN212846689U

CN212846689U - Cooling system applied to intelligent terminal and intelligent terminal with cooling system

Info

Publication number: CN212846689U
Application number: CN202021975492.3U
Authority: CN
Inventors: 丁智成; 郑凯; 王浩; 湛承诚; 刘艳珍
Original assignee: Nanchang Black Shark Technology Co Ltd
Current assignee: Shenzhen Mygt Co ltd
Priority date: 2020-09-11
Filing date: 2020-09-11
Publication date: 2021-03-30
Anticipated expiration: 2030-09-11

Abstract

The utility model provides a cooling system applied to an intelligent terminal and an intelligent terminal with the cooling system, wherein the cooling system comprises a heating part and a fan, and a semiconductor refrigerator (TEC) is arranged between the heating part and the fan; the TEC is in contact connection with the heating element through a heat conducting element and receives heat of the heating element; the fan is positioned on one side of the TEC, and the blowing space of the fan covers the TEC and/or the heating member and/or the heat conducting member so as to dissipate heat generated by the heating member. The utility model discloses an increase semiconductor cooler, show the heat dispersion that improves intelligent terminal, and through the accurate control to TEC and fan, can solve the high problem of intelligent terminal heat dissipation power consumption to guarantee not improving under intelligent terminal's the heat dissipation power consumption's the prerequisite, show and improve complete machine heat dispersion.

Description

Cooling system applied to intelligent terminal and intelligent terminal with cooling system

Technical Field

The utility model relates to an intelligent terminal field especially relates to a be applied to intelligent terminal's cooling system and have this cooling system's intelligent terminal.

Background

In recent decades, the advent of large scale integrated circuits has driven the proliferation and development of the smart terminal industry. When the intelligent terminal runs a high-load game or other applications for a long time, the temperature of the intelligent terminal is higher and higher, the heat dissipation of a heating device (PU or a charging chip) is poor, the phenomenon of frequency reduction and blockage can occur, the game or other applications can not run smoothly, and even the intelligent terminal is halted, so that the use experience of a user is seriously influenced.

The existing intelligent terminal heat dissipation scheme mainly realizes heat dissipation of a main heating device in the intelligent terminal through a heat pipe and a hot plate, or carries out heat dissipation by adding a fan inside the intelligent terminal. However, with the upgrading of intelligent terminal software, especially game software, the use of 5G networks with improved screen refresh rate, and the like, the heat dissipation requirement of the intelligent terminal is higher and higher. For such higher heat dissipation requirements, stronger heat dissipation performance and finer heat dissipation management are required to meet the higher heat dissipation requirements.

SUMMERY OF THE UTILITY MODEL

In order to overcome the technical defect, the utility model aims to provide a be applied to intelligent terminal's cooling system and have this cooling system's intelligent terminal. By adding a semiconductor cooler (TEC), the heat dissipation performance of the intelligent terminal is obviously improved, and the problem of high heat dissipation energy consumption of the intelligent terminal can be solved by accurately controlling the TEC and the fan, so that the heat dissipation performance of the whole machine is obviously improved on the premise of not improving the heat dissipation energy consumption of the intelligent terminal.

The utility model discloses a heat dissipation system applied to an intelligent terminal, which comprises a heating part and a fan, wherein a semiconductor refrigerator is arranged between the heating part and the fan; the TEC is in contact connection with the heating element through a heat conducting element and receives heat of the heating element; the fan is located on one side of the TEC, the fan blows out heat dissipation flow for dissipating heat, the space where the heat dissipation flow circulates is a blowing space, and the blowing space covers the TEC and/or the heating member and/or the heat conducting member so as to dissipate heat generated by the heating member.

Preferably, a heat-conducting silicone grease is further arranged between the heat-conducting member and the heating member.

Preferably, the heating element, the TEC and the fan are arranged on the same line, and the blowing space covers the heating element and the TEC at the same time.

Preferably, the heating member and the TEC are located on different surfaces of the heat conducting member, and the blowing space covers only the TEC.

Preferably, the heat transfer member is curved, the heat transfer member includes a first section close to the fan and a second section far from the fan, and the blowing space covers the first section and/or the second section.

Preferably, the heat dissipation system further comprises a control unit, a monitoring module and a processing module are arranged in the control unit, and the monitoring module monitors the real-time temperature of the heating element and forms a temperature signal; the processing module is electrically connected with the monitoring module and receives the temperature signal; the processing module is further electrically connected with the fan and the TEC, a first temperature threshold value is arranged in the processing module, and when the temperature signal is larger than the first temperature threshold value, the processing module controls the fan and the TEC to work.

Preferably, a second temperature threshold and a third temperature threshold are further arranged in the processing module, and the third temperature threshold is greater than the second temperature threshold and greater than the first temperature threshold; when the temperature signal is greater than or equal to the second temperature threshold, the processing module forms a first current adjustment instruction; when the temperature signal is greater than or equal to the third temperature threshold, the processing module forms a second current adjustment instruction; the first current adjustment command and the second current adjustment command are used to adjust the operating current input to the fan and TEC.

Preferably, a first time period and a second time period are arranged in the processing module; when the current time is within a first time period and the temperature signal is greater than or equal to the first temperature threshold, the processing module controls only the fan to work; and when the current time is within a second time period and the temperature signal is smaller than the first temperature threshold value, the processing module controls the fan and the TEC to work simultaneously.

Preferably, a list of designated applications is provided in the processing module, and when the processing module detects that a designated application in the list of designated applications is activated, the processing module controls the fan and the TEC to operate simultaneously.

The utility model discloses an intelligent terminal, as above cooling system install in intelligent terminal's casing.

After the technical scheme is adopted, compared with the prior art, the method has the following beneficial effects:

1. the TEC is arranged between the heating part and the fan, so that the TEC actively absorbs heat from the heating part, and the heat dissipation effect of the heating part can be greatly improved by matching with the blowing heat dissipation work of the fan; the utility model discloses an initiative heat absorption relative ratio passive heat dissipation of prior art has higher radiating efficiency.

2. The position of the air blowing space can be changed by changing the setting position of the fan, so that the aim of blowing and heat dissipation of the TEC, the heating piece and the heat conducting piece is realized, and the heat dissipation effect is further enhanced;

3. the heat-conducting silicone grease is arranged between the heating part and the heat-conducting part, so that a surface gap between the heating part and the heat-conducting part can be filled, and the heat-conducting effect is enhanced;

4. the curved heat conducting member increases the surface area of the heat conducting member in a limited space, thereby increasing the heat dissipation area;

5. the TEC and the fan are independently controlled by the control unit, so that the TEC and the fan can realize an operation mode of independent operation or synchronous operation, and the heat dissipation and energy consumption of the intelligent terminal can be effectively reduced;

6. the intelligent terminal state is monitored in real time through the monitoring module, so that the temperature information of the intelligent terminal and the starting information of a high-heating application program can be captured, the corresponding time period can be matched, the adjustment of the TEC and the fan operation mode can be realized, and better experience is brought to a user;

7. through set up different temperature threshold values in processing module, and through the real-time temperature of intelligent terminal is acquireed to the monitor module, can be according to intelligent terminal's actual temperature automatic adjustment TEC with the operation gear of fan avoids unnecessary heat dissipation power consumption.

Drawings

Fig. 1 is a heat dissipation path of a heat dissipation system applied to an intelligent terminal provided by the present invention;

fig. 2 is a schematic view of an overall structure of a heat dissipation system according to an embodiment of the present invention;

fig. 3 is a control schematic diagram of a control unit of the heat dissipation system applied to the intelligent terminal provided by the present invention;

FIG. 4 is a control schematic of a prior art processor.

Wherein: 1-heating element, 2-heat-conducting silicone grease, 3-heat-conducting element, 4-TEC, 5-fan and 6-control component.

Detailed Description

The advantages of the present invention will be further explained with reference to the accompanying drawings and specific embodiments.

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, unless otherwise specified and limited, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, mechanically or electrically connected, or may be connected between two elements through an intermediate medium, or may be directly connected or indirectly connected, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.

In the following description, suffixes such as "module", "part", or "unit" used to indicate elements are used only for the convenience of description of the present invention, and have no specific meaning in itself. Thus, "module" and "component" may be used in a mixture.

Referring to fig. 1, the utility model provides a pair of be applied to intelligent terminal's cooling system is including generating heat 1, heat-conducting piece 3 and radiating piece. Specifically, the heat conducting member 3 is a heat pipe or a hot plate, and is used for transferring heat generated by the heating member 1; the heat dissipation piece is TEC and fan 5, and the TEC includes a thermocouple pair that N type semiconductor material and a P type semiconductor material link together, when wherein there is the electric current to pass through, will produce the heat transfer between the both ends, and the heat will be transferred to the other end from one end to produce the difference in temperature and form cold and hot end, realizes the heat dissipation to the target piece from this, and the TEC has stronger initiative heat-absorbing capacity, and the size is 15mm x 3.8 mm's TEC's maximum refrigeration power can reach 8.98Watts, can conduct the heat away fast. The TEC is arranged between the heating part 1 and the fan 5 and is in contact connection with the heating part 1 through the heat conducting part 3, heat on the heat conducting part 3 is actively absorbed, and the heat dissipation effect on the heating part 1 is realized by combining the blowing heat dissipation of the fan 5. Specifically, the fan 5 is located on one side of the TEC, and the fan 5 blows a heat radiation flow for dissipating heat, and a space through which the heat radiation flow flows is a blowing space, that is, an orientation direction of the fan 5 after operation and an air flow formed in the orientation direction are the blowing space. The blowing space covers the TEC and/or the heat generating member 1 and/or the heat conductive member 3 to dissipate heat generated from the heat generating member 1. The position of the blowing space can be changed by adjusting the specific setting position of the fan 5, specifically, the blowing space can only cover one of the TEC, the heating part 1 and the heat conducting part 3, and can also cover the combination of two of the TEC, the heat conducting part and the combination of three of the TEC, and technical personnel in the field can set the position of the fan 5 according to the actual spatial arrangement of the intelligent terminal so as to achieve the actual optimal heat dissipation effect.

Further, heat-conducting member 3 still is equipped with heat conduction silicone grease 2 with generating heat between 1, can fill the surface space that generates heat between 1 and the heat-conducting member 3, strengthens the heat conduction effect. It should be noted that the filler of the present invention is not limited to the heat conductive silicone grease 2, and other heat conductive materials capable of filling the surface gap can be used, and the present invention is not limited herein.

Further, the utility model provides an embodiment, in this embodiment, generate heat 1, TEC, fan 5 sets up on same straight line, and the space of blowing covers simultaneously and generates heat 1 and TEC, and fan 5's radiating action will be applied to simultaneously and generate heat 1 and TEC. Through the configuration, the blowing space formed by the fan 5 covers the heating object and the heat radiating object in the heat radiating system at the same time, so that the overall heat radiation performance of the heat radiating system is further improved, and the heat dissipation effect of the heating element 1 is improved in a conduction and convection mode at the same time.

Referring to fig. 2, the utility model provides still another kind of embodiment, in this embodiment, because intelligent terminal's internals's structural arrangement rationality is considered for generate heat 1 and the different planes that TEC is located heat-conducting piece 3, the space of blowing can't cover simultaneously and generate heat 1 and TEC, and only covers TEC, so fan 5's the effect of blowing will only be applied to TEC.

The utility model provides another kind of embodiment, in this embodiment, because intelligent terminal's internals's structural configuration rationality is considered for generate heat 1 and TEC are located the different planes of heat conduction piece 3, and the space of blowing can't cover simultaneously and generate heat 1 and TEC, and only cover and generate heat 1, so fan 5's the effect of blowing will only be applied to and generate heat 1.

In the two embodiments, no matter only the TEC is covered or only the heating element 1 is covered, the actual configuration should be determined according to the internal space structure of the device including the heat dissipation system, and the heat dissipation effect on the heating element 1 should be improved as much as possible without affecting the existing installation positions of other components in the device.

Further, the heat-conducting member 3 is curved, and the blowing space of the fan 5 may cover the heat-conducting member 3. Specifically, the heat-conducting member 3 includes a first section close to the fan 5 and a second section remote from the fan 5. The utility model provides an embodiment, fan 5's position makes the space of blowing only cover first segmentation. In another embodiment the fan 5 is positioned such that the blowing space covers only the second section. In another embodiment, the fan 5 is positioned such that the blowing space can cover both the first and second sections. It can be understood that the surface area of the heat conducting member 3 is increased by the arrangement of the curved heat conducting member 3, the heat dissipation effect of the heat conducting member 3 can be improved, and meanwhile, the installation requirements of different devices can be met under the working condition that the internal space of the device is smaller. On the other hand, the blowing space formed by the fan 5 is generally linear or quasi-linear, and cannot completely cover the whole of the heat conducting member 3, so that when the lengths of the first segment and the second segment are different, the longer part of the first segment and the second segment can be covered by the blowing space preferentially, and the heat dissipation effect is kept as much as possible.

Further, referring to fig. 3-4, the utility model provides a be applied to intelligent terminal's cooling system is still including the control unit, is equipped with monitor module and processing module in the control unit. The processing module can respectively and independently control the TEC and the fan 5, so that the TEC and the fan 5 can realize an operation mode of independent operation or synchronous operation; the monitoring module monitors the state of the intelligent terminal in real time, obtains the high-heating working condition and the special working condition of the intelligent terminal, and accurately controls the operation modes of the TEC and the fan 5 according to the two working conditions and the normal working condition, so that the heat dissipation performance of the whole machine can be improved, and the high heat dissipation energy consumption of the whole machine can be avoided.

Specifically, for the high heating working condition, if the real-time temperature of the heating element 1 is obviously higher than the acceptable temperature when the user holds the heating element, the monitoring module monitors the real-time temperature of the heating element 1 and forms a temperature signal, and the processing module is electrically connected with the monitoring module to receive the real-time temperature signal of the heating element 1. The processing module is also electrically connected with the fan 5 and the TEC for controlling the operation of the fan 5 and the TEC. A first temperature threshold value is arranged in the processing module, when the temperature signal is larger than the first temperature threshold value, the processing module controls the fan 5 and the TEC to work simultaneously, so that the intelligent terminal can automatically start a high heat dissipation mode of the fan 5-TEC under a high heat-emitting working condition, the heat dissipation effect is improved, and good use experience is brought to a user.

Further, in order to avoid unnecessary heat dissipation and energy consumption, the control unit can automatically adjust the TEC and the operating gear of the fan 5 according to the real-time temperature of the intelligent terminal. Specifically, a second temperature threshold and a third temperature threshold are further arranged in the processing module, and the third temperature threshold is larger than the second temperature threshold and larger than the first temperature threshold. When the real-time temperature signal received by the processing module is greater than the first temperature threshold and less than the second temperature threshold, the fan 5 and the TEC operate at a low gear; when the real-time temperature signal received by the processing module is greater than or equal to the second temperature threshold and less than the third temperature threshold, the processing module forms a first current regulation instruction, increases the input current of the fan 5 and the TEC, and accordingly increases the operating gears of the fan 5 and the TEC, and at this time, the fan 5 and the TEC operate at a middle gear; when the temperature signal is greater than or equal to the third temperature threshold, the processing module will form a second current adjustment command to further increase the input current of the fan 5 and the TEC, and at this time, the fan 5 and the TEC operate at a high-stage. It is worth explaining that, the utility model discloses a temperature threshold is not limited to the three temperature threshold of this embodiment, and the skilled person in the art also can increase or reduce the number of temperature threshold according to actual conditions to the actual intelligent terminal of more adaptive matching.

For special working conditions, a first time period and a second time period are preset in the processing module, wherein the first time period is the condition that the intelligent terminal has no charging condition, such as non-working time, weekends and other outdoor conditions; the second time period is the situation that the intelligent terminal has charging conditions, such as working hours and the like. When the current time is within the first time period, the intelligent terminal has no charging condition, the high energy consumption will affect the cruising ability of the equipment, at the moment, even if the real-time temperature signal received by the processing module is greater than or equal to the first temperature threshold, only the fan 5 is still controlled to work, and the high energy consumption of heat dissipation is avoided. When the current time is within the second time period, the intelligent terminal has a charging condition, the cruising ability of the equipment cannot be influenced even if the energy consumption is high, at the moment, the processing module controls the fan 5 and the TEC to work simultaneously even if the temperature signal is smaller than the first temperature threshold value, and the heat dissipation efficiency of the equipment is accelerated.

For another special working condition, a list of appointed application programs is preset in the processing module, and the appointed application programs are application programs which can accelerate the running of the CPU after being started, so that the intelligent terminal can generate heat seriously. When the processing module detects that the designated application program in the designated application program list is activated, the fan 5 and the TEC are automatically controlled to work simultaneously, and the optimal heat dissipation system is started in advance by predicting the subsequent high-temperature condition which possibly occurs in the intelligent terminal in advance, so that the conditions of overhigh temperature and hot hand feeling can be avoided when a user uses the intelligent terminal, and the user experience is improved.

The heat dissipation system is applied to the intelligent terminal and is installed in the shell of the intelligent terminal, and therefore the intelligent terminal with the heat dissipation function is obtained.

The smart terminal may be implemented in various forms. For example, the terminal described in the present invention may include an intelligent terminal such as a mobile phone, a smart phone, a notebook computer, a PDA (personal digital assistant), a PAD (tablet computer), a PMP (portable multimedia player), a navigation device, and the like, and a fixed terminal such as a digital TV, a desktop computer, and the like. In the following, it is assumed that the terminal is a smart terminal. However, it will be understood by those skilled in the art that the configuration according to the embodiment of the present invention can be applied to a fixed type terminal, in addition to elements particularly for moving purposes.

It should be noted that the embodiments of the present invention have better practicability and are not intended to limit the present invention in any way, and any person skilled in the art may change or modify the technical contents disclosed above to equivalent effective embodiments, but all the modifications or equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A heat dissipation system for an intelligent terminal comprises a heating part and a fan, and is characterized in that a semiconductor refrigerator is arranged between the heating part and the fan;

the semiconductor refrigerator is in contact connection with the heating element through a heat conducting element and receives heat of the heating element;

the fan is positioned on one side of the semiconductor refrigerator, the fan blows out heat dissipation flow for dissipating heat, the space where the heat dissipation flow circulates is a blowing space, and the blowing space covers the semiconductor refrigerator and/or the heating element and/or the heat conducting element so as to dissipate heat generated by the heating element.

2. The heat dissipation system for the intelligent terminal according to claim 1, wherein a heat conductive silicone grease is further disposed between the heat conductive member and the heat generating member.

3. The heat dissipation system for the intelligent terminal according to claim 2, wherein the heat generating member, the semiconductor refrigerator, and the fan are disposed on a same line, and the blowing space covers both the heat generating member and the semiconductor refrigerator.

4. The heat dissipation system for an intelligent terminal according to claim 2, wherein the heat generating member and the semiconductor refrigerator are located on different surfaces of the heat conducting member, and the blowing space covers only the semiconductor refrigerator.

5. The heat dissipating system for a smart terminal as claimed in claim 2, wherein the heat conducting member is curved, the heat conducting member includes a first section close to the fan and a second section far from the fan, and the blowing space covers the first section and/or the second section.

6. The heat dissipation system for the intelligent terminal according to claim 1, further comprising a control unit, wherein a monitoring module and a processing module are arranged in the control unit, and the monitoring module monitors the real-time temperature of the heating element and forms a temperature signal;

the processing module is electrically connected with the monitoring module and receives the temperature signal;

the processing module is further electrically connected with the fan and the semiconductor refrigerator, a first temperature threshold is arranged in the processing module, and when the temperature signal is larger than the first temperature threshold, the processing module controls the fan and the semiconductor refrigerator to work.

7. An intelligent terminal, characterized by comprising the heat dissipation system according to any one of claims 1 to 6, wherein the heat dissipation system is installed in a housing of the intelligent terminal.