CN212786376U - Cooling fin structure, electric appliance assembly structure and electric appliance device - Google Patents
Cooling fin structure, electric appliance assembly structure and electric appliance device Download PDFInfo
- Publication number
- CN212786376U CN212786376U CN202021512342.9U CN202021512342U CN212786376U CN 212786376 U CN212786376 U CN 212786376U CN 202021512342 U CN202021512342 U CN 202021512342U CN 212786376 U CN212786376 U CN 212786376U
- Authority
- CN
- China
- Prior art keywords
- screw
- hole
- spring
- fin
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a fin structure, electrical apparatus assembly structure and electrical apparatus, fin structure includes: the first radiating fin is provided with a first through hole, and the first through hole is provided with a first internal thread structure; the screw is provided with an external thread structure matched with the first internal thread structure; and the spring is sleeved on the screw and positioned on the upper surface of the first radiating fin. The utility model discloses a with fin, screw and spring equipment in advance, and can guarantee that in-process spring and screw such as transportation can not drop from the fin to can reduce the assembly part when the fin is assembled in the complete machine production, and then improve the production efficiency of complete machine.
Description
Technical Field
The utility model belongs to the technical field of the electronic product technique and specifically relates to a fin structure, electrical apparatus assembly structure and electrical apparatus.
Background
Generally, a heat sink needs to be tightly coupled with a heating device for heat dissipation, which involves a plurality of mounting and fixing methods of the heat sink, and the common mounting and fixing methods can be classified into fixing with a heat conducting adhesive, fixing with a screw, fixing with a pin by welding, and fixing with a plastic spring fastener. When the radiator is fastened by plastic, if the radiator is large in size and heavy in weight, the radiator is easy to deform and break if the strength of the plastic is not enough. In order to solve the problems, the metal screw and the spring are combined, so that the fixing strength is ensured, and the condition that the chip is damaged due to overlarge torque can be avoided. However, the installation and fixation method of the combination of the metal screw and the spring needs to assemble three components of the radiator, the spring and the screw, so that the production efficiency of the radiator is low during the assembly in a factory, and the production efficiency of the whole machine is low.
Accordingly, the prior art is yet to be improved and developed.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned prior art not enough, the utility model aims to provide a fin structure, electrical apparatus assembly structure and electrical apparatus to solve because of the radiator production efficiency is lower when the assembly of mill, thereby lead to the lower problem of production efficiency of complete machine.
The technical scheme of the utility model as follows:
a heat sink structure, comprising:
the first radiating fin is provided with a first through hole, and the first through hole is provided with a first internal thread structure;
the screw is provided with an external thread structure matched with the first internal thread structure; and
and the spring is sleeved on the screw and positioned on the upper surface of the first radiating fin.
The utility model discloses a further setting, the external diameter of spring is greater than the diameter of first through-hole.
According to the utility model, the screw comprises a nut and a screw rod, and the spring is sleeved on the screw rod and is positioned between the nut and the first radiating fin; wherein the diameter of the nut is larger than the outer diameter of the screw and larger than the outer diameter of the spring.
The utility model discloses a further setting, the screw rod includes polished rod and is located the external screw thread structure of polished rod below, the diameter of external screw thread structure more than or equal to the diameter of polished rod; wherein the diameter of the spring is greater than the diameter of the external thread structure.
The utility model discloses a further setting, the height of polished rod is greater than the height of first through-hole with the high sum of spring.
The utility model discloses a further setting, first inner thread structure with an organic whole of first fin sets up.
The utility model discloses a further setting, first inner thread structure sets up on a riveting post, the riveting post sets up in the first through-hole.
An electric appliance assembling structure comprises a second radiating fin, a circuit board and the radiating fin structure; wherein the content of the first and second substances,
the second radiating fins and the first radiating fins are arranged at intervals, mounting holes are formed in the positions, corresponding to the first through holes, of the second radiating fins, and second internal thread structures with the diameter equal to that of the first internal thread structures are arranged on the mounting holes;
the circuit board is positioned between the first radiating fin and the second radiating fin, and a second through hole is formed in the circuit board corresponding to the first through hole and the mounting hole;
the screw is sequentially arranged in the first through hole and the second through hole in a penetrating mode and is in threaded connection with the mounting hole.
The utility model discloses a further setting, first fin with between the circuit board and the second fin with all be provided with the heat-conducting layer between the circuit board.
An electrical device comprises the electrical device assembling structure.
The utility model provides a pair of radiating fin structure, electrical apparatus assembly structure and electrical apparatus, radiating fin structure includes: the first radiating fin is provided with a first through hole, and the first through hole is provided with a first internal thread structure; the screw is provided with an external thread structure matched with the first internal thread structure; and the spring is sleeved on the screw and positioned on the upper surface of the first radiating fin. The utility model discloses a with fin, screw and spring equipment in advance, and can guarantee that in-process spring and screw such as transportation can not drop from the fin to can reduce the assembly part when the fin is assembled in the complete machine production, and then improve the production efficiency of complete machine.
Drawings
In order to clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the middle heat sink structure of the present invention.
Fig. 2 is a schematic structural diagram of the middle electric appliance assembling structure of the present invention.
The various symbols in the drawings: 1. a first heat sink; 11. a first internal thread formation; 2. a screw; 21. a nut; 22. a screw; 221. a polish rod; 222. an external thread structure; 3. a spring; 4. a second heat sink; 5. a circuit board; 6. a heat conductive layer; 7. and (3) a chip.
Detailed Description
The utility model provides a fin structure, electrical apparatus assembly structure and electrical apparatus, this electrical apparatus assembly structure can be applicable to among liquid crystal TV, the commercial flat board isoelectronic apparatus of showing, the utility model discloses a tooth of attacking of radiator and screw matches the design, realizes the pre-assembly of radiator, screw, spring to improve the efficiency of complete machine equipment. In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention will be described in further detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the embodiments and claims, the terms "a" and "an" can mean "one or more" unless the article is specifically limited.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a preferred embodiment of a heat sink structure.
A heat sink structure includes a first heat sink 1, a screw 2, and a spring 3. Specifically, the first heat sink 1 is made of a heat conductive material, the first heat sink 1 may be in a square or polygonal shape, a first through hole (not shown) is formed in the first heat sink 1, the first through hole is provided with a first internal thread structure 11, wherein all or part of the first through hole is tapped by the first internal thread structure 11, the first through hole is used as a mounting hole of the screw 2, then an external thread structure 222 adapted to the first internal thread structure 11 is formed on the screw 2, and the spring 3 is sleeved on the screw 2 and located on the upper surface of the first heat sink 1. When first fin 1 equipment, can be earlier with 3 covers of spring are established on the screw 2, install screw 2 afterwards on the first fin 1, alright this moment in order to accomplish the installation of screw 2, spring 3 and first fin 1, obtain the fin structure after the installation, be used for the complete machine installation spare after the installation is accomplished, consequently the utility model discloses a can reduce the assembly part when complete machine factory equipment fin in advance at fin equipment factory to improve the production efficiency of complete machine.
In a further embodiment of an embodiment, the outer diameter of the spring 3 is larger than the outer diameter of the first through hole. Specifically, spring 3 is formed by the wire coiling, and this spring 3 has a plurality of circles, wherein, spring 3 has the external diameter, just the external diameter of spring 3 is greater than the external diameter of first through-hole, in order to guarantee screw 2 is in with 1 installation of first fin after, prevent that spring 3 falls into first fin 1.
In a further embodiment of an embodiment, the screw 2 comprises a nut 21 and a screw 22, and the spring 3 is sleeved on the screw 22 and located between the nut 21 and the first heat sink 1. The screw 2 is made of metal or plastic with sufficient strength, and the diameter of the nut 21 is larger than the outer diameter of the screw 22 and larger than the outer diameter of the spring 3, so as to prevent the spring 3 from falling off the screw 2. More specifically, the screw 22 includes a polish rod 221 and the external thread structure 222 located below the polish rod 221, and the diameter of the external thread structure 222 is greater than or equal to the diameter of the polish rod 221. Wherein the diameter of the spring 3 is larger than that of the external thread structure 222, so as to ensure that the spring 3 can pass through the external thread structure 222 to reach the position of the polish rod 221 and be positioned between the nut 21 and the external thread structure 222.
In a further implementation manner of an embodiment, the height of the polish rod 221 is greater than the sum of the height of the first through hole and the height of the spring 3, so as to ensure that the spring 3 has enough installation space to completely cover the polish rod 221. Here, the height of the spring 3 may be a natural height of the spring 3, may also be a height after the spring 3 is completely compressed, or may also be a certain value between the natural height and the height after the spring 3 is completely compressed.
In specific implementation, the spring 3 passes through the screw 2 and is located between the nut 21 and the external thread of the screw 2, then the spring 3 and the screw 2 are installed on the first heat sink 1 through the screw 2, after the installation, the spring 3 is located between the nut 21 of the screw 2 and the upper surface of the first heat sink 1, the external thread structure 222 of the screw 2 completely passes through the first through hole of the first heat sink 1 or partially passes through the first through hole of the first heat sink 1, after the external thread structure 222 of the screw 2 completely passes through the first through hole of the first heat sink 1, the screw 2 and the spring 3 can be ensured not to naturally fall off from the heat sink, except the non-forced external force, because the screw 2 can only rotate to enter and exit, similarly, after the external thread structure 222 of the screw 2 partially passes through the first through hole of the first heat sink 1, the screw 2 can only rotate to be detached from the first heat sink 1, the spring 3 and the screw 2 do not come off from the first heat sink 1. It can be understood that, after the assembly of the first heat sink 1 is finally completed, the external thread structure 222 of the screw 2 completely passes through the first through hole of the first heat sink 1 having the first internal thread structure 11, and the polish rod 221 of the screw 2 is located in the first through hole of the first heat sink 1.
In a further embodiment of an embodiment, the first internal thread structure 11 is provided integrally with the first heat sink 1, i.e. directly tapping on the first through hole to form the first internal thread structure 11.
In another embodiment, the first internal thread formation 11 is provided on a rivet stud provided in the first through bore. Specifically, a mounting hole for mounting the screw 2 is obtained by riveting a rivet stud having the first internal thread structure 11 into a first through hole of the first heat sink 1. The height of the rivet column can be smaller than the thickness of the first heat sink 1 or higher than the height of the first heat sink 1, and only the height of the polish rod 221 of the screw 2 needs to be greater than the sum of the height of the internal thread of the rivet column and the height of the spring 3, where the height of the spring 3 can be the natural height of the spring 3, the height of the spring 3 after being completely compressed, or a certain value between the natural height and the height after being completely compressed. The diameter of the first internal thread structure 11 on the rivet stud needs to be smaller than or equal to the diameter of the non-internal thread part in the rivet stud.
Referring to fig. 2, the present invention further provides an electrical apparatus assembly structure, which includes a second heat sink 4 and a circuit board 5, and further includes the heat sink structure. The radiating fin structure comprises a first radiating fin 1, a screw 2 and a spring 3, wherein a first through hole is formed in the first radiating fin 1, a first internal thread structure 11 is arranged in the first through hole, an external thread structure 222 matched with the first internal thread structure 11 is arranged on the screw 2, and the spring 3 is sleeved on the screw 2 and located on the upper surface of the first radiating fin 1.
Furthermore, the second heat sink 4 and the first heat sink 1 are arranged at intervals, a mounting hole (not shown) is arranged at a position of the second heat sink 4 corresponding to the first through hole, a second internal thread structure (not shown) having a diameter equal to that of the first internal thread structure 11 is arranged on the mounting hole, the circuit board 5 is arranged between the first heat sink 1 and the second heat sink 4, the circuit board 5 is provided with a second through hole corresponding to the first through hole and the mounting hole, the screw 2 sequentially penetrates through the first through hole and the second through hole and is in threaded connection with the mounting hole, and the circuit board 5 is provided with a chip 7, wherein the chip 7 is a heat source needing heat dissipation. Specifically, the screw 2 includes a nut 21 and a threaded rod 22, and the diameter of the second through hole is larger than the outer diameter of the threaded rod 22 of the screw 2, so that the screw 2 does not make contact with the circuit board 5 during the process of passing the screw 2 through the first heat sink 1 and the circuit board 5 and connecting with the second heat sink 4, that is, the screw 2 does not touch the circuit board 5 during the process of locking the screw 2 to the first heat sink 1 and the second heat sink 4.
Further, a heat conductive layer 6 is provided between the first heat sink 1 and the circuit board 5 and between the second heat sink 4 and the circuit board 5. Specifically, the heat conduction layer 6 is entirely or partially disposed between the first heat sink 1 and the circuit board 5 and between the second heat sink 4 and the circuit board 5, wherein the heat conduction layer 6 is made of a heat conduction interface material, which is also called a thermal interface material or an interface heat conduction material, and is a material for IC packaging and electronic heat dissipation, and is mainly used for filling up micro-gaps and holes with uneven surfaces generated when two materials are joined or contacted, reducing heat transfer contact resistance, and improving heat dissipation performance of devices, for example, the heat conduction layer 6 may be a heat conduction silica gel sheet or a layer structure composed of heat conduction mud. When the screw 2 is locked, the first radiating fin 1 and the second radiating fin 4 are in full stress contact with the heat conducting layer 6, so that a good radiating effect is ensured, and on the premise that the contact strength of the first radiating fin 1 and the second radiating fin 4 with the heat conducting layer 6 is ensured, the situation that the chip 7 is damaged due to overlarge torque caused by the fixation of the screw 2 can be prevented due to the fact that the spring 3 has a buffering effect due to the fact that the spring 3 is arranged between the first radiating fin 1 and the nut 21.
The utility model also provides an electrical apparatus, this electrical apparatus chip still include electrical apparatus assembly structure. The electric appliance assembling structure comprises a second radiating fin, a circuit board and the radiating fin structure. As described above, the details are not repeated herein.
To sum up, the utility model provides a pair of fin structure, electrical apparatus assembly structure and electrical apparatus, the fin structure includes: the first radiating fin is provided with a first through hole, and the first through hole is provided with a first internal thread structure; the screw is provided with an external thread structure matched with the first internal thread structure; and the spring is sleeved on the screw and positioned on the upper surface of the first radiating fin. The utility model discloses a with fin, screw and spring equipment in advance, and can guarantee that in-process spring and screw such as transportation can not drop from the fin to can reduce the assembly part when the fin is assembled in the complete machine production, and then improve the production efficiency of complete machine.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. A heat sink structure, comprising:
the first radiating fin is provided with a first through hole, and the first through hole is provided with a first internal thread structure;
the screw is provided with an external thread structure matched with the first internal thread structure; and
and the spring is sleeved on the screw and positioned on the upper surface of the first radiating fin.
2. A fin structure according to claim 1, wherein the outer diameter of the spring is larger than the diameter of the first through hole.
3. A heat sink structure as recited in claim 2 wherein said screw comprises a nut and a shank, said spring fitting over said shank and between said nut and said first heat sink; wherein the diameter of the nut is larger than the outer diameter of the screw and larger than the outer diameter of the spring.
4. The fin structure according to claim 3, wherein the screw includes a light rod and the male screw structure located below the light rod, the male screw structure having a diameter equal to or greater than a diameter of the light rod; wherein the diameter of the spring is greater than the diameter of the external thread structure.
5. The heat sink structure of claim 4, wherein the height of the light rod is greater than the sum of the height of the first through hole and the height of the spring.
6. A fin structure according to claim 1, wherein the first internal thread structure is provided integrally with the first fin.
7. A fin structure according to claim 1, wherein the first internal thread structure is provided on a rivet post provided in the first through hole.
8. An electrical appliance mounting structure comprising a second heat sink and a circuit board, further comprising the heat sink structure of any one of claims 1-7; wherein the content of the first and second substances,
the second radiating fins and the first radiating fins are arranged at intervals, mounting holes are formed in the positions, corresponding to the first through holes, of the second radiating fins, and second internal thread structures with the diameter equal to that of the first internal thread structures are arranged on the mounting holes;
the circuit board is positioned between the first radiating fin and the second radiating fin, and a second through hole is formed in the circuit board corresponding to the first through hole and the mounting hole;
the screw is sequentially arranged in the first through hole and the second through hole in a penetrating mode and is in threaded connection with the mounting hole.
9. The electrical apparatus mounting structure of claim 8, wherein a heat conductive layer is disposed between the first heat sink and the circuit board and between the second heat sink and the circuit board.
10. An electrical appliance apparatus, characterized in that it comprises an appliance mounting structure according to any one of claims 8-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021512342.9U CN212786376U (en) | 2020-07-27 | 2020-07-27 | Cooling fin structure, electric appliance assembly structure and electric appliance device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021512342.9U CN212786376U (en) | 2020-07-27 | 2020-07-27 | Cooling fin structure, electric appliance assembly structure and electric appliance device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212786376U true CN212786376U (en) | 2021-03-23 |
Family
ID=75039723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021512342.9U Active CN212786376U (en) | 2020-07-27 | 2020-07-27 | Cooling fin structure, electric appliance assembly structure and electric appliance device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212786376U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158183A (en) * | 2021-12-03 | 2022-03-08 | Oppo广东移动通信有限公司 | Chip heat radiation structure and electronic equipment |
-
2020
- 2020-07-27 CN CN202021512342.9U patent/CN212786376U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158183A (en) * | 2021-12-03 | 2022-03-08 | Oppo广东移动通信有限公司 | Chip heat radiation structure and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102403419B (en) | Manufacturing technology of high-power LED radiating structure | |
| US7321492B2 (en) | Heat sink module for an electronic device | |
| US8581290B2 (en) | Embedding type solder point-free combination structure of LED beads with substrate or lamp body | |
| TWI490429B (en) | A method of mounting a led module to a heat sink | |
| CN1446376A (en) | Vibration and shock resistant heat sink assembly | |
| JPH0637216A (en) | Method and apparatus for attachment of heat sink to semiconductor device | |
| CN104066291B (en) | Housing And Power Module Having The Same | |
| CN212786376U (en) | Cooling fin structure, electric appliance assembly structure and electric appliance device | |
| CN1489432A (en) | Radiating structure for electronic circuit device capalbe of efficiently radiating heat for heating element | |
| CN101555898A (en) | Fastener | |
| CN112509994A (en) | Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device | |
| WO2024002324A1 (en) | Heat sink, circuit board module and electronic device | |
| CN217363615U (en) | Radiator for intelligent terminal | |
| CN205726824U (en) | Heat abstractor and circuit board | |
| CN210925685U (en) | Tank body heat dissipation device | |
| CN208862607U (en) | A kind of charge-discharge modules component of electrical equipment | |
| CN106982540A (en) | A kind of heat abstractor | |
| CN208444827U (en) | A kind of mounting structure of Surface Mount Metal Oxide Semiconductor Field Effect Transistor | |
| CN2649826Y (en) | Radiating device | |
| CN206314056U (en) | A kind of circuit board of intelligent heat dissipation | |
| US20050254207A1 (en) | Cooling means for a driver semiconductor | |
| CN219919549U (en) | Electronic equipment | |
| CN213782008U (en) | Semiconductor device fixing device and heat dissipation assembly | |
| CN217160329U (en) | Novel aluminum corrugated heat dissipation strip | |
| CN211295146U (en) | Heat dissipation metal substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |