CN212753011U - Modular liquid cooling system - Google Patents
Modular liquid cooling system Download PDFInfo
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- CN212753011U CN212753011U CN202021524524.8U CN202021524524U CN212753011U CN 212753011 U CN212753011 U CN 212753011U CN 202021524524 U CN202021524524 U CN 202021524524U CN 212753011 U CN212753011 U CN 212753011U
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Abstract
The utility model discloses embodiment provides a modular liquid cooling system belongs to high-power electronic device technical field. The liquid cooling system includes: a liquid cooling module comprising: a main body; the cold plate is arranged on the upper surface of the main body and used for placing an electronic device to be cooled; the liquid cooling runner is arranged in the main body and is positioned at the bottom of the cold plate; the water outlet is arranged on the back of the main body; the water inlet is arranged on the back surface of the main body and is connected with the water outlet through the liquid cooling runner; and the main water channel is connected with the water outlet and the water inlet. The liquid cooling system can meet the heat dissipation requirements of electronic devices under different power levels while reducing the design volume.
Description
Technical Field
The utility model relates to a high-power electronic device technical field specifically relates to a modular liquid cooling system.
Background
In order to improve the power output capability of high-power electronic equipment, a plurality of semiconductor switching devices are generally required to be used in parallel. The traditional heat dissipation system is designed under the condition of facing a plurality of semiconductor switching devices to be used in parallel, the requirements of multiple dimensions such as the spacing among the switching devices, the heat dissipation capacity and the volume control cannot be met simultaneously, the traditional heat radiator easily causes the uneven heat dissipation effect of the switching devices connected in parallel, in order to prevent the overheating damage of the parallel devices, the switching devices need to be derated for use, and the power output capacity is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a modular liquid cooling system, this liquid cooling system can satisfy electronic device's under the different power levels heat dissipation requirement when reducing the design volume.
In order to achieve the above object, the embodiment of the present invention provides a modular liquid cooling system, the liquid cooling system includes:
a liquid cooling module comprising:
a main body;
the cold plate is arranged on the upper surface of the main body and used for placing an electronic device to be cooled;
the liquid cooling runner is arranged in the main body and is positioned at the bottom of the cold plate;
the water outlet is arranged on the back of the main body; and
the water inlet is arranged on the back surface of the main body and is connected with the water outlet through the liquid cooling runner;
and the main water channel is connected with the water outlet and the water inlet.
Optionally, a flow channel plug connected with the liquid cooling flow channel is arranged on the side surface of the main body.
Optionally, the liquid cooling module further comprises a mounting mechanism disposed at a bottom of the body.
Optionally, a flow channel plug connected with the liquid cooling flow channel is arranged on the side surface of the main body.
Optionally, the front surface of the main body is provided with a bracket fixing mechanism corresponding to the cold plate one to one.
Optionally, the back of the main body is provided with a plurality of first grooves, and the first grooves are arranged around the liquid cooling flow channel and used for supplying the liquid in the liquid cooling flow channel to perform primary heat dissipation.
Optionally, a second groove is disposed on the back of the main body, and the second groove is disposed on the back of the main body and opposite to the position of the bracket fixing mechanism.
Optionally, one of the water inlet and the water outlet of the liquid cooling module is connected to the other of the water inlet and the water outlet of the adjacent liquid cooling module, and the water inlets or the water outlets of the liquid cooling modules at the two ends are connected to the main water channel.
Optionally, the water inlet and the water outlet of each liquid cooling module are respectively connected with the main water channel.
Through the technical scheme, the utility model provides a pair of modular liquid cooling system adopts a plurality of parallelly connected liquid cooling modules to dispel the heat to the electron device under the different power grades, confirms the liquid cooling module of different quantity to the height of power grade. For electronic devices with high power levels, a large number of liquid cooling modules are used, and for electronic devices with low power levels, a small number of liquid cooling modules are used. The technical problem that the heat dissipation assembly needs to be redesigned aiming at electronic devices with different power levels in the prior art is solved, and the design cost is saved while the design volume is reduced.
Other features and advantages of embodiments of the present invention will be described in detail in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention, but do not constitute a limitation of the embodiments of the invention. In the drawings:
fig. 1 is a schematic diagram of a modular liquid cooling system according to an embodiment of the present invention;
fig. 2a is a back view of a main body according to an embodiment of the present invention;
fig. 2b is a back view of the main body according to an embodiment of the present invention;
fig. 2c is a back view of the main body according to an embodiment of the present invention;
figure 2d is a back view of the main body according to one embodiment of the present invention;
fig. 3 is a schematic view of the connection of the water inlet and outlet to the main water channel according to an embodiment of the present invention;
fig. 4 is a schematic view of a connection mode of the water inlet and the water outlet and the main water channel according to an embodiment of the present invention.
Detailed Description
The following describes in detail embodiments of the present invention with reference to the accompanying drawings. It is to be understood that the description herein is merely for purposes of illustration and explanation and is not intended to limit the embodiments of the present invention.
In the embodiments of the present invention, unless otherwise specified, the use of directional terms such as "upper, lower, top, and bottom" is generally used with respect to the orientation shown in the drawings or the positional relationship between the components in the vertical, or gravitational direction.
In addition, if there is a description in the embodiments of the present invention referring to "first", "second", etc., the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments can be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or can not be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a modular liquid cooling system, this liquid cooling system can include a plurality of parallelly connected liquid cooling modules and main water course 10. Fig. 1 is a schematic view of the liquid cooling module, and fig. 2a to 2d are rear views of the liquid cooling module. In fig. 1, the liquid cooling module may include a main body 01, a cold plate 02, a liquid cooling flow passage, a water outlet 03, and a water inlet 04.
In fig. 1, a cold plate 02 may be used to house the electronic devices to be cooled, which may be, for example, various types of switching devices, etc. The cold plate 02 may be welded to the body 02 by friction stir welding. A liquid cooling flow channel (not shown in fig. 1) may be disposed in the main body 01 and located at the bottom of the cold plate 02, so that heat of the electronic device to be cooled can be conducted to the cooling liquid in the liquid cooling flow channel through the cold plate 02, thereby achieving a technical effect of heat dissipation. As shown in fig. 2, both the water outlet 03 and the water inlet 04 may be disposed on the back surface of the main body 01 and connected through the liquid cooling flow passage. Because the cooling system commonly used in the prior art often sets up cold drawing 02, water inlet 04 and delivery port 03 all in the coplanar of main part 01, can lead to the area reduction of cold drawing 02 like this. In the case of performing a cooling operation on the same electronic device, a larger-sized body is required with the heat dissipation system commonly used in the related art. And the utility model provides a this liquid cooling module is owing to set up water inlet 04 and delivery port 03 in main part 01 for the another side (the back promptly) of cold plate 02, the area of cold plate 02 does not receive the restriction of water inlet 04 and delivery port 03, consequently the utility model provides a this liquid cooling module can further reduce the design volume for prior art.
In an embodiment of the present invention, as shown in fig. 1, a flow channel plug 06 connected to the liquid cooling flow channel may be disposed on a side surface of the main body 01.
In one embodiment of the present invention, in consideration of the installation of the liquid cooling system, as shown in fig. 1, the liquid cooling module may further include an installation mechanism 07 provided at the bottom of the main body 01. The specific form of the mounting mechanism 07 can be various structures known to those skilled in the art, such as a bolt and nut fit, a snap-fit, a weld, etc.
In one embodiment of the present invention, in order to facilitate the fixing of the electronic device to the cold plate 02, as shown in fig. 1, the front surface of the main body 01 may be provided with a bracket fixing mechanism 08 in one-to-one correspondence with the cold plate 02. The holder fixing mechanism 08 may be used to fixedly connect with a holder of an electronic device.
Since the cooling liquid enters the liquid-cold flow passage from the main water passage 10 through the water inlet 04, and passes through the bottom of the cold plate 02, the heat of the electronic device is absorbed, and then the cooling liquid is injected into the main water passage 10 again through the water outlet 03, thereby completing the whole energy exchange process. In the process, the energy exchange efficiency of the cooling liquid decreases with the increase of the temperature of the cooling liquid, and then the heat dissipation effect is gradually reduced due to the increase of the temperature of the cooling liquid when the cooling liquid flows through the bottom of the cold plate 02. Therefore, in one embodiment of the present invention, as shown in fig. 2a to 2d, the back surface of the main body 01 may be provided with a first groove 09. This first recess 09 can set up around the liquid cooling runner, and the area of contact of coolant liquid and outside can be improved to the structure of its recess to liquid (coolant liquid) in the liquid cooling runner carries out preliminary heat dissipation, finally improves the radiating efficiency of whole liquid cooling system.
In this embodiment, since the cold plate 02 and the holder fixing mechanism 08 are provided on the front surface of the cooling module, since only the vicinity of the cold plate 02 is required to dissipate heat, the liquid cooling flow passage does not need to be provided at the bottom of the holder fixing mechanism 08. Therefore, as shown in fig. 2, in an embodiment of the present invention, the back surface of the main body 01 may be provided with a second groove 11. The second recess 11 can reduce the actual volume of the liquid cooling module, thereby reducing the mass of the overall liquid cooling system.
In this embodiment, the connection modes of the main water channel 10, the water inlet 04 and the water outlet 03 may be different due to different structures of different electronic devices. For the case of relatively narrow bottom space of the device, the connection mode may be as shown in fig. 3. In fig. 3, one of the water inlet 04 and the water outlet 03 of the liquid cooling module is connected to the other of the water inlet 04 and the water outlet 03 of the adjacent liquid cooling module, and the water inlet 04 or the water outlet 03 of the liquid cooling module located at both ends is connected to the main water channel 10. In the case of a relatively large space at the bottom of the device, the connection may be as shown in fig. 4. In fig. 4, the water inlet 04 and the water outlet 03 of each liquid cooling module are connected to the main water channel 10.
Through the technical scheme, the utility model provides a pair of modular liquid cooling system adopts a plurality of parallelly connected liquid cooling modules to dispel the heat to the electron device under the different power grades, confirms the liquid cooling module of different quantity to the height of power grade. For electronic devices with high power levels, a large number of liquid cooling modules are used, and for electronic devices with low power levels, a small number of liquid cooling modules are used. The technical problem that the heat dissipation assembly needs to be redesigned aiming at electronic devices with different power levels in the prior art is solved, and the design cost is saved while the design volume is reduced.
The above describes in detail optional embodiments of the present invention with reference to the accompanying drawings, however, the embodiments of the present invention are not limited to the details of the above embodiments, and the technical concept of the embodiments of the present invention can be within the scope of the present invention, and can be modified in a variety of ways, and these simple modifications all belong to the protection scope of the embodiments of the present invention.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the embodiments of the present invention do not separately describe various possible combinations.
In addition, various different embodiments of the present invention can be combined arbitrarily, and the embodiments of the present invention should be considered as disclosed in the embodiments of the present invention as long as the embodiments do not depart from the spirit of the embodiments of the present invention.
Claims (9)
1. A modular liquid cooling system, comprising:
a liquid cooling module comprising:
a main body;
the cold plate is arranged on the upper surface of the main body and used for placing an electronic device to be cooled;
the liquid cooling runner is arranged in the main body and is positioned at the bottom of the cold plate;
the water outlet is arranged on the back of the main body; and
the water inlet is arranged on the back surface of the main body and is connected with the water outlet through the liquid cooling runner;
and the main water channel is connected with the water outlet and the water inlet.
2. The liquid cooling system of claim 1, wherein a channel stopper is disposed on a side of the body to connect to the liquid cooling channel.
3. The liquid cooling system of claim 1, wherein the liquid cooling module further comprises a mounting mechanism disposed at a bottom of the body.
4. The liquid cooling system of claim 1, wherein a channel stopper is disposed on a side of the body to connect to the liquid cooling channel.
5. The liquid cooling system of claim 1, wherein the front face of the body is provided with bracket fixing mechanisms in one-to-one correspondence with the cold plates.
6. The liquid cooling system of claim 1, wherein a plurality of first grooves are disposed on a back surface of the main body, the first grooves being disposed around the liquid cooling flow channel for primarily dissipating heat from the liquid in the liquid cooling flow channel.
7. The liquid cooling system of claim 5, wherein the back surface of the body is provided with a second recess, the second recess being disposed in the back surface of the body and in a position relative to the bracket fixing mechanism.
8. The liquid cooling system of claim 1, wherein one of the water inlet and the water outlet of the liquid cooling module is connected to the other of the water inlet and the water outlet of the adjacent liquid cooling module, and the water inlets or the water outlets of the liquid cooling modules at both ends are connected to the main water channel.
9. The liquid cooling system of claim 1, wherein the water inlet and the water outlet of each liquid cooling module are connected to the main water channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021524524.8U CN212753011U (en) | 2020-07-28 | 2020-07-28 | Modular liquid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021524524.8U CN212753011U (en) | 2020-07-28 | 2020-07-28 | Modular liquid cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212753011U true CN212753011U (en) | 2021-03-19 |
Family
ID=75023858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021524524.8U Active CN212753011U (en) | 2020-07-28 | 2020-07-28 | Modular liquid cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212753011U (en) |
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2020
- 2020-07-28 CN CN202021524524.8U patent/CN212753011U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 201114 Room 101, building 23, No. 588, Xinjun Ring Road, Minhang District, Shanghai Patentee after: Zhizhan Technology (Shanghai) Co.,Ltd. Address before: Room 207.208, East District, building 1, 68 xiupu Road, Pudong New Area, Shanghai, 201315 Patentee before: Zhizhan Technology (Shanghai) Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |