CN219610424U - Power module and assembly - Google Patents

Abstract

The utility model discloses a power module and an assembly, wherein the power module comprises a power module main body, and the power module main body comprises a radiator, a power semiconductor and a conductive bar; the radiator is a thermosiphon radiator and comprises a condenser and an evaporator, the condenser and the evaporator are connected through a pipeline, and the power semiconductor is connected with the conducting bar; the power semiconductor is mounted on the side of the evaporator; the condenser uses the evaporator as the benchmark to the slope of evaporator one side arrange, the evaporator set up in the lower part of condenser, the normal line of the windward side of condenser and the normal line of the device installation face of evaporator form contained angle theta, contained angle theta is: 10 degrees to 85 degrees; the power module has compact structure, high space utilization rate, great heat exchange area of the radiator, small wind resistance, capacity of solving the problem of blockage of the condenser, high power density of the equipment and low cost.

Description

Power module and assembly

Technical Field

The utility model relates to the technical field of heat dissipation of new energy power devices, in particular to a power module and a power module assembly.

Background

The high-power electronic equipment mainly comprises a power semiconductor, a radiator, a capacitor, an inductor, a plurality of distribution switch devices and the like. The radiator mainly takes charge of transferring heat generated by power conversion of the power semiconductor in the working process. For maintenance, electrical performance and other factors, it is currently common practice to integrate the IGBT, the heat sink, and the conductive connection row into a module, called a power module, through sheet metal structural members.

With the development of industry, the power of the power electronic equipment is larger, the heating value is correspondingly increased, but the volume of the equipment is required to be further reduced due to the limit of installation volume and cost, the power density is further increased, and the development of heat dissipation technology has gradually become a bottleneck for restricting the development of the industry.

Under the condition of further increasing the power density, the heat pipe cannot meet the heat dissipation requirement. In order to further improve the heat exchange efficiency of the radiator, the radiator is replaced by a two-phase flow radiator. Existing two-phase flow heat dissipation systems generally include: the evaporator, the condenser and the vapor pipe and the liquid pipe of the evaporator and the condenser are communicated, and a condensible working medium is filled in an inner space loop formed by the communication of the components.

The two-phase flow radiator in the prior art has insufficient condenser area, and the increase of the condenser area leads to the increase of the cabinet, so that the occupied structural space is large, and the problem of power density improvement is not facilitated

Chinese patent No. CN215500189U discloses a cabinet comprising one or more power modules 10, a fan 20, and an air guiding cavity 30. The power module 10 includes a power semiconductor, a thermosiphon radiator condenser, a thermosiphon radiator evaporator, and an electrical conductor bar. The air outlet of the condenser of the radiator is communicated with the air guide cavity 30, and the heat emitted in the working process of the power semiconductor is transferred out of the cabinet by driving the fan 20.

The cabinet has the following problems: the heat exchange area of the radiator facing the wind is small, the wind resistance is large, the condenser of the radiator is easy to be blocked, and the power module is overheated.

Disclosure of Invention

The utility model aims to solve the technical problems of providing a power module which has compact structure, high space utilization rate, large windward heat exchange area of a radiator and small wind resistance, and can be used for better solving the problem of blockage of a condenser, improving the power density of equipment and reducing the cost, and further improving the heat exchange capacity of the power module.

In order to solve the technical problems, the utility model provides a power module, which comprises a power module main body, a power module and a power module, wherein the power module main body comprises a radiator, a power semiconductor and a conductive bar; the radiator is a thermosiphon radiator and comprises a condenser and an evaporator, the condenser and the evaporator are connected through a pipeline, and the power semiconductor is connected with the conducting bar; the power semiconductor is mounted on the side of the evaporator; the condenser uses the evaporator as the benchmark to the slope of evaporator one side arrange, the evaporator set up in the lower part of condenser, the normal line of the windward side of condenser and the normal line of the device installation face of evaporator form contained angle theta, contained angle theta is: 10 degrees to 85 degrees.

Preferably, the condenser is enclosed into a cavity through a sheet metal part, and an air outlet of the cavity faces to the side face or the top of the power module main body.

Preferably, the evaporator is in a flat plate structure, and the power semiconductor is mounted on the left side or the right side of the flat plate structure or on the left side and the right side of the flat plate structure at the same time.

Preferably, the condenser is constituted by a microchannel parallel flow configuration.

Preferably, the condenser and the evaporator are made of aluminum or copper.

Preferably, the condenser and the evaporator are connected together through an aluminum pipe or a copper pipe.

Preferably, a capacitor is arranged at the back or the middle of the power module main body, and the capacitor is connected with the power semiconductor through the conductive bars.

In order to solve the technical problems, the utility model also discloses a power module assembly, which comprises an assembly main body, wherein the assembly main body is internally provided with N power modules as claimed in claim 1,

preferably, a wind collecting cavity for collecting and discharging hot air passing through the condenser is formed in the top of the assembly main body.

Preferably, a fan is arranged at the top or the back of the wind collecting cavity.

After the structure is adopted, the power module comprises a power module main body, wherein the power module main body comprises a radiator, a power semiconductor and a conductive bar; the radiator is a thermosiphon radiator and comprises a condenser and an evaporator, the condenser and the evaporator are connected through a pipeline, and the power semiconductor is connected with the conducting bar; the power semiconductor is mounted on the side of the evaporator; the condenser uses the evaporator as the benchmark to the slope of evaporator one side arrange, the evaporator set up in the lower part of condenser, the normal line of the windward side of condenser and the normal line of the device installation face of evaporator form contained angle theta, contained angle theta is: 10 degrees to 85 degrees; the power module has compact structure, high space utilization rate, great heat exchange area of the radiator, small wind resistance, capacity of solving the problem of blockage of the condenser, high power density of the equipment and low cost.

Drawings

FIG. 1 is a block diagram of a prior art power module cabinet;

fig. 2 is a first structure diagram of a power module according to a first embodiment of the present utility model;

FIG. 3 is a second block diagram of a power module according to the first embodiment of the present utility model;

fig. 4 is a third block diagram of a power module according to the first embodiment of the present utility model;

FIG. 5 is a diagram illustrating a power module according to a fifth embodiment of the present utility model;

fig. 6 is a diagram illustrating a second configuration of a power module according to a fifth embodiment of the present utility model.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear and obvious, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Example 1

Referring to fig. 2 and 3, fig. 2 is a first structural diagram of a power module according to a first embodiment of the present utility model, and fig. 3 is a second structural diagram of the power module according to the first embodiment of the present utility model;

the present embodiment discloses a power module 100, comprising a power module body including a heat sink, a power semiconductor 11, and a conductive bar 14; the radiator is a thermosiphon radiator and comprises a condenser 15 and an evaporator 12, the condenser 15 is connected with the evaporator 12 through a pipeline 17, and the power semiconductor 11 is connected with the conducting bar 14; the power semiconductor 11 is mounted on the side of the evaporator 12; the condenser 15 is obliquely arranged to one side of the evaporator 12 by taking the evaporator 12 as a reference, the evaporator 12 is arranged at the lower part of the condenser 15, and an included angle theta is formed between a normal line of the windward side 13 of the condenser and a normal line of the device mounting surface 19 of the evaporator, and the included angle theta is as follows: 10 degrees to 85 degrees.

As shown in fig. 2, the condenser 15 is disposed obliquely to the left of the evaporator 12 with reference to the evaporator 12.

As shown in fig. 4, the condenser 15 is disposed obliquely to the right of the evaporator 12 with reference to the evaporator 12.

Example two

In this embodiment, the condenser 15 is enclosed into a cavity 16 by a sheet metal part, and the air outlet of the cavity faces to the side or top of the power module main body.

Example III

The present embodiment is based on the first embodiment, in which the evaporator 12 is in a flat plate structure, and the power semiconductor 11 is mounted on the left or right side of the flat plate structure, or on both the left and right sides of the flat plate structure.

The condenser 15 is constituted by a microchannel parallel flow structure.

The condenser 15 and the evaporator 12 are made of aluminum or copper.

The condenser 15 and the evaporator 12 are connected together by an aluminum pipe or a copper pipe.

Example IV

The present embodiment is based on the first embodiment, in this embodiment, a capacitor is disposed at a back or middle portion of the power module main body, and the capacitor is connected to the power semiconductor through the conductive bar.

Example five

The embodiment discloses a power module assembly, which comprises an assembly main body 200, wherein N embodiments of the power module 100 are arranged in the assembly main body, and N is more than or equal to 1.

In this embodiment, the top of the module body 200 is provided with a wind collecting cavity 201 for collecting and discharging the hot wind passing through the condenser.

The top or back of the wind collecting cavity is designed with a fan 300.

The preferred embodiments of the present utility model have been described above with reference to the accompanying drawings, and thus do not limit the scope of the claims of the present utility model. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and spirit of the present utility model shall fall within the scope of the appended claims.

Claims (10)

1. A power module, comprising a power module body, wherein the power module body comprises a radiator, a power semiconductor and a conductive bar; the radiator is a thermosiphon radiator and comprises a condenser and an evaporator, the condenser and the evaporator are connected through a pipeline, and the power semiconductor is connected with the conducting bar; the power semiconductor is mounted on the side of the evaporator; the condenser uses the evaporator as the benchmark to the slope of evaporator one side arrange, the evaporator set up in the lower part of condenser, the normal line of the windward side of condenser and the normal line of the device installation face of evaporator form contained angle theta, contained angle theta is: 10 degrees to 85 degrees.

2. The power module of claim 1, wherein the condenser is enclosed by a sheet metal part into a cavity, and an air outlet of the cavity faces a side surface or a top of the power module body.

3. The power module of claim 1, wherein the evaporator is in a flat plate structure, and the power semiconductor is mounted on the left or right of the flat plate structure, or on both the left and right of the flat plate structure.

4. The power module of claim 1 wherein the condenser is comprised of a microchannel parallel flow configuration.

5. The power module of claim 1, wherein the condenser and the evaporator are made of aluminum or copper.

6. The power module of claim 1 wherein the condenser and evaporator are connected together by aluminum or copper tubing.

7. The power module of claim 6, wherein a back or middle portion of the power module body is provided with a capacitor, the capacitor being connected to the power semiconductor through the conductive bar.

8. A power module assembly, comprising an assembly body in which N power modules according to claim 1 are disposed, wherein N is greater than or equal to 1.

9. The power module assembly according to claim 8, wherein the top of the assembly body is provided with a wind collecting cavity for collecting and discharging hot wind passing through the condenser.

10. The power module assembly of claim 9, wherein a fan is designed on top of or behind the wind collection cavity.