CN212723212U - Test tool and test system of chip module - Google Patents
Test tool and test system of chip module Download PDFInfo
- Publication number
- CN212723212U CN212723212U CN202021210526.XU CN202021210526U CN212723212U CN 212723212 U CN212723212 U CN 212723212U CN 202021210526 U CN202021210526 U CN 202021210526U CN 212723212 U CN212723212 U CN 212723212U
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- Prior art keywords
- chip module
- circuit board
- test
- bluetooth
- hole
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- 238000012360 testing method Methods 0.000 title claims abstract description 105
- 239000000523 sample Substances 0.000 claims abstract description 40
- 238000003825 pressing Methods 0.000 claims description 29
- 210000004907 gland Anatomy 0.000 claims description 11
- 238000013142 basic testing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
The utility model discloses a test fixture and test system of chip module, wherein, the test fixture of chip module includes: the circuit board is used for being electrically connected with a test instrument, and a first through hole is formed in the circuit board; the testing component is arranged on the circuit board and is electrically connected with the circuit board, and an accommodating cavity for placing the chip module is formed in the testing component; the bluetooth probe subassembly, the bluetooth probe subassembly includes the mounting panel and fixes bluetooth probe on the mounting panel, the mounting panel be used for with the circuit board is fixed, bluetooth probe is used for passing first via hole and with the bluetooth module contact of chip module. The utility model discloses on the basis that satisfies the basic test of chip module, can realize that the chip module carries out the connection and the disconnection of signal to bluetooth module on the chip module under the inside condition of test assembly, satisfy the bluetooth module test of chip module.
Description
Technical Field
The utility model relates to a semiconductor test fixture technical field, concretely relates to test fixture and test system of chip module.
Background
As the integration of chip modules is becoming a trend, the functions of the modules are becoming more complex and multifunctional, for example, SIP (System in Package) modules are a packaging method in which all or most of the electronic functions of one System or subsystem are disposed in an integrated substrate, and chips are bonded to the integrated substrate in 2D or 3D manner. SIP can not only assemble multiple chips, but also serve as a dedicated processor, flash memory and passive components in combination with resistors and capacitors, connectors, antennas, etc., all mounted on the same substrate. Along with the function integration of the SIP module is increasing, and the miniaturization, integration, multi-functionalization and the like of the module are always pursued, so that the module testing becomes more difficult. Because the size of the chip module is limited, manual welding is unrealistic during batch testing and during operations such as burning programs and the like, the chip module can be damaged, and the manufacturing of a chip module testing tool is necessary. Meanwhile, for a chip module with a Bluetooth test switch, in the test process, the chip module is clamped inside a mechanical tool test assembly and cannot be pressed to be switched on or off, so that the module test is influenced; if carry out thimble control to the bluetooth module in the chip module alone, produce the damage to the device because of the alignment problem again easily.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a test fixture and test system of chip module, the test fixture who aims at improving present chip module is not convenient for carry out the test of break-make operation to bluetooth module.
In order to achieve the above object, the utility model provides a test fixture of chip module, include:
the circuit board is used for being electrically connected with a test instrument, and a first through hole is formed in the circuit board;
the testing component is arranged on the circuit board and is electrically connected with the circuit board, and an accommodating cavity for placing the chip module is formed in the testing component;
the bluetooth probe subassembly, the bluetooth probe subassembly includes the mounting panel and fixes bluetooth probe on the mounting panel, the mounting panel be used for with the circuit board is fixed, bluetooth probe is used for passing first via hole and with the bluetooth module contact of chip module.
Preferably, the testing component comprises a pressing part and a thimble part, the pressing part comprises a base fixed on the circuit board, and the base forms the accommodating cavity; the thimble portion is located the inside of base, thimble portion includes a plurality of thimbles, the one end of thimble is fixed in the circuit board, the other end of thimble be used for with the test point contact of chip module.
Preferably, the circuit board is provided with a pin header electrically connected with the test instrument, and the pin header is electrically connected with the plurality of ejector pins.
Preferably, the thimble portion still includes the fixing base, the fixing base is installed on the circuit board, and is a plurality of the thimble arranges in proper order at interval on the fixing base, the fixing base seted up with the second via hole that first via hole is linked together.
Preferably, the pressing part further comprises a pressing cover covered on the base, and the pressing cover is provided with a pressing plate used for being abutted to the upper end of the chip module.
Preferably, one end of the gland is rotatably connected with the base, and the other end of the gland is used for being clamped with the base.
Preferably, the circuit board is provided with a first positioning hole for fixing the mounting plate, and the first positioning hole is located beside the first via hole and located on the inner side of the test assembly.
Preferably, the number of the first positioning holes is two, and the two first positioning holes are respectively arranged at two sides of the first via hole.
Preferably, the circuit board is further provided with a second positioning hole for fixing the mounting plate, and the second positioning hole is located on the outer side of the test component.
Furthermore, the utility model also provides a test system, including the aforesaid the test fixture of chip module.
The technical scheme of the utility model, test assembly install on the circuit board and with circuit board electric connection, the circuit board is connected with the test instrument electricity, during the test, put into test assembly's the chamber that holds with the chip module, pass the first via hole of circuit board with the bluetooth probe, and fix the mounting panel on the circuit board, make the top of bluetooth probe and the bluetooth module contact of chip module, on the basis that satisfies chip module basic test, through seting up first via hole on the circuit board, and the bluetooth probe is fixed at the circuit board, can realize that the chip module carries out the connection and the disconnection of signal under the inside condition of test assembly, the bluetooth module test of satisfying the chip module to the bluetooth module on the chip module.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a test fixture for a chip module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another angle of the test fixture of the chip module according to an embodiment of the present invention;
fig. 3 is a bottom view of a test fixture of a chip module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a bluetooth probe assembly of a test fixture of a chip module according to an embodiment of the present invention;
the reference numbers illustrate:
| 1 | circuit board | 11 | A |
| 12 | Pin header | 13 | A |
| 14 | |
15 | |
| 2 | |
21 | |
| 211 | |
212 | Gland |
| 2121 | |
2122 | Clamping |
| 22 | |
221 | Fixed |
| 2212 | Second via |
222 | |
| 23 | Containing |
3 | Bluetooth |
| 31 | |
32 | Bluetooth |
| 321 | |
4 | Chip module |
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
As shown in fig. 1-4, the utility model provides a test fixture of chip module 4, include:
the circuit board 1 is used for being electrically connected with a test instrument, and a first through hole 11 is formed in the circuit board 1;
the testing component 2 is arranged on the circuit board 1 and is electrically connected with the circuit board 1, and the testing component 2 is provided with an accommodating cavity 23 for accommodating the chip module 4;
the bluetooth probe subassembly 3, the bluetooth probe subassembly 3 includes mounting panel 31 and fixes the bluetooth probe 32 on mounting panel 31, and mounting panel 31 is used for fixing with circuit board 1, and bluetooth probe 32 is used for passing first via hole 11 and contacts with the bluetooth module of chip module 4.
Put into the chamber 23 that holds of test component 2 with chip module 4, chip module 4's bluetooth module just corresponds circuit board 1's first via hole 11, pass first via hole 11 with bluetooth probe 32, mounting panel 31 is fixed on circuit board 1, bluetooth probe 32's tip just contacts with chip module 4's bluetooth module, bluetooth probe 32 of this embodiment can be spring probe, there is press point 321 at the tip, press point 321, just can realize that bluetooth probe 32 carries out the connection or the disconnection of signal to bluetooth module on chip module 4, spring probe is the well-known probe of technical personnel in the art, no longer describe repeatedly here to its specific structure. When fixing mounting panel 31 to circuit board 1 with bluetooth probe subassembly 3, bluetooth probe 32 highly just makes bluetooth chip module 4's bluetooth switch on, presses down pressing point 321 once, can break off with chip module 4's bluetooth module. This embodiment is on the basis of satisfying chip module 4 basic test, through set up first via hole 11 on circuit board 1 to and bluetooth probe 32 is fixed at circuit board 1, can realize chip module 4 and under the inside circumstances of test component 2, carry out the connection and the disconnection of signal to the bluetooth module on chip module 4, satisfy chip module 4's bluetooth module test, make things convenient for the burning record of serial ports procedure.
It should be noted that, the utility model discloses a test fixture not only limits to the test to the SIP module, and Chip module 4 still can be SOC (System on Chip ) module or other modules, and SIP adopts different chips to carry out side by side or superimposed packaging mode, and SOC is then highly integrated Chip product.
Specifically, the testing component 2 includes a pressing part 21 and an ejector pin part 22, the pressing part 21 includes a base 211 fixed on the circuit board 1, and the base 211 forms an accommodating cavity 23; the thimble portion 22 is located inside the base 211, the thimble portion 22 includes a plurality of thimbles 222, one end of each thimble 222 is fixed to the circuit board 1, and the other end of each thimble 222 is used for contacting with a test point of the chip module 4. The circuit board 1 has a pad reserved at the position of the thimble 222, and the thimble 222 is fixed to the circuit board 1 by welding. During testing, one surface of the chip module 4 with the test points is placed above the ejector pin part 22, the ejector pin 222 is in contact with the test points of the chip module 4, the base 211 is used for forming the accommodating cavity 23, and the test points of the chip module 4 are pressed on the ejector pin 222 through the pressing part 21, so that the testing stability is improved. The thimble portion 22 in the test component 2 realizes the basic test of the chip module 4, and the bluetooth probe 32 realizes the test of the bluetooth module, solves the alignment problem of the bluetooth probe 32, realizes the disconnection of the bluetooth module in the chip module 4, and is convenient for the burning of the serial port program.
More specifically, the circuit board 1 is provided with a pin header 12 for electrically connecting with a test instrument, and the pin header 12 is electrically connected with the plurality of ejector pins 222. The thimble 222 is electrically connected to the pin header 12 through an internal circuit of the circuit board 1, and the pin header 12 is electrically connected to an external test instrument, so as to supply power to the chip module 4 and perform signal detection on a test point of the chip module 4. The thimble type can be selected to row needle 12, also can select row needle female seat type, and the row needle 12 order of serial ports socket can carry out appropriate adjustment according to required actual serial ports line, carries out the signal according to the signal line order of burning the procedure serial ports and connects out, when carrying out the procedure burning to the module, can directly link to each other the serial ports with test fixture through row needle female seat, and the serial ports of burning the procedure can directly be connected with test fixture through row needle female seat, has reduced the use of extra dupont line.
In more detail, the thimble portion 22 further includes a fixing seat 221, the fixing seat 221 is installed on the circuit board 1, the plurality of thimbles 222 are sequentially arranged on the fixing seat 221 at intervals, and the fixing seat 221 is provided with a second through hole 2212 communicated with the first through hole 11. The second through hole 2212 is arranged corresponding to the first through hole 11, and when the bluetooth probe assembly 3 is installed, the bluetooth probe 32 respectively passes through the first through hole 11 and the second through hole 2212 and then contacts with the bluetooth module of the chip module 4. The size of the first and second vias 11 and 2212 may be different depending on the shape of the bluetooth probe, for example, in this embodiment, the size of the second via 2212 is smaller than the size of the first via 11, and just matches the shape of the bluetooth probe 32 in fig. 4. The fixing base 221 is opened with a plurality of through holes, and the ejector pins 222 are fixed in the through holes, so that the plurality of ejector pins 222 can be vertically fixed on the circuit board 1.
Further, the pressing portion 21 further includes a pressing cover 212 covering the base 211, and the pressing cover 212 is provided with a pressing plate 2121 for abutting against the upper end of the chip module 4. As shown in fig. 3, the circuit board 1 is provided with fixing holes 15, and the base 211 is fixed on the circuit board 1 by the cooperation of screws and the fixing holes 15. When the chip module 4 is placed into the containing cavity 23 of the testing component 2 during testing, the pressing cover 212 is buckled on the base 211, the pressing plate 2121 of the pressing cover 212 presses the top of the chip module 4 and slightly rotates the pressing cover 212, so that the pressing plate 2121 generates pressure on the chip module 4 but does not damage the chip module, the test point of the chip module 4 can be fully connected and conducted with the thimble 222 of the thimble portion 22 and the bluetooth probe 32, and the testing stability and accuracy are improved.
Preferably, one end of the pressing cover 212 is rotatably connected to the base 211, and the other end of the pressing cover 212 is used for being clamped with the base 211. Through the rotation of gland 212 and base 211 being connected for pressing part 21 can rotate to push down and let chip module 4 and thimble 222 more laminate, and the other end joint with gland 212 is on base 211 after rotatory arriving the position, and convenient operation just makes the pressfitting more firm. Wherein, specific joint structure does: the gland 212 includes a gland shell and a hook 2122, the hook 2122 is rotatably connected to the rotating shaft on the gland shell, a spring is disposed between the gland shell and the hook 2122, and the hook 2122 can be engaged with a slot on the base 211.
As shown in fig. 3, the circuit board 1 of the present embodiment is provided with a first positioning hole 13 for fixing the mounting plate 31, and the first positioning hole 13 is located beside the first via hole 11 and inside the testing component 2. The mounting plate 31 is provided with a first mounting hole (not shown) corresponding to the first positioning hole 13, and the first mounting hole and the first positioning hole 13 are respectively penetrated by a fastener (such as a screw), and then the mounting plate 31 is fixed with the circuit board 1 by a nut, so that the structure is simple and the assembly is convenient. Furthermore, the number of the first positioning holes 13 is two, and the two first positioning holes 13 are respectively arranged on two sides of the first via hole 11, so that the stability between the bluetooth probe assembly 3 and the circuit board 1 can be further enhanced.
More preferably, the circuit board 1 further defines a second positioning hole 14 for fixing the mounting plate 31, and the second positioning hole 14 is located outside the testing component 2. Because of the size reason of mounting panel 31, first locating hole 13 is inboard at test assembly 2, if mounting panel 31 is fixed to first locating hole 13, may exert an influence to test assembly 2, in order to avoid interfering, can fix mounting panel 31 to second locating hole 14 through shell fragment pressfitting mode, for example will set up the shell fragment pressure of second mounting hole on mounting panel 31, then pass second mounting hole and second locating hole 14 respectively with the fastener, realize the fixed of mounting panel 31, but can not influence test assembly 2 again. The number of the second positioning holes 14 may also be two, two second positioning holes 14 are respectively located at two sides of the first via hole 11, and the two second positioning holes 14 are both located at the outer side of the testing component 2, the spring plate is fixed to the circuit board 1 after passing through the two second positioning holes 14 respectively through two fasteners, and the mounting plate 31 is firmly clamped between the spring plate and the circuit board 1.
Furthermore, the utility model also provides a test system, including foretell chip module 4's test fixture, this test fixture is connected with the test instrument electricity. Since the test system adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
The above is only the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all of which are under the concept of the present invention, the equivalent transformation made by the specification or direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a test fixture of chip module which characterized in that includes:
the circuit board is used for being electrically connected with a test instrument, and a first through hole is formed in the circuit board;
the testing component is arranged on the circuit board and is electrically connected with the circuit board, and an accommodating cavity for placing the chip module is formed in the testing component;
the bluetooth probe subassembly, the bluetooth probe subassembly includes the mounting panel and fixes bluetooth probe on the mounting panel, the mounting panel be used for with the circuit board is fixed, bluetooth probe is used for passing first via hole and with the bluetooth module contact of chip module.
2. The test tool for the chip module according to claim 1, wherein the test assembly comprises a press-fit portion and a thimble portion, the press-fit portion comprises a base fixed on the circuit board, and the base forms the accommodating cavity; the thimble portion is located the inside of base, thimble portion includes a plurality of thimbles, the one end of thimble is fixed in the circuit board, the other end of thimble be used for with the test point contact of chip module.
3. The test tool of the chip module according to claim 2, wherein a pin header for electrically connecting with the test instrument is disposed on the circuit board, and the pin header is electrically connected with the plurality of ejector pins.
4. The test tool for the chip module according to claim 2, wherein the thimble portion further comprises a fixing seat, the fixing seat is mounted on the circuit board, the plurality of thimbles are sequentially arranged on the fixing seat at intervals, and the fixing seat is provided with a second through hole communicated with the first through hole.
5. The tool for testing the chip module according to claim 2, wherein the pressing portion further comprises a pressing cover covering the base, and the pressing cover is provided with a pressing plate for abutting against the upper end of the chip module.
6. The test tool of the chip module according to claim 5, wherein one end of the gland is rotatably connected with the base, and the other end of the gland is clamped with the base.
7. The tool for testing the chip module according to any one of claims 1 to 6, wherein the circuit board is provided with a first positioning hole for fixing the mounting board, and the first positioning hole is located beside the first via hole and inside the testing component.
8. The test tool for the chip module according to claim 7, wherein the number of the first positioning holes is two, and the two first positioning holes are respectively disposed at two sides of the first via hole.
9. The tool for testing the chip module according to claim 7, wherein the circuit board further defines a second positioning hole for fixing the mounting plate, and the second positioning hole is located outside the testing component.
10. A test system, characterized by comprising the test tool of the chip module set according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021210526.XU CN212723212U (en) | 2020-06-24 | 2020-06-24 | Test tool and test system of chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021210526.XU CN212723212U (en) | 2020-06-24 | 2020-06-24 | Test tool and test system of chip module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212723212U true CN212723212U (en) | 2021-03-16 |
Family
ID=74962679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021210526.XU Expired - Fee Related CN212723212U (en) | 2020-06-24 | 2020-06-24 | Test tool and test system of chip module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212723212U (en) |
-
2020
- 2020-06-24 CN CN202021210526.XU patent/CN212723212U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210316 |