CN212677395U - Ceramic wafer loading machine - Google Patents
Ceramic wafer loading machine Download PDFInfo
- Publication number
- CN212677395U CN212677395U CN202021834398.6U CN202021834398U CN212677395U CN 212677395 U CN212677395 U CN 212677395U CN 202021834398 U CN202021834398 U CN 202021834398U CN 212677395 U CN212677395 U CN 212677395U
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- mounting platform
- workbench
- spring
- control box
- ceramic wafer
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a potsherd chip bonding machine, comprises a workbench, be equipped with the mounting platform on the table surface of workstation, be equipped with the installation frame on the mounting platform, be equipped with the mounting support plate in the installation frame, mounting platform one end is equipped with the spring, the spring other end is fixed with table surface, mounting platform bottom is equipped with the rocking device, the rocking device includes upper portion bearing frame, connecting rod bent axle, lower part bearing frame, shaft coupling and control motor in proper order, upper portion bearing frame and mounting platform bottom fixed connection, workstation lower part one side is equipped with the electrical apparatus control box, the electrical apparatus control box with rock device circuit connection, workstation one side is equipped with start button and stop button. This practicality is through setting up in mounting platform bottom and rocking device, and mechanical operation can effectively reduce intensity of labour, reduces manpower resources.
Description
Technical Field
The utility model relates to a potsherd preparation auxiliary device, concretely relates to potsherd chip bonding machine.
Background
At present, PTC ceramics are widely used as a new heating source in various fields such as white home appliances, integrated ceilings, automobiles, kitchen appliances, etc., and have excellent characteristics such as slow decay, stable operation, no open flame, etc. In the production process of the upper electrode of the traditional PTC heating ceramic chip, double-sided aluminum spraying needs to be carried out on the PTC ceramic chip, and before the double-sided aluminum spraying operation, the PTC heating ceramic chip needs to be loaded in a chip loading carrier so as to be carried out with high quality and high efficiency. The existing method adopts manual loading, the PTC heating ceramic wafer is manually installed in the loading carrier in a shaking way, the efficiency is lower, the labor intensity is high, and the labor consumption is time-consuming.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a potsherd die bonder is provided, through set up rocking device in die bonder platform bottom, mechanical operation can effectively reduce intensity of labour, reduces manpower resources.
The utility model provides a technical scheme that technical problem adopted is: the utility model provides a potsherd chip bonding machine, includes the workstation, be equipped with the mounting platform on the table surface of workstation, be equipped with the installation frame on the mounting platform, be equipped with the mounting support plate in the installation frame, mounting platform one end is equipped with the spring, the spring other end is fixed with table surface, mounting platform bottom is equipped with the rocking device, the rocking device includes upper portion bearing frame, connecting rod bent axle, lower part bearing frame, shaft coupling and control motor in proper order, upper portion bearing frame and mounting platform bottom fixed connection, workstation lower part one side is equipped with the electrical apparatus control box, the electrical apparatus control box with rock device circuit connection, workstation one side is equipped with start button and stop button.
Preferably, a speed regulator, a forward and reverse rotation controller and a time relay are arranged in the electrical appliance control box.
Preferably, the height of the mounting frame is 40-80 mm.
As a further improvement, the periphery of the working table is provided with a folded edge, and the spring is fixed on the folded edge.
Adopt the utility model discloses afterwards, 1 balance average output of everyone is 6 ten thousand, compares 1 balance average output of manual dress piece everyone and is 4 ten thousand, and efficiency promotes 1.5 times, reduces intensity of labour, reducible manpower resources.
The beneficial effects of the utility model are that through set up the device that rocks in mounting platform bottom, mechanical operation can effectively reduce intensity of labour, reduces manpower resources. The edge folds are arranged on the periphery of the working table, so that the spring is conveniently fixed, and the ceramic wafer on the working table is not easy to slide to the ground from the working table.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic top view of the embodiment of fig. 1.
The present invention will be further explained with reference to the accompanying drawings.
Detailed Description
As shown in the accompanying drawing 1, a ceramic wafer loading machine comprises a workbench 1, a loading platform 3 is arranged on a workbench surface 2 of the workbench 1, an installation frame 4 is arranged on the loading platform 3, the height of the installation frame 4 is 60mm, a loading support plate 5 is arranged in the installation frame 4, a spring 6 is arranged at one end of the loading platform 3, a folding edge 15 is arranged around the workbench surface 2, and the spring 6 is fixed on the folding edge 15. 3 bottoms of mounting platform are equipped with the device of rocking, rock the device and include upper portion bearing frame 7, connecting rod bent axle 8, lower part bearing frame 9, shaft coupling 10 and control motor 11 in proper order, upper portion bearing frame 7 and 3 bottoms fixed connection of mounting platform, 1 lower part one side of workstation is equipped with electrical control box 12, electrical control box 12 with rock device circuit connection, be equipped with the speed regulator in the electrical control box 12, positive and negative rotation controller and time relay. A start button 13 and a stop button 14 are arranged on one side of the workbench 1.
During practical use, the single shaking device is set to shake for 30 seconds through the time relay, ceramic wafers of different specifications are loaded, and different times can be set. During operation, the workman puts into installation frame 4 with the potsherd in, presses start button 13, rocks the device and rocks and drive mounting platform 3 and rock, and spring 6 can effectively stabilize mounting platform 3 and rock the frequency, makes the orderly dress of potsherd in the installation frame 4 to mounting support plate 5 in, rocks the device after 30 seconds and stops, can take out mounting support plate 5.
Claims (4)
1. A ceramic wafer loading machine is characterized in that: comprises a workbench (1), a sheet loading platform (3) is arranged on a workbench surface (2) of the workbench (1), the mounting platform (3) is provided with a mounting frame (4), a mounting carrier plate (5) is arranged in the mounting frame (4), one end of the chip mounting platform (3) is provided with a spring (6), the other end of the spring (6) is fixed with the working table top (2), the bottom of the chip mounting platform (3) is provided with a shaking device which sequentially comprises an upper bearing seat (7), a connecting rod crankshaft (8), a lower bearing seat (9), a coupler (10) and a control motor (11), the upper bearing seat (7) is fixedly connected with the bottom of the chip mounting platform (3), an electric appliance control box (12) is arranged on one side of the lower part of the workbench (1), the electric appliance control box (12) is connected with a shaking device circuit, and a starting button (13) and a stopping button (14) are arranged on one side of the workbench (1).
2. The ceramic wafer die bonder of claim 1, wherein: the electric appliance control box (12) is internally provided with a speed regulator, a forward and reverse rotation controller and a time relay.
3. The ceramic wafer die bonder of claim 1, wherein: the height of the mounting frame (4) is 40-80 mm.
4. The ceramic wafer die bonder of claim 1, wherein: the periphery of the working table top (2) is provided with a folded edge (15), and the spring (6) is fixed on the folded edge (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021834398.6U CN212677395U (en) | 2020-08-28 | 2020-08-28 | Ceramic wafer loading machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021834398.6U CN212677395U (en) | 2020-08-28 | 2020-08-28 | Ceramic wafer loading machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212677395U true CN212677395U (en) | 2021-03-09 |
Family
ID=74820211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021834398.6U Active CN212677395U (en) | 2020-08-28 | 2020-08-28 | Ceramic wafer loading machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212677395U (en) |
-
2020
- 2020-08-28 CN CN202021834398.6U patent/CN212677395U/en active Active
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