CN212665202U - Double-station laser marking system - Google Patents
Double-station laser marking system Download PDFInfo
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- CN212665202U CN212665202U CN202020609776.4U CN202020609776U CN212665202U CN 212665202 U CN212665202 U CN 212665202U CN 202020609776 U CN202020609776 U CN 202020609776U CN 212665202 U CN212665202 U CN 212665202U
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Abstract
The utility model provides a duplex position laser marking system, it includes: the automatic feeding device comprises a rack, a processing assembly, a feeding assembly, a marking assembly and a driving assembly. The processing assembly comprises a first processing table and a second processing table which are arranged on the rack in parallel; the feeding assembly is arranged on the frame and is adjacent to the processing assembly; the marking assembly is arranged above the processing assembly and is used for marking a workpiece to be marked; the driving assembly comprises a fixing mechanism, a first driving mechanism and a second driving mechanism, the fixing mechanism is arranged on the rack and is adjacent to the machining assembly, the first driving mechanism and the second driving mechanism are respectively and movably arranged on the fixing mechanism, and the first driving mechanism and the second driving mechanism are used for alternately driving the first machining table and the second machining table to move to the position right below the marking assembly so as to enable the marking assembly to mark a workpiece to be marked. The utility model discloses a first processing platform and second processing platform transport in turn treat mark work piece to mark the subassembly below and mark, have guaranteed the continuity of mark operation.
Description
Technical Field
The utility model relates to a laser equipment technical field especially relates to a duplex position laser marking system.
Background
The circuit board needs to mark and record product information in the manufacturing process, for example, serial numbers, bar codes, LOGO and the like are marked, and the circuit board is widely formed by adopting ink-jet silk-screen printing at present, but the marking effect of the ink-jet silk-screen printing is unstable, the definition is not high, the color is easy to fade, the ink is easy to change or copy, a large amount of ink is consumed by the ink-jet silk-screen printing, and the environment is easy to pollute.
At present, in the prior art, a laser technology is adopted to replace an ink-jet silk-screen printing technology for marking. However, the existing laser technology usually adopts a single processing table, and part of the existing laser technology adopts manual operation to load and unload materials, so that manual operation is needed, the marking efficiency is low, the manpower is wasted, and the cost is high.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a duplex position laser marking system to solve among the prior art laser technology and adopt the operation mode of single processing platform and artifical manual operation unloading usually, cause the marking efficiency low and extravagant manpower, lead to the higher problem of cost.
In order to solve the above problem, the utility model provides a duplex position laser marking system, this duplex position laser marking system includes:
a frame;
the processing assembly comprises a first processing table and a second processing table which are arranged on the rack in parallel;
the feeding assembly is arranged on the rack and is close to the processing assembly, and the feeding assembly is used for clamping a workpiece to be marked and placing the workpiece to be marked on the first processing table or the second processing table;
the marking assembly is arranged above the processing assembly and is used for marking a workpiece to be marked;
the driving assembly comprises a fixing mechanism, a first driving mechanism and a second driving mechanism, the fixing mechanism is arranged on the rack and is close to the machining assembly, the first driving mechanism and the second driving mechanism are respectively and movably arranged on the fixing mechanism, and the first driving mechanism and the second driving mechanism are used for alternately driving the first machining table and the second machining table to move to the position under the marking assembly so as to enable the marking assembly to mark the workpiece to be marked.
As a further improvement, the double-station laser marking system further comprises a feeding table, the feeding table is arranged on the frame and is adjacent to the feeding assembly, and the feeding table is used for storing the workpiece to be marked to clamp the feeding assembly.
As a further improvement, the double-station laser marking system further comprises a coaxial positioning component, the coaxial positioning component is arranged on one side of the marking component and electrically connected with the driving component, and the coaxial positioning component is used for positioning the workpiece to be marked.
As the utility model discloses a further improvement, the mark subassembly includes first base, laser light source and the mirror that shakes, and first base is installed in the frame and is located the processing subassembly top, and laser light source with shake the mirror and be connected to install on first base, laser light source is used for sending laser to the mirror that shakes, the mirror that shakes deflects laser to waiting to mark the work piece.
As the utility model discloses a further improvement, the mark subassembly is still including shooting device and auxiliary light source, and it all installs on first base to shoot device and auxiliary light source.
As a further improvement, the feeding assembly comprises a second base and a feeding manipulator, the second base is arranged on the frame, the feeding manipulator is arranged on the second base, and the feeding manipulator is used for clamping the workpiece to be marked and placing the workpiece to the first processing platform or the second processing platform.
As a further improvement, the double-station laser marking system further comprises a blanking assembly, and the blanking assembly is arranged on the frame and is relative to the feeding assembly.
As a further improvement, the blanking assembly comprises a third base and a blanking manipulator, the third base is arranged on the frame and is opposite to the second base, the blanking manipulator is arranged on the third base, and the blanking manipulator is used for clamping the marked workpiece.
As a further improvement of the present invention, the blanking assembly includes a first material collecting platform, a second material collecting platform, a lifting mechanism and a translation mechanism, wherein the lifting mechanism and the translation mechanism are both mounted on the frame and located between the first processing platform and the second processing platform, the first material collecting platform is mounted on the lifting mechanism, and the second material collecting platform is mounted on the translation mechanism; the lifting mechanism is used for driving the first material collecting platform to receive the first type of marked workpieces, and the translation mechanism is used for driving the second material collecting platform to receive the second type of marked workpieces.
As a further improvement, the double-station laser marking system further comprises a feeding table, the feeding table is arranged on the frame and positioned below the feeding assembly, and the feeding table is used for storing the workpiece to be marked.
The utility model discloses a first processing platform and the transportation of second processing platform that are parallel to each other are in turn waited to mark the work piece and mark the subassembly below and mark for mark operation process does not have the idle period, has guaranteed the continuity of mark operation, and does not need manual operation among the mark process, has promoted marking efficiency.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the double-station laser marking system of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the double-station laser marking system of the present invention;
fig. 3 is a schematic structural diagram of an embodiment of the double-station laser marking system of the present invention;
fig. 4 is a schematic structural diagram of an embodiment of the double-station laser marking system of the present invention;
fig. 5 is a schematic structural diagram of an embodiment of the double-station laser marking system of the present invention;
fig. 6 is a schematic structural diagram of an embodiment of the double-station laser marking system of the present invention;
fig. 7 is a schematic structural diagram of an embodiment of the double-station laser marking system of the present invention;
fig. 8 is a schematic structural diagram of an embodiment of the double-station laser marking system of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Fig. 1 and fig. 2 show an embodiment of the double-station laser marking system of the present invention, referring to fig. 1, in this embodiment, the double-station laser marking system includes a frame 1, a processing assembly 2, a feeding assembly 3, a marking assembly 4, and a driving assembly 5.
Specifically, see fig. 2, wherein the processing assembly 2 comprises a first processing station 11 and a second processing station 12 arranged in parallel on the frame 1; the feeding assembly 3 is arranged on the frame 1 and is adjacent to the processing assembly 2, and the feeding assembly 3 is used for clamping a workpiece to be marked and placing the workpiece to be marked on the first processing table 11 or the second processing table 12; the marking component 4 is arranged above the processing component 2, and the marking component 4 is used for marking a workpiece to be marked; the driving assembly 5 includes a fixing mechanism 51, a first driving mechanism 52 and a second driving mechanism 53, the fixing mechanism 51 is installed on the frame 1 and is adjacent to the processing assembly 2, the first driving mechanism 52 and the second driving mechanism 53 are respectively movably disposed on the fixing mechanism 51, and the first driving mechanism 52 and the second driving mechanism 53 are used for alternately driving the first processing table 11 and the second processing table 12 to move to a position right below the marking assembly 4 so that the marking assembly 4 marks a workpiece to be marked.
Specifically, referring to fig. 3, the first processing table 11 includes a first fixed carrier 111, a first driving member 112, a first guiding member 113, a first lifting executing member 114 and a first base 115, the first base 115 is mounted on the frame 1, the first guiding member 113 is vertically mounted on the first base 115, the first driving member 112 is mounted on the first base 115, the first lifting executing member 114 is mounted on an output end of the first driving member 112, the first driving member 112 is configured to drive the first lifting executing member 114 to ascend or descend so as to drive the first fixed carrier 111 to ascend or descend along the direction of the first guiding member 113, so as to drive the workpiece to be marked to be conveyed to the marking position of the marking element for marking; the second processing table 12 includes a second fixed carrier 121, a second driving member 122, a second guiding member 123, a second lifting executing member 124 and a second base 125, the second base 125 is installed on the rack 1, the second guiding member 123 is vertically installed on the second base 125, the second driving member 122 is installed on the second base 125, the second lifting executing member 124 is installed on the output end of the second driving member 122, and the second driving member 122 is used for driving the second lifting executing member 124 to ascend or descend so as to drive the second fixed carrier 121 to ascend or descend along the direction of the second guiding member 123, so as to drive the workpiece to be marked to be conveyed to the marking position of the marking assembly for marking.
Specifically, referring to fig. 4, the feeding assembly 3 includes a second base 31 and a feeding manipulator 32, the second base 31 is mounted on the frame 1, the feeding manipulator 32 is mounted on the second base 31, and the feeding manipulator 32 is used for clamping the workpiece to be marked and placing the workpiece on the first processing table 11 or the second processing table 12.
Further, the feeding assembly 3 further includes a feeding table 33, the feeding table 33 is installed on the frame 1 and is adjacent to the feeding assembly 3, the feeding manipulator 32 is installed above the feeding table 33, the feeding table 33 is used for storing a plurality of workpieces to be marked, and the feeding manipulator 32 is used for clamping the workpieces to be marked on the feeding table 33 and placing the workpieces to be marked on the first processing table 11 or the second processing table 12.
Further, referring to fig. 5, the feeding table 33 includes a tray 331 to be processed, a sensor 332, a third driving member 333, and a third guiding member 334, the tray 331 to be processed is driven by the third driving member 333 to move up and down along the third guiding member 334 so as to cooperate with the feeding mechanism to take a material, and the tray to be processed is driven by the third driving member 333 to perform height compensation according to the workpiece height information collected by the sensor 332, so as to implement automatic feeding compensation.
Specifically, referring to fig. 6, the marking assembly 4 includes a first base 41, a laser light source 42 and a galvanometer 43, the first base 41 is installed on the frame 1 and located above the processing assembly 2, the laser light source 42 is connected to the galvanometer 43 and installed on the first base 41, the laser light source 42 is configured to emit laser light to the galvanometer 43, and the galvanometer 43 deflects the laser light to the workpiece to be marked.
Further, the marking assembly 4 further includes a focusing mirror 44, and the focusing mirror 44 is disposed on the light path of the laser light source and is configured to focus the laser light emitted by the laser light source.
Preferably, the driving assembly 5 may be configured as an X-2Y marble linear motion platform (not labeled), the X-2Y marble linear motion platform includes a motion base, an X-axis fixing end, a Y-axis motion end, and a 2Y-axis motion end, the first processing table 11 is installed on the Y-axis, the X-axis fixing end, the Y-axis motion end, and the 2Y-axis motion end are all installed on the top surface of the base, the Y-axis motion end is parallel to the 2Y-axis motion end, and the X-axis fixing end is respectively parallel to the Y-axis motion end and the 2Y-axis motion end. First processing platform 11 is installed on Y axle motion end, second processing platform 12 is installed on 2Y axle motion end, mark subassembly 4 is installed on X axle fixed end, Y axle motion end is used for driving first processing platform 11 and moves to mark subassembly 4 below to supply mark subassembly 4 on the X axle fixed end to treat the mark work piece and mark, 2Y axle motion end is used for driving second processing platform 12 and moves to mark subassembly 4 below, treat the mark work piece and mark for mark subassembly 4 on the X axle fixed end.
Further, the Y-axis moving end and the 2Y-axis moving end move alternately, and when the first processing table 11 on the Y-axis moving end is performing the marking operation, the 2Y-axis moving end stands by in situ and places the workpiece to be marked on the second processing table 12 through the feeding assembly 3; after the workpiece to be marked on the first processing table 11 is marked, the Y-axis moving end drives the first processing table 11 to move to the initial position for blanking operation, and at this time, the 2Y-axis moving end drives the second processing table 12 on which the workpiece to be marked is placed to move to the position below the marking assembly 4 for marking operation, so as to achieve the effect of alternate marking.
In the embodiment, the workpieces to be marked are alternately conveyed to the lower part of the marking assembly 4 for marking through the first processing table 11 and the second processing table 12 which are parallel to each other, so that the marking operation process has no idle period, the continuity of the marking operation is ensured, manual operation is not needed in the marking process, and the marking efficiency is improved.
In order to accurately position the workpiece to be marked, in the embodiment, referring to fig. 7, on the basis of the above embodiment, in the embodiment, the double-station laser marking system further includes a coaxial positioning assembly 6, the coaxial positioning assembly 6 is installed on one side of the marking assembly 4 and electrically connected with the driving assembly 5, and the coaxial positioning assembly 6 is used for positioning the workpiece to be marked.
Specifically, the coaxial positioning assembly 6 includes a shooting probe 61, a coaxial device 62 and an auxiliary light source 63, the shooting probe 61 and the coaxial device 62 are installed at the front end of the marking assembly 4 and are located on the same propagation line with the laser emitted by the marking assembly 4, and the auxiliary light source 63 is installed between the first processing station 11 and the second processing station 12.
Further, the photographing probe 61 is aligned with the workpiece to be marked, and a photograph of the marked workpiece is taken when the marking assembly 4 has marked the workpiece to be marked.
Specifically, the laser mark comprises a logo, numbers, characters, a bar code, a two-dimensional code and other patterns, and the shooting probe 61 is also used for detecting the shape, the size, the position and the definition of the mark component 4 after the mark is finished and if the mark content is the logo, the numbers, the characters and the other patterns; and if the marked content is a bar code and/or a two-dimensional code, reading the content and identifying the position of the marked content in real time.
Further, when at least one of the shape, size, position, and definition of the laser mark does not meet the preset requirements, the photographing probe 61 generates a fail signal.
It should be noted that the shooting probe 61 is used for, but not limited to, detecting and recognizing the above-mentioned marks, and any form of marks, patterns, etc. generated by the laser light can be detected and recognized by the shooting probe 61.
The present embodiment positions the workpiece to be marked on the first processing table 11 or the second processing table 12 by the coaxial positioning assembly 6 to prevent the marking position of the marking assembly 4 from being inaccurate to cause invalid marks.
In order to timely withdraw the marked workpiece, in the embodiment, referring to fig. 8, on the basis of the above embodiment, in this embodiment, the double-station laser marking system further includes a blanking assembly 7, and the blanking assembly 7 is installed on the frame 1 and is opposite to the loading assembly 3.
Specifically, the blanking assembly 7 includes a third base 71 and a blanking manipulator 72, the third base 71 is mounted on the frame 1 and is opposite to the second base 31, the blanking manipulator 72 is mounted on the third base 71, and the blanking manipulator 72 is used for clamping the marked workpiece.
Further, the blanking assembly 7 includes a first material collecting platform 73, a second material collecting platform 74, a lifting mechanism 75 and a translation mechanism 76, the lifting mechanism 75 and the translation mechanism 76 are both installed on the frame 1 and located between the first processing platform 11 and the second processing platform 12, the first material collecting platform 73 is installed on the lifting mechanism 75, and the second material collecting platform 74 is installed on the translation mechanism 76; the lifting mechanism 75 is used for driving the first material collecting platform 73 to receive the first type of marked workpieces, and the translation mechanism 76 is used for driving the second material collecting platform 74 to receive the second type of marked workpieces.
Preferably, if the first type of marked workpiece can be a good workpiece without quality problem, the first material collecting table 73 is a good-quality material collecting table, and if the second type of marked workpiece can be a defective workpiece with quality problem, the second material collecting table 74 is a defective material collecting table; similarly, if the first type of marked workpiece can be a defective workpiece with a problem quality, the first stocker 73 can be a defective stocker, and if the second type of marked workpiece can be a good workpiece without a problem quality, the second stocker 74 can be a good stocker.
Preferably, the lifting mechanism 75 or the translation mechanism 76 can drive the defective product collection table to receive the defective workpiece according to the defective signal generated by the workpiece after the shooting probe 61 identifies the unsatisfactory mark in the above embodiment.
This implementation will accomplish the non-defective products work piece clamp of mark through unloading manipulator 72 and get to non-defective products collecting table, get to substandard product collecting table with the substandard product work piece clamp of accomplishing the mark, do not need the manual work to classify, further promoted marking efficiency, reduced the human cost.
The above detailed description of the embodiments of the present invention is only exemplary, and the present invention is not limited to the above described embodiments. It will be apparent to those skilled in the art that any equivalent modifications or substitutions can be made to the present invention without departing from the spirit and scope of the invention, and therefore, all equivalent changes, modifications, improvements, etc. made without departing from the spirit and scope of the invention are intended to be covered by the scope of the invention.
Claims (10)
1. A dual-station laser marking system, comprising:
a frame;
the processing assembly comprises a first processing table and a second processing table which are arranged on the rack in parallel;
the feeding assembly is arranged on the rack and is close to the processing assembly, and the feeding assembly is used for clamping a workpiece to be marked and placing the workpiece to be marked on the first processing table or the second processing table;
the marking assembly is arranged above the processing assembly and is used for marking a workpiece to be marked;
the driving assembly comprises a fixing mechanism, a first driving mechanism and a second driving mechanism, the fixing mechanism is arranged on the rack and is close to the processing assembly, the first driving mechanism and the second driving mechanism are respectively and movably arranged on the fixing mechanism, and the first driving mechanism and the second driving mechanism are used for alternately driving the first processing table and the second processing table to move to the position right below the marking assembly so as to enable the marking assembly to mark the workpiece to be marked.
2. The double-station laser marking system according to claim 1, further comprising a feeding table, wherein the feeding table is mounted on the frame and disposed adjacent to the feeding assembly, and the feeding table is used for storing a workpiece to be marked for the feeding assembly to clamp.
3. The double-station laser marking system according to claim 1, further comprising a coaxial positioning assembly, wherein the coaxial positioning assembly is mounted on one side of the marking assembly and electrically connected to the driving assembly, and the coaxial positioning assembly is used for positioning a workpiece to be marked.
4. The double-station laser marking system according to claim 1, wherein the marking assembly comprises a first base, a laser source and a galvanometer, the first base is mounted on the frame and located above the machining assembly, the laser source is connected with the galvanometer and mounted on the first base, the laser source is used for emitting laser to the galvanometer, and the galvanometer deflects the laser to a workpiece to be marked.
5. The double-station laser marking system according to claim 4, wherein the marking assembly further comprises a photographing device and an auxiliary light source, and the photographing device and the auxiliary light source are both mounted on the first base.
6. The dual-station laser marking system according to claim 1, wherein the feeding assembly comprises a second base and a feeding manipulator, the second base is mounted on the frame, the feeding manipulator is mounted on the second base, and the feeding manipulator is used for clamping a workpiece to be marked and placing the workpiece on the first processing table or the second processing table.
7. The double-station laser marking system according to claim 6, further comprising a blanking assembly mounted on the frame opposite the loading assembly.
8. The double-station laser marking system according to claim 7, wherein the blanking assembly comprises a third base and a blanking manipulator, the third base is arranged on the frame and opposite to the second base, the blanking manipulator is arranged on the third base, and the blanking manipulator is used for clamping a marked workpiece.
9. The double-station laser marking system according to claim 7, wherein the blanking assembly comprises a first material collecting platform, a second material collecting platform, a lifting mechanism and a translation mechanism, the lifting mechanism and the translation mechanism are both mounted on the frame and located between the first processing platform and the second processing platform, the first material collecting platform is mounted on the lifting mechanism, and the second material collecting platform is mounted on the translation mechanism; the lifting mechanism is used for driving the first material collecting platform to receive a first type of marked workpieces, and the translation mechanism is used for driving the second material collecting platform to receive a second type of marked workpieces.
10. The double-station laser marking system according to claim 1, further comprising a loading table, wherein the loading table is mounted on the frame and located below the loading assembly, and the loading table is used for storing a workpiece to be marked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020609776.4U CN212665202U (en) | 2020-04-22 | 2020-04-22 | Double-station laser marking system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020609776.4U CN212665202U (en) | 2020-04-22 | 2020-04-22 | Double-station laser marking system |
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| Publication Number | Publication Date |
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| CN212665202U true CN212665202U (en) | 2021-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020609776.4U Active CN212665202U (en) | 2020-04-22 | 2020-04-22 | Double-station laser marking system |
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| CN (1) | CN212665202U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117226295A (en) * | 2023-10-18 | 2023-12-15 | 深圳铭创智能装备有限公司 | Double-station laser grooving device |
| CN117226295B (en) * | 2023-10-18 | 2024-05-31 | 深圳铭创智能装备有限公司 | Double-station laser grooving device |
-
2020
- 2020-04-22 CN CN202020609776.4U patent/CN212665202U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117226295A (en) * | 2023-10-18 | 2023-12-15 | 深圳铭创智能装备有限公司 | Double-station laser grooving device |
| CN117226295B (en) * | 2023-10-18 | 2024-05-31 | 深圳铭创智能装备有限公司 | Double-station laser grooving device |
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Effective date of registration: 20220607 Address after: 518000 floor 1, building C, Chuangzhi Park, No. 18, Shangnan Shangliao Industrial Road, Shangliao community, Xinqiao street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Guoao display and semiconductor technology (Shenzhen) Co.,Ltd. Address before: 808, national technology building, 109 Baoshen Road, songpingshan community, Xili street, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: GOAL TECHNOLOGY (SHENZHEN) Co.,Ltd. |
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