CN212659033U

CN212659033U - Heat radiator for computer mainboard

Info

Publication number: CN212659033U
Application number: CN202020798768.9U
Authority: CN
Inventors: 刘纯坚; 龚英涛; 柏军; 孙峰
Original assignee: Shanghai Sixunited Intelligent Technology Co ltd
Current assignee: Shanghai Sixunited Intelligent Technology Co ltd
Priority date: 2020-05-14
Filing date: 2020-05-14
Publication date: 2021-03-05
Anticipated expiration: 2030-05-14

Abstract

The utility model provides a heat dissipation device for a computer mainboard, which comprises a mounting plate, a circular ring, a transverse copper pipe, an inclined communicating pipe, a longitudinal communicating pipe, a heat dissipation fan, a first mounting pipe, a transverse drainage pipe, an auxiliary cooling frame structure which is convenient to disassemble, a water return pipe, a water liquid cooling circulating frame structure and a water injection pipe, wherein the circular ring is embedded in the middle position of the mounting plate; the transverse copper pipes are respectively installed at the rear side positions of the circular rings by screws; the inclined communicating pipes are respectively inserted at the connecting parts of the left side and the right side of the transverse copper pipe; the longitudinal communicating pipe is inserted at the connecting position of the middle position of the left side of the transverse copper pipe; the heat radiation fan screw is arranged in the middle of the front side of the transverse copper pipe; the first mounting tube is embedded at the four corners of the mounting plate. The utility model discloses cooling copper pipe support sets up on the right side of mounting panel, is favorable to utilizing the screw to run through the second installation pipe and installs in required radiating position when using to interior more heat dissipation position.

Description

Heat radiator for computer mainboard

Technical Field

The utility model belongs to the technical field of the computer heat abstractor, especially, relate to a heat abstractor for computer mainboard.

Background

The computer heat sink is one heat sink installed on one side of computer mainboard for lowering the stability of computer mainboard during operation and ensuring the normal operation of computer.

But the heat abstractor for the computer mainboard still has the heat dissipation position singleness, and inconvenient cooling and the inconvenient problem of dismantling supplementary heat dissipation frame to the water-cooling liquid still exist.

Therefore, it is very necessary to provide a heat dissipation device for a computer motherboard.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a heat abstractor for computer mainboard to there is the heat dissipation position singleness in solving current heat abstractor for the computer mainboard, and inconvenient cooling and the inconvenient problem of dismantling supplementary heat dissipation frame are cooled down to the water-cooling liquid. A heat dissipation device for a computer mainboard comprises a mounting plate, a circular ring, a transverse copper pipe, an inclined communicating pipe, a longitudinal communicating pipe, a heat dissipation fan, a first mounting pipe, a transverse liquid guide pipe, a conveniently-disassembled auxiliary cooling frame structure, a water return pipe, a water liquid cooling circulating frame structure and a water injection pipe, wherein the circular ring is embedded in the middle of the mounting plate; the transverse copper pipes are respectively installed at the rear side positions of the circular rings by screws; the inclined communicating pipes are respectively inserted at the connecting parts of the left side and the right side of the transverse copper pipe; the longitudinal communicating pipe is inserted at the connecting position of the middle position of the left side of the transverse copper pipe; the heat radiation fan screw is arranged in the middle of the front side of the transverse copper pipe; the first mounting pipe is embedded at four corners of the mounting plate; the transverse liquid guide pipe is inserted at the right upper side of the transverse copper pipe; the auxiliary cooling frame structure convenient to disassemble is arranged on the right side of the transverse liquid guide pipe; the water liquid cooling circulating frame structure is arranged at the lower parts of the water return pipe and the water injection pipe; the water injection pipe is inserted at the right lower side of the transverse copper pipe; the auxiliary cooling frame structure convenient to disassemble comprises a cooling copper pipe frame, a mounting lug plate, a second mounting pipe, an upper pipe joint and a lower pipe joint, wherein the mounting lug plate is welded on the left side and the right side of the upper end and the lower end; the upper pipe joint is inserted at the left upper side of the cooling copper pipe frame and is communicated with the right end of the transverse liquid guide pipe; the lower pipe joint is inserted at the left lower side of the cooling copper pipe frame; the water return pipe is inserted and connected to the left side of the lower pipe joint.

Preferably, the water liquid cooling circulation frame structure comprises a liquid storage tank, a water suction pump, a semiconductor refrigeration sheet, a water suction pipe, a backwater connecting pipe and a pipeline joint, wherein the water suction pump is mounted on the left lower side of the front part of the liquid storage tank through a screw, and meanwhile, a water inlet is communicated with the liquid storage tank; the water pumping pipe is in threaded connection with a water outlet of the water pumping pump; the backwater connecting pipe is inserted and connected at the right side of the upper part of the liquid storage tank.

Preferably, the cooling copper pipe support set up the right side at the mounting panel.

Preferably, the semiconductor refrigeration pieces are arranged in plurality and are respectively embedded into the front side and the rear side of the liquid storage box.

Preferably, the second mounting tube is embedded in the middle of the mounting ear plate.

Preferably, the pipeline joint is respectively in threaded connection with the left side of the upper portion of the water pumping pipe and the right side of the upper portion of the water return connecting pipe.

Preferably, the first mounting pipe and the second mounting pipe are respectively provided in plural.

Preferably, the water suction pump adopts a twelve-volt five-watt direct current brushless water pump, and the heat radiation fan adopts an SF axial flow fan.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in, cooling copper pipe support set up on the right side of mounting panel, be favorable to utilizing the screw to run through the second installation pipe when using and install in required radiating position to interior more heat dissipation position.

2. The utility model discloses in, the semiconductor refrigeration piece be provided with a plurality ofly, the semiconductor refrigeration piece imbed both sides around the liquid reserve tank respectively, be favorable to the convenient further cooling to the water-cooling liquid in the liquid reserve tank when using.

3. The utility model discloses in, second installation pipe embedding in the intermediate position of installation otic placode, be favorable to when using the person of facilitating the use to utilize the screw to run through second installation pipe and install in appointed heat dissipation position.

4. The utility model discloses in, pipe joint respectively with the upper portion left side of drinking-water pipe and the upper portion right side threaded connection of return water connecting pipe, be favorable to when using convenient according to demand and return water pipe and water injection union coupling.

5. The utility model discloses in, first installation pipe and second installation pipe be provided with a plurality ofly respectively, be favorable to overlapping two first installation pipes or second installation pipe when using and deposit to increase the interval between mounting panel and the mainboard and cool down the interval between copper pipe support and the mainboard.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a schematic structural view of the auxiliary cooling rack structure convenient for disassembly;

fig. 3 is a schematic structural view of the water cooling circulation frame structure of the present invention.

In the figure:

1. mounting a plate; 2. a circular ring; 3. a transverse copper tube; 4. an inclined communicating pipe; 5. a longitudinal communicating pipe; 6. a heat radiation fan; 7. a first mounting tube; 8. a transverse catheter; 9. the auxiliary cooling frame structure is convenient to disassemble; 91. cooling the copper pipe frame; 92. mounting an ear plate; 93. a second mounting tube; 94. an upper pipe joint; 95. a lower pipe joint; 10. a water return pipe; 11. a water liquid cooling circulation frame structure; 111. a liquid storage tank; 112. a water pump; 113. a semiconductor refrigeration sheet; 114. a water pumping pipe; 115. a backwater connecting pipe; 116. a pipe joint; 12. a water injection pipe.

Detailed Description

The invention is further described below with reference to the accompanying drawings:

example (b):

as shown in figures 1 and 2

The utility model provides a heat dissipation device for a computer mainboard, which comprises a mounting plate 1, a circular ring 2, a transverse copper pipe 3, an inclined communicating pipe 4, a longitudinal communicating pipe 5, a heat dissipation fan 6, a first mounting pipe 7, a transverse liquid guide pipe 8, an auxiliary cooling frame structure 9 which is convenient to disassemble, a water return pipe 10, a water liquid cooling circulating frame structure 11 and a water injection pipe 12, wherein the circular ring 2 is embedded in the middle position of the mounting plate 1; the transverse copper pipes 3 are respectively installed at the rear side positions of the circular rings 2 by screws; the inclined communicating pipes 4 are respectively inserted at the connecting parts of the left side and the right side of the transverse copper pipe 3; the longitudinal communicating pipe 5 is inserted at the connecting position of the middle position of the left side of the transverse copper pipe 3; the heat radiation fan 6 is arranged at the middle position of the front side of the transverse copper pipe 3 through a screw; the first mounting tube 7 is embedded at the four corners of the mounting plate 1; the transverse liquid guide pipe 8 is inserted at the right upper side of the transverse copper pipe 3; the auxiliary cooling frame structure 9 convenient to disassemble is arranged on the right side of the transverse liquid guide pipe 8; the water liquid cooling circulating frame structure 11 is arranged at the lower parts of the water return pipe 10 and the water injection pipe 12; the water injection pipe 12 is inserted at the right lower side of the transverse copper pipe 3; the first mounting pipes 7 and the second mounting pipes 93 are respectively provided with a plurality of pipes, and when the cooling device is used, the two first mounting pipes 7 or the two second mounting pipes 93 are overlapped and stored so as to increase the distance between the mounting plate 1 and the main plate and the distance between the cooling copper pipe frame 91 and the main plate; the auxiliary cooling frame structure 9 convenient to disassemble comprises a cooling copper pipe frame 91, an installation lug plate 92, a second installation pipe 93, an upper pipe joint 94 and a lower pipe joint 95, wherein the installation lug plate 92 is welded on the left side and the right side of the upper end and the lower end; the upper pipe joint 94 is inserted at the left upper side of the cooling copper pipe frame 91 and is communicated with the right end of the transverse liquid guide pipe 8; the lower pipe joint 95 is inserted at the left lower side of the cooling copper pipe frame 91; the water return pipe 10 is inserted and connected to the left side of the lower pipe joint 95; cooling copper pipe support 91 set up on the right side of mounting panel 1, utilize the screw to run through second installation pipe 93 and install in required radiating position when using to interior more radiating position, second installation pipe 93 imbed in the intermediate position of installation otic placode 92, convenient to use user utilizes the screw to run through second installation pipe 93 and installs in appointed radiating position when using.

As shown in fig. 3, in the above embodiment, specifically, the water cooling circulation frame structure 11 includes a liquid storage tank 111, a water pump 112, a semiconductor cooling plate 113, a water pumping pipe 114, a water return connection pipe 115 and a pipe joint 116, the water pump 112 is mounted on the left lower side of the front portion of the liquid storage tank 111 by screws, and the water inlet is communicated with the liquid storage tank 111; the water pumping pipe 114 is in threaded connection with a water outlet of the water pumping pump 112; the backwater connecting pipe 115 is inserted at the right side of the upper part of the liquid storage tank 111; semiconductor refrigeration piece 113 be provided with a plurality ofly, semiconductor refrigeration piece 113 imbed respectively in the front and back both sides of liquid reserve tank 111, the convenient further cooling of the water-cooling liquid in the liquid reserve tank 111 when using, pipe joint 116 respectively with the upper portion left side of drinking-water pipe 114 and the upper portion right side threaded connection of return water connecting pipe 115, convenient when using is connected with wet return 10 and water injection pipe 12 according to the demand.

Principle of operation

In the working process of the utility model, the first installation pipe 7 which is not fixed on the installation plate 1 is overlapped with the first installation pipe 7 according to the requirement, the first installation pipe 7 which is overlapped by the screw is connected with the mainboard by the screw, so as to fix the installation plate 1, the second installation pipe 93 which is not fixed on the installation ear plate 92 is overlapped with the second installation pipe 93 according to the requirement, the screw is connected with the other position of the mainboard by the screw which is penetrated through the second installation pipe 93, the water suction pump 112, the semiconductor refrigeration piece 113 and the cooling fan 6 are powered, so that the liquid refrigerated by the refrigeration semiconductor piece 113 is extracted by the water suction pump 112 and is led into the transverse copper pipe 3 and the inclined connecting pipe 4 by the water suction pipe 114 and the water injection pipe 12, then the water-cooling liquid is led into the transverse copper pipe 3 of the upper half part by the longitudinal connecting pipe 5, and finally enters the cooling copper pipe frame 91 by the transverse liquid guide pipe 8, the other part is cooled and finally introduced into the liquid storage tank 111 from the return water connection pipe 115 through the return pipe 10.

Utilize technical scheme, or technical personnel in the field are in the utility model discloses under technical scheme's the inspiration, design similar technical scheme, and reach above-mentioned technological effect, all fall into the utility model discloses a protection scope.

Claims

1. A heat dissipation device for a computer mainboard is characterized by comprising a mounting plate (1), a circular ring (2), a transverse copper pipe (3), an inclined communicating pipe (4), a longitudinal communicating pipe (5), a heat dissipation fan (6), a first mounting pipe (7), a transverse liquid guide pipe (8), an auxiliary cooling frame structure (9) which is convenient to disassemble, a water return pipe (10), a water liquid cooling circulating frame structure (11) and a water injection pipe (12), wherein the circular ring (2) is embedded in the middle of the mounting plate (1); the transverse copper pipes (3) are respectively installed at the rear side positions of the circular rings (2) by screws; the inclined communicating pipes (4) are respectively inserted at the connecting parts of the left side and the right side of the transverse copper pipe (3); the longitudinal communicating pipe (5) is inserted at the connecting position of the middle position of the left side of the transverse copper pipe (3); the heat radiation fan (6) is arranged in the middle of the front side of the transverse copper pipe (3) through a screw; the first mounting pipe (7) is embedded at the four corners of the mounting plate (1); the transverse liquid guide pipe (8) is inserted at the right upper side of the transverse copper pipe (3); the auxiliary cooling frame structure (9) convenient to disassemble is arranged on the right side of the transverse liquid guide pipe (8); the water liquid cooling circulating frame structure (11) is arranged at the lower parts of the water return pipe (10) and the water injection pipe (12); the water injection pipe (12) is inserted at the right lower side of the transverse copper pipe (3); the auxiliary cooling frame structure (9) convenient to disassemble comprises a cooling copper pipe frame (91), an installation lug plate (92), a second installation pipe (93), an upper side pipe joint (94) and a lower side pipe joint (95), wherein the installation lug plate (92) is welded on the left side and the right side of the upper end and the lower end; the upper pipe joint (94) is inserted at the left upper side of the cooling copper pipe frame (91) and is communicated with the right end of the transverse liquid guide pipe (8); the lower side pipe joint (95) is inserted at the left lower side of the cooling copper pipe frame (91); the water return pipe (10) is inserted and connected to the left side of the lower pipe joint (95).

2. The heat dissipating device for computer motherboard as claimed in claim 1, wherein the water cooling circulation frame structure (11) comprises a liquid storage tank (111), a water pump (112), a semiconductor cooling plate (113), a water pumping pipe (114), a water return connecting pipe (115) and a pipe joint (116), the water pump (112) is screwed on the left lower side of the front portion of the liquid storage tank (111), and the water inlet is connected to the liquid storage tank (111); the water pumping pipe (114) is in threaded connection with a water outlet of the water pumping pump (112); the backwater connecting pipe (115) is inserted at the right side of the upper part of the liquid storage tank (111).

3. The heat sink for computer motherboard according to claim 1, wherein said cooling copper pipe frame (91) is disposed on the right side of the mounting plate (1).

4. The heat dissipating device for a computer motherboard according to claim 2, wherein a plurality of semiconductor cooling fins (113) are provided, and the semiconductor cooling fins (113) are respectively embedded in the front and rear sides of the liquid storage tank (111).

5. The heat dissipating device for a computer motherboard as set forth in claim 1, wherein the second mounting tube (93) is embedded in a middle position of the mounting lug (92).

6. The heat dissipating device for a computer motherboard as set forth in claim 2, wherein the pipe joint (116) is respectively screwed to the left side of the upper portion of the water pumping pipe (114) and the right side of the upper portion of the water returning connection pipe (115).

7. The heat dissipating device for a computer motherboard as set forth in claim 1, wherein a plurality of the first mounting pipes (7) and a plurality of the second mounting pipes (93) are provided.