CN212648240U

CN212648240U - LED packaging structure

Info

Publication number: CN212648240U
Application number: CN202021640326.8U
Authority: CN
Inventors: 刘明剑; 朱更生; 周凯; 吴振雷; 赵建中; 罗仕昆; 沈进辉
Original assignee: Dongguan Opcso Optoelectronics Technology Co ltd
Current assignee: Dongguan Opcso Optoelectronics Technology Co ltd
Priority date: 2020-08-07
Filing date: 2020-08-07
Publication date: 2021-03-02
Anticipated expiration: 2030-08-07

Abstract

The utility model discloses a LED packaging structure, which comprises a lamp body, pins and a luminous chip group, wherein the pins comprise a welding pad part and a pin part formed by extending from the welding pad part; the lamp body is provided with a first end face and a second end face adjacent to the first end face, a chip mounting groove is formed in the first end face, the pad portion is embedded in the chip mounting groove, and the pin portions are distributed on the second end face; the light emitting chip group comprises at least four LED chips which are mutually parallel and arranged on the bonding pad part, and each LED chip is correspondingly connected with two pin parts, so that the LED chips can be connected with an external power supply through the pin parts which are respectively connected with the LED chips; the chip mounting groove comprises a first chip mounting groove and a second chip mounting groove, at least four LED chips are arranged on the first chip mounting groove in a part mode, and the other LED chips are arranged on the second chip mounting groove in another part mode.

Description

LED packaging structure

Technical Field

The utility model relates to a LED technical field especially relates to a LED packaging structure.

Background

Because of the advantages of energy saving, power saving, high efficiency, fast reaction time, long life cycle, no mercury, environmental protection and the like, the LED product is widely used in the lighting and display industries and becomes one of the most attention-focused products in recent years.

At present, the LED chips in the LED package structure are usually connected in series, which not only increases the failure rate of the entire LED package structure, but also requires a specific voltage to drive the LED chips inside the LED package structure to emit light normally, for example, the RGB package structure requires a voltage of 9V, and the RGBW package structure requires a voltage of 12V.

SUMMERY OF THE UTILITY MODEL

The utility model provides a LED packaging structure not only can avoid whole LED packaging structure's fault rate, and the voltage that also only needs to satisfy LED chip work moreover can drive whole LED packaging structure work, simple structure.

The utility model provides a LED packaging structure, include:

a lead including a pad part and a lead part extended from the pad part;

the lamp body is provided with a first end face and a second end face adjacent to the first end face, a chip mounting groove is formed in the first end face, the pad part is embedded in the chip mounting groove, and the pin parts are distributed on the second end face;

the light emitting chip set comprises at least four LED chips, the at least four LED chips are mutually parallel and are arranged on the bonding pad part, and each LED chip is correspondingly connected with two pin parts, so that the LED chips can be connected with an external power supply through the pin parts which are respectively connected with the LED chips;

the chip mounting groove comprises a first chip mounting groove and a second chip mounting groove, at least four LED chips are arranged on the first chip mounting groove in a part mode, and the other LED chips are arranged on the second chip mounting groove in another part mode.

The utility model discloses in the LED packaging structure of embodiment, the quantity of LED chip is four, the quantity of pin is eight.

The utility model discloses in the LED packaging structure of embodiment, eight wherein two settings of pin are in the first chip mounting groove, eight the other six settings of pin are in the second chip mounting groove.

The utility model discloses in the LED packaging structure of embodiment, the LED chip is including setting up white light chip in the first chip mounting groove is in with the setting blue light chip, green glow chip and ruddiness chip in the second chip mounting groove.

The utility model discloses in the LED packaging structure of embodiment, the pin includes the follow first pin, second pin, third pin, fourth pin, fifth pin, sixth pin, seventh pin and the eighth pin that the one end of lamp body one side set gradually to the other end.

The utility model discloses in the LED packaging structure of embodiment, the pad portion of first pin, second pin, third pin, fourth pin, fifth pin, sixth pin, seventh pin and eighth pin is located the coplanar.

The utility model discloses in the LED packaging structure of embodiment, first pin, second pin, third pin, fourth pin, fifth pin, sixth pin, seventh pin and eighth pin clearance each other are greater than 0.15mm at least.

The utility model discloses in the LED packaging structure of embodiment, first pin has at least partial pad portion to be located in the first chip mounting groove, the pad portion of second pin is followed one side of pin portion is crooked rather than the direction of relative one side, in order to form keep away the position district of the pad portion of first pin.

The utility model discloses in embodiment's LED packaging structure, the eighth pin has at least partial pad portion to be located in the second chip mounting groove, the eighth pin is located the pad portion of second chip mounting groove with first pin is located the setting of staggering of pad portion of first chip mounting groove.

The utility model discloses in embodiment's LED packaging structure, first chip mounting groove and second chip mounting groove intussuseption are filled with the encapsulation and are glued, the LED chip passes through the encapsulation glue seal in the inside of first chip mounting groove and second chip mounting groove.

The technical scheme provided by the embodiment of the application can have the following beneficial effects: the application designs an LED packaging structure, because the last LED chip that is provided with four at least mutual parallelly connected of LED packaging structure, so not only can avoid whole LED packaging structure's fault rate, also only need satisfy the voltage of LED chip work moreover and can drive whole LED packaging structure work. In addition, can also classify the back with the LED chip and install respectively in first chip mounting groove and second chip mounting groove, avoid the mutual interference of light between the LED chip, simple structure is but practical.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.

Fig. 1 is a schematic structural diagram of an LED package structure according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of the LED package structure of FIG. 1;

FIG. 3 is a schematic structural diagram of the LED package structure of FIG. 1;

FIG. 4 is a partial block diagram of the LED package structure of FIG. 1;

fig. 5 is a partial structural view of the LED package structure in fig. 1.

Description of reference numerals:

10. a lamp body; 11. a first chip mounting groove; 12. a second chip mounting groove; 20. a pin; 21. a first pin; 22. a second pin; 23. a third pin; 24. a fourth pin; 25. a fifth pin; 26. a sixth pin; 27. a seventh pin; 28. an eighth pin; 30. an LED chip; 31. a white light chip; 32. a blue light chip; 33. a green chip; 34. a red light chip;

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only, and it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships illustrated in the drawings and are for the purpose of describing the present application and simplifying the description without indicating or implying that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

As shown in fig. 1 to 5, the present application provides an LED package structure, which includes a lamp body 10, pins 20 and a light emitting chip set, where the pins 20 include a pad portion and a pin portion formed by extending from the pad portion, the lamp body 10 has a first end surface and a second end surface disposed adjacent to the first end surface, a chip mounting groove is formed on the first end surface, the pad portion of the pin 20 is embedded in the chip mounting groove, and the pin portions of the pin 20 are distributed on the second end surface.

The light emitting chip set comprises at least four LED chips 30, the at least four LED chips 30 are connected in parallel with each other and are arranged on the pad portion, and each LED chip 30 is correspondingly connected with two pin portions, so that the LED chips 30 can be connected with an external power supply through the pin portions connected with the LED chips 30 respectively, the failure rate of the whole LED packaging structure can be avoided, and the whole LED packaging structure can be driven to work only by the voltage meeting the work requirement of the LED chips 30.

In this embodiment, the chip mounting groove includes a first chip mounting groove 11 and a second chip mounting groove 12, a part of at least four LED chips 30 is disposed on the first chip mounting groove 11, and another part is disposed on the second chip mounting groove 12, so that not only the phenomenon of mixing light during operation of the LED chips 30 in the first chip mounting groove 11 and the LED chips 30 in the second chip mounting groove 12 can be avoided, but also the selection of corresponding materials can be performed according to the colors of the light emitted by the LED chips 30 in the first chip mounting groove 11 and the LED chips 30 in the second chip mounting groove 12, thereby achieving the effect of killing two birds with one stone.

In an alternative embodiment, the number of the LED chips 30 is four, the number of the pins 20 is eight, that is, each LED chip 30 can be electrically connected to two pins 20 separately, and the four LED chips 30 correspond to eight pins, so that the independence between the LED chips 30 is ensured, and the influence of other LED chips 30 is avoided.

Illustratively, two of the eight leads 20 are disposed in the first chip mounting groove 11, and the other six of the eight leads 20 are disposed in the second chip mounting groove 12, in order to ensure the compactness of the LED package structure, the leads 20 of the first chip mounting groove 11 or the second chip mounting groove 12 near the side wall may only expose part of the pad portion, wherein the first chip mounting groove 11 or the second chip mounting groove 12 just can accommodate the number of the corresponding LED chips 30, and in this application, only one LED chip 30 is accommodated in the first chip mounting groove 11, and the other three LED chips 30 are accommodated in the second chip mounting groove 12.

After the technical scheme is adopted, because not only are the mutual independence between every LED chip 30 in the chip mounting groove, simultaneously through pin 20 and external power source parallel connection between every LED chip 30, so not only can avoid whole LED packaging structure's fault rate, and only need satisfy the voltage that LED chip worked and can drive whole LED packaging structure work, need not specific voltage can drive the inside LED chip of LED packaging structure normally luminous, for example RGB packaging structure needs 9V's voltage, RGBW packaging structure then needs 12V's voltage etc..

Illustratively, the LED chip 30 includes a white chip 31, a blue chip 32, a green chip 33 and a red chip 34, the white chip 31 is disposed in the first chip mounting groove 11, and the blue chip 32, the green chip 33 and the red chip 34 are disposed in the second chip mounting groove 12, so as to avoid the light of the adjacent white chip 31 from mixing with the light of the blue chip 32, the green chip 33 or the red chip 34, and the blue chip 32, the green chip 33 and the red chip 34 do not need to be mixed to generate white light.

In an alternative embodiment, the pins 20 include a first pin 21, a second pin 22, a third pin 23, a fourth pin 24, a fifth pin 25, a sixth pin 26, a seventh pin 27, and an eighth pin 28, and the first pin 21, the second pin 22, the third pin 23, the fourth pin 24, the fifth pin 25, the sixth pin 26, the seventh pin 27, and the eighth pin 28 are sequentially disposed from one end of one side of the lamp body 10 to the other end thereof, and are used for connecting an external power source.

Illustratively, the pad portions of the first and second leads 21 and 22 are disposed in the first chip mounting groove 11, and the white chip 31 is connected to the pad portions of the first and second leads 21 and 22 by gold wires. Pad portions of the third pin 23, the fourth pin 24, the fifth pin 25, the sixth pin 26, the seventh pin 27, and the eighth pin 28 are disposed in the second chip mounting groove 12, the blue chip 32 is connected to the pad portions of the third pin 23 and the fourth pin 24 by gold wires, the red chip 34 is connected to the pad portions of the fifth pin 25 and the sixth pin 26 by gold wires, and the green chip 33 is connected to the pad portions of the seventh pin 27 and the eighth pin 28 by gold wires.

Illustratively, the bottom surface of the second chip mounting groove 12 is divided into three regions, and the blue chip 32, the red chip 34 and the green chip 33 are disposed on the corresponding regions, wherein the area of each region is preferably substantially the same, or the shape of each region is substantially the same, so that the distance between each two LED chips is substantially the same, and the uniformity of the mixed light of the blue chip 32, the red chip 34 and the green chip 33 can be ensured.

In an alternative embodiment, the pad portions of the first pin 21, the second pin 22, the third pin 23, the fourth pin 24, the fifth pin 25, the sixth pin 26, the seventh pin 27, and the eighth pin 28 are located on the same plane to ensure that the white chip 31, the blue chip 32, the red chip 34, and the green chip 33 can be located on the same plane after being packaged.

Illustratively, the first lead 21 includes a first pad portion 211 and a first lead portion 212, the second lead 22 includes a second pad portion 221 and a second lead portion 222, the third lead 23 includes a third pad portion 231 and a third lead portion 232, the fourth lead 24 includes a fourth pad portion 241 and a fourth lead portion 242, the fifth lead 25 includes a fifth pad portion 251 and a fifth lead portion 252, the sixth lead 26 includes a sixth pad portion 261 and a sixth lead portion 262, the seventh lead 27 includes a seventh pad portion 271 and a seventh lead portion 272, and the eighth lead 28 includes an eighth pad portion 281 and an eighth lead portion 282, wherein the white die 31 is disposed on the second pad portion 221, the blue die 32 is disposed on the fourth pad portion 241, the red die 34 is disposed on the fifth pad portion 251, and the green die 33 is disposed on the seventh pad portion 251.

In an alternative embodiment, the first pin 21, the second pin 22, the third pin 23, the fourth pin 24, the fifth pin 25, the sixth pin 26, the seventh pin 27 and the eighth pin 28 have a gap of at least more than 0.15mm from each other.

Specifically, the gap between the first pad part 211 and the second pad part 221, the gap between the second pad part 221 and the third pad part 231, the gap between the third pad part 231 and the fourth pad part 241, the gap between the fourth pad part 241 and the fifth pad part 251, the gap between the fifth pad part 251 and the sixth pad part 261, the gap between the sixth pad part 261 and the seventh pad part 271, and the gap between the seventh pad part 27 and the eighth pad part 281 are all greater than 0.15 mm.

In an optional embodiment, at least a part of the pad portions of the first leads 21 are located in the first chip mounting groove 11, and the pad portions of the second leads 22 are bent from one side of the lead portions to the opposite side thereof to form a avoiding region of the pad portions of the first leads 21, so as to ensure that the first chip mounting groove 11 can accommodate the first pad portions 211 and the second pad portions 221, so that the white chip 31 can be connected to the first pad portions 211 and the second pad portions 221 by gold wires, thereby reducing the packaging process of the first chip mounting groove 11.

In an alternative embodiment, at least a portion of the pad portion of the eighth lead 28 is located in the second chip mounting groove 12, wherein the pad portion of the eighth lead 28 located in the second chip mounting groove 12 is staggered from the pad portion of the first lead 21 located in the first chip mounting groove 11, so that the pad portions of the first lead 21, the second lead 22, the third lead 23, the fourth lead 24, the fifth lead 25, the sixth lead 26, the seventh lead 27 and the eighth lead 28 can be sequentially located in the compact first chip mounting groove 11 and the compact second chip mounting groove 12.

Illustratively, the first pad portion 211 protrudes toward the second pad portion 221 at a side away from the first lead portion 212, other portions of the first pad portion 211 may be encapsulated inside the lamp body 10 or slightly leak out of the lamp body 10 to ensure that the first lead 21 is stably fixed to the lamp body 10, the second pad portion 221 is bent at the protruding portion of the first pad portion 211 toward the side away from the first pad portion 211 to ensure a gap between the first pad portion 211 and the second pad portion 221, and so on, or a side of the second pad portion 221 facing away from the first pad portion 211 is regular-shaped, i.e., perpendicular to a sidewall of the lamp body 10 until the eighth pad portion 281 protrudes toward the seventh pad portion 271 at a side near the eighth lead portion 282, and the rest of the eighth pad portion 281 may be disposed inside the lamp body 10 or slightly leak out of the lamp body 10, so as to ensure that the LED chips 30 in the first chip mounting groove 11 and the second chip mounting groove 12 can be electrically connected to the lead 20 And the compactness of the first chip mounting groove 11 and the second chip mounting groove 12 can be ensured, and the size of the volume of the LED packaging structure is ensured.

In an optional embodiment, the first chip mounting groove 11 and the second chip mounting groove 12 are filled with an encapsulation adhesive, and the LED chip 20 is sealed inside the first chip mounting groove 11 and the second chip mounting groove 12 by the encapsulation adhesive, wherein the encapsulation adhesive may use epoxy resin as a filler, so as to improve the heat resistance of the bracket and reduce the light attenuation.

In the description of the present application, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the application. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An LED package structure, comprising:

a lead including a pad part and a lead part extended from the pad part;

2. The LED package structure of claim 1, wherein the number of the LED chips is four, and the number of the pins is eight.

3. The LED package structure of claim 2, wherein two of the eight pins are disposed in the first chip mounting slot and the other six of the eight pins are disposed in the second chip mounting slot.

4. The LED package structure of claim 2, wherein the LED chips comprise a white chip disposed in the first chip mounting groove and a blue chip, a green chip, and a red chip disposed in the second chip mounting groove.

5. The LED package structure of claim 4, wherein the leads comprise a first lead, a second lead, a third lead, a fourth lead, a fifth lead, a sixth lead, a seventh lead and an eighth lead sequentially arranged from one end of one side of the lamp body to the other end.

6. The LED package structure of claim 5, wherein the pad portions of the first, second, third, fourth, fifth, sixth, seventh, and eighth leads are located on a same plane.

7. The LED package structure of claim 5, wherein a gap between the first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin, the seventh pin, and the eighth pin is at least greater than 0.15 mm.

8. The LED package structure of claim 5, wherein at least a portion of the pad portion of the first lead is located in the first chip mounting groove, and the pad portion of the second lead is bent from one side of the lead portion to the opposite side thereof to form a position avoiding region of the pad portion of the first lead.

9. The LED package structure of claim 5, wherein at least a portion of the pad portion of the eighth lead is located in the second chip mounting groove, and the pad portion of the eighth lead located in the second chip mounting groove is offset from the pad portion of the first lead located in the first chip mounting groove.

10. The LED package structure of claim 1, wherein the first chip mounting groove and the second chip mounting groove are filled with packaging adhesive, and the LED chip is sealed inside the first chip mounting groove and the second chip mounting groove by the packaging adhesive.