CN212322999U

CN212322999U - LED package

Info

Publication number: CN212322999U
Application number: CN202020441346.6U
Authority: CN
Inventors: 刘明剑; 朱更生; 周凯; 吴振雷; 罗仕昆; 沈进辉
Original assignee: Dongguan Opcso Optoelectronics Technology Co ltd
Current assignee: Dongguan Opcso Optoelectronics Technology Co ltd
Priority date: 2020-03-30
Filing date: 2020-03-30
Publication date: 2021-01-08
Anticipated expiration: 2030-03-30

Abstract

The utility model discloses a LED packaging piece, which comprises a body and a packaging layer, wherein the body comprises a seat body with a plurality of concave cavities and an LED bracket arranged on the seat body, one of the concave cavities is internally provided with a monochromatic LED chip, the other concave cavity is internally provided with a drive IC and a colorful LED chip, and the monochromatic LED chip, the drive IC and the colorful LED chip are all arranged on the LED bracket; the packaging layer comprises a single-color packaging layer and a multi-color packaging layer, the single-color packaging layer is packaged in the cavity on the single-color LED chip, and the multi-color packaging layer is packaged in the cavities on the drive IC and the multi-color LED chip, so that the current change of the single-color LED chip and/or the multi-color LED chip in different cavities can be controlled through the drive IC, the number of pins outside the LED support can be reduced, and the small-size design of the LED packaging piece is facilitated.

Description

LED package

Technical Field

The utility model relates to a LED technical field especially relates to a LED packaging part.

Background

Because of the advantages of energy saving, power saving, high efficiency, fast reaction time, long life cycle, no mercury, environmental protection and the like, the LED product is widely used in the lighting and display industries and becomes one of the most attention-focused products in recent years.

The existing monochromatic lamp beads, RGB lamp beads or RGBW lamp beads are generally provided with corresponding negative pins and positive pins outside an LED support, for example, the RGB lamp beads refer to that three LED chips of blue LED, red LED and green LED are arranged in an LED package, the outside of the LED support is provided with positive pins and negative pins respectively corresponding to the three LED chips of blue LED, red LED and green LED, or a common anode pin and negative pins respectively corresponding to the three LED chips of blue LED, red LED and green LED, if the current change of the three LED chips of blue LED, red LED and green LED is to be controlled, a current control device needs to be externally arranged, the current control of the three LED chips of blue LED, red LED and green LED is realized, thus, the pin number of the LED package is increased, and the design requirement of miniaturization of the LED package is not facilitated.

SUMMERY OF THE UTILITY MODEL

The utility model provides a LED packaging part can effectively solve foretell problem.

The utility model provides a LED packaging part, include:

the LED lamp comprises a body and a lamp body, wherein the body comprises a base body with a plurality of concave cavities and an LED bracket arranged on the base body, a single-color LED chip is arranged in one of the concave cavities, a driving IC and a colorful LED chip are arranged in the other concave cavity, and the single-color LED chip, the driving IC and the colorful LED chip are all arranged on the LED bracket;

and the packaging layer comprises a single-color packaging layer and a multi-color packaging layer, the single-color packaging layer is packaged in the concave cavity on the single-color LED chip, and the multi-color packaging layer is packaged in the concave cavities on the drive IC and the multi-color LED chip.

The utility model discloses an among the LED packaging part, the LED support includes first support and second support, the quantity of cavity is two, has at least part the second support sets up two between the cavity, the one end of monochromatic LED chip is passed through the second support with driver IC electric connection, the other end of monochromatic LED chip with first support electric connection.

The utility model discloses an among the LED packaging part, the LED support includes third support, fourth support, fifth support and sixth support, drive IC's data input end with third support electric connection, drive IC's earthing terminal with fourth support electric connection, drive IC's power end with fifth support electric connection, drive IC's data output end with sixth support electric connection.

The utility model discloses an among the LED packaging part, colorful LED chip includes blue light LED, be equipped with at least one current control end on the drive IC, the current control end with blue light LED's one end electric connection, blue light LED's the other end with fifth support electric connection.

The utility model discloses an among the LED packaging part, the fourth support includes that ground connection pin and setting are in fourth pad in the cavity, blue light LED with driver IC all sets up on the fourth pad, the ground connection pin sets up the outside of pedestal.

The utility model discloses an among the LED packaging part, colorful LED chip includes ruddiness LED, the current control end with ruddiness LED's one end electric connection, ruddiness LED's the other end with fifth support electric connection.

The utility model discloses an among the LED packaging part, colorful LED chip includes green glow LED, the current control end with green glow LED's one end electric connection, green glow LED's the other end with fifth support electric connection.

The utility model discloses an among the LED packaging part, the fifth support includes that power pin and setting are in fifth pad in the cavity, ruddiness LED with green glow LED all sets up on the fifth pad, power pin sets up the outside of pedestal.

The utility model discloses an among the LED packaging part, monochromatic LED chip is white light LED, white light LED sets up on the second support, the current control end with white light LED's one end electric connection.

The utility model discloses an among the LED packaging part, the second support includes the hollow pin and sets up second pad in the cavity, white light LED sets up on the second pad, the hollow pin sets up the outside of pedestal.

The technical scheme provided by the embodiment of the application can have the following beneficial effects: the application designs an LED packaging part, because be equipped with driver IC in the cavity, not only make things convenient for the LED packaging part to change through the monochromatic LED chip of driver IC control in the different cavities and/or colorful LED chip's current, but also can reduce the outside pin quantity of LED support, be favorable to the small-size design of LED packaging part.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.

Fig. 1 is a schematic structural diagram of an LED package according to an embodiment of the present invention;

FIG. 2 is an exploded schematic view of the LED package of FIG. 1;

FIG. 3 is a schematic structural view of the body of FIG. 1;

FIG. 4 is an exploded schematic view of the body of FIG. 1;

FIG. 5 is a partial block diagram of the body of FIG. 4;

FIG. 6 is a partial block diagram of the body of FIG. 5;

FIG. 7 is a block diagram of the single color LED chip of FIG. 6;

FIG. 8 is a schematic structural view of the first bracket of FIG. 6;

FIG. 9 is a schematic structural view of the second bracket of FIG. 6;

FIG. 10 is a partial block diagram of the body of FIG. 5;

FIG. 11 is a block diagram of the multi-color LED chip of FIG. 10;

FIG. 12 is a schematic structural view of the third bracket of FIG. 10;

FIG. 13 is a schematic structural view of the fourth bracket of FIG. 10;

FIG. 14 is a schematic structural view of the fifth bracket of FIG. 10;

FIG. 15 is a schematic structural view of the sixth bracket of FIG. 10;

fig. 16 is a partial structural schematic view of the seat body in fig. 4.

Description of reference numerals:

100. a body;

10. a base body; 111. a monochromatic cavity; 112. a multi-color cavity; 11. a concave cavity;

20. an LED support; 21. a first bracket; 211. a first pad; 212. a first power supply pin; 213. a first buckling part; 22. a second bracket; 221. a second pad; 222. a null pin; 23. a third support; 231. a third pad; 232. a data input pin; 24. a fourth bracket; 241. a fourth pad; 242. a ground pin; 25. a fifth support; 251. a fifth pad; 252. a power supply pin; 26. a sixth support; 261. A sixth pad; 262. a data output pin; 263. a second fastening part;

30. a driver IC;

40. a single color LED chip;

50. a multi-color LED chip; 51. a blue LED; 52. a red LED; 53. a green LED;

60. a wire;

200. a packaging layer; 201. a single color encapsulation layer; 202. a multi-color encapsulation layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

As shown in fig. 1 to 16, the present application provides an LED package, which includes a body 100 and an encapsulation layer 200, wherein the body 100 includes a base 10 having a plurality of cavities 11 and an LED support 20 disposed on the base 10, in this embodiment, a single color LED chip 40 is disposed in one of the cavities 11, a driver IC30 and a multi-color LED chip 50 are disposed in the other cavity, the encapsulation layer 200 includes a single color encapsulation layer 201 and a multi-color encapsulation layer 202, the single color encapsulation layer 201 is encapsulated in the cavity on the single color LED chip, and the multi-color encapsulation layer 202 is encapsulated in the cavity on the driver IC30 and the multi-color LED chip 50.

Specifically, the number of the cavities 11 is two, and the cavities are a monochrome cavity 111 and a multi-color cavity 112, wherein the monochrome LED chip 40 is disposed in the monochrome cavity 111, and the driver IC30 and the multi-color LED chip 50 are disposed in the multi-color cavity 112, so that the problem of light mixing emitted by the monochrome cavity 111 and the multi-color cavity 112 can be solved, and the monochrome packaging layer 201 and the multi-color packaging layer 202 can be selected according to the monochrome LED chip 40 and the multi-color LED chip 50, for example, the material packaged in the monochrome packaging layer 201 can be packaging glue with high transparency; the multi-color package layer 202 may employ a combination of transparent glue and fluorescent glue, wherein the fluorescent glue may be disposed in a partial area, such as in a partial area of the transparent glue, or the fluorescent glue may also be composed of fluorescent glue with different colors, so as to adjust the equivalent of the light emission of the LED package.

After the technical scheme is adopted, the monochromatic LED chips 40 and the multicolor LED chips 50 are respectively and correspondingly arranged in the monochromatic concave cavities 111 and the multicolor concave cavities 112, so that the phenomenon that light rays of the monochromatic LED chips 40 and the multicolor LED chips 50 are mixed when the LED chips operate can be avoided, meanwhile, corresponding materials can be selected for the monochromatic packaging layers 201 and the multicolor packaging layers 202 according to the different light emitting colors of the monochromatic LED chips 40 and the multicolor LED chips 50, and the effect of killing two birds with one stone is achieved. In addition, the driving IC30 is further disposed in the multi-color cavity 112, so that current control of the single-color LED chip 40 and the multi-color LED chip can be realized, an external current control device is not required, the number of pins outside the LED support 20 is reduced, and the small-sized design of the LED package is facilitated.

In an alternative embodiment, the LED support 20 includes a first support 21 and a second support 22, wherein at least a portion of the second support 22 is disposed between the single-color cavity 111 and the multi-color cavity 112, so that one end of the single-color LED chip 40 can be electrically connected to the driving IC30 through the second support 22, and the driving IC30 can control the current of the single-color LED chip 40 in the single-color cavity 111.

Specifically, one end of the single-color LED chip 40 is electrically connected to the driving IC30, the other end of the single-color LED chip 40 is electrically connected to the first support 21, and the first support 21 is used for being connected to an external power supply, so that the single-color LED chip 40 can emit light under the control of the driving IC 30.

After the technical scheme is adopted, one end of the monochromatic LED chip 40 is electrically connected with the driving IC30 through the second support 22 by the second support 22, so that the appearance attractiveness of the LED packaging piece is not influenced, and meanwhile, the monochromatic cavity 111 and the colorful cavity 112 are electrically connected conveniently, so that the driving IC30 can control the current change of the work of the monochromatic LED chip 40.

In an alternative embodiment, the LED support 20 includes a third support 23, a fourth support 24, a fifth support 25 and a sixth support 26, wherein a data input terminal of the driver IC30 is electrically connected to the third support 23, a ground terminal of the driver IC30 is electrically connected to the fourth support 24, a power terminal of the driver IC30 is electrically connected to the fifth support 25, a data output terminal of the driver IC30 is electrically connected to the sixth support 26, one end of the multi-color LED chip is connected to a current control terminal of the driver IC30, and the other end of the multi-color LED chip is electrically connected to the fifth support 25, so that the driver IC30 can control current variation of the multi-color LED chip 50 during operation.

Specifically, the multicolor LED chip 50 includes a blue LED51, a red LED52, and a green LED53, the driving IC30 is provided with at least one current control terminal, one end of each of the blue LED51, the red LED52, and the green LED53 is electrically connected to the current control terminal of the driving IC30 through a wire 60, and the other end of each of the blue LED51, the red LED52, and the green LED53 is electrically connected to the fifth support 25 through a wire 60. In the present embodiment, the driving IC30 is a programmable control dust collecting chip so that the driving IC30 can control after the single color LED chip 40, the blue LED51, the red LED52, and the green LED53 are connected to the driving IC 30.

In this embodiment, a connection line between the blue LED51 and the red LED52 is substantially perpendicular to the length direction of the green LED53, and the red LED52 is disposed between the blue LED51 and the green LED53, so that the light emitted by the multi-color LED chip 50 in the multi-color cavity 112 can be more uniform, and the phenomena of bright middle, dark two sides, bright edges at the light entering edge, or inconsistent brightness at different angles do not occur.

In an alternative embodiment, the first bracket 21 includes a first power pin 212 and a first pad 211, the first pad 211 is disposed in the single-color cavity 111 and has a linear structure, a length direction of the first pad is perpendicular to a length direction of the LED package, and the first power pin 212 is disposed outside the base 10.

In an alternative embodiment, the second bracket 22 includes a dummy pin 222 and a second pad 221 connected to the dummy pin 222, wherein the second pad 221 is disposed in the cavity 11. In this embodiment, the second bonding pad 221 is of an inverted L-shaped structure, one end of the second bonding pad 221 along the length direction of the base 10 is disposed between the single-color cavity 111 and the multi-color cavity 112, one end of the second bonding pad 221 along the width direction of the base 10 is connected to the empty pin 222, and the empty pin 222 and the first power pin 212 are disposed at an interval outside the base 10.

In an alternative embodiment, the single-color LED chip 40 is a white LED, and the white LED is disposed on one end of the second pad 221 in the width direction of the housing 10.

In an alternative embodiment, the third support 23 includes a data input pin 232 and a third pad 231 connected to the data input pin 232, and the third pad 231 is disposed in the cavity 11. In the present embodiment, the third bonding pad 231 is disposed in the color cavity 112 and has a rectangular shape, the data input terminal of the driving IC30 is connected to the third bonding pad 231, and the data input pin 232 and the dummy pin 222 are disposed at an interval outside the housing 10.

In an alternative embodiment, the fourth bracket 24 includes a ground pin 242 and a fourth pad 241 connected to the ground pin 242, and the fourth pad 241 is disposed in the cavity 11. In this embodiment, the fourth pads 241 are disposed in the multi-color cavity 112 and have a notch shape, so that the fourth pads 241 have enough space for mounting the blue LED51 and the driving IC30, wherein the ground pins 242 and the data input pins 232 are disposed at intervals outside the base 10.

In an alternative embodiment, the fifth support 25 includes a power pin 252 and a fifth pad 251 connected to the power pin 252, the fifth pad 251 being disposed in the cavity 11. In this embodiment, the fifth pads 251 are disposed in the color cavity 112 and have a T-shape, the red LEDs 52 are disposed on the upper portion of the fifth pads 251, the green LEDs 53 are disposed on the vertical edges of the fifth pads 252 near the corners, and the power pins 252 and the ground pins 242 are disposed on the outer side of the housing 10 at intervals.

In an alternative embodiment, the sixth support 25 includes a data output pin 262 and a sixth pad 261 connected to the data output pin 262, and the sixth pad 261 is disposed in the cavity 11. In this embodiment, the sixth bonding pad 261 is disposed in the multi-color cavity 112 and has an L-shape, the data output terminal of the driving IC30 is connected to the sixth bonding pad 261, and the data output pin 262 and the power pin 252 are disposed at an interval outside the base 10.

The first power pin 212, the dummy pin 222, the data input pin 232, the ground pin 242, the power pin 252, and the data output pin 262 are sequentially disposed at intervals outside the base 10, wherein the first power pin 212 and the data output pin 262 are disposed at the outermost sides of the base 10, respectively, so that the data output pin 262 has a structure similar to that of the first power pin 212, the outer side of the data output pin 262 is provided with a second engaging portion 263, and the second engaging portion 263 is disposed at one side of the base 10 adjacent to the data output pin 262.

In an alternative embodiment, the LED support 20 may be integrally formed with the base 10 by insert molding, and the LED support 20 may also be formed separately from the base 10. For example, a first groove 121, a second groove 122, a third groove 123, a fourth groove 124, a fifth groove 125 and a sixth groove 126 are provided on the housing 10, wherein a first pad 211, a second pad 221, a third pad 231, a fourth pad 241, a fifth pad 251 and a sixth pad 261 are correspondingly mounted in the first groove 121, the second groove 122, the third groove 123, the fourth groove 124, the fifth groove 125 and the sixth groove 126, a first power pin 212, a dummy pin 222, a data input pin 232, a ground pin 242, a power pin 252 and a data output pin 262 sequentially pass through a first cut 1211, a second cut 1221, a third cut 1231, a fourth cut 1241, a fifth cut 1251 and a sixth cut 1261 which are communicated with the first groove 121, the second groove 122, the third groove 123, the fourth groove 124, the fifth groove 125 and the sixth groove 126 and then are located outside the housing 10, the connection between the LED support 20 and the base 10 is more stable.

In an alternative embodiment, the first bracket 21, the second bracket 22, the third bracket 23, the fourth bracket 24, the fifth bracket 25 and the sixth bracket 26 are integrally formed by a bending process, so that the manufacturing cost of the LED package can be saved.

It should be noted that the present application is not limited to the number of cavities 11 and their relative positions.

In the description of the present application, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the application. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An LED package, comprising:

2. The LED package of claim 1, wherein the LED support comprises a first support and a second support, the number of the cavities is two, at least a portion of the second support is disposed between the two cavities, one end of the single-color LED chip is electrically connected to the driver IC through the second support, and the other end of the single-color LED chip is electrically connected to the first support.

3. The LED package according to claim 2, wherein the LED support comprises a third support, a fourth support, a fifth support and a sixth support, the data input terminal of the driver IC is electrically connected to the third support, the ground terminal of the driver IC is electrically connected to the fourth support, the power terminal of the driver IC is electrically connected to the fifth support, and the data output terminal of the driver IC is electrically connected to the sixth support.

4. The LED package of claim 3, wherein the multi-color LED chip comprises a blue LED, the driver IC is provided with at least one current control terminal, the current control terminal is electrically connected to one end of the blue LED, and the other end of the blue LED is electrically connected to the fifth support.

5. The LED package of claim 4, wherein the fourth support comprises a ground pin and a fourth pad disposed in the cavity, the blue LED and the driver IC are disposed on the fourth pad, and the ground pin is disposed on an outer side of the base.

6. The LED package of claim 4, wherein the multi-color LED chip comprises a red LED, the current control terminal is electrically connected to one end of the red LED, and the other end of the red LED is electrically connected to the fifth support.

7. The LED package of claim 6, wherein the multi-color LED chip comprises a green LED, the current control terminal is electrically connected to one end of the green LED, and the other end of the green LED is electrically connected to the fifth support.

8. The LED package of claim 7, wherein the fifth support comprises a power pin and a fifth pad disposed in the cavity, wherein the red LED and the green LED are both disposed on the fifth pad, and wherein the power pin is disposed on an outer side of the body.

9. The LED package of claim 4, wherein the single-color LED chip is a white LED disposed on the second support, and the current control terminal is electrically connected to one terminal of the white LED.

10. The LED package of claim 9, wherein the second frame comprises a hollow pin and a second pad disposed in the cavity, the white LED is disposed on the second pad, and the hollow pin is disposed on an outer side of the body.