CN217062091U

CN217062091U - LED lamp bead and backlight lamp strip

Info

Publication number: CN217062091U
Application number: CN202220444797.4U
Authority: CN
Inventors: 张汝楠; 许怀书; 李鹏飞; 李健林
Original assignee: Huizhou Shiwei New Technology Co Ltd
Current assignee: Huizhou Shiwei New Technology Co Ltd
Priority date: 2022-03-02
Filing date: 2022-03-02
Publication date: 2022-07-26
Anticipated expiration: 2032-03-02
Also published as: WO2023165215A1

Abstract

The utility model belongs to the technical field of LED is shaded, when having solved the mixed light mode that adopts red phosphor powder to be aroused that exists among the prior art, the unable intensive mixing's of light of blue light chip edge part and green glow chip problem provides a LED lamp pearl and lamp strip in a poor light. The LED lamp bead comprises a bracket; the LED lamp comprises a first light-emitting chip and at least two second light-emitting chips, wherein the first light-emitting chip and the second light-emitting chips are distributed in a bracket, the second light-emitting chips are arranged on the side part of the first light-emitting chip, and the second light-emitting chips are arranged around the first light-emitting chip in a central symmetry manner; and the light conversion layer is used for emitting red light and is arranged on the light emitting sides of the first light emitting chip and the second light emitting chip. This application can make the light that first luminescent chip sent mix with the light that the second luminescent chip sent as far as possible, realizes LED lamp pearl outgoing uniform light.

Description

LED lamp bead and backlight lamp strip

Technical Field

The application relates to the technical field of LED backlight, in particular to an LED lamp bead and a backlight lamp bar.

Background

At present, the LED backlight source becomes the mainstream of the market, and compared with the traditional CCFL backlight source, the LED backlight source has the advantages of high color gamut, high brightness, long service life, energy conservation, environmental protection, adjustable color and the like. In order to realize white light, the mainstream method at present is to adopt a blue light chip and a green light chip respectively disposed at two ends of a bracket, and then to make the light emitted by the blue light chip and the green light chip respectively activate red fluorescent powder and mix the red fluorescent powder with the red light to emit uniform white light. However, due to the arrangement of the red and blue chips, the area of the blue chip far away from the center can only excite the red fluorescent powder to be mixed with the red light, the reddish light is presented, the part of the green chip far away from the center area can present the greenish light, and the middle part is white light, so that the light emitted by the blue and green chip can not be fully mixed in the bracket when the mixed light mode of the red fluorescent powder is adopted, the color of the LED is uneven after the light is emitted, and the uniform light can not be emitted.

SUMMERY OF THE UTILITY MODEL

In view of this, for the blue-green chip mixed light insufficient problem that exists among the solution prior art, this application provides a new LED lamp pearl and a lamp strip in a poor light.

The technical solution adopted by the present application to solve the above technical problems is as follows:

the first aspect, this application provides a LED lamp pearl, includes:

a support;

the LED lamp comprises a first light-emitting chip and at least two second light-emitting chips, wherein the first light-emitting chip and the second light-emitting chips are distributed in a bracket, the second light-emitting chips are arranged on the side part of the first light-emitting chip, and the second light-emitting chips are arranged around the first light-emitting chip in a centrosymmetric manner;

and the light conversion layer is used for emitting red light and is arranged on the light emitting sides of the first light emitting chip and the second light emitting chip.

Optionally, in some embodiments of the present application, an even number of the second light emitting chips are correspondingly disposed on each of the first light emitting chips to form a first chip module, and in the first chip module, the second light emitting chips are respectively disposed on two sides of the first light emitting chip in pairs.

Optionally, in some embodiments of the present application, the bracket is cup-shaped, and includes a bottom wall and an inner side wall surrounding a rim of the bottom wall, and at least a portion of the inner side wall extends from a side connected to the bottom wall to a direction away from the second light emitting chip.

Optionally, in some embodiments of the present application, the first light emitting chip and the second light emitting chip are both disposed on the bottom wall.

Optionally, in some embodiments of the present application, in each of the first chip modules, the first light emitting chip and the second light emitting chip are connected in parallel.

Optionally, in some embodiments of the present application, the first chip module includes one first light emitting chip and two second light emitting chips respectively disposed at two sides of the first light emitting chip, the inner side wall includes a first inner side wall and a second inner side wall perpendicular to the first inner side wall, the first inner side wall is located at a side of the second light emitting chip departing from the first light emitting chip, and the first inner side wall extends obliquely from a side connected to the bottom wall toward a direction departing from the second light emitting chip; the second inner side wall is perpendicular to the bottom wall.

Optionally, in some embodiments of the present application, in the first chip module, each of the first light emitting chips is connected in parallel to at least two of the second light emitting chips, and two or more of the chip modules are connected in parallel.

Optionally, in some embodiments of the present application, each of the first light emitting chips is correspondingly provided with an odd number of second light emitting chips to form a second chip module, and in the second chip module, the number of the second light emitting chips is at least three, and each of the second light emitting chips is distributed around the side of the first light emitting chip at equal intervals.

Optionally, in some embodiments of the present application, at least two of the second light emitting chips are connected in parallel to form a chip string, and the chip string is connected in series with the first light emitting chip.

In a second aspect, the present application provides a backlight light bar, comprising the LED light bead as described in the first aspect.

In conclusion, due to the adoption of the technical scheme, the application at least comprises the following beneficial effects:

the application provides an LED lamp bead and a backlight lamp bar, in the embodiment provided by the application, the purpose of uniform light mixing is achieved by arranging a first light emitting chip and a second light emitting chip, at least two second light emitting chips are mainly arranged on the side part of the first light emitting chip and are distributed around the first light emitting chip in a surrounding manner and are arranged in a central symmetry manner, so that the light emitted by the first light emitting chip at one end far away from one of the second light emitting chips can be still mixed with the light emitted by the other second light emitting chips, and the light emitted by the first light emitting chip at any angle can be uniformly mixed with the light emitted by the second light emitting chips as much as possible; the light conversion layers for emitting red light are arranged on the light emitting sides of the first light emitting chip and the second light emitting chip, so that the light emitted by the first light emitting chip and the light emitted by the second light emitting chip can be uniformly mixed with the red light, and uniform emission of the non-stray light is realized.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly described below, and it should be apparent that the drawings in the following description only relate to some embodiments of the present application and are not limiting of the present application, wherein:

FIG. 1 is a schematic plan view of a stent according to example 1 of the present application;

fig. 2 is a schematic diagram of a parallel connection arrangement structure of two second light emitting chips corresponding to one first light emitting chip in embodiment 1 of the present application;

FIG. 3 is a side view of FIG. 2;

fig. 4 is a schematic view of an arrangement structure in which a first light emitting chip and a second light emitting chip are connected in series in embodiment 1 of the present application;

fig. 5 is a schematic diagram of an arrangement structure of one first light emitting chip corresponding to three second light emitting chips in embodiment 1 of the present application.

Description of reference numerals:

1-a scaffold; 2-an inner side wall; 3-a bottom wall; 4-a first light emitting chip; 5-a second light emitting chip; 6-a pad; 7-gold wire; an 8-light converting layer.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it should be understood that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used for convenience of description and simplicity of description only, and do not indicate or imply that the referenced devices or elements must have a unique orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or including indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "plurality" means two or more unless specifically limited otherwise.

In the present application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as exemplary is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the application. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present application may be practiced without these specific details. In other instances, well-known structures and processes are not set forth in detail in order to avoid obscuring the description of the present application with unnecessary detail. Thus, the present application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles disclosed herein.

Example 1

Please refer to fig. 1 to 5, this embodiment discloses an LED lamp bead, which specifically includes:

a support 1;

the LED lamp comprises a first light-emitting chip 4 and at least two second light-emitting chips 5, wherein the first light-emitting chip 4 and the second light-emitting chips 5 are distributed in a bracket 1, the second light-emitting chips 5 are arranged on the side part of the first light-emitting chip 4, and the second light-emitting chips 5 are arranged around the first light-emitting chip 4 in a centrosymmetric manner;

and the light conversion layer 8 is arranged on the light emitting sides of the first light emitting chip 4 and the second light emitting chip 5, and the light emitted by the first light emitting chip 4, the second light emitting chip 5 and the light conversion layer 8 can be mixed to form white light.

It should be noted that the first light emitting chip 4 is a blue light emitting chip emitting blue light, and the second light emitting chip 5 is a green light emitting chip emitting green light; or the first light emitting chip 4 is a green light emitting chip emitting green light, and the second light emitting chip 5 is a blue light emitting chip emitting blue light. The wavelengths of the blue light chip and the green light chip can both generate excitation action on the light conversion layer 8, so that the light conversion layer emits red light, and then the blue light emitted by the blue light chip, the green light emitted by the green light chip and the red light emitted by the light conversion layer 8 after being excited are uniformly mixed, so that the LED lamp bead emits uniform white light.

It should be further noted that, referring to fig. 3, the light conversion layer 8 specifically includes red phosphor and a packaging adhesive, the red phosphor is mixed with the packaging adhesive, and then the red phosphor is fixed in the packaging adhesive by baking and disposed on the light emitting sides of the first light emitting chip 4 and the second light emitting chip 5, and the red phosphor is excited to emit red light by light emitted by the light emitting chips and conforming to the excitation wavelength.

In the scheme provided in this embodiment, at least two second light emitting chips 5 are mainly disposed around the first light emitting chip 4, and the second light emitting chips 5 are disposed in a central symmetry manner with the first light emitting chip 4 as a center, so that light emitted by the second light emitting chips 5 can be mixed with light emitted by the second light emitting chips 5 to the greatest extent on the premise that the same second light emitting chips 5 are used, thereby avoiding mixing of light emitted by the second light emitting chips 5 which is not obtained by a part of light emitted by the first light emitting chip 4, and especially light emitted by a part of the first light emitting chip 4 away from the second light emitting chip 5.

Referring to fig. 2, in the scheme provided in this embodiment, there are a plurality of arrangement manners for the first light emitting chip 4 and the second light emitting chip 5, such as the first manner: one first light emitting chip 4 is disposed, and then an even number of second light emitting chips 5 are disposed around the side of the first light emitting chip 4 to form a first chip module. In the first chip module, even number of the second light emitting chips 5 are paired, and each pair of the second light emitting chips 5 is disposed on two sides of the first light emitting chip 4, and is disposed on the paired sides. The arrangement can make up the problem that in the prior art, the light of the first light-emitting chip 4 at the side departing from the second light-emitting chip 5 cannot be mixed with the light emitted by the second light-emitting chip 5, and by adopting the arrangement mode, the uniform light mixing of the first light-emitting chip 4 and the second light-emitting chip 5 can be realized by the least second light-emitting chip 5. The specific number of the first light emitting chips 4 and the second light emitting chips 5 is one first light emitting chip 4 and two second light emitting chips 5, that is, two second light emitting chips 5 are correspondingly disposed on two sides of one first light emitting chip 4.

Referring to fig. 1 and fig. 3, in the solution provided in this embodiment, the support 1 for accommodating each light emitting chip and the light conversion layer 8 is in a cup shape, and the cross-sectional area of the cup-shaped support 1 is not limited, and may be square, circular, long strip, or other regular shapes. In this embodiment, what adopt to support 1 cross sectional shape is square, specifically includes diapire 3 and encircles the inside wall 2 at 3 borders of diapire, and at least partial inside wall 2 begins to extend the setting towards the direction slope that deviates from second luminescence chip 5 from the one side that is connected with diapire 3, makes LED lamp pearl when the light after the emergence mixes, and light emergence effect is better, has certain diffusion to the light, and irradiation range is wider. The inner side wall 2 is at least partially inclined, and the number and the position of the inclined inner side wall 2 are set according to the arrangement distribution position between the first light emitting chip 4 and the second light emitting chip 5.

In order to facilitate a better understanding of the relationship between the inclined inner side wall 2 and the second light emitting chip 5, the following is exemplified:

referring to fig. 2 and fig. 3, if the first chip module includes a first light emitting chip 4 and two second light emitting chips 5, the first light emitting chip 4 is located between the two second light emitting chips 5, and the two second light emitting chips 5 are disposed oppositely, that is, the first light emitting chip 4 and the second light emitting chips 5 are arranged in a straight line. For the cross sectional shape of support 1 chooses the rectangle for use, then the inside wall 2 is four, specifically includes two first inside walls and two second inside walls perpendicular to first inside wall, and wherein two first inside walls are located the both ends head department of first light-emitting chip 4 and second light-emitting chip 5 array orientation, and first inside wall is located the one side that second light-emitting chip 5 deviates from first light-emitting chip 4 promptly. First inside wall begins the orientation from the one side that is connected with diapire 3 to deviate from the direction slope extension setting of second luminescence chip 5, can reach that the emergent light is better, and the effect that diffusion range is wider just can not influence the mixture of the light that first luminescence chip 4 sent and the light that second luminescence chip 5 sent again.

In the scheme that this embodiment provided, all set up first luminescent chip 4 and second luminescent chip 5 on the diapire 3 of support 1, make first luminescent chip 4 and second luminescent chip 5 all be in the coplanar, guarantee that the light that first luminescent chip 4 sent can follow the emergence stage and just directly mix with second luminescent chip 5, and can not cause because of two kinds of chip height differences that the light between two chips can not be mixed in the direction of height, even cause sheltering from of light. And the first light-emitting chip 4 and the second light-emitting chip 5 are both limited on the same bottom wall 3, so that the subsequent wiring of the chips is convenient. Further, still be equipped with electrically conductive pad 6 in support 1, the luminous chip passes through gold thread 7 and is connected with pad 6, makes things convenient for follow-up line connection.

In the solution provided in this embodiment, for another arrangement manner of the first light emitting chips 4 and the second light emitting chips 5, that is, one first light emitting chip 4 is correspondingly provided with odd number of second light emitting chips 5, so as to form a second chip module. In the second chip module, the number of the second light emitting chips 5 is at least three, and the second light emitting chips 5 are distributed around the side of the first light emitting chip 4 at equal intervals. To facilitate understanding of the arrangement of the odd number of second light emitting chips 5 around the first light emitting chip 4, the following is exemplified:

referring to fig. 5, in the second chip module, one first light emitting chip 4 is selected, three second light emitting chips 5 are selected, and the three second light emitting chips 5 are disposed around the side portion of the first light emitting chip 4. The connecting lines among the three second light-emitting chips 5 form an equilateral triangle, and the light emitted by the first light-emitting chip 4 can be mixed with the light emitted by the second light-emitting chip 5 within the range of 360 degrees, so that the situation that the light at the edge of the first light-emitting chip 4 in a certain direction cannot be mixed with the light emitted by the second light-emitting chip 5 is avoided. By the arrangement mode, the light emitted by the first light-emitting chip 4, the light emitted by the second light-emitting chip 5 and the light conversion layer 8 can be fully mixed, and white light without mixed colors can be obtained.

It should be noted that, for this kind of mode, compared with the mode that one first light-emitting chip 4 corresponds to two second light-emitting chips 5, it can better ensure the light color mixing of the first light-emitting chip 4, and the mode that one first light-emitting chip 4 corresponds to three second light-emitting chips 5 is adopted, and the mode that odd number of second light-emitting chips 5 are arranged is adopted, and the second light-emitting chips 5 are used the fewest, and the simplest arrangement mode is also adopted, and the wiring mode is simpler than other odd number arrangement modes.

In the scheme provided by this embodiment, the arrangement manner of two second light-emitting chips 5 is correspondingly set on two sides of one first light-emitting chip 4, and in order to reduce the use of light-emitting chips and the arrangement complexity as much as possible, the arrangement manner of one first light-emitting chip 4 corresponding to two second light-emitting chips 5 is usually selected. However, compared with the arrangement of one first light emitting chip 4 corresponding to three second light emitting chips 5, the light mixing effect is still slightly inferior. Therefore, the arrangement mode that one first light emitting chip 4 corresponds to two second light emitting chips 5 needs to be further improved to make up for the situation that a small amount of light emitted by a part of the first light emitting chips 4 cannot be mixed with the second light emitting chips 5, specifically, the second inner side wall is arranged to be perpendicular to the bottom wall 3 or to be inclined towards the chip direction by a certain angle, so that the light emitting range of the first light emitting chips 4 at two sides without the second light emitting chips 5 is reduced, and the light is compressed to the range close to the second light emitting chips 5 as much as possible.

In the scheme provided by this embodiment, no matter the arrangement manner of the odd number of second light emitting chips 5 or the arrangement manner of the even number of second light emitting chips 5, the light emitting intensity of the first light emitting chip 4 is greater than the light emitting intensity of the second light emitting chip 5, so that the light emitted from the first light emitting chip 4 can cover the light emitted from the edge of the second light emitting chip 5 away from the first light emitting chip 4. The implementation manner that the luminous intensity of the first luminous chip 4 is greater than that of the second luminous chip 5 can be various, for example, the first luminous chip 4 and the second luminous chip 5 with different luminous intensities, such as power, material and the like, can be selected; the circuit connection mode can also be changed, and the following describes a mode of changing the light intensity of the light emitting chip through the circuit connection:

referring to fig. 2, a first connection method: in first chip module or second chip module, with first luminescence chip 4 and second luminescence chip 5 parallel connection, also be parallel connection between a plurality of second luminescence chips 5, and set up a variable resistance in series on each parallel branch or the second luminescence chip 5 resistance of choosing for use is greater than first luminescence chip 4's resistance, through adjusting variable resistance, alright realize adjusting the electric current size that first luminescence chip 4 and second luminescence chip 5 passed through, thereby realize adjusting the light intensity that first luminescence chip 4 and second luminescence chip 5 sent. The light intensity of the first light emitting chip 4 is adjusted to be larger than the light intensity of the second light emitting chip 5, so that the light emitted by the first light emitting chip 4 can cover the light emitted by the second light emitting chip 5 as much as possible, especially the light emitted by the second light emitting chip 5 in the direction far away from the first light emitting chip 4, and the light emitted by the edge of the second light emitting chip 5 is prevented from being mixed with the light emitted by the first light emitting chip 4, so that the green color is presented. The connection mode can adjust the light intensity of the light emitting chip at any time, and is convenient for controlling the mixing of white light.

It should be noted that, in the first chip module, one first light emitting chip 4 is connected in parallel with at least two second light emitting chips 5 or in the second chip module, one first light emitting chip 4 is connected in parallel with at least three second light emitting chips 5, the number of the chip modules in the bracket 1 is not limited, and the chip modules may be two or more chip modules, and the two or more chip modules are also connected in parallel, so that the light intensity of the light emitting chips on the lines of the plurality of chip modules can be controlled simultaneously.

Referring to fig. 4, a second connection method: at least two second light emitting chips 5 are connected in parallel to form a chip string, and then the chip string is connected in series with the first light emitting chip 4. In this connection manner, the current passing through the chip string is equal to the current passing through the first light emitting chip 4, and the currents passing through the second light emitting chips 5 in the chip string are the same, so that the light emitting intensity of each second light emitting chip 5 can be controlled by controlling the number of the second light emitting chips 5. If the number of the second light emitting chips 5 is two, the currents passed by the two second light emitting chips 5 are equal and are half of the current of the first light emitting chip 4, that is, under the condition that the remaining parameters of the first light emitting chip 4 and the second light emitting chips 5 are the same, the light emitting intensity of each second light emitting chip 5 is half of the light emitting intensity of the first light emitting chip 4. By adopting the wiring mode, compared with the first wiring mode, the wiring cost can be reduced.

In the solution disclosed in this embodiment, the first light emitting chip 4 is a blue light chip with dominant wavelength of 447-.

In the solution disclosed in this embodiment, the LED packaging process is exemplified as follows:

firstly, placing a chip into a support 1 on which die attach adhesive is dispensed; putting the bracket 1 into baking equipment for baking at the baking temperature of 100 ℃ for 1 hour, then adjusting the baking temperature to 150 ℃ and baking for 2 hours; connecting the chip with a bonding pad 6 in the bracket 1 through a gold wire 7; arranging a packaging adhesive mixed with red fluorescent powder on the light-emitting side of each chip to form a light conversion layer 8; and putting the bracket 1 into baking equipment, pre-baking and curing, and packaging after baking.

Example 2

The embodiment 2 of the application discloses backlight lamp strip, this backlight lamp strip includes in embodiment 1 at least one LED lamp pearl.

As one of the implementation modes of the backlight lamp bar, the backlight lamp bar comprises at least one LED lamp bead and a PCB, and the LED lamp bead is installed on the PCB. Furthermore, the PCB board is provided with a wiring terminal for connecting with an external power supply.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be considered merely illustrative and not restrictive of the broad application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, though not expressly described herein. Such modifications, improvements and adaptations are proposed in the present application and thus fall within the spirit and scope of the exemplary embodiments of the present application.

Also, this application uses specific language to describe embodiments of the application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means a feature, structure, or characteristic described in connection with at least one embodiment of the application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, certain features, structures, or characteristics may be combined as suitable in one or more embodiments of the application.

Similarly, it should be noted that in the preceding description of embodiments of the application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to imply that more features are required than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single disclosed embodiment.

Where numerals describing the number of components, attributes or the like are used in some embodiments, it is to be understood that such numerals used in the description of the embodiments are modified in some instances by the modifier "about", "approximately" or "substantially". Unless otherwise indicated, "about", "approximately" or "substantially" indicates that the number allows for a variation of + -%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit-preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range are approximations, in the specific examples, such numerical values are set forth as precisely as possible within the scope of the application.

For each patent, patent application publication, and other material cited in this application, such as articles, books, specifications, publications, documents, and the like, the entire contents of which are hereby incorporated by reference into this application, except for application history documents that are inconsistent with or conflict with the contents of this application, and except for documents that are currently or later become incorporated into this application as though fully set forth in the claims below. It is to be understood that the descriptions, definitions and/or uses of terms in the attached materials of this application shall control if they are inconsistent or inconsistent with this application.

Claims

1. The utility model provides a LED lamp pearl which characterized in that includes:

a support;

the LED lamp comprises a first light-emitting chip and at least two second light-emitting chips, wherein the first light-emitting chip and the second light-emitting chips are distributed in a bracket, the second light-emitting chips are arranged on the side part of the first light-emitting chip, and the second light-emitting chips are arranged around the first light-emitting chip in a central symmetry manner;

2. The LED lamp bead of claim 1, wherein an even number of the second light emitting chips are correspondingly disposed on each of the first light emitting chips to form a first chip module, and in the first chip module, the second light emitting chips are respectively disposed in pairs on two sides of the first light emitting chip.

3. The LED lamp bead of claim 2, wherein the holder is cup-shaped and includes a bottom wall and an inner sidewall surrounding a rim of the bottom wall, and at least a portion of the inner sidewall extends from a side connected to the bottom wall in an inclined manner in a direction away from the second light-emitting chip.

4. The LED lamp bead of claim 3, wherein the first light emitting chip and the second light emitting chip are both disposed on the bottom wall.

5. The LED lamp bead of claim 2, wherein in each of the first chip modules, the first light emitting chip is connected in parallel with the second light emitting chip.

6. The LED lamp bead according to claim 3, wherein the first chip module includes one of the first light emitting chips and two of the second light emitting chips respectively disposed at two sides of the first light emitting chip, the inner side walls include a first inner side wall and a second inner side wall perpendicular to the first inner side wall, the first inner side wall is located at a side of the second light emitting chip away from the first light emitting chip, and the first inner side wall extends obliquely from a side connected to the bottom wall toward a direction away from the second light emitting chip; the second inner side wall is perpendicular to the bottom wall.

7. The LED lamp bead of claim 5, wherein in the first chip module, each of the first light emitting chips is connected in parallel with at least two of the second light emitting chips, and two or more of the chip modules are connected in parallel.

8. The LED lamp bead according to claim 1, wherein each of the first light-emitting chips is correspondingly provided with an odd number of the second light-emitting chips to form a second chip module, and in the second chip module, the number of the second light-emitting chips is at least three, and the second light-emitting chips are distributed around the side of the first light-emitting chip at equal intervals.

9. The LED lamp bead of claim 1, wherein at least two of the second light emitting chips are connected in parallel to form a chip string, and the chip string is connected in series with the first light emitting chip.

10. A backlight lamp strip, comprising the LED lamp bead of any one of claims 1 to 9.