CN212628076U - Infrared thermal imaging module - Google Patents
Infrared thermal imaging module Download PDFInfo
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- CN212628076U CN212628076U CN202021612088.XU CN202021612088U CN212628076U CN 212628076 U CN212628076 U CN 212628076U CN 202021612088 U CN202021612088 U CN 202021612088U CN 212628076 U CN212628076 U CN 212628076U
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- thermal imaging
- infrared
- processing unit
- radiating piece
- heat dissipation
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Abstract
The utility model discloses an infrared thermal imaging module, including thermal imaging camera, first radiating piece, thermal imaging unit, second radiating piece, processing unit and third radiating piece, first radiating piece is located to thermal imaging camera, the second radiating piece is located to the thermal imaging unit, the third radiating piece is located to the processing unit, thermal imaging camera is used for acquireing infrared radiation and transmits to the thermal imaging unit, the thermal imaging unit is used for converting infrared radiation into infrared signal of telecommunication and transmits to the processing unit electricity and connects, the processing unit is used for converting infrared signal of telecommunication into thermal imaging picture. The utility model provides an infrared thermal imaging module, the radiating effect is good, improves the effect of thermal imaging picture.
Description
Technical Field
The utility model relates to a thermal imaging technology field, specifically speaking relates to an infrared thermal imaging module.
Background
The principle of thermal imaging is to convert invisible infrared energy emitted by an object into a visible thermal imaging image, an infrared detector is a main functional component of a thermal imaging device, the temperature specification of the infrared detector is often low, the infrared detector is particularly sensitive to temperature uniformity and stability, and local high temperature and temperature change can seriously affect the image effect. The thermal imaging device in the prior art has poor heat dissipation effect, and the temperature of the infrared detector is easily influenced, so that the effect of a thermal imaging graph is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an infrared thermal imaging module, the radiating effect is good, improves the effect of thermal imaging picture.
The utility model discloses a technical scheme that infrared thermal imaging module adopted is:
the utility model provides an infrared thermal imaging module, includes thermal imaging camera, first radiating piece, thermal imaging unit, second radiating piece, processing unit and third radiating piece, first radiating piece is located to the thermal imaging camera, the second radiating piece is located to the thermal imaging unit, the third radiating piece is located to the processing unit, the thermal imaging camera is used for acquireing infrared radiation and transmits to the thermal imaging unit, the thermal imaging unit is used for converting infrared radiation into infrared signal and transmits to the processing unit electricity and is connected, the processing unit is used for converting infrared signal into thermal imaging picture.
Preferably, the thermal imaging camera comprises a lens and a bracket, the bracket is arranged on the first heat dissipation member, and the lens is arranged on the bracket.
As preferred scheme, first radiating part top is equipped with first joint portion, the support bottom is equipped with second joint portion, first radiating part is connected through first joint portion and second joint portion joint with the support.
As the preferred scheme, first radiating piece bottom is equipped with third joint portion, second radiating piece top is equipped with fourth joint portion, first radiating piece is connected through third joint portion and fourth joint portion joint with the second radiating piece.
As a preferred scheme, second radiating piece bottom is equipped with fifth joint portion, third radiating piece top is equipped with sixth joint portion, second radiating piece is connected through fifth joint portion and sixth joint portion joint with the third radiating piece.
As the preferred scheme, the first radiating piece, the second radiating piece and the third radiating piece are provided with mounting holes, and the first radiating piece, the second radiating piece and the third radiating piece are connected through screws.
Preferably, the thermal imaging unit comprises a thermal imaging sensor and a thermal imaging circuit board, the thermal imaging circuit board is arranged on the second heat dissipation member, and the thermal imaging sensor is arranged on the thermal imaging circuit board.
Preferably, the processing unit includes a processor and a processing circuit board, the processing circuit board is disposed on the third heat dissipation member, and the processor is disposed on the processing circuit board.
Preferably, the heat dissipation device further comprises an interface adapter plate, the interface adapter plate is arranged on one surface, back to the processing unit, of the third heat dissipation member, and the interface adapter plate is electrically connected with the processing unit.
The utility model discloses an infrared thermal imaging module's beneficial effect is: the thermal imaging camera is arranged on the first heat dissipation part, the thermal imaging unit is arranged on the second heat dissipation part, and the processing unit is arranged on the third heat dissipation part. The thermal imaging camera, the thermal imaging unit and the processing unit are isolated through the first radiating piece, the second radiating piece and the third radiating piece, and meanwhile, the thermal imaging camera, the thermal imaging unit and the processing unit can be respectively used for heat dissipation, so that the heat dissipation effect is improved, the temperature influence among the thermal imaging camera, the thermal imaging unit and the processing unit is small, and the effect of a thermal imaging graph is improved.
Drawings
Fig. 1 is a schematic structural diagram of the infrared thermal imaging module of the present invention.
Detailed Description
The invention will be further elucidated and described with reference to the following embodiments and drawings in which:
referring to fig. 1, the infrared thermal imaging module includes a thermal imaging camera 10, a first heat dissipation member 20, a thermal imaging unit 30, a second heat dissipation member 40, a processing unit 50, and a third heat dissipation member 60. The thermal imaging camera 10 is disposed in the first heat dissipation member 20, the thermal imaging unit 30 is disposed in the second heat dissipation member 40, and the processing unit 50 is disposed in the third heat dissipation member 60. Thermal imaging camera 10 is used for acquireing infrared radiation and transmits to thermal imaging unit 30, thermal imaging unit 30 is used for converting infrared radiation into infrared electric signal and transmits to processing unit 50 electricity and connects, processing unit 50 is used for converting infrared electric signal into thermal imaging picture.
The thermal imaging camera 10 is disposed in the first heat dissipation member 20, the thermal imaging unit 30 is disposed in the second heat dissipation member 40, and the processing unit 50 is disposed in the third heat dissipation member 60. The thermal imaging camera 10, the thermal imaging unit 30 and the processing unit 50 are isolated by the first heat dissipation member 20, the second heat dissipation member 40 and the third heat dissipation member 60, and simultaneously, the thermal imaging camera 10, the thermal imaging unit 30 and the processing unit 50 can be respectively used for heat dissipation, so that the heat dissipation effect is improved, the temperature influence among the thermal imaging camera 10, the thermal imaging unit 30 and the processing unit 50 is small, and the effect of a thermal imaging diagram is improved.
The thermal imaging camera 10 comprises a lens 12 and a bracket, wherein the bracket 14 is arranged on a first heat dissipation member 20, and the lens 12 is arranged on the bracket 14. The support 14 is provided with a mounting hole, threads are arranged in the mounting hole, and the lens 12 is in threaded connection with the support 14 through the threads.
The bottom of the second heat dissipation piece 40 is provided with a fifth clamping portion 44, the top of the third heat dissipation piece 60 is provided with a sixth clamping portion 62, and the second heat dissipation piece 40 and the third heat dissipation piece 60 are connected in a clamping mode through the fifth clamping portion 44 and the sixth clamping portion 62. Specifically, the fifth clamping portion 44 is a plurality of protrusions or/and grooves, the sixth clamping portion 62 is a corresponding groove or/and protrusion, and the fifth clamping portion 44 and the sixth clamping portion 62 are only partially matched, so that a gap is left between the fifth clamping portion 44 and the sixth clamping portion 62.
The first heat dissipation element 20, the second heat dissipation element 40 and the third heat dissipation element 60 are all provided with mounting holes, and the first heat dissipation element 20, the second heat dissipation element 40 and the third heat dissipation element 60 are connected through screws. Because the first heat dissipation element 20, the second heat dissipation element 40 and the third heat dissipation element 60 are stacked, after the first heat dissipation element 20, the second heat dissipation element 40 and the third heat dissipation element 60 are connected in a clamped mode, the first heat dissipation element 20, the second heat dissipation element 40 and the third heat dissipation element 60 can be stably connected and are not easy to loosen, and then the first heat dissipation element 20, the second heat dissipation element 40 and the third heat dissipation element 60 are fastened through screws, so that the connection stability is guaranteed.
Specifically, the thermal imaging unit 30 includes a thermal imaging sensor and a thermal imaging circuit board, the thermal imaging circuit board is disposed on the second heat dissipation member 40, and the thermal imaging sensor is disposed on the thermal imaging circuit board. The processing unit 50 includes a processor and a processing circuit board, the processing circuit board is disposed on the third heat dissipating member 60, and the processor is disposed on the processing circuit board.
The infrared thermal imaging module further comprises an interface adapter plate 70, the interface adapter plate 70 is arranged on one surface of the third heat dissipation member 60, which faces away from the processing unit 50, and the interface adapter plate 70 is electrically connected with the processing unit 50. The interface adapter board 70 is used for connecting with an external device.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (9)
1. The utility model provides an infrared thermal imaging module, its characterized in that includes thermal imaging camera, first radiating piece, thermal imaging unit, second radiating piece, processing unit and third radiating piece, first radiating piece is located to thermal imaging camera, the second radiating piece is located to the thermal imaging unit, processing unit locates the third radiating piece, thermal imaging camera is used for acquireing infrared radiation and transmits to the thermal imaging unit, the thermal imaging unit is used for converting infrared radiation into infrared signal of telecommunication and transmits to the processing unit electricity and connects, the processing unit is used for converting infrared signal of telecommunication into thermal imaging picture.
2. The infrared thermal imaging module set forth in claim 1 wherein the thermal imaging camera includes a lens and a holder, the holder being disposed on the first heat dissipating member, the lens being disposed on the holder.
3. The infrared thermal imaging module as set forth in claim 2, wherein the first heat dissipating member has a first engaging portion at a top thereof, and a second engaging portion at a bottom thereof, and the first heat dissipating member is engaged with the bracket via the first engaging portion and the second engaging portion.
4. The infrared thermal imaging module as set forth in claim 3, wherein the first heat dissipating member has a third engaging portion at the bottom, and a fourth engaging portion at the top, and the first heat dissipating member and the second heat dissipating member are engaged with each other by the third engaging portion and the fourth engaging portion.
5. The infrared thermal imaging module as set forth in claim 4, wherein the second heat dissipating member has a fifth clamping portion at the bottom, and a sixth clamping portion at the top, and the second heat dissipating member and the third heat dissipating member are connected by the fifth clamping portion and the sixth clamping portion.
6. The infrared thermal imaging module of claim 1, wherein the first, second, and third heat dissipation elements each define a mounting hole, and the first, second, and third heat dissipation elements are connected by screws.
7. The infrared thermal imaging module of claim 1 wherein the thermal imaging unit comprises a thermal imaging sensor and a thermal imaging circuit board, the thermal imaging circuit board being disposed on the second heat spreader, the thermal imaging sensor being disposed on the thermal imaging circuit board.
8. The infrared thermal imaging module of claim 1 wherein the processing unit includes a processor and a processing circuit board, the processing circuit board being disposed on the third heat spreader, the processor being disposed on the processing circuit board.
9. The infrared thermal imaging module of claim 1 further comprising an interface adapter plate disposed on a side of the third heat spreading member facing away from the processing unit, the interface adapter plate being electrically connected to the processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021612088.XU CN212628076U (en) | 2020-08-06 | 2020-08-06 | Infrared thermal imaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021612088.XU CN212628076U (en) | 2020-08-06 | 2020-08-06 | Infrared thermal imaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212628076U true CN212628076U (en) | 2021-02-26 |
Family
ID=74712195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021612088.XU Active CN212628076U (en) | 2020-08-06 | 2020-08-06 | Infrared thermal imaging module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212628076U (en) |
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2020
- 2020-08-06 CN CN202021612088.XU patent/CN212628076U/en active Active
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