CN212625562U - Two-piece type surface-mounted diode convenient for heat dissipation - Google Patents
Two-piece type surface-mounted diode convenient for heat dissipation Download PDFInfo
- Publication number
- CN212625562U CN212625562U CN202021864149.1U CN202021864149U CN212625562U CN 212625562 U CN212625562 U CN 212625562U CN 202021864149 U CN202021864149 U CN 202021864149U CN 212625562 U CN212625562 U CN 212625562U
- Authority
- CN
- China
- Prior art keywords
- pin
- colloid
- chip
- heat dissipation
- gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model provides a make things convenient for radiating two formula paster diodes, it includes the colloid, go up the pin, lower pin, chip and solder, the colloid is used for the encapsulation protection, it stretches into in the colloid to go up pin one end, other end bending type connects at the colloid lower surface, pin one end stretches into in the colloid down, and stretch into the colloid part and be located the pin and stretch into colloid part below, the other end is located and keeps away from pin one side bending type and connects at the colloid lower surface, the chip sets up inside the colloid, and connect between last pin and lower pin, the solder is connected both ends about the chip, be used for chip and last pin and lower pin to connect, the pin is connected down the partial length of colloid lower surface compares go up the part length that the pin is connected at the colloid lower surface long. The utility model discloses a pin extension is longer under convenient radiating two formula paster diodes, has increased the area of contact of pin and PCB, very big promotion heat-sinking capability for product good heat dissipation, stable in quality.
Description
Technical Field
The utility model relates to a paster diode field, in particular to convenient radiating two formula paster diodes.
Background
Transient Voltage Suppressor (TVS) is used as an effective protection device to effectively suppress Transient interference. The TVS is a diode with special functions made of silicon semiconductor materials, and when two ends of the TVS tube are subjected to instantaneous high-energy impact, the TVS tube can be quickly started, simultaneously absorbs surge current, and clamps the voltage between the two ends of the TVS tube to a preset value, so that the following precise electronic components are prevented from being damaged by the impact of transient high energy. The existing two-piece type patch diode has poor heat dissipation, so that the technical problem needs to be solved by providing a two-piece type patch diode which is convenient to dissipate heat.
SUMMERY OF THE UTILITY MODEL
The utility model provides a make things convenient for radiating two formula paster diodes to the thermal diffusivity of solving two formula paster diodes among the prior art is relatively poor, and the not reasonable problem of distributing of each part inadequately.
In order to solve the technical problem, the utility model adopts the technical scheme that: a two-piece patch diode that facilitates heat dissipation, comprising:
the colloid is used for packaging protection;
one end of the upper pin extends into the colloid, and the other end of the upper pin is connected to the lower surface of the colloid in a bending manner;
one end of the lower pin extends into the colloid, the part of the lower pin extending into the colloid is positioned below the part of the upper pin extending into the colloid, and the other end of the lower pin is positioned on one side far away from the upper pin and is connected to the lower surface of the colloid in a bending manner;
the chip is arranged in the colloid and connected between the upper pin and the lower pin;
the welding flux is connected to the upper end and the lower end of the chip and is used for connecting the chip with the upper pin and the lower pin;
the length of the part of the lower pin connected to the lower surface of the colloid is longer than that of the part of the upper pin connected to the lower surface of the colloid.
Make things convenient for radiating two formula paster diodes in, the colloid below is provided with the spacing block, the spacing block contact go up the end that the pin stretches out the colloid part, spacing block contact the end that the pin stretches out the colloid part down.
Make things convenient for radiating two formula paster diodes in, go up the pin and include the clamp plate, go up connecting portion and last kink, the clamp plate is connected the chip top, go up connecting portion connect the clamp plate with go up the kink, go up kink one end and connect in the colloid, one end is buckled and is connected at the colloid lower surface.
Make things convenient for radiating two formula paster diodes in, the pin includes extension board, lower connecting portion and lower bending portion down, the extension board is connected the chip below, lower connecting portion connect the extension board with lower bending portion, lower bending portion one end is connected in the colloid, one end bending connection is at the colloid lower surface.
Make things convenient for radiating two-piece formula paster diode in, the clamp plate below is provided with the boss, it connects to go up the boss below the solder, the extension board top is provided with down the boss, the solder is connected to lower boss top.
Make things convenient for radiating two formula paster diodes in, the cross sectional area of going up the boss is less than the area of the cross section of chip, the cross sectional area of boss is less than the area of the cross section of chip down.
In the two-piece type patch diode convenient for heat dissipation, the width of the pressing plate is greater than that of the upper connecting part, the width of the upper connecting part is consistent with that of the upper bending part, and the cross sectional area of the pressing plate is greater than that of the upper boss;
the width of the support plate is larger than that of the lower connecting part, the width of the lower connecting part is consistent with that of the lower bending part, and the cross section area of the support plate is larger than that of the lower boss.
Make things convenient for radiating two formula paster diodes in, the colloid is cubic, the upper surface and the lower surface of colloid are parallel, the colloid with go up the pin and outwards bulge with the both sides middle part that the pin is connected down.
Make things convenient for radiating two formula paster diodes in, go up the kink and stretch out the middle part that colloid department is located the colloid, lower kink stretches out colloid department and is located the middle part of colloid, goes up the upper surface that the kink stretched into colloid part and the upper surface that lower kink stretched into colloid part at same horizontal plane.
Make things convenient for radiating two formula paster diodes in, go up connecting portion and follow go up the kink and stretch into the terminal upwards buckling of colloid part, lower connecting portion are followed down the kink stretches into the terminal downwards buckling of colloid part.
The utility model discloses compare in prior art, its beneficial effect is: the utility model discloses a pin stretches out longer down in the convenient radiating two formula paster diodes, utilizes the pin extension copper product that present diode will be washed away and cut away, directly forms a big pin bottom the device, has increased the area of contact of pin and PCB, and very big promotion heat-sinking capability has compromise the low cost for product good heat dissipation, stable in quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding drawings of some embodiments of the present invention.
Fig. 1 is a bottom view of the two-piece type patch diode of the present invention, which facilitates heat dissipation.
Fig. 2 is a sectional view taken along the direction a in fig. 1.
Fig. 3 is a front view of the upper pin of the two-piece type patch diode convenient for heat dissipation.
Fig. 4 is a top view of the upper pin of the two-piece type patch diode convenient for heat dissipation.
Fig. 5 is a front view of the lower pin of the two-piece type patch diode convenient for heat dissipation of the present invention.
Fig. 6 is a top view of the lower pin of the two-piece type patch diode convenient for heat dissipation.
The structure comprises 1, colloid, 2, upper pins, 3, lower pins, 4, a chip, 5, solder, 11, an isolation block, 21, a pressing plate, 22, an upper connecting part, 23, an upper bending part, 24, an upper boss, 31, a support plate, 32, a lower connecting part, 33, a lower bending part, 34 and a lower boss.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
In the present invention, the directional terms, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top" and "bottom", refer to the orientation of the drawings, and the directional terms are used for illustration and understanding, but not for limiting the present invention.
The terms "first," "second," and the like in the terms of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, nor should they be construed as limiting in any way.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The two-piece type patch diode in the prior art has poor heat dissipation performance.
The following is the utility model provides a can solve the convenient radiating two formula paster diode's of above technical problem preferred embodiment.
Please refer to fig. 1-6, wherein fig. 1 is the utility model discloses a make things convenient for the bottom view of radiating two formula paster diodes, fig. 2 is along the section view of A in fig. 1 to, fig. 3 is the utility model discloses a make things convenient for the main view of radiating two formula paster diodes's last pin, fig. 4 is the utility model discloses a make things convenient for the plan view of radiating two formula paster diodes's last pin, fig. 5 is the utility model discloses a make things convenient for the main view of radiating two formula paster diodes's lower pin, fig. 6 is the utility model discloses a make things convenient for the plan view of radiating two formula paster diodes's lower pin.
In the drawings, elements having similar structures are denoted by the same reference numerals.
The utility model provides a two-piece type surface-mounted diode convenient for heat dissipation, which comprises a colloid 1, an upper pin 2, a lower pin 3, a chip 4 and a solder 5, wherein the chip 4 is arranged inside the colloid 1 and is connected between the upper pin 2 and the lower pin 3; solder 5 is connected to the upper and lower ends of the chip 4 for connecting the chip 4 to the upper and lower leads 2 and 3. Wherein, the part length of pin 3 connection at colloid 1 lower surface is longer than the part of last pin 2 connection at colloid 1 lower surface down, and lower pin 3 stretches out longer, utilizes the epitaxial copper product of pin that present diode will be washed away, directly forms a big pin in the device bottom, has increased the area of contact of pin and PCB, very big promotion heat-sinking capability, has compromise low-cost for product good heat dissipation, the steady quality.
The colloid 1 is used for packaging protection; colloid 1 is cubic, and the upper surface and the lower surface of colloid 2 are parallel, and colloid 1 outwards bulges with the both sides middle part that last pin 2 and lower pin 3 are connected, conveniently goes up the bending of pin 2 and 3 projections of lower pin. The 1 below of colloid is provided with spacing block 11, and spacing block 11 contacts the end that pin 2 stretches out the colloid part, and pin 3 stretches out the end of colloid part under the 11 contact contacts of spacing block, sets up spacing block 11, effectively keeps apart the last pin 2 and the lower pin 3 that stretch out colloid 1, avoids last pin 2 and lower pin 3 contact to cause the short circuit, can conveniently distinguish simultaneously and go up pin 2 and lower pin 3.
Referring to fig. 2, fig. 3 and fig. 4, go up 2 one ends of pin and stretch into colloid 1 in, the other end is buckled and is connected at 1 lower surface of colloid, pin 3 is also buckled and is connected at 1 lower surface of colloid down, it is convenient to go up pin 2 and lower pin 3 welding on the pcb board, it includes clamp plate 21 to go up pin 2, go up connecting portion 22 and last kink 23, clamp plate 21 connects in chip 4 top, go up connecting portion 22 and connect clamp plate 21 and last kink 23, go up kink 23 one end and connect in colloid 1, the one end is buckled and is connected at 1 lower surface of colloid. An upper boss 24 is provided below the pressing plate 21, solder 5 is connected below the upper boss 24, and the upper boss 24 is connected to the chip 4 by the solder 5. The cross sectional area of going up boss 24 is less than the area of chip 4's cross section, set up boss 24 and support board 31 on the clamp plate 21 and set up lower boss 34, can avoid solder 5 to cover full chip 4 whole surface, cause the destruction to the passivation layer at chip 4 edge, effectively ensure chip 4's stability, clamp plate 21 width is greater than the width of last connecting portion 22, clamp plate 21 department widens, it is narrower to go up pin 2 derivation part, save material, clamp plate 21 is used for placing boss 24, the width of going up connecting portion 22 is unanimous with the width of last kink 23, the cross sectional area of clamp plate 21 is greater than the cross sectional area of last boss 24.
Referring to fig. 2, 5 and 6, one end of the lower pin 3 extends into the colloid 1, the part of the lower pin extending into the colloid 1 is positioned below the part of the upper pin 2 extending into the colloid 1, and the other end of the lower pin is positioned on the side far away from the upper pin 2 and is connected to the lower surface of the colloid 1 in a bending manner; the lower lead 3 comprises a support plate 31, a lower connecting part 32 and a lower bending part 33, the support plate 31 is connected below the chip 4, the lower connecting part 32 is connected with the support plate 31 and the lower bending part 33, one end of the lower bending part 33 is connected in the colloid 1, and one end of the lower bending part is connected to the lower surface of the colloid 1 in a bending mode. The support plate 31 is provided with a lower boss 34, and the solder 5 is connected above the lower boss 34. The cross-sectional area of the lower boss 34 is smaller than the cross-sectional area of the chip 4. The width of the support plate 31 is larger than that of the lower connecting part 32, the width of the lower connecting part 32 is consistent with that of the lower bent part 33, and the cross-sectional area of the support plate 31 is larger than that of the lower boss 34.
Go up kink 23 and stretch out colloid 1 department and be located the middle part of colloid 1, lower kink 33 stretches out colloid 1 department and is located the middle part of colloid 1, and the upper surface that goes up kink 23 and stretch into colloid 1 part and the upper surface that 33 portions of buckling stretch into colloid 1 part down are at same horizontal plane. The upper connecting portion 22 is bent upwards along the end of the portion of the upper bending portion 23 extending into the glue body 1, and the lower connecting portion 32 is bent downwards along the end of the portion of the lower bending portion 23 extending into the glue body 1.
The utility model discloses a theory of operation: the upper end of a chip 4 is welded on an upper boss 24 of an upper pin 2 through a welding flux 5, the lower end of the chip 4 is welded on a lower boss 34 of a lower pin 3 through the welding flux 5, the upper pin 2, the lower pin 3 and the chip 4 are packaged by a colloid 1, the upper pin 2 is bent to extend out of a colloid part to the lower surface of the colloid 1, the lower pin 3 is bent to extend out of the colloid part to the lower surface of the colloid 1, the upper pin 2 and the lower pin 3 are electrified, when two ends of the chip 4 are subjected to instantaneous high-energy impact, the chip 4 can change the impedance value between the two ends from high impedance to low impedance at a high speed so as to absorb an instantaneous large current, and the voltage at the two ends of the chip 4 is clamped on a preset value, so that a circuit element behind is protected from the impact of transient high.
Thus, the assembly and working process of the two-piece patch diode with convenient heat dissipation of the preferred embodiment are completed.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so that the scope of the present invention shall be determined by the scope of the appended claims.
Claims (10)
1. The utility model provides a convenient radiating two formula paster diodes which characterized in that includes:
the colloid is used for packaging protection;
one end of the upper pin extends into the colloid, and the other end of the upper pin is connected to the lower surface of the colloid in a bending manner;
one end of the lower pin extends into the colloid, the part of the lower pin extending into the colloid is positioned below the part of the upper pin extending into the colloid, and the other end of the lower pin is positioned on one side far away from the upper pin and is connected to the lower surface of the colloid in a bending manner;
the chip is arranged in the colloid and connected between the upper pin and the lower pin;
the welding flux is connected to the upper end and the lower end of the chip and is used for connecting the chip with the upper pin and the lower pin;
the length of the part of the lower pin connected to the lower surface of the colloid is longer than that of the part of the upper pin connected to the lower surface of the colloid.
2. The two-piece patch diode convenient for heat dissipation according to claim 1, wherein an isolation block is disposed under the encapsulant, the isolation block contacting the end of the portion of the upper lead protruding from the encapsulant, and the isolation block contacting the end of the portion of the lower lead protruding from the encapsulant.
3. The two-piece patch diode convenient for heat dissipation according to claim 1, wherein the upper lead comprises a pressing plate, an upper connecting portion and an upper bending portion, the pressing plate is connected above the chip, the upper connecting portion is connected with the pressing plate and the upper bending portion, one end of the upper bending portion is connected in the glue body, and the other end of the upper bending portion is connected to the lower surface of the glue body in a bending manner.
4. The two-piece patch diode convenient for heat dissipation according to claim 3, wherein the lower lead comprises a support plate, a lower connecting portion and a lower bending portion, the support plate is connected below the chip, the lower connecting portion is connected with the support plate and the lower bending portion, one end of the lower bending portion is connected in the glue body, and the other end of the lower bending portion is connected to the lower surface of the glue body in a bending manner.
5. The two-piece chip diode facilitating heat dissipation according to claim 4, wherein an upper boss is disposed below the pressing plate, the solder is connected below the upper boss, a lower boss is disposed above the support plate, and the solder is connected above the lower boss.
6. The two-chip patch diode for facilitating heat dissipation of claim 5, wherein the cross-sectional area of the upper boss is smaller than the area of the cross-section of the chip, and the cross-sectional area of the lower boss is smaller than the area of the cross-section of the chip.
7. The two-piece patch diode facilitating heat dissipation according to claim 5, wherein the width of the pressing plate is greater than the width of the upper connecting portion, the width of the upper connecting portion is consistent with the width of the upper bending portion, and the cross-sectional area of the pressing plate is greater than the cross-sectional area of the upper boss;
the width of the support plate is larger than that of the lower connecting part, the width of the lower connecting part is consistent with that of the lower bending part, and the cross section area of the support plate is larger than that of the lower boss.
8. The two-piece patch diode convenient for heat dissipation according to claim 1, wherein the gel is block-shaped, the upper surface and the lower surface of the gel are parallel, and the middle parts of two sides of the gel connected with the upper pin and the lower pin are protruded outwards.
9. The two-piece patch diode convenient for heat dissipation according to claim 4, wherein the position of the upper bending portion extending out of the gel is located in the middle of the gel, the position of the lower bending portion extending out of the gel is located in the middle of the gel, and the upper surface of the portion of the upper bending portion extending into the gel and the upper surface of the portion of the lower bending portion extending into the gel are at the same horizontal plane.
10. The two-piece patch diode convenient for heat dissipation according to claim 9, wherein the upper connection portion is bent upward along the end of the upper bending portion extending into the gel portion, and the lower connection portion is bent downward along the end of the lower bending portion extending into the gel portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021864149.1U CN212625562U (en) | 2020-08-27 | 2020-08-27 | Two-piece type surface-mounted diode convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021864149.1U CN212625562U (en) | 2020-08-27 | 2020-08-27 | Two-piece type surface-mounted diode convenient for heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212625562U true CN212625562U (en) | 2021-02-26 |
Family
ID=74704971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021864149.1U Active CN212625562U (en) | 2020-08-27 | 2020-08-27 | Two-piece type surface-mounted diode convenient for heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212625562U (en) |
-
2020
- 2020-08-27 CN CN202021864149.1U patent/CN212625562U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214505484U (en) | Packaging structure of power semiconductor device and power module | |
| CN211719597U (en) | SMD diode with heat release short circuit prevention structure | |
| CN209804635U (en) | Large-current semiconductor power device beneficial to welding | |
| CN212625562U (en) | Two-piece type surface-mounted diode convenient for heat dissipation | |
| CN212625569U (en) | Patch diode of multi-chip lamination | |
| CN214428637U (en) | Silicon carbide Schottky diode structure | |
| CN212625543U (en) | High-power double-boss patch diode | |
| CN211719583U (en) | Chip inclined vertical semiconductor device packaging structure | |
| CN210200717U (en) | Silicon controlled rectifier adopting insulation encapsulation | |
| CN112259517A (en) | Photovoltaic module bypass element soldering lug, bypass protection element module and junction box | |
| CN218215295U (en) | High-reliability surface-mounted diode | |
| CN213716872U (en) | Anti-interference high-power silicon carbide diode packaging structure | |
| CN213401176U (en) | Firm-welding patch type semiconductor device | |
| CN213401177U (en) | Multi-pin semiconductor device with internal connection structure | |
| CN219017645U (en) | Packaging structure applied to planar power device | |
| CN212782904U (en) | Simplified patch type piezoresistor | |
| CN104966774A (en) | Reverse-buckling type small-dimension large-power LED packaging structure | |
| CN216212604U (en) | Chip thermistor capable of reducing mounting height | |
| CN212517189U (en) | Novel common cathode diode packaging structure | |
| CN218333782U (en) | Electron cigarette chip foot position heat radiation structure | |
| CN214384751U (en) | High-power diode easy to process | |
| CN213401213U (en) | SMD diode with dampproofing structure | |
| CN210535658U (en) | Improved generation lead frame | |
| CN220896670U (en) | DPIM power switch module | |
| CN218039187U (en) | Packaging structure applied to planar power device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |