CN212570960U - Flexible substrate manufacturing device - Google Patents
Flexible substrate manufacturing device Download PDFInfo
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- CN212570960U CN212570960U CN202021826838.3U CN202021826838U CN212570960U CN 212570960 U CN212570960 U CN 212570960U CN 202021826838 U CN202021826838 U CN 202021826838U CN 212570960 U CN212570960 U CN 212570960U
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- adhesion area
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- flexible material
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Abstract
The utility model discloses a flexible substrate making devices, include: a carrier plate having a low adhesion area and a high adhesion area thereon, the high adhesion area being disposed around the low adhesion area; a flexible material layer formed on the carrier plate, the flexible material layer covering the low adhesion area and the high adhesion area; the flexible material layer comprises a flexible substrate area and a to-be-cut area, the flexible substrate area is located on the low adhesion area, and the to-be-cut area is located on the high adhesion area. The application forms a low adhesion area in the middle and a high adhesion area at the edge on the carrier plate. The high adhesion area can prevent the flexible material layer and the carrier plate from falling off in the subsequent processing procedure; and finally, the high-adhesion flexible material layer positioned at the edge can be cut off, only the flexible material layer in the low-adhesion area is reserved as the flexible substrate, and the low-adhesion area is low in adhesion between the flexible material layer and the carrier plate, so that the separation can be conveniently realized.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a flexible substrate making devices.
Background
In the process of manufacturing a flexible display product, a flexible substrate is usually formed on a relatively rigid carrier, then an electronic device is manufactured on the flexible substrate, and finally the flexible substrate is separated from the carrier.
In order to separate the flexible substrate from the carrier, some prior arts are prone to damage the electronic device by using methods such as high-temperature heating, ultraviolet irradiation, ion bombardment, and the like.
SUMMERY OF THE UTILITY MODEL
In view of this, an object of the present invention is to provide a flexible substrate manufacturing apparatus, which can separate a flexible substrate from a carrier more conveniently.
In order to realize the purpose, the utility model discloses a technical scheme is: provided is a flexible substrate manufacturing apparatus including:
a carrier plate having a low adhesion area and a high adhesion area thereon, the high adhesion area being disposed around the low adhesion area;
a flexible material layer formed on the carrier plate, the flexible material layer covering the low adhesion area and the high adhesion area;
the flexible material layer comprises a flexible substrate area and a to-be-cut area, the flexible substrate area is located on the low adhesion area, and the to-be-cut area is located on the high adhesion area.
Preferably, an easily separable coating is laminated on the carrier plate; the area of the easily separable coating forms a low adhesion area, and the area of the carrier plate without the easily separable coating forms a high adhesion area.
Preferably, the easily separable coating is an OC film layer.
Preferably, the flexible material layer is a polymer film.
Preferably, the polymer film is polyimide.
Preferably, the carrier plate is a hard plate.
Preferably, the carrier plate is a glass carrier plate.
Compared with the prior art, the utility model discloses beneficial effect as follows:
the application forms a low adhesion area in the middle and a high adhesion area at the edge on the carrier plate. After the flexible material layer is formed on the carrier plate, the adhesive force between the peripheral flexible material layer and the carrier plate is larger, so that the flexible material layer and the carrier plate can be prevented from falling off in the subsequent processing process; and finally, the high-adhesion flexible material layer positioned at the edge can be cut off, only the flexible material layer in the low-adhesion area is reserved as the flexible substrate, and the low-adhesion area is low in adhesion between the flexible material layer and the carrier plate, so that the separation can be conveniently realized.
Drawings
Fig. 1 is a schematic structural diagram of a flexible substrate manufacturing apparatus according to an embodiment of the present invention;
fig. 2 is a schematic view after a carrier sheet is formed with a frangible coating;
FIG. 3 is a top view of the flexible substrate manufacturing apparatus shown in FIG. 2;
fig. 4 is a schematic view of a cutting line of a flexible substrate manufacturing apparatus according to an embodiment of the present invention during cutting;
FIG. 5 is a schematic view of the flexible material layer after cutting the area to be cut;
fig. 6 is a schematic diagram of the flexible material layer separated from the carrier.
Reference numerals:
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1 to 5. The embodiment of the utility model provides a pair of flexible substrate making devices.
The flexible substrate manufacturing device comprises a carrier plate and a flexible material layer formed on the carrier plate.
The carrier plate is a hard plate and can be made of plastics, glass, metal and the like. Preferably a glass carrier plate.
The carrier plate has a low adhesion area and a high adhesion area disposed around the low adhesion area. In the high adhesion area the adhesion between the flexible material layer and the carrier plate is greater than 4B. In the low adhesion area the adhesion between the flexible material layer and the carrier plate is less than 2B, preferably close to 0B.
The flexible material layer covers the low adhesion area and the high adhesion area.
The flexible material layer covered on the high-adhesion area forms a region to be cut, the adhesion between the flexible material layer and the carrier plate is large, and the flexible material layer and the carrier plate can be prevented from falling off in the subsequent processing process; this portion of the flexible material layer is used only for fixation and finally the high adhesion flexible material layer at the edge needs to be cut away, leaving only the low adhesion area of the flexible material layer.
Wherein the layer of flexible material overlying the low adhesion area forms a flexible substrate region.
Preferably, the flexible material layer is a polymer film. Further, the polymer film is Polyimide (PI).
The application forms a low adhesion area in the middle and a high adhesion area at the edge on the carrier plate. After the flexible material layer is formed on the carrier plate, the adhesive force between the peripheral flexible material layer and the carrier plate is larger, so that the flexible material layer and the carrier plate can be prevented from falling off in the subsequent processing process; and finally, the high-adhesion flexible material layer positioned at the edge can be cut off, only the flexible material layer in the low-adhesion area is reserved as the flexible substrate, and the low-adhesion area is low in adhesion between the flexible material layer and the carrier plate, so that the separation can be conveniently realized.
More specifically, the carrier plate is laminated with the easily separable coating, and a low adhesion area is formed in the area where the easily separable coating is located. The areas of the carrier plate without the frangible coating form areas of high adhesion. In a preferred embodiment, the frangible coating is an OC film layer.
OC is the abbreviation of over coat, and OC film layer is a photosensitive resin film. The OC material is composed of polyimide resin, acrylic resin, photosensitizer and the like.
The preparation method comprises the following steps:
(1) as shown in fig. 2 and 3, an OC film is first applied on the glass carrier, and the OC film is about 10mm away from a single edge of the edge glass carrier;
(2) then, a polyimide film is coated on the glass carrier, as shown in fig. 1. The part of the edge which is not coated with the OC film layer is the direct contact of glass and the polyimide film, the adhesion force is 5B, the adhesion force is larger, and the falling of the flexible material layer and the carrier plate in the subsequent TFT process can be prevented. The adhesion force between the polyimide and the glass carrier plate at the position with the OC film layer at the center is close to 0B, and the polyimide can be conveniently separated from the glass carrier plate subsequently.
(3) The TFT process is performed on the polyimide film, and a display unit is formed and packaged as shown in fig. 4.
(4) Finally, the polyimide film can be cut off where the OC film layer is not coated at the edge, as shown in FIG. 5.
(5) And then the separation of the polyimide film and the glass carrier plate can be conveniently realized, as shown in figure 6.
Compared with the prior art, the utility model discloses beneficial effect as follows:
the application forms a low adhesion area in the middle and a high adhesion area at the edge on the carrier plate. After the flexible material layer is formed on the carrier plate, the adhesive force between the peripheral flexible material layer and the carrier plate is larger, so that the flexible material layer and the carrier plate can be prevented from falling off in the subsequent processing process; and finally, the high-adhesion flexible material layer positioned at the edge can be cut off, only the flexible material layer in the low-adhesion area is reserved as the flexible substrate, and the low-adhesion area is low in adhesion between the flexible material layer and the carrier plate, so that the separation can be conveniently realized.
It will be understood that modifications and variations can be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the appended claims.
Claims (7)
1. A flexible substrate manufacturing apparatus, comprising:
a carrier plate having a low adhesion area and a high adhesion area thereon, the high adhesion area being disposed around the low adhesion area;
a flexible material layer formed on the carrier plate, the flexible material layer covering the low adhesion area and the high adhesion area;
the flexible material layer comprises a flexible substrate area and a to-be-cut area, the flexible substrate area is located on the low adhesion area, and the to-be-cut area is located on the high adhesion area.
2. The apparatus according to claim 1, wherein a release coating is laminated on the carrier; the area of the easily separable coating forms a low adhesion area, and the area of the carrier plate without the easily separable coating forms a high adhesion area.
3. The flexible substrate fabrication apparatus of claim 2, wherein the frangible coating is an OC film layer.
4. The flexible substrate fabrication apparatus of claim 1, wherein the layer of flexible material is a polymer film.
5. The flexible substrate fabrication apparatus of claim 4, wherein the polymer film is polyimide.
6. The apparatus according to claim 1, wherein the carrier plate is a rigid plate.
7. The apparatus of claim 1, wherein the carrier is a glass carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021826838.3U CN212570960U (en) | 2020-08-27 | 2020-08-27 | Flexible substrate manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021826838.3U CN212570960U (en) | 2020-08-27 | 2020-08-27 | Flexible substrate manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212570960U true CN212570960U (en) | 2021-02-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021826838.3U Active CN212570960U (en) | 2020-08-27 | 2020-08-27 | Flexible substrate manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212570960U (en) |
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2020
- 2020-08-27 CN CN202021826838.3U patent/CN212570960U/en active Active
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