CN212570958U - Pick-and-place head frame for semiconductor wafer processing equipment - Google Patents
Pick-and-place head frame for semiconductor wafer processing equipment Download PDFInfo
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- CN212570958U CN212570958U CN202021238645.6U CN202021238645U CN212570958U CN 212570958 U CN212570958 U CN 212570958U CN 202021238645 U CN202021238645 U CN 202021238645U CN 212570958 U CN212570958 U CN 212570958U
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Abstract
The utility model discloses a get and put headstock for semiconductor wafer processing equipment designs the semiconductor processing field, especially is used for the semiconductor to get the blowing, get the head including the bush support with getting, get and put the head setting on the bush support. And adopt the air duct to directly set up in the slip joint hole to current getting to put the head, in the installation through-hole of this application, produce wearing and tearing easily and improved. In the field, a semiconductor processing sorting machine integrates multiple functions of optical inspection, printing and the like, so that the working frequency of the pick-and-place head is very high, certain brands reach the frequency of more than ten times per second, and air leakage is easily caused by abrasion only by adopting a connection mode of an air guide pipe and a sliding connection hole, and finally the work of picking and placing materials cannot be finished.
Description
Technical Field
The utility model belongs to the technical field of electronic components detects and specifically relates to a get and put headstock that is used for semiconductor wafer processing equipment is related to.
Background
In the field, a semiconductor processing sorting machine integrates multiple functions of optical inspection, printing and the like, so that the working frequency of the pick-and-place head is very high, certain brands reach the frequency of more than ten times per second, and air leakage is easily caused by abrasion only by adopting a connection mode of an air guide pipe and a sliding connection hole, and finally the work of picking and placing materials cannot be finished.
Such as chinese patent CN201710638073.7 sorter. The technical scheme of the pick-and-place head part comprises a driving shaft fixedly connected with a turntable driving part and a disc part driven to rotate by the turntable driving part, wherein each suction nozzle is fixedly arranged at the outer edge of the disc part, each suction nozzle comprises a suction nozzle seat fixedly arranged at the outer edge of the disc part, a first sliding connection hole for allowing a suction nozzle air pipe to pass through is arranged on the suction nozzle seat, a first plug is arranged at the top of the suction nozzle air pipe, the suction nozzle further comprises a mounting seat, one end of the mounting seat pushes the first plug and the other end of the mounting seat push the first elastic part of the suction nozzle seat, the turntable device further comprises a pressing component fixedly arranged on a stator component and used for pressing the suction nozzle air pipe, and the pressing component comprises a mounting seat fixedly connected with the stator component and provided with a second sliding connection hole extending downwards, a pressing motor, a, The pressing assembly comprises a pressing motor, a pressing cam, a pressing column and a second elastic piece, wherein the pressing cam is fixed on a motor shaft of the pressing motor and driven by the pressing motor to rotate, the pressing column is inserted in the second sliding connection hole in a sliding mode and used for abutting against the suction nozzle air pipe to enable the suction nozzle air pipe to slide up and down, the pressing column is provided with a second plug at the top, and the pressing assembly further comprises a second elastic piece, one end of the second elastic piece abuts against and pushes the second plug, and the other end of the second elastic piece abuts against and pushes the mounting seat.
It can be seen that the air duct is directly arranged in the sliding connection hole in the pick-and-place head in the prior art, so that the air duct is easily abraded with the sliding connection hole due to mutual friction under the working condition of high frequency. Meanwhile, when the reciprocating pressing-down and bouncing actions are continuously carried out, the suction head is easy to rotate, so that the position of the semiconductor wafer when the semiconductor wafer is placed down is influenced, and meanwhile, the twisted air duct is easy to cause air leakage.
Disclosure of Invention
The utility model aims to solve the problem that to the shortcoming among the above-mentioned prior art, put forward improvement scheme or alternative, especially one kind improves gets stability and the accuracy of putting the head when getting the material, reduces the wear rate of air duct, improves the life of air duct, places and gets the rotatory improvement of head or alternative.
In order to solve the above problem, the utility model discloses a scheme as follows: a pick-and-place head frame for semiconductor wafer processing equipment comprises a lining support and a pick-and-place head, and is characterized in that the lining support is provided with an installation through hole and a fixing screw hole; the taking and placing head is arranged in the mounting through hole; the taking and placing head comprises an air guide head, an air guide pipe, a clamping block, a suction nozzle, a compression spring and a slide rail combination; the slide rail combination is arranged in the mounting through hole; the air guide head is connected with the clamping block through an air guide pipe; the suction nozzle is arranged at the bottom of the clamping block; the air guide pipe is arranged in the slide rail combination; the compression spring is arranged between the air guide head and the lining support; the slide rail combination comprises a miniature ball guide rail, a miniature ball slide block and a sleeve plug; the miniature ball sliding block is arranged in the miniature ball guide rail, and the upper part of the miniature ball guide rail is blocked by a sleeve plug; the centers of the sleeve plug and the micro ball sliding block are provided with through holes for arranging air ducts; the micro ball sliding block can move in the micro ball guide rail; the miniature ball guide rail is arranged in the mounting through hole on the bushing bracket.
Further, according to the above design scheme, the pick-and-place head frame for semiconductor wafer processing equipment is characterized in that the slide rail assembly further comprises a gasket, and a through hole is formed in the center of the gasket and used for arranging an air guide pipe; the gasket is arranged in the mounting through hole, and the bottom of the mounting through hole is provided with a circle of bearing platform; the miniature ball guide rail is arranged on the gasket, and the miniature ball sliding block is limited to move in the miniature ball guide rail through the gasket and the sleeve plug.
Further, according to the above design scheme, the pick-and-place head frame for semiconductor wafer processing equipment is characterized in that the clamping block is of a right-angle structure, and is provided with a mounting through hole and a sliding rod; the air guide pipe is arranged in the mounting through hole and is fixed by a stop screw; and the lining support is provided with a sliding connection hole matched with the sliding rod and used for arranging the sliding rod.
Further, according to the above design scheme, the pick-and-place head frame for semiconductor wafer processing equipment is characterized in that a kidney-shaped hole is formed in the middle of the bushing support and used for being placed on a vent pipe communicated with the gas guide head; the upper end of the air guide head is provided with a pressing component, and the pressing component comprises a static support and a dynamic support; the dynamic support is movably arranged on the static support and is driven by a servo motor to reciprocate up and down on the static support; the bottom of dynamic support is equipped with the push rod, the bottom setting of push rod is at the top of air guide head.
Furthermore, according to the above design scheme, the taking and placing head frame for the semiconductor wafer processing equipment is characterized in that the air guide tube is fixedly arranged in the upper half part of the installation through hole, the lower half part of the installation through hole is provided with a positioning plane, the suction nozzle is provided with a positioning plane matched with the suction nozzle, and the suction nozzle is fixed through a stop screw after being inserted into the lower half part of the installation through hole.
Further, according to the above design scheme, the pick-and-place head frame for semiconductor wafer processing equipment is characterized in that a flange type oilless sleeve is arranged in the sliding connection hole, and the slide rod is arranged in the sliding connection hole through the flange type oilless sleeve.
The technical effects of the utility model are as follows: the utility model provides a get and put head and adopt the slide rail combination to separate air duct and sliding connection hole (installation through hole), wherein the slide rail combination adopts miniature ball guide and miniature ball slider to carry out the combination that slides, set up miniature ball slider in the miniature ball guide, make miniature ball slider can easily slide in miniature ball guide, and miniature ball slider sets up on the air duct, miniature ball slider is static relatively with the air duct, only move between miniature ball slider and the miniature ball guide, thereby the friction between air duct and installation through hole (sliding connection hole) has been avoided. A positioning plane is adopted between the suction nozzle and the clamping block for position calibration and positioning, the suction nozzle is placed to rotate, a stop screw is adopted for fixation, and air leakage and dislocation movement are further placed.
A slide rod is arranged on the clamping block, and the position of the clamping block is further positioned to prevent the clamping block from rotating; the lining support is provided with a sliding connection hole matched with the slide rod, the slide rod is arranged in the sliding connection hole through a flange type oilless sleeve, the whole pick-and-place head is positioned through the air duct and the slide rod, and the pick-and-place head only moves vertically without rotating when in work.
When the semiconductor wafer clamping device works, the dynamic support of the pressing component moves downwards under the action of the servo motor and the special-shaped wheel to enable the compression spring to compress downwards, the micro ball sliding block is driven to slide downwards in the micro ball guide rail to enable the clamping block and the suction nozzle connected with the air guide pipe to move downwards to the position above the semiconductor wafer, the suction nozzle is pressed on the upper surface of the semiconductor, the air guide pipe is connected with the air guide head and is provided with the air vent pipe, the air vent pipe is connected with the negative pressure device, negative pressure is generated by the negative pressure device, and negative pressure exists in the air guide pipe communicated with the air guide head and the suction nozzle to enable the semiconductor to be adsorbed on the suction. Then the servo motor drives the special-shaped wheel to rotate to a shorter side, so that the dynamic support loosens the pressing of the air guide head, the air guide head bounces under the action of the compression spring, and the suction nozzle is driven to drive the semiconductor wafer to bounce. Then the work platform is transferred to other work positions under the action of the large turntable. The servo motor continuously runs in the whole process, and the working frequency of the servo motor is very high. The requirement for lower friction performance is very high.
Drawings
Fig. 1 is an exploded view of the pick-and-place head frame.
Fig. 2 shows the pick-and-place headstock after the hold-down assembly is installed.
Fig. 3 is a schematic view of the clamping block and the suction nozzle.
Fig. 4 is a schematic structural view when the suction nozzle is lifted.
Fig. 5 is a schematic view of the structure of the suction nozzle when it is pressed down.
Wherein, 1 is the air guide head, 2 is the bush support, 3 is the sleeve stopper, 4 is the air duct, 5 is compression spring, 6 is miniature ball guide rail, 7 is miniature ball slider, 8 is flange formula oil free sleeve pipe, 9 is the gasket, 10 is the clamp block, 11 is the suction nozzle, 12 is the slide bar, 13 is static support, 14 is dynamic support, 15 is servo motor.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b): a pick-and-place head frame for semiconductor wafer processing equipment comprises a lining support and a pick-and-place head, and is characterized in that the lining support is provided with an installation through hole and a fixing screw hole; the taking and placing head is arranged in the mounting through hole; the taking and placing head comprises an air guide head, an air guide pipe, a clamping block, a suction nozzle, a compression spring and a slide rail combination; the slide rail combination is arranged in the mounting through hole; the air guide head is connected with the clamping block through an air guide pipe; the suction nozzle is arranged at the bottom of the clamping block; the air guide pipe is arranged in the slide rail combination; the compression spring is arranged between the air guide head and the lining support; the slide rail combination comprises a miniature ball guide rail, a miniature ball slide block and a sleeve plug; the miniature ball sliding block is arranged in the miniature ball guide rail, and the upper part of the miniature ball guide rail is blocked by a sleeve plug; the centers of the sleeve plug and the micro ball sliding block are provided with through holes for arranging air ducts; the micro ball sliding block can move in the micro ball guide rail; the miniature ball guide rail is arranged in the mounting through hole on the bushing bracket; the slide rail combination also comprises a gasket, and a through hole is formed in the center of the gasket and used for arranging an air guide pipe; the gasket is arranged in the mounting through hole, and the bottom of the mounting through hole is provided with a circle of bearing platform; the miniature ball guide rail is arranged on the gasket, and the miniature ball sliding block is limited to move in the miniature ball guide rail through the gasket and the sleeve plug; the clamping block is of a right-angle structure, and is provided with a mounting through hole and a sliding rod; the air guide pipe is arranged in the mounting through hole and is fixed by a stop screw; the bushing bracket is provided with a sliding connection hole matched with the sliding rod and used for arranging the sliding rod; the middle part of the bushing bracket is provided with a waist-shaped hole for being placed on a vent pipe communicated with the gas guide head; the upper end of the air guide head is provided with a pressing component, and the pressing component comprises a static support and a dynamic support; the dynamic support is movably arranged on the static support and is driven by a servo motor to reciprocate up and down on the static support; the bottom of the dynamic support is provided with a push rod, and the bottom end of the push rod is arranged at the top of the air guide head; the air guide pipe is fixedly arranged in the upper half part of the mounting through hole, the lower half part of the mounting through hole is provided with a positioning plane, the suction nozzle is provided with a positioning plane matched with the suction nozzle, and the suction nozzle is fixed by a stop screw after being inserted into the lower half part of the mounting through hole; and a flange type oilless sleeve is arranged in the sliding connection hole, and the sliding rod is arranged in the sliding connection hole through the flange type oilless sleeve.
When the semiconductor wafer clamping device works, the dynamic support of the pressing component moves downwards under the action of the servo motor and the special-shaped wheel to enable the compression spring to compress downwards, the micro ball sliding block is driven to slide downwards in the micro ball guide rail to enable the clamping block and the suction nozzle connected with the air guide pipe to move downwards to the position above the semiconductor wafer, the suction nozzle is pressed on the upper surface of the semiconductor, the air guide pipe is connected with the air guide head and is provided with the air vent pipe, the air vent pipe is connected with the negative pressure device, negative pressure is generated by the negative pressure device, and negative pressure exists in the air guide pipe communicated with the air guide head and the suction nozzle to enable the semiconductor to be adsorbed on the suction. Then the servo motor drives the special-shaped wheel to rotate to a shorter side, so that the dynamic support loosens the pressing of the air guide head, the air guide head bounces under the action of the compression spring, and the suction nozzle is driven to drive the semiconductor wafer to bounce. Then the work platform is transferred to other work positions under the action of the large turntable. The servo motor continuously runs in the whole process, and the working frequency of the servo motor is very high. The requirement for lower friction performance is very high.
Claims (6)
1. A pick-and-place head frame for semiconductor wafer processing equipment comprises a lining support and a pick-and-place head, and is characterized in that the lining support is provided with an installation through hole and a fixing screw hole; the taking and placing head is arranged in the mounting through hole; the taking and placing head comprises an air guide head, an air guide pipe, a clamping block, a suction nozzle, a compression spring and a slide rail combination; the slide rail combination is arranged in the mounting through hole; the air guide head is connected with the clamping block through an air guide pipe; the suction nozzle is arranged at the bottom of the clamping block; the air guide pipe is arranged in the slide rail combination; the compression spring is arranged between the air guide head and the lining support; the slide rail combination comprises a miniature ball guide rail, a miniature ball slide block and a sleeve plug; the miniature ball sliding block is arranged in the miniature ball guide rail, and the upper part of the miniature ball guide rail is blocked by a sleeve plug; the centers of the sleeve plug and the micro ball sliding block are provided with through holes for arranging air ducts; the micro ball sliding block can move in the micro ball guide rail; the miniature ball guide rail is arranged in the mounting through hole on the bushing bracket.
2. The pick-and-place head frame for semiconductor wafer processing equipment of claim 1, wherein the slide rail assembly further comprises a spacer, the center of the spacer is provided with a through hole for arranging an air duct; the gasket is arranged in the mounting through hole, and the bottom of the mounting through hole is provided with a circle of bearing platform; the miniature ball guide rail is arranged on the gasket, and the miniature ball sliding block is limited to move in the miniature ball guide rail through the gasket and the sleeve plug.
3. The pick-and-place head frame for semiconductor wafer processing apparatus as claimed in claim 1, wherein said clamping blocks are right-angled structures having mounting through holes and slide bars; the air guide pipe is arranged in the mounting through hole and is fixed by a stop screw; and the lining support is provided with a sliding connection hole matched with the sliding rod and used for arranging the sliding rod.
4. The pick-and-place head frame for semiconductor wafer processing apparatus as claimed in claim 1, wherein said bushing holder has a kidney-shaped hole at a middle portion thereof for receiving a vent tube communicating with the gas guide head; the upper end of the air guide head is provided with a pressing component, and the pressing component comprises a static support and a dynamic support; the dynamic support is movably arranged on the static support and is driven by a servo motor to reciprocate up and down on the static support; the bottom of dynamic support is equipped with the push rod, the bottom setting of push rod is at the top of air guide head.
5. A pick-and-place head frame for semiconductor wafer processing equipment as claimed in claim 3, wherein the air duct is fixedly disposed in the upper half of the mounting through hole, the lower half of the mounting through hole is provided with a positioning plane, the suction nozzle is provided with a positioning plane matching therewith, and the suction nozzle is fixed by a set screw after being inserted into the lower half of the mounting through hole.
6. A pick-and-place head frame for semiconductor wafer processing apparatus as claimed in claim 3, wherein a flange-style oilless bushing is disposed in said slide opening, and wherein said slide bar is disposed in the slide opening through the flange-style oilless bushing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021238645.6U CN212570958U (en) | 2020-06-30 | 2020-06-30 | Pick-and-place head frame for semiconductor wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021238645.6U CN212570958U (en) | 2020-06-30 | 2020-06-30 | Pick-and-place head frame for semiconductor wafer processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212570958U true CN212570958U (en) | 2021-02-19 |
Family
ID=74614117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021238645.6U Active CN212570958U (en) | 2020-06-30 | 2020-06-30 | Pick-and-place head frame for semiconductor wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212570958U (en) |
-
2020
- 2020-06-30 CN CN202021238645.6U patent/CN212570958U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210427 Address after: 2 / F, building 6, No. 8, Xinzhong Road, Haining Economic Development Zone, Haining City, Jiaxing City, Zhejiang Province Patentee after: Zhejiang Qingxin Technology Co.,Ltd. Address before: 212300 original badminton hall, science and Innovation Park, No.19, Qiliang Road, Danyang City, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Tongzhen Intelligent Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A pickup and placement head frame for semiconductor wafer processing equipment Effective date of registration: 20211214 Granted publication date: 20210219 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Haining sub branch Pledgor: Zhejiang Qingxin Technology Co.,Ltd. Registration number: Y2021330002525 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220714 Granted publication date: 20210219 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Haining sub branch Pledgor: Zhejiang Qingxin Technology Co.,Ltd. Registration number: Y2021330002525 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |