CN212514719U - Radio frequency large-current high-frequency probe card for wafer test - Google Patents
Radio frequency large-current high-frequency probe card for wafer test Download PDFInfo
- Publication number
- CN212514719U CN212514719U CN202020846057.4U CN202020846057U CN212514719U CN 212514719 U CN212514719 U CN 212514719U CN 202020846057 U CN202020846057 U CN 202020846057U CN 212514719 U CN212514719 U CN 212514719U
- Authority
- CN
- China
- Prior art keywords
- probe
- high frequency
- frequency
- special
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a radio frequency heavy current high frequency probe card for wafer test, concretely relates to heavy current high frequency probe card field, including special PCB board of high frequency and two SMA connectors, be equipped with dedicated SMA connector on the special PCB board of high frequency for with signal of telecommunication transmission to the semiconductor element that awaits measuring, SMA connector inner conductor portion welding probe tail end. The utility model discloses adopt special parts and special treatment at probe and structural, make it be suitable for at the high-frequency band high efficiency more, even the probe shielding functionalization commonly used that adopts and the welding is on printed circuit board, test through the contact, structurally probably all shield the product of guaranteeing true characteristic with silver material on each node of electric current characteristic, electric connection between special PCB board of high frequency and the SMA connector is unblocked, reduce the signal of telecommunication among the signal transmission and run off, thereby high frequency test demand has been satisfied.
Description
Technical Field
The utility model relates to a heavy current high frequency probe card technical field, more specifically say, the utility model relates to a radio frequency heavy current high frequency probe card for wafer test.
Background
Since the advent of smart phones, mobile data traffic has increased explosively, and with the advent of further intellectualization in the future, user-centric (flip phones, tablet computers) terminal devices and inter-device communication terminals (tip sensors, tip black boxes), this trend will be further accelerated, constantly pursuing faster speeds. Communication technology changes place great demands on surface acoustic wave filter chips. Compared with the shipment volume of mobile phones, with the development change of the communication era, the frequency range to be covered is increased, so that a surface acoustic wave filter chip must be carried, and the carrying amount required is increased in proportion; the surface acoustic wave filter is an essential component for operations such as radio frequency, Wi-Fi, Bluetooth and national mobile communication authentication carried on a smart phone, and the high-frequency test probe card is a device for detecting whether the chip has defects.
The large-current high-frequency probe card is used as a high-frequency wafer testing device for detecting whether a 4G/5G Surface Acoustic Wave Filter (Surface Acoustic Wave Filter) chip has defects or not. The prior testing device adopts a cantilever type probe to be solidified on a PCB by resin, and the used probe has certain current limit, so the testing device is not in line with the testing of high-current high-frequency parameters; the traditional probe card manufacturing method is difficult to achieve the applicable frequency band above 1Ghz, and as for the existing probe card, the signal transmission path is complex in structure, the signal path lengths such as the welding length of an alignment pin and a PCB (printed circuit board) are difficult, and as a result, the distortion phenomenon of an electric signal is frequent, and the problem of limitation on large current and high-frequency signals is solved.
Disclosure of Invention
In order to overcome the above defects in the prior art, embodiments of the present invention provide a radio frequency large current high frequency probe card for wafer testing, and the technical problem to be solved by the present invention is: how to more safely test the surface acoustic wave filter core suitable for 4G/5G communication and solve the problem of high-frequency test which cannot be solved by the traditional resin probe card.
In order to achieve the above object, the utility model provides a following technical scheme: a radio frequency heavy current high frequency probe card for wafer test comprises a high frequency special PCB board and two SMA connectors, wherein the tail part of a probe is welded on the inner conductor part of the SMA connector, the head part of the probe, which is far away from one end of the SMA connector, is plated with silver alloy, an insulating tube is fixedly arranged between the head part of the probe and the tail part of the probe, a copper tube cable is fixedly arranged on the outer wall of the insulating tube, an inserting hole is arranged at the joint of the high frequency special PCB board and the SMA connector, epoxy resin is filled between the inserting hole and the SMA connector for fixation, a first shielding coating is arranged between one end of the inserting hole and the SMA connector, the non-shielding needle at the head part and the tail part of the probe is fixed on a ceramic ring through special epoxy resin, a shielding copper plate is fixedly arranged on the outer resin wall of the probe internally fixed by the ceramic ring, and a second shielding, two anti-noise processing plating layers are fixedly arranged on one side, away from the ceramic ring, of the high-frequency special PCB, and a through hole is formed between each anti-noise processing plating layer and the high-frequency special PCB.
In a preferred embodiment, a copper tube cable and an insulating tube are arranged between the probe tail part and the probe head part.
In a preferred embodiment, the probe head and the outer wall of the shielding copper plate are provided with silver coatings, the first shielding coating, the third shielding coating and the second shielding coating are all made of silver-tin alloy silver-based electroplating materials, and the silver-based electroplating materials are coated on the high-frequency special PCB and the high-frequency transmission SMA connector, so that outward leakage current and noise can be protected and blocked; the tail part and the head part of the probe are plated with special silver alloy materials to ensure smooth current and improve the conductivity of the probe.
In a preferred embodiment, the insulating tube and the copper tube cable are both arranged in a hollow mode, the inner diameter of the copper tube cable is larger than the outer diameter of the insulating tube, and the inner diameter of the insulating tube is larger than the outer diameter of the probe head.
In a preferred embodiment, the insulating tube is made of a polyimide material, the noise-proof coating layer is formed as an organic OSP, the high-frequency-dedicated PCB and the probe tail portion are fixed on the ceramic ring with an epoxy resin, then the probe tail portion surface for testing is covered with a shielding copper plate, and the shielding copper plate and the high-frequency-dedicated PCB are welded with a second shielding coating layer, so that current leakage and noise interference can be completely blocked when a test chip is detected, and smooth performance of the test can be ensured, the noise-proof coating layer is applied on the upper surface of the high-frequency-dedicated PCB, and double coating is performed with a third shielding coating layer, and the probe tail portion and the shielding copper plate are protected from electromagnetic field interference, so as to ensure high-frequency testing.
The utility model discloses a technological effect and advantage:
the utility model discloses break current mode, propose brand-new wafer testing arrangement, probe and structural special parts and special treatment of adoption promptly, it is suitable for to make it at high-band high efficiency more, adopt the thin needle that epoxy solidification is commonly used and the welding on printed circuit board promptly, test through the contact, all shield the product of guaranteeing true characteristic with silver material on each node that may disturb the current characteristic, electric connection between high frequency special PCB board and the SMA connector is unblocked, reduce the signal of telecommunication among the signal transmission and run off, high-band signal test has been guaranteed, thereby high frequency test demand has been satisfied, can test high frequency channel chip more effectively, with guarantee chip quality, the stable test of complicated and unstable high frequency channel test range in the past has been realized.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic structural diagram of the SMA connector of the present invention.
Fig. 3 is the utility model discloses a special PCB plate structure schematic diagram of high frequency.
The reference signs are: the device comprises a 10 SMA connector, a 11 copper tube cable, a 12 insulating tube, a 13 probe tail, a 14 first shielding coating, a 15 ceramic ring, a 16 third shielding coating, a 17 probe head, a 18 shielding copper plate, a 19 second shielding coating, a 20 high-frequency special PCB, a 21 insertion hole and a 22 anti-noise processing plating layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a radio frequency heavy current high frequency probe card for wafer test, including special PCB board 20 of high frequency and two SMA connectors 10, SMA connector 10 inner conductor portion welding probe afterbody 13, probe afterbody 13 keeps away from SMA connector 10 one end probe head 17 and has plated silver alloy, fixed insulating tube 12 that is equipped with between probe head 17 and the probe afterbody 13, insulating tube 12 outer wall is fixed and is equipped with copper pipe cable 11, the special PCB board 20 of high frequency is equipped with patchhole 21 with SMA connector 10 junction, it fixes to fill epoxy between patchhole 21 and SMA connector 10, be equipped with first shielding coating 14 between patchhole 21 one end and SMA connector 10, the unshielded needle of probe head 17 and probe afterbody 13 is fixed in ceramic ring 15 through special epoxy at the position, ceramic ring 15 is fixed with shielding copper 18 including the resin outer wall of fixed probe, a second shielding coating 19 is arranged between the shielding copper plate 18 and the high-frequency special PCB, two anti-noise processing plating layers 22 are fixedly arranged on one side of the high-frequency special PCB 20, which is far away from the ceramic ring 15, and a through hole is formed between the two anti-noise processing plating layers 22 and the high-frequency special PCB 20;
a copper pipe cable 11 and an insulating pipe 12 are arranged between the probe tail part 13 and the probe head part 17, silver coatings are arranged on the outer walls of the probe head part 17 and the shielding copper plate 18, the silver coatings, the first shielding coating 14, the third shielding coating 16 and the second shielding coating 19 are all silver-based electroplating materials of silver-tin alloy, and the silver-based electroplating materials are coated on the high-frequency special PCB 20 and the SMA connector 10 with the high-frequency transmission function, so that outward leakage current and noise can be protected and blocked; the probe tail part 13 and the probe head part 17 are plated with special silver alloy materials to ensure smooth current and improve the conductivity of the probe, the insulating tube 12 and the copper tube cable 11 are both arranged in a hollow way, the inner diameter of the copper tube cable 11 is larger than the outer diameter of the insulating tube 12, the inner diameter of the insulating tube 12 is larger than the outer diameter of the probe head part 17, the insulating tube 12 is made of polyimide materials, the anti-noise processing plating layer 22 is set to be organic OSP, the high-frequency special PCB 20 and the probe tail part 13 are fixed on the ceramic ring 15 by epoxy resin, then the surface of the probe tail part 13 for testing is covered by the shielding copper plate 18, the shielding copper plate 18 and the high-frequency special PCB 20 are welded by the second shielding coating 19, thus the current leakage and the noise interference can be completely blocked when a testing chip is detected, the testing is ensured to be smoothly executed, the anti-noise processing plating, and double-coated with a third shield coating 16 to prevent electromagnetic field interference with the probe tail 13 and the shield copper plate 18 to ensure high frequency testing.
As shown in fig. 1 to 3, the embodiment specifically is as follows: inserting the probe head 17 plated with silver by gold plating technique on the polyimide insulating tube 12 for preventing leakage short circuit, then inserting the insulating tube 12 inserted with the probe head 17 into the copper tube cable 11 with shielding function according with high frequency signal, and jointing the copper tube cable 11 with the SMA connector 10 according with high frequency section characteristic by welding and fixing way to complete the first construction, inserting the SMA connector 10 into the predetermined insertion hole 21 of the special high frequency PCB 20, fixing with epoxy resin, coating the first shielding coating 14 for preventing interference and shielding function, fixing the probe tail assembly on the ceramic ring 15 at the testing surface of the special high frequency PCB with special high temperature epoxy resin, then covering the probe tail 13 surface for testing with the shielding copper plate 18, coating the second shielding coating 19 on the copper tube cable 11, The joint part of the copper plate 18 and the high-frequency special PCB 20 is shielded, so that a probe device with strong anti-interference and anti-signal distortion is realized, the test of high-frequency signals is ensured, the precise test can be carried out on specific frequency filtering radio frequency components required by communication of mobile phones and the like, and the test function of products with special high-frequency test requirements is realized.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A radio frequency large current high frequency probe card for wafer test, which comprises a PCB (20) special for high frequency and two SMA connectors (10), and is characterized in that: the probe tail part (13) is welded on the inner conductor part of the SMA connector (10), the probe head part (17) of one end, far away from the SMA connector (10), of the probe tail part (13) is plated with silver alloy, an insulating tube (12) is fixedly arranged between the probe head part (17) and the probe tail part (13), a copper tube cable (11) is fixedly arranged on the outer wall of the insulating tube (12), an inserting hole (21) is formed in the joint of the high-frequency special PCB (20) and the SMA connector (10), epoxy resin is filled between the inserting hole (21) and the SMA connector (10) for fixation, a first shielding coating (14) is arranged between one end of the inserting hole (21) and the SMA connector (10), unshielded needles of the probe head part (17) and the probe tail part (13) are fixed on a ceramic ring (15) through special epoxy resin, and the ceramic ring (15) is fixedly provided with a shielding outer wall (18) of the copper plate probe, be equipped with second shielding coating (19) between shielding copper (18) and the special PCB board of high frequency, special PCB board of high frequency (20) keep away from ceramic ring (15) one side fixed and are equipped with two noise control and handle cladding material (22), two the through-hole has been seted up between noise control and handle cladding material (22) and special PCB board of high frequency (20).
2. The radio frequency high current high frequency probe card for wafer test as claimed in claim 1, wherein: a copper tube cable (11) and an insulating tube (12) are arranged between the probe tail (13) and the probe head (17).
3. The radio frequency high current high frequency probe card for wafer test as claimed in claim 1, wherein: the outer walls of the probe head (17) and the shielding copper plate (18) are respectively provided with a silver coating, and the silver coatings, the first shielding coating (14), the third shielding coating (16) and the second shielding coating (19) are all made of silver-based electroplating materials of silver-tin alloy.
4. The radio frequency high current high frequency probe card for wafer test as claimed in claim 1, wherein: insulating tube (12) and copper pipe cable (11) all cavity and set up, copper pipe cable (11) internal diameter is greater than insulating tube (12) external diameter, insulating tube (12) internal diameter is greater than the probe external diameter.
5. The radio frequency high current high frequency probe card for wafer test as claimed in claim 1, wherein: the insulating tube (12) is made of polyimide material, and the noise-proof treatment coating (22) is set to be organic OSP.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020846057.4U CN212514719U (en) | 2020-05-20 | 2020-05-20 | Radio frequency large-current high-frequency probe card for wafer test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020846057.4U CN212514719U (en) | 2020-05-20 | 2020-05-20 | Radio frequency large-current high-frequency probe card for wafer test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212514719U true CN212514719U (en) | 2021-02-09 |
Family
ID=74380047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020846057.4U Active CN212514719U (en) | 2020-05-20 | 2020-05-20 | Radio frequency large-current high-frequency probe card for wafer test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212514719U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337592A (en) * | 2017-02-24 | 2019-10-15 | 泰克诺探头公司 | Measuring head with improved frequency performance |
| CN113393894A (en) * | 2021-05-31 | 2021-09-14 | 西安理工大学 | Voltage-current characteristic testing system of resistive random access memory under irradiation environment |
-
2020
- 2020-05-20 CN CN202020846057.4U patent/CN212514719U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337592A (en) * | 2017-02-24 | 2019-10-15 | 泰克诺探头公司 | Measuring head with improved frequency performance |
| US11828774B2 (en) | 2017-02-24 | 2023-11-28 | Technoprobe S.P.A. | Testing head with improved frequency property |
| CN113393894A (en) * | 2021-05-31 | 2021-09-14 | 西安理工大学 | Voltage-current characteristic testing system of resistive random access memory under irradiation environment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212514719U (en) | Radio frequency large-current high-frequency probe card for wafer test | |
| CN102110920A (en) | High-speed connector package and packaging method | |
| US9433094B2 (en) | Electronic substrate and structure for connector connection thereof | |
| CN201522509U (en) | High-frequency short arm probe card | |
| KR101914014B1 (en) | Substrate Integrated Waveguide Millimeter Wave Circulator | |
| WO2014183489A1 (en) | Printed circuit board and terminal | |
| KR20230127958A (en) | Radio-frequency arrangement having two interconnected radio-frequency components | |
| WO2023019864A1 (en) | Printed circuit board, and wiring method for printed circuit board | |
| CN113540733B (en) | Vertical switching structure | |
| JPH10327004A (en) | Circuit module with coaxial connector | |
| CN208285640U (en) | A kind of signal transmssion line line structure and mobile terminal | |
| CN110011002B (en) | Self-matching ultra-wideband microwave insulator | |
| CN109088142B (en) | Method for ensuring port standing wave performance | |
| CN111370822A (en) | Dielectric filter with capacitive coupling structure | |
| TW201940030A (en) | Soldering pad structure for RF testing comprising a grounding layer, an insulating layer, and a soldering area that are directly soldered onto a coaxial cable | |
| US11477890B2 (en) | Plated pads and leads for surface mount technology connections | |
| US8647927B2 (en) | Microwave circuit package | |
| CN217717872U (en) | Probe block, signal expansion device, and semiconductor tester | |
| CN218450656U (en) | Module packaging structure convenient to repair | |
| CN112738985B (en) | Circuit board assembly and electronic equipment | |
| US20030019653A1 (en) | Intermetallic contact surface structure and connector | |
| CN203340417U (en) | Welding structure of radio-frequency test feeding points | |
| CN217507717U (en) | Cable connection structure, probe block, signal expansion device and semiconductor tester | |
| KR20120116706A (en) | Optical module having to-can structure for high-speed signal transmission | |
| JP4421243B2 (en) | Combined structure consisting of chassis and printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |