CN217717872U - Probe block, signal expansion device, and semiconductor tester - Google Patents

Abstract

The application relates to a probe block, a signal expansion device and a semiconductor tester. The probe block includes: an insulating base; the conductive assembly is arranged on the back surface of the insulating base, a first through hole structure and a second through hole structure are arranged in the conductive assembly, the first through hole structure is used for the first wire core to pass through, and the conductive assembly is used for being electrically connected with the reference signal layer; the first signal type probe penetrates through the front surface of the insulating base and is used for being connected with a first wire core penetrating through the first through hole structure; the second signal type probe penetrates through the front surface of the insulating base and is adjacent to the first signal type probe; the second signal type probe penetrates through the second through hole structure and is electrically connected with the conductive assembly. The adoption of the probe block and the cable connection can ensure that the return path of the signal keeps continuity and integrity.

Description

Probe block, signal expansion device, and semiconductor tester

Technical Field

The application relates to the technical field of signal transmission, in particular to a probe block, a signal expansion device and a semiconductor tester.

Background

The cable includes sinle silk, dielectric layer, reference signal layer and the insulating layer that sets up respectively from inside to outside, and when utilizing the cable to carry out high-speed signal transmission, the sinle silk is used for transmitting signal, and the dielectric layer is used for controlling impedance, and the reference signal layer is equivalent to shielding ground, and return path as the signal also is used for shielding external noise, can be after external signal is derived from the sinle silk, for shielding the signal in order to prevent that the signal from leaking to the outside of cable outward, the insulating layer is equivalent to the protective sheath, is used for protecting each layer structure of inside.

When an existing cable is connected with a probe on a probe block, a wire core is usually connected with a first signal type probe, a reference signal layer is connected with another adjacent second signal type probe after being processed, namely a signal ground end is connected to another second signal type probe, but the connection mode enables the first signal type probe to be matched with only one second signal type probe, impedance continuity is poor, integrity of a return signal is poor, and a signal crosstalk phenomenon is easy to occur.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide a probe block, a signal spreading device, and a semiconductor tester capable of ensuring the integrity of a return signal in response to the above-mentioned technical problems.

A probe block is used for being connected with a cable, the cable comprises a first wire core, a dielectric layer, a reference signal layer and an insulating layer which are arranged from inside to outside respectively, and the probe block comprises:

an insulating base;

the conductive assembly is arranged on the back surface of the insulating base, a first through hole structure and a second through hole structure are arranged in the conductive assembly, the first through hole structure is used for the first wire core to penetrate through, and the conductive assembly is used for being electrically connected with the reference signal layer;

the first signal type probe penetrates through the front surface of the insulating base and is used for being connected with a first wire core penetrating through the first through hole structure;

the second signal type probe penetrates through the front surface of the insulating base and is adjacent to the first signal type probe; the second signal type probe penetrates through the second through hole structure and is electrically connected with the conductive assembly.

According to the probe block, the conductive assembly of the probe block is electrically connected with the reference signal layer, and the conductive assembly is electrically connected with the second signal type probes, so that one first signal type probe is matched with a plurality of adjacent second signal type probes, and a return path is converted into a plurality of second signal type probes surrounding the wire core.

In one embodiment, each of the first signal type probes and each of the second signal type probes are arranged in an array, and when the first signal type probes are at edge positions, one of the first signal type probes is adjacent to two or three of the second signal type probes; when the first signal type probe is not in an edge position, one of the first signal type probes is adjacent to four of the second signal type probes.

In one embodiment, the conductive assembly includes a plurality of conductive sheets connected to each other, a first concave hole and a second concave hole are formed in an edge of each of the conductive sheets, the first concave holes are spliced to form each of the first through-hole structures, and the second concave holes are spliced to form each of the second through-hole structures.

A signal expansion apparatus, comprising: the cable comprises a first wire core, a dielectric layer, a reference signal layer and an insulating layer, wherein the first wire core, the dielectric layer, the reference signal layer and the insulating layer are respectively arranged from inside to outside, the first wire core penetrates through the first through hole structure to be connected with the first signal type probe, and the reference signal layer is abutted to the conductive assembly.

The advantages of the signal expansion device over the prior art are the same as the advantages of the probe block over the prior art, and are not described herein again.

In one embodiment, the first signal type probe includes a first signal type probe body and a first connection terminal, the first connection terminal being located at a side of the first signal type probe body close to the cable, the first connection terminal being connected with a first core passing through the first via structure; the second signal type probe comprises a second signal type probe body and a second connecting terminal, the second connecting terminal is located on one side, close to the cable, of the second signal type probe body, and the second connecting terminal is electrically connected with the conductive assembly.

In one embodiment, when the cable is a coaxial cable, the reference signal layer includes a woven mesh layer, and the woven mesh layer is electrically connected to the conductive element.

In one embodiment, at least part of the woven net layer which is not covered by the insulating layer is positioned in the first through hole structure, and the side surface of the woven net layer is welded or abutted with the inner wall of the first through hole structure; alternatively, the first and second electrodes may be,

the braided net layer which is not covered with the insulating layer is positioned outside the first through hole structure, and the end surface of one end, close to the conductive component, of the braided net layer is welded or abutted with the surface, close to the braided net layer, of the conductive component.

In one embodiment, when the cable is an aluminum foil cable, the reference signal layer comprises a second core and a shielding layer which are mutually connected, and the second core is electrically connected with the conductive component.

In one embodiment, at least part of the second wire core which is not covered by the insulating layer is positioned in the first through hole structure, and the side surface of the second wire core is welded or abutted with the inner wall of the first through hole structure; alternatively, the first and second liquid crystal display panels may be,

the second wire core which is not coated with the insulating layer is positioned outside the first through hole structure, and the end face of one end, close to the conductive assembly, of the second wire core is welded or abutted with the surface, close to the second wire core, of the conductive assembly.

A semiconductor tester comprising a signal spreading device as described above.

The advantages of the semiconductor tester over the prior art are the same as the advantages of the signal expansion device over the prior art, and are not described herein again.

Drawings

Fig. 1 is a schematic cross-sectional view of a conventional coaxial cable;

FIG. 2 is a schematic diagram of a connection structure of a coaxial cable and a probe block in the prior art;

FIG. 3 is a schematic cross-sectional view of a conventional aluminum foil wire;

FIG. 4 is a schematic view of a connection structure between an aluminum foil wire and a probe block in the prior art;

FIG. 5 is a graph showing the relationship between the position of a first signal type probe and a second signal type probe in the prior art;

FIG. 6 is a schematic diagram of the structure of a probe tile in one embodiment;

FIG. 7 is an enlarged view taken at I in FIG. 6;

FIG. 8 is a bottom view of the connection structure of the probe block to the cable in one embodiment;

FIG. 9 is a diagram illustrating the connection of a probe card to a cable in one embodiment;

FIGS. 10 and 11 are schematic structural views of conductive sheets in different embodiments;

FIG. 12 is a diagram illustrating the connection of a probe block to a coaxial cable according to one embodiment;

FIG. 13 is a diagram showing the connection between the probe blocks and the aluminum foil wire in one embodiment;

FIG. 14 is a diagram of an arrangement of probes of a first signal type and a second signal type in one embodiment;

FIG. 15 is a graph illustrating a positional relationship between a first signal type probe and a second signal type probe in one embodiment;

FIG. 16 is a diagram showing the connection relationship between the probe block and the coaxial cable according to another embodiment;

FIG. 17 is a diagram showing the connection of a probe block to a coaxial cable according to still another embodiment;

FIG. 18 is a side view of a connection structure of a probe block to a coaxial cable in one embodiment;

FIG. 19 is a diagram showing the connection between the probe blocks and the aluminum foil wires in another embodiment;

fig. 20 is a diagram illustrating a connection relationship between the first connection terminal and the second connection terminal and the base in one embodiment.

Description of the reference numerals:

1-cable, 1A-coaxial cable, 1B-aluminum foil wire, 11-first wire core, 12-dielectric layer, 13-reference signal layer, 13A-woven mesh layer, 13B-second wire core, 13C-shielding layer, 14-insulating layer, 2-probe block, 21-insulating base, 22-conductive component, 221-first through hole structure, 222-second through hole structure, 223-conductive sheet, 224-substrate, 225-conductive ring, 226-signal transmission line, 227-insulating sleeve, 23-first signal type probe, 230-first signal type probe body, 231-first connection terminal, 24-second signal type probe, 240-second signal type probe body, 241-second connection terminal, 3-soldering tin.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

Spatial relational terms, such as "under," "below," "under," "over," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may comprise additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. In addition, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", and the like if there is a transfer of electrical signals or data between the connected objects.

As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," or "having," and the like, specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, as used in this specification, the term "and/or" includes any and all combinations of the associated listed items.

As background art, the conventional cable 1 includes a first core, a dielectric layer, a reference signal layer and an insulating layer respectively arranged from inside to outside, and when the cable is connected to probes on a probe block, the first core is usually connected to a first signal type probe, and the reference signal layer is processed and then connected to an adjacent second signal type probe. For example, as shown in fig. 1 and 2, if the cable 1 is a coaxial cable 1A, and the reference signal layer 13 is a braided mesh layer 13A for the coaxial cable 1A, since the braided mesh material is brittle, the braided mesh can only be cut and stroked into a set of burr lines through which a second signal type probe 24 is connected. For another example, as shown in fig. 3 and 4, if the cable 1 is an aluminum foil wire 1B, the reference signal layer 13 includes a second wire core 13B and a shielding layer 13C for the aluminum foil wire 1B, and the second wire core 13B can be connected to only one second signal type probe 24. The reference signal layer 13 can therefore only be connected to one second signal type probe 24, i.e. the core corresponding first signal type probe 23 has only one corresponding second signal type probe 24 as a reference.

The prior art connection introduces a dielectric layer 12 into the air medium, either for the coaxial cable 1A or the aluminum foil wire 1B. Therefore, the existing connection mode has the problem of discontinuous signal impedance, and the air medium existing in the return path can cause abrupt impedance change. As shown in fig. 5, in the prior art, since the first signal type probe 23 only matches one corresponding second signal type probe 24, the first signal type probe 23 and the second signal type probe 24 are distributed in a 1 to 1 manner, S represents the first signal type probe 23, and G represents the second signal type probe 24, so that for the first signal type probe 23 at the central position (circled part in fig. 5), a case where one S corresponds to three G also occurs, that is, the first signal type probe 23 at the non-edge position cannot guarantee that 1S always corresponds to four G. Since the impedance can be controlled well only by adopting the case of 4G around one S, the case of one S corresponding to three G is also unfavorable for controlling the impedance continuity. When a plurality of cables 1 are connected simultaneously, one of two adjacent cables 1 is a first cable and the other is a second cable, the first cable is connected to one first signal type probe 23 and one second signal type probe 24, the second cable adjacent to the first cable is also connected to one first signal type probe 23 and one second signal type probe 24, and the first signal type probe 23 connected to the first cable is also adjacent to the other second signal type probe 24 connected to the second cable. The first signal type probe 23 is used for transmitting signals as S-terminal signals, and the second signal type probe 24 is used for transmitting signals as G-terminal signals. However, as shown in fig. 2 and 4, an air medium is introduced into both the medium layer 12, the woven mesh layer 13A and the second wire core 13B only expose a small section, and the other part of the woven mesh layer 13A and the second wire core 13B are wrapped and shielded by the insulating layer 14 in the cable 1, so that the S-end signal transmitted by the first cable cannot be completely referred to the G-end signal transmitted by the second cable, and after the first cable receives a small part of the G-end signal, because the reference signal layer 13 is wrapped by the insulating layer 14, the return current signal in the adjacent return path is immediately broken and cannot be continuously received, which results in the degradation of signal integrity. In addition, because the G-end signal transmitted by the second cable cannot be completely referred to, even if one S corresponds to four G, the signal integrity still exists in the prior art. Even if a plurality of surrounding G-terminal signals are referenced, the phenomenon of impedance abrupt change caused by air medium and reference G-terminal signal interruption caused by the wrapping of the insulating layer 14 cannot be eliminated. Therefore, the existing connection method of the cable 1 and the probe block 2 can result in poor integrity of the return signal.

In order to solve the above problem, in one embodiment, as shown in fig. 6 to 9, the present application provides a probe block 2 for connecting with a cable 1, the cable 1 including a first core 11, a dielectric layer 12, a reference signal layer 13 and an insulating layer 14, which are respectively disposed from inside to outside, the probe block 2 including: the circuit comprises an insulating base 21, a conductive assembly 22, a first signal type probe 23 and a second signal type probe 24, wherein the conductive assembly 22 is arranged on the back surface of the insulating base 21, a first through hole structure 221 and a second through hole structure 222 are arranged in the conductive assembly 22, the first through hole structure 221 is used for a first wire core 11 to pass through, and the conductive assembly 22 is used for being electrically connected with a reference signal layer 13; the first signal type probe 23 penetrates through the front surface of the insulating base 21 and is used for being connected with the first wire core 11 penetrating through the first through hole structure 221; the second signal type probe 24 penetrates the front surface of the insulating base 21 and is adjacent to the first signal type probe 23; the second signal type probe 24 penetrates through the second via structure 222 and is electrically connected to the conductive element 22.

The material of at least a partial region of the insulating base 21 is an insulating material, so that when the first signal type probe 23 and the second signal type probe 24 are disposed on the insulating base 21, the first signal type probe 23 and the second signal type probe 24 are not electrically connected only through the insulating base 21. The first signal type probe 23 and the second signal type probe 24 are penetrated through the front surface of the insulating base 21, and the first signal type probe 23 and the second signal type probe 24 are penetrated through the insulating base 21 from the front surface and are arranged on the insulating base 21. When the conductive member 22 is connected to the rear surface of the probe block 2, there is no gap between the conductive member 22 and the probe block 2, so that the exposed first core 11 is not exposed to the external air. The material of the conductive member 22 may be selected from one or more of metal and conductive rubber. As shown in fig. 10, the conductive member 22 may include a plurality of conductive sheets 223 connected to each other, the conductive sheets 223 may have a shape similar to a rectangle, a first concave hole exposing the first signal type probe 23 is left at an edge of the conductive sheets 223, and a second concave hole for connecting the second signal type probe 24 is provided, after the plurality of conductive sheets 223 are spliced, each first concave hole is spliced into each first through hole structure 221, each second concave hole is spliced into each second through hole structure 222, the rectangular conductive sheet 223 at least includes two first concave holes and two second concave holes, so as to form an association relationship between one cable 1 and at least two second signal type probes 24 around the cable 1. The shape of the conductive sheet 223 may be similar to that of fig. 11, and the whole conductive sheet may be rectangular in a strip shape, and may cover an area between two rows of signal type probes, and the edge of the conductive sheet 223 may have a first concave hole exposing the end of the first signal type probe 23 and a second concave hole exposing the end of the second signal type probe 24, and after the conductive sheets 223 are jointly spliced together, a mesh shape similar to a honeycomb shape may be formed, and each first concave hole may be spliced into each first through-hole structure 221, and each second concave hole may be spliced into each second through-hole structure 222. Of course, the conductive member 22 may also be provided as an integral one-piece conductive strip 223 having the first and second via structures 221 and 222 to connect the second signal type probes 24 together so that the cable 1 portions of the return path may be connected together by the conductive strip 223, resulting in improved return path continuity and increased signal integrity. The conductive element 22 may be electrically connected to the reference signal layer 13 by abutting or soldering to the reference signal layer 13, and the second signal type probe may be electrically connected to the reference signal layer 13 by abutting or soldering to the conductive element 22.

It will be appreciated that the conductive element 22 and the reference signal layer 13 are electrically connected in the signal transmission between the cable 1 and the probe block 2. Since the conductive element 22 is electrically connected to each of the second signal type probes 24, the reference signal of each of the second signal type probes 24 can be jointly connected to form a reference ground by using the conductive element 22, the reference signal layer 13 of the cable 1 is electrically connected to the conductive element 22, and if no air medium exists between the reference signal layer 13 and the conductive element 22, no reference ground is interrupted. The signal path in the cable 1 is transmitted to the first signal type probe 23 through the first wire core 11, the return path in the cable 1 is transmitted to the conductive component 22 around the first wire core 11 through the connection of the reference signal layer 13 and the conductive component 22, and then is transmitted to the plurality of second signal type probes 24 surrounding the first wire core 11 through the conductive component 22, the arrangement is such that one cable 1 corresponds to the adjacent plurality of second signal type probes 24, the plurality of second signal type probes 24 can return the reference signal, and therefore the integrity of the signal is improved. In addition, through the connection in the above manner, the air medium is not introduced into the medium layer 12, the problem of discontinuous signal impedance is not caused, and abrupt change of impedance is not caused, so that the integrity of the transmission process of the return signal is ensured.

In application, when the conductive assembly 22 includes a plurality of conductive sheets 223, the conductive sheets 223 may be disposed on the back of the probe block 2 one by one, or a plurality of conductive sheets 223 may be pre-spliced together and then disposed on the back of the probe block 2. The first core 11 of the cable 1 may be connected to the first signal type probe 23 after the conductive sheet 223 is disposed on one or a part of the back surface, or may be connected to the first signal type probe 23 after the conductive sheet 223 is disposed on the back surface of the probe block 2.

In this embodiment, the conductive element 22 is disposed on the back of the insulating base 21, so that when the cable 1 is connected to the probe block 2, the conductive element 22 is electrically connected to the reference signal layer 13, and since the conductive element 22 is electrically connected to the adjacent second signal type probes 24, the reference signal layer 13 is electrically connected to the adjacent second signal type probes 24, so that one first signal type probe 23 is matched with the adjacent second signal type probes 24, and the return path is converted into a plurality of second signal type probes 24 surrounding the first wire core 11, by such an arrangement, the continuity and integrity of the return path can be maintained, and the conductive element 22 abuts against the reference signal layer 13, and no air medium is introduced when the return path returns, thereby solving the problem of discontinuous signal impedance in the prior art, and further improving the integrity of the return signal.

In one embodiment, as shown in fig. 12 and 13, the conductive assembly 22 includes a substrate 224 and a conductive ring 225, the substrate 224 is internally provided with the first via structure 221, the second via structure 222 and a signal transmission line 226, the signal transmission line 226 is used for connecting the first via structure 221 (not shown) and the second via structure 222 (not shown), the first via structure 221 is used for the first core 11 to pass through to connect with the first signal type probe 23, and the second via structure 222 is used for accommodating the second signal type probe 24; the conductive ring 225 is disposed in the first via structure 221 and electrically connected to the signal transmission line 226, and the conductive ring 225 is used for electrically connecting to the reference signal layer 13 of the cable 1.

The substrate 224 may be a printed circuit board. The conducting ring 225 can be in the shape of a circular ring, a hollow polygon, a ring with a boss, a ring with a notch, or the like; the conductive ring 225 may also be disposed on the reference signal layer 13, and the conductive ring 225 may be connected to the reference signal layer 13 by soldering. When the conductive ring 225 is in a ring shape with a notch and the cable 1 is an aluminum foil wire 1B, the conductive ring 225 may be sleeved on the reference signal layer 13, the notch of the conductive ring 225 is filled with the second wire core 13B, and the second wire core 13B contacts with two inner walls of the notch.

It can be understood that the conductive ring 225 is conductive as a whole, and the inner wall of the conductive ring 225 is in contact with the reference signal layer 13 (the woven mesh layer 13A or the second core 13B), and the two are electrically connected when signal transmission is performed between the cable 1 and the probe block 2. The reference signal layer 13 is electrically connected to the signal transmission line 226 in the substrate 224 through the conductive ring 225, the second signal type probes 24 pass through the second via structure 222 and are electrically connected to the signal transmission line 226, and since the signal transmission line 226 is connected to each adjacent second signal type probe 24, the reference signal layer 13 is connected to each adjacent second signal type probe 24, so that one cable 1 corresponds to a plurality of second signal type probes 24, and reference signals of the plurality of second signal type probes 24 are realized, thereby improving the integrity of signals.

The conductive ring 225 and the substrate 224 may be connected by a direct connection method such as interference fit or clearance fit; the connecting structure can also adopt a conductive auxiliary connecting piece for indirect connection and can also adopt a welding mode for connection. It should be noted that the above-mentioned modes are only examples, and do not limit the present embodiment, and other modes other than the above-mentioned modes can be adopted.

In this embodiment, the conductive ring 225 is electrically connected to the reference signal layer 13, and the conductive ring 225 is electrically connected to the signal transmission line 226 in the substrate 224, so that the reference signal layer 13 of one cable 1 can be simultaneously connected to the adjacent second signal type probes 24, one first signal type probe 23 can be matched with the adjacent second signal type probes 24, and the return path is converted into a plurality of second signal type probes 24 surrounding the first core 11.

In one embodiment, as shown in fig. 12 and 13, the probe block 2 further includes an insulating sleeve 227, and the insulating sleeve 227 is disposed in the first through hole structure 221 and located at one axial side of the conductive ring 225.

It can be understood that when the conductive ring 225 is disposed on the exposed reference signal layer 13, the conductive ring 225 may contact the first core 11, and when the conductive ring 225 contacts the first core 11, the reference signal layer 13 is electrically connected to the first core 11, and the signal line and the signal ground are shorted.

Specifically, the insulating sleeve 227 is disposed in the first through hole structure 221 and located on one axial side of the conductive ring 225, and when the cable 1 and the probe block 2 are connected through the conductive assembly 22, the exposed first core 11 of the cable 1 penetrates the first through hole structure 221 from a side close to the conductive ring 225, and sequentially penetrates through the conductive ring 225 and the insulating sleeve 227 to be connected with the first signal type probe 23. At this time, the insulating sleeve 227 is on the side of the grounding ring near the exposed first core 11, and the insulating sleeve 227 is located between the first core 11 and the conductive ring 225 to separate the first core 11 from the conductive ring 225, so as to avoid the reference signal layer 13 from being electrically connected to the first core 11.

In this embodiment, the insulating sleeve 227 is disposed in the first through hole structure 221 and located on one side of the conductive ring 225, so that the first core 11 and the conductive ring 225 can be separated by the insulating sleeve 227, thereby preventing the reference signal layer 13 from being electrically connected to the first core 11, and further preventing the signal line from being shorted to the signal ground.

In one embodiment, the portion of the second signal type probe 24 that penetrates through the second via structure 222 is connected to the substrate 21 by solder 3.

In one embodiment, as shown in fig. 14 and 15, each of the first signal type probes 23 and each of the second signal type probes 24 are arranged in an array, and when the first signal type probes 23 are at the edge positions, one first signal type probe 23 is adjacent to two or three second signal type probes 24; when the first signal type probe 23 is not in the edge position, one first signal type probe 23 is adjacent to four second signal type probes 24.

In fig. 15, S corresponds to the first signal type probe 23 and g corresponds to the second signal type probe 24.

In addition to the cross arrangement shown in fig. 15, the first signal type probes 23 and the second signal type probes 24 may be arranged in an X-shape, the midpoint position is S, and the four points on the edge are G, so that one first signal type probe 23 and four second signal type probes 24 are adjacent to each other. And may even be arranged in a "meter" fashion, one first signal-type probe 23 may be adjacent to more second signal-type probes 24. In the present application, the arrangement of the first signal type probe 23 and the second signal type probe 24 is not limited to the above-described exemplary manner, and may be other manners, and only one first signal type probe 23 may be adjacent to a plurality of second signal type probes 24.

It is understood that the first signal-type probes 23 and the second signal-type probes 24 are arranged in an array. When the first signal type probe 23 is in both the edge row and edge column, there is only one adjacent second signal type probe 24 in both the row direction and the column direction, one first signal type probe 23 adjacent to two second signal type probes 24; when the first signal type probe 23 is in an edge row but not in an edge column, there are two adjacent second signal type probes 24 in the row direction, only one adjacent second signal type probe 24 in the column direction, and one first signal type probe 23 is adjacent to three second signal type probes 24; likewise, when the first signal type probe 23 is in an edge column but not in an edge row, there are two adjacent second signal type probes 24 in the column direction, only one adjacent second signal type probe 24 in the row direction, and one first signal type probe 23 is adjacent to three second signal type probes 24; when the first signal type probe 23 is not located at an edge position, two adjacent second signal type probes 24 are present in one first signal type probe 23 in both the row direction and the column direction, and one first signal type probe 23 is adjacent to four second signal type probes 24. As shown in fig. 15, the first signal type probe 23 at the center position is inevitably matched with four adjacent second signal type probes 24, and the problem that the first signal type probe 23 at the center position is only matched with three adjacent second signal type probes 24 in fig. 5 does not occur, so that the first signal type probe 23 transmitting the critical signal is matched with four adjacent second signal type probes 24, and thus the continuity and integrity of the return path can be maintained, and the signal integrity is improved.

In this embodiment, each first signal type probe 23 and each second signal type probe 24 are arranged in an array, so that one first signal type probe 23 is adjacent to at least two second signal type probes 24, so that one first signal type probe 23 is matched with at least two adjacent second signal type probes 24, and the number of second signal type probes 24 included in the return path is large, thereby ensuring the integrity of the return signal.

In one embodiment, as shown in fig. 16-20, the present application further provides a signal expansion apparatus comprising: the cable 1 and the probe block 2, the cable 1 includes a first wire core 11, a dielectric layer 12, a reference signal layer 13 and an insulating layer 14 which are respectively arranged from inside to outside, the first wire core 11 passes through the first through hole structure 221 to be connected with the first signal type probe 23, and the reference signal layer 13 is electrically connected with the conductive component 22.

The conductive element 22 may be electrically connected to the reference signal layer 13 by abutting against or welding with the reference signal layer 13.

In this embodiment, the first core 11 is connected to the first signal type probe 23 through the first through hole structure 221, and the conductive element 22 is disposed on the back surface of the insulating base 21, so that when the cable 1 is connected to the probe block 2, the conductive element 22 is electrically connected to the reference signal layer 13, and since the conductive element 22 is electrically connected to the adjacent second signal type probes 24, the reference signal layer 13 is electrically connected to the adjacent second signal type probes 24, so that one first signal type probe 23 is matched with the adjacent second signal type probes 24, and the return path is converted into the second signal type probes 24 surrounding the core.

In one embodiment, as shown in fig. 1, 12, 16-18, when the cable 1 is a coaxial cable 1A, the reference signal layer 13 includes a braided mesh layer 13A, and the braided mesh layer 13A is electrically connected to the conductive element 22.

When the cable 1 is a coaxial cable 1A, the coaxial cable 1A includes a first core 11, a dielectric layer 12, a braided mesh layer 13A, and an insulating layer 14, which are respectively disposed from inside to outside, and when the braided mesh layer 13A is connected to the second signal type probe 24, the return path is transmitted from the braided mesh layer 13A in the coaxial cable 1A to the corresponding second signal type probe 24 as a signal ground. Since the conductive element 22 is electrically connected to the second signal type probes 24, the knitted mesh layer 13A can be electrically connected to each second signal type probe 24 by electrically connecting the knitted mesh layer 13A to the conductive element 22, and then the return path is transmitted from the knitted mesh layer 13A in the coaxial cable 1A to each second signal type probe 24, so that the plurality of second signal type probes 24 return the reference signal, thereby improving the integrity of the signal.

In application, when the coaxial cable 1A is connected with the probe block 2, the coaxial cable 1A is firstly peeled off part of the insulating layer 14 to expose a small section of the woven mesh layer 13A, then a part of the woven mesh layer 13A and the dielectric layer 12 are peeled off to expose a small section of the first core 11, then the exposed first core 11 passes through the first through hole structure 221 to be connected with the first signal type probe 23, when the first core 11 is connected with the first signal type probe 23, the woven mesh layer 13A of the coaxial cable 1A can be abutted or welded with the conductive component 22, so that the conductive component 22 is electrically connected with the woven mesh layer 13A, and further the woven mesh layer 13A of one coaxial cable 1A is connected with the plurality of second signal type probes 24 through the conductive component 22.

In one embodiment, as shown in fig. 16, at least a part of the woven mesh layer 13A not covered with the insulating layer is located inside the first through-hole structure 221, and the side surface of the woven mesh layer 13A is welded or abutted against the inner wall of the first through-hole structure 221.

It can be understood that when the diameter of the first through hole structure 221 is greater than or equal to the outer diameter of the knitted mesh layer 13A, the knitted mesh layer 13A can enter the first through hole structure 221, and when the knitted mesh layer 13A is located in the first through hole structure 221, the side surface of the knitted mesh layer 13A can be welded or abutted against the inner wall of the first through hole structure 221, so that the knitted mesh layer 13A is electrically connected with the conductive element 22.

The knitted mesh layer 13A may be connected to the inner wall of the first through hole structure 221 by abutting and welding, and when the aperture of the first through hole structure 221 is larger than the aperture of the knitted mesh layer 13A, in order to ensure that the side surface of the knitted mesh layer 13A abuts against the inner wall of the first through hole structure 221 stably, the knitted mesh layer 13A may be further fixed by welding, so that the knitted mesh layer 13A is fixedly connected to the conductive assembly 22, and the side surface of the knitted mesh layer 13A and the inner wall of the first through hole structure 221 maintain a tight contact state.

In one embodiment, as shown in fig. 17, the woven mesh layer 13A without the insulating layer is located outside the first through hole structure 221, and the end surface of the woven mesh layer 13A near one end of the conductive member 22 abuts against the surface of the conductive member 22 near the woven mesh layer 13A.

It can be understood that the aperture of the first through hole structure 221 may also be larger than the outer diameter of the dielectric layer 12 and smaller than the outer diameter of the woven mesh layer 13A, at this time, the first through hole structure 221 may only be used to pass through the first core 11 and the dielectric layer 12 of the coaxial cable 1A, and clamp the woven mesh layer 13A outside the first through hole structure 221, so that the end surface of the end of the woven mesh layer 13A close to the conductive component 22 abuts against the surface of the conductive component 22 close to the woven mesh layer 13A, and obviously, this way may also achieve the electrical connection between the woven mesh layer 13A and the conductive component 22. However, in some applications, an end surface of one end of knitted mesh layer 13A close to conductive element 22 may not abut against a surface of conductive element 22 close to knitted mesh layer 13A, and at this time, knitted mesh layer 13A and conductive element 22 may be connected by welding. When the end surface of one end of knitted mesh layer 13A near conductive element 22 is in contact with the surface of conductive element 22 near knitted mesh layer 13A, knitted mesh layer 13A may be further fixed to the surface of conductive element 22 by welding. When the coaxial cable is connected to the probe block 2, a side view thereof is shown in fig. 18.

In one embodiment, as shown in fig. 19, the cable 1 is an aluminum foil wire 1B, the reference signal layer 13 includes a second wire core 13B and a shielding layer 13C connected to each other, and the second wire core 13B is electrically connected to the conductive element 22.

When the cable 1 is an aluminum foil wire 1B, the aluminum foil wire 1B includes a first wire core 11, a dielectric layer 12, a second wire core 13B, a shielding layer 13C and an insulating layer 14, which are respectively disposed from inside to outside, the first wire core 11 is used as a signal path, the second wire core 13B and the shielding layer 13C are used as a return path, the first wire core 11 is connected with the first signal type probe 23 and is used for transmitting signals, and the signal path is transmitted to the corresponding first signal type probe 23 by the first wire core 11 in the aluminum foil wire 1B. When the second wire core 13B is electrically connected to the second signal type probe 24, the return path is transmitted from the second wire core 13B and the shielding layer 13C in the aluminum foil wire 1B to the second signal type probe 24 as a signal ground. Because the conductive element 22 is electrically connected with the second signal type probe 24, and each conductive element 22 in the array of the conductive element 22 is connected, the second core 13B is abutted against the conductive element 22, so that the electrical connection between the woven mesh layer 13A and each second signal type probe 24 can be realized, and then the return path is transmitted from the woven mesh layer 13A in the cable 1 to each second signal type probe 24, so that the return of the reference signal by the plurality of second signal type probes 24 is realized, and the integrity of the signal is improved.

In one embodiment, as shown in fig. 19, at least a part of the second wire core 13B not covered with the insulating layer is located in the first through hole structure 221, and a side surface of the second wire core 13B abuts against an inner wall of the first through hole structure 221.

It can be understood that when the aperture of the first through hole structure 221 is greater than or equal to the sum of the outer diameter of the dielectric layer 12 and the diameter of the cross section of the second core 13B, the second core 13B can enter the first through hole structure 221, and when the second core 13B is located in the first through hole structure 221, the side surface of the second core 13B can be welded or abutted to the inner wall of the first through hole structure 221, so that the second core 13B is electrically connected to the conductive element 22. In addition, the side surface of the second wire core 13B can be abutted against the inner wall of the first through hole structure 221, and meanwhile, the second wire core 13B is further fixed by welding, so that the second wire core 13B is fixedly connected with the conductive component 22, and further, the side surface of the second wire core 13B is kept in close contact with the inner wall of the first through hole structure 221.

In one embodiment, as shown in fig. 19, when the second wire core 13B not covered by the insulating layer is located outside the first through hole structure 221, an end surface of the second wire core 13B close to one end of the conductive component 22 is soldered or abutted on a surface of the conductive component 22 close to the second wire core 13B.

It can be understood that the aperture of the first through-hole structure 221 may also be larger than the outer diameter of the dielectric layer 12 and smaller than the sum of the outer diameter of the dielectric layer 12 and the diameter of the cross section of the second wire core 13B, at this time, the first through-hole structure 221 may only be used to pass through the first wire core 11 and the dielectric layer 12 of the aluminum foil wire 1B, and clamp the second wire core 13B outside the first through-hole structure 221, so that the end surface of the end of the second wire core 13B close to the conductive component 22 abuts against the surface of the conductive component 22 close to the woven mesh layer 13A, obviously, this way may also achieve the electrical connection between the second wire core 13B and the conductive component 22. In application, there may be a case that an end surface of the second wire core 13B near one end of the conductive component 22 cannot abut against a surface of the conductive component 22 near the second wire core 13B, and at this time, the second wire core 13B and the conductive component 22 may be connected by welding. When the end surface of one end of knitted mesh layer 13A near conductive element 22 is in contact with the surface of conductive element 22 near knitted mesh layer 13A, knitted mesh layer 13A may be further fixed to the surface of conductive element 22 by welding.

It should be noted that, each connection manner shown in the foregoing embodiments is only an example of a specific connection manner, and is not limited to the specific connection manner in this application, and other connection manners may also be adopted in this application to implement electrical connection of corresponding structures.

In one embodiment, as shown in fig. 20, the first signal type probe 23 includes a first signal type probe body 230 and a first connection terminal 231, the first connection terminal 231 is located at a side of the first signal type probe body 230 close to the cable 1, and the first connection terminal 231 is connected with the first wire core 11 passing through the first via structure 221; the second signal type probe 24 includes a second signal type probe body 240 and a second connection terminal 241, the second connection terminal 241 is located at a side of the second signal type probe body 240 close to the cable 1, and the second connection terminal 241 is electrically connected to the conductive member 22.

Wherein, one end of the first connection terminal 231 connected to the first core 11 may be a metal sheet so as to be connected to the first core 11; similarly, the end of the second connection terminal 241 connected to the conductive member 22 may also be a metal sheet, so that the second connection terminal 241 is in full contact with the conductive member 22 to ensure connection stability. When the ends of the first connection terminal 231 and the second connection terminal 241 are both metal sheets, the first signal-type probes 23 and the second signal-type probes 24 are easily arranged in an array.

In one embodiment, the cable 1 further includes a conductor cap, the conductor cap is sleeved on the exposed first core 11, the conductor cap is electrically connected to the first core 11, and when the cable 1 is connected to the probe block 2, the conductor cap is electrically connected to the inner wall of the needle sleeve of the first signal type probe 23.

Wherein, the conductor cap is bullet-type conductor cap.

Specifically, wear out the sinle silk part of first through-hole structure 221, connect through the conductor cap of bullet head formula, wholly impress in the probe cover of the first signal type probe 23 of corresponding position through corresponding tool at last, the outer wall of the conductor cap of bullet head formula passes through interference fit's mode and is connected with the needle cover inner wall of first signal type probe 23.

Wherein, first sinle silk 11 is yielding, directly is connected first sinle silk 11 and first signal type probe 23, is difficult to guarantee connection stability, consequently, through conductor cap auxiliary connection.

The first core 11 and the conductor cap may be connected by welding, interference fit, or indirectly through an auxiliary conductor. In addition to the above-described connection, other ways, such as snap-in, are also possible.

All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims (10)

1. The utility model provides a probe block for be connected with the cable, the cable includes first sinle silk, dielectric layer, reference signal layer and the insulating layer that sets up respectively from inside to outside, the probe block includes:

an insulating base;

the conductive assembly is arranged on the back surface of the insulating base, a first through hole structure and a second through hole structure are arranged in the conductive assembly, the first through hole structure is used for the first wire core to pass through, and the conductive assembly is used for being electrically connected with the reference signal layer;

the first signal type probe penetrates through the front surface of the insulating base and is used for being connected with a first wire core penetrating through the first through hole structure;

the second signal type probe penetrates through the front surface of the insulating base and is adjacent to the first signal type probe; the second signal type probe penetrates through the second through hole structure and is electrically connected with the conductive assembly.

2. The probe block of claim 1, wherein each of the first signal type probes and each of the second signal type probes are arranged in an array, one of the first signal type probes being adjacent to two or three of the second signal type probes when the first signal type probe is in an edge position; when the first signal type probe is not in an edge position, one of the first signal type probes is adjacent to four of the second signal type probes.

3. The probe tile of claim 1, wherein the conductive assembly comprises a plurality of conductive strips connected to each other, wherein a first recess and a second recess are formed in an edge of each of the conductive strips, the first recesses are connected to form the first through hole structures, and the second recesses are connected to form the second through hole structures.

4. A signal expansion apparatus, comprising: the cable and the probe block of any one of claims 1-3, the cable comprising a first core, a dielectric layer, a reference signal layer and an insulating layer respectively disposed from inside to outside, the first core passing through the first via structure to connect with the first signal type probe, the reference signal layer electrically connecting with the conductive component.

5. The signal expansion device of claim 4, wherein the first signal type probe includes a first signal type probe body and a first connection terminal, the first connection terminal being located on a side of the first signal type probe body adjacent to the cable, the first connection terminal being connected to a first wire core passing through the first via structure; the second signal type probe comprises a second signal type probe body and a second connecting terminal, the second connecting terminal is located on one side, close to the cable, of the second signal type probe body, and the second connecting terminal is electrically connected with the conductive assembly.

6. The signal extension device of claim 4, wherein when the cable is a coaxial cable, the reference signal layer comprises a woven mesh layer, and the woven mesh layer is electrically connected to the conductive element.

7. The signal extension device of claim 6, wherein at least a portion of the woven mesh layer not covered by the insulation layer is located within the first via structure, and a side surface of the woven mesh layer is welded or abutted to an inner wall of the first via structure; alternatively, the first and second electrodes may be,

the braided net layer which is not covered with the insulating layer is positioned outside the first through hole structure, and the end surface of one end, close to the conductive component, of the braided net layer is welded or abutted with the surface, close to the braided net layer, of the conductive component.

8. The signal extension device of claim 4, wherein when the cable is an aluminum foil cable, the reference signal layer comprises a second core and a shielding layer that are connected to each other, the second core being electrically connected to the conductive member.

9. The signal extension device of claim 8, wherein at least a portion of the second wire core that is not covered by the insulation layer is located within the first via structure, and a side surface of the second wire core is welded or abutted with an inner wall of the first via structure; alternatively, the first and second electrodes may be,

the second wire core which is not coated with the insulating layer is positioned outside the first through hole structure, and the end face of one end, close to the conductive assembly, of the second wire core is welded or abutted with the surface, close to the second wire core, of the conductive assembly.

10. A semiconductor tester comprising the signal expansion apparatus of any one of claims 4-9.

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