CN112738985B - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
- Publication number
- CN112738985B CN112738985B CN202110157959.6A CN202110157959A CN112738985B CN 112738985 B CN112738985 B CN 112738985B CN 202110157959 A CN202110157959 A CN 202110157959A CN 112738985 B CN112738985 B CN 112738985B
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- circuit board
- microstrip
- hdmi
- microstrip structure
- board assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The embodiment of the application relates to the technical field of circuit boards, and discloses a circuit board assembly and electronic equipment. In this application, line department, HDMI that the HDMI interface connects on lieing in the circuit board is walked line department and is set up the microstrip structure promptly, it just couples out and restrict in the shield cover and consume gradually to walk line department with the HDMI of harmonic at the circuit board, thereby eliminated the influence of harmonic to the wiFi signal when transmitting the rear end, improve the stability that the wiFi is connected, and simultaneously, because this application has adopted the mode that sets up the microstrip structure on the circuit board surface, the problem that the wave filter lug connection that is used for filtering harmonic among the correlation technique influences the transmission power of HDMI signal on the transmission path of HDMI signal has been avoided, when greatly having reduced the influence to HDMI signal power, the volume of whole circuit board has also been reduced.
Description
Technical Field
The embodiment of the application relates to the technical field of circuit boards, in particular to a circuit board assembly and electronic equipment.
Background
Currently, in the field of consumer electronics, WIreless Fidelity (WIFI) and High Definition Multimedia Interface (HDMI) are almost indispensable requirements, for example, a set top box of a television needs to be networked through the WIFI Interface and transmit data to the television through the HDMI Interface; however, the HDMI signal transmitted by the HDMI interface carries a harmonic that can interfere with the WiFi2.4ghz signal, and the harmonic may cause interference to the WiFi signal in the WiFi channel, so that the effect of receiving the WiFi signal by the user is poor. In order to solve the problem of interference of the HDMI signals to the WiFi signals in the related art, the method is as follows: a filter circuit is added in the HDMI channel to filter out harmonic waves in the HDMI signal.
However, the filter circuit added in the related art can simultaneously suppress the transmission power of the HDMI signal itself, so that the HDMI signal is transmitted with poor effect.
Disclosure of Invention
An object of the embodiment of the application is to provide a circuit board assembly and electronic equipment for under the condition that does not influence HDMI and walk line the HDMI signal power of transmission, eliminate the harmonic of interference wiFi signal in the HDMI signal, improve the stability that wiFi connects.
To solve the above technical problem, an embodiment of the present application provides a circuit board assembly, including: the high-definition multimedia interface HDMI cable comprises a circuit board, a high-definition multimedia interface HDMI cable arranged on the inner layer of the circuit board, a micro-strip structure arranged on the surface of the circuit board, and a shielding cover arranged on the circuit board and covering the micro-strip structure; the center line of the microstrip structure and the HDMI trace are positioned on the same plane, and the plane is perpendicular to the circuit board; the micro-strip structure is used for coupling out harmonic waves disturbing WiFi signals in the HDMI wiring; the shield is used to confine the harmonics inside the shield.
An embodiment of the present application further provides an electronic device, including: the circuit board assembly is described above.
Compared with the prior art, this application is walked line department at the HDMI that is located the circuit board and is HDMI interface connection HDMI and is walked line department and set up the microstrip structure, it just comes out and restrict in the shield cover and consume gradually to walk line department with the HDMI with the harmonic at the circuit board, thereby eliminated the harmonic and to the influence of wiFi signal when transmitting the rear end, improve the stability that the wiFi is connected, and simultaneously, because this application has adopted the mode of setting microstrip structure on the circuit board surface, the problem that the wave filter lug connection that is used for filtering harmonic among the correlation technique influences the transmission power of HDMI signal on the transmission path of HDMI signal has been avoided, when greatly having reduced the influence to HDMI signal power, the volume of whole circuit board has also been reduced.
In addition, the number of the microstrip structures is two, and the microstrip structures are respectively a first microstrip structure and a second microstrip structure; the first microstrip structure is arranged on the upper surface of the circuit board, and the second microstrip structure is arranged on the lower surface of the circuit board. The microstrip structures are arranged on the two sides of the HDMI, so that the efficiency of coupling out harmonic waves can be improved.
In addition, the first microstrip structure and the second microstrip structure are both of serpentine structures.
In addition, the serpentine structure of the first microstrip structure is the same as the serpentine structure of the second microstrip structure.
In addition, the first microstrip structure has N first folding points, the second microstrip structure has N second folding points corresponding to the N first folding points, and N is greater than or equal to 4; each first folding point is provided with a through hole along the vertical direction of the circuit board, and each through hole extends to the second folding point corresponding to the first folding point; the circuit board assembly further comprises a metal piece, and the metal piece penetrates through the through hole. Through setting up the through-hole and set up the metalwork in the through-hole, a plurality of metalworks and microstrip structure can form a cavity filtering structure that holds the HDMI and walk the line jointly, can further improve the coupling and go out the harmonic effect.
In addition, in the direction perpendicular to the circuit board, the distance between the microstrip structure and the HDMI trace is the line width of the HDMI trace.
In addition, the total length of the microstrip structure is M times of a quarter wavelength of the harmonic wave, and M is an integer greater than or equal to 1.
In addition, the inner surface of the shielding cover is provided with wave-absorbing materials.
In addition, the microstrip structure is coated on the circuit board. The microstrip structure can be manufactured together with the circuit board, thereby simplifying the process flow.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a schematic cross-sectional view of a circuit board assembly according to a first embodiment of the present application, the cross-sectional view extending along a length direction of an HDMI trace and perpendicular to a circuit board direction;
fig. 2 is a schematic cross-sectional structure view of a circuit board assembly according to a second embodiment of the present application, the cross-sectional structure extending along a length direction of an HDMI trace and perpendicular to a circuit board direction;
figure 3 is a schematic structural view of a first microstrip structure according to a second embodiment of the present application;
fig. 4 is a schematic structural view of a second microstrip structure according to the first embodiment of the present application.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in the examples of the present application, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present application, and the embodiments may be mutually incorporated and referred to without contradiction.
A first embodiment of the present application relates to a circuit board assembly, as shown in fig. 1, which is a schematic cross-sectional structure diagram of the circuit board assembly of this embodiment along a length direction of an HDMI trace and perpendicular to a circuit board direction, and the circuit board assembly of this embodiment includes: the high-definition multimedia interface HDMI cable comprises a circuit board 101, a high-definition multimedia interface HDMI cable 102 arranged on the inner layer of the circuit board 101, a microstrip structure 103 arranged on the surface of the circuit board 101, and a shielding case 104 arranged on the circuit board 101 and covering the microstrip structure 103.
Specifically, the center line of the microstrip structure 103 and the HDMI trace 102 are located on the same plane, which is perpendicular to the circuit board 101; the microstrip structure 103 is used for coupling out harmonic waves disturbing the WiFi signals in the HDMI trace 102; the shield 104 serves to confine the harmonics inside the shield 104.
In practical applications, an HDMI interface (not shown) is disposed on the circuit board 101 for connecting with other devices, such as a television; the HDMI trace 102 is etched inside the circuit board 101, one end of the HDMI trace 102 is connected to the HDMI interface, and the other end of the HDMI trace 102 is connected to the trace outside the circuit board 101. It should be noted that the HDMI signal transmitted by the HDMI cable 102 carries a harmonic that interferes with the WiFi signal, and when the HDMI signal is transmitted to the WiFi interface at the rear end of the circuit board 101, the transmission of the WiFi signal is affected, so that the stability of the WiFi signal is reduced.
In the related art, in order to filter the harmonic waves carried by the HDMI signal, a filter is connected to a transmission line of the HDMI signal, so as to filter the harmonic waves in the HDMI signal; however, the filter is provided to reduce the power of the HDMI signal transmitted on the transmission path of the HDMI signal, suppressing the transmission effect of the HDMI signal.
In this embodiment, the microstrip structure 103 is disposed at the HDMI trace 102 on the circuit board 101, that is, at the HDMI trace 102 connected to the HDMI interface, so that the harmonic wave is coupled out at the HDMI trace 102 of the circuit board 101 and is limited in the shielding can 104 and gradually consumed, thereby eliminating the influence of the harmonic wave on the WiFi signal when being transmitted to the rear end, and improving the stability of WiFi connection; meanwhile, the microstrip structure 103 is arranged on the surface of the circuit board 101, so that the problem that the filter for filtering out harmonic waves in the related art is directly connected to the transmission path of the HDMI signal to influence the transmission power of the HDMI signal is avoided, the influence on the HDMI signal power is greatly reduced, and the size of the whole circuit board 101 is reduced.
It should be noted that, in the present application, because the microstrip structure 103 is disposed on the surface of the circuit board 101, when the length of the microstrip structure 103 is larger or smaller, the length of the microstrip structure 103 can be reduced or increased as required, so that the microstrip structure 103 can be adjusted more conveniently as required.
Specifically, the microstrip structure 103 is etched on the circuit board 101. In practical application, the microstrip structure 103 is coated on a green oil layer on the surface of the circuit board 101, and the microstrip structure 103 can be manufactured together with the circuit board 101, so that the process flow is simplified.
In one example, the distance between the microstrip structure 103 and the HDMI trace 102 in the direction perpendicular to the circuit board 101 is the line width of the HDMI trace 102.
In one example, the total length of the microstrip structure 103 is M times a quarter wavelength of a harmonic, where M is an integer greater than or equal to 1.
In one example, the inner surface of the shield 104 is provided with a wave-absorbing material. In this embodiment, by setting the wave-absorbing material, the harmonic wave coupled out by the microstrip structure 103 can be absorbed quickly. In practical application, the wave-absorbing material is one or more of graphene, iron oxide, and silicon carbide, and may be set according to actual requirements, which is not specifically limited in this embodiment.
A second embodiment of the present application relates to a circuit board assembly. The second embodiment is substantially the same as the first embodiment, with the main differences being: in the second embodiment of the present application, the number of the microstrip structures is two, and the first microstrip structure and the second microstrip structure are respectively provided, where the first microstrip structure is disposed on the upper surface of the circuit board, and the second microstrip structure is disposed on the lower surface of the circuit board. It should be noted that the same or corresponding parts of this embodiment as those of the first embodiment are not described herein again to avoid repetition.
As shown in fig. 2, a schematic cross-sectional structure of the circuit board assembly of this embodiment extending along the length direction of the HDMI trace and perpendicular to the circuit board direction includes a circuit board 201, an HDMI trace 202, a first microstrip structure 2031, a second microstrip structure 2032, a first shield 2041, and a second shield 2042, wherein the first microstrip structure 2031 is disposed on the upper surface of the circuit board 201, the second microstrip structure 2032 is disposed on the lower surface of the circuit board 202, the first shield 2041 is disposed on the upper surface of the circuit board 201 and covers the first microstrip line 2031, and the second shield 2042 is disposed on the lower surface of the circuit board 201 and covers the second microstrip line 2032.
In this embodiment, the upper and lower surfaces of the circuit board 201 are both provided with microstrip structures, i.e., the first microstrip structure 2031 and the second microstrip structure 2032, so that the harmonic of the HDMI signal transmitted by the HDMI trace 202 can be coupled out through the two microstrip structures of the upper surface and the lower surface, i.e., the first microstrip structure 2031 and the second microstrip structure 2032, thereby improving the efficiency of coupling out the harmonic in the HDMI signal.
In one example, the first microstrip structure 2031 and the second microstrip structure 2032 each have a serpentine configuration. As shown in fig. 3, which is a schematic structural diagram of the first microstrip structure 2031, a straight line OP in the drawing is a central line of the first microstrip line 2031, the first microstrip structure 2031 is divided into a plurality of microstrip lines, i.e., line segments AB, BC, CD, DE, EF, FG, and GH in the drawing, two intersecting microstrip lines are perpendicular to each other, wherein the central line OP is located at a midpoint of the microstrip lines AB, CD, EF, and GH, i.e., a distance between the microstrip line BC and the central line OP, a distance between the microstrip line DE and the central line OP, and a distance between the microstrip line FG and the central line OP are the same.
In practical applications, the first microstrip structure 2031 may be composed of only microstrip lines AB, BC, and CD, or microstrip lines may be added after the microstrip line GH, specifically, the microstrip structure is set according to practical requirements, but at least one U-shaped structure composed of the microstrip lines AB, BC, and CD in the drawing needs to be set. However, the total length of the serpentine structure of the first microstrip structure 2031 should be M times the quarter wavelength of the harmonic, and M is an integer greater than or equal to 1, and the length of the first microstrip structure 2031 can be increased or decreased according to actual needs as long as it is ensured that the total length of the serpentine structure of the first microstrip structure 2031 is M times the quarter wavelength of the harmonic.
Correspondingly, as shown in fig. 4, the structure diagram of the second microstrip structure 2032 is shown, where the straight line op is a center line of the second microstrip line 2032, and the second microstrip structure 2032 is divided into a plurality of microstrip lines, that is, line segments ab, bc, cd, de, ef, fg, and gh in the drawing, and two intersecting microstrip lines are perpendicular to each other, where the center line op is located at the middle point of the microstrip line ab, the microstrip line cd, the microstrip line ef, and the microstrip line gh, that is, the distance between the microstrip line bc and the center line op, the distance between the microstrip line de and the center line op, and the distance between the microstrip line fg and the center line op are the same.
In practical applications, the second microstrip structure 2032 may be composed of microstrip lines ab, bc, and cd only, or microstrip lines may be added after the microstrip line gh, specifically, the microstrip lines are set according to practical requirements, but at least one U-shaped structure formed by the microstrip lines ab, bc, and cd in the figure needs to be set. However, the total length of the serpentine structure of the second microstrip structure 2032 should be M times the quarter wavelength of the harmonic, M being an integer equal to or greater than 1, and the length of the second microstrip structure 2032 can be increased or decreased as needed as long as it is ensured that the total length of the serpentine structure of the second microstrip structure 2032 is M times the quarter wavelength of the harmonic.
In one example, the serpentine configuration of the first microstrip structure 2031 is the same as the serpentine configuration of the second microstrip structure 2032. That is, the first microstrip structure 2031 and the second microstrip structure 2032 are symmetrically disposed on the upper and lower surfaces of the circuit board.
A third embodiment of the present application is directed to a circuit board assembly. The third embodiment is substantially the same as the second embodiment, with the main differences being: in the third embodiment of the present application, each first folding point is provided with a through hole along the vertical direction of the circuit board, and each through hole extends to a second folding point corresponding to the first folding point; the circuit board assembly further comprises a metal piece, and the metal piece penetrates through the through hole. It should be noted that the same or corresponding parts of this embodiment as those of the second embodiment are not described herein again to avoid repetition.
Continuing to refer to fig. 3 and 4, the first microstrip structure has N first inflection points, and correspondingly, the second microstrip structure has N second inflection points corresponding to the N first inflection points, where N is greater than or equal to 4; because the first microstrip structure and the second microstrip structure are symmetrically arranged on the upper surface and the lower surface of the circuit board, the first folding point of the first microstrip structure and the second folding point of the second microstrip structure are also symmetrically arranged one by one.
Specifically, the first folding point of the first microstrip structure is point a, point B, point C, point D, point E, point F, point G, and point H in fig. 3; the second folding point of the second microstrip structure is point a, point b, point c, point d, point e, point f, point g and point h in fig. 4. That is, the first folding point includes two end points of the first microstrip structure and each folding point of the first microstrip structure, and the second folding point includes two end points of the second microstrip structure and each folding point of the second microstrip structure.
Specifically, each first folding point on the upper surface of the circuit board is provided with a through hole along the vertical direction of the circuit board, and each through hole extends to a second folding point corresponding to the first folding point; that is, each first folding point and the corresponding second folding point are connected through a through hole perpendicular to the circuit board.
Specifically, point a in fig. 3 is connected to point a in fig. 4 through a through hole, point B is connected to point B through a through hole, point C is connected to point C through a through hole, point D is connected to point D through a through hole, and so on.
Specifically, the circuit board assembly further comprises metal pieces, and the number of the metal pieces is N, namely the number of the metal pieces is the same as that of the through holes; and each metal piece is correspondingly arranged in the through hole and penetrates through the through hole.
In the embodiment, as the through hole for communicating the first folding point with the second folding point is arranged and the metal key is arranged in the through hole, the structure formed by the through hole and the metal piece can couple out harmonic waves on the plane where the circuit board is located; that is to say, the present embodiment can couple out the harmonic in four directions of the HDMI trace, i.e. up, down, left, and right, thereby improving the quality of the HDMI signal. Therefore, the plurality of metal pieces and the microstrip structure of the embodiment can jointly form a cavity filtering structure for accommodating the HDMI wiring, so that the coupling-out harmonic effect can be further improved.
In practical applications, the sidewall of the through hole is provided with a copper layer, and the metal member is copper metal, but of course, the metal member may also be formed by other metals or metal mixtures, and the embodiment is not particularly limited.
A fourth embodiment of the present application relates to an electronic apparatus including the circuit board assemblies of the first, second, and third embodiments described above.
In the electronic device of the embodiment, the micro-strip structure is arranged at the HDMI wiring position on the circuit board, namely the HDMI wiring position connected with the HDMI interface, so that the harmonic waves are coupled out at the HDMI interface of the circuit board and limited in the shielding case and gradually consumed, thereby eliminating the influence of the harmonic waves on WiFi signals when the harmonic waves are transmitted to the rear end and improving the stability of WiFi connection; meanwhile, the microstrip structure is arranged on the surface of the circuit board, so that the problem that the filter for filtering harmonic waves in the related technology is directly connected to the transmission path of the HDMI signal to influence the transmission power of the HDMI signal is avoided, the influence on the HDMI signal power is greatly reduced, and the size of the whole circuit board is reduced.
The steps of the above various components are divided for clarity of description, and implementation may be combined into one component or split into some components, so long as the same logical relationship is included, which are within the protection scope of the present patent; it is within the scope of this patent to add insignificant modifications to the components or to introduce insignificant designs without changing the core design.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the present application, and that various changes in form and details may be made therein without departing from the spirit and scope of the present application in practice.
Claims (6)
1. A circuit board assembly, comprising: the high-definition multimedia interface HDMI cable comprises a circuit board, a high-definition multimedia interface HDMI cable arranged on the inner layer of the circuit board, a micro-strip structure arranged on the surface of the circuit board, and a shielding cover arranged on the circuit board and covering the micro-strip structure;
the center line of the microstrip structure and the HDMI trace are positioned on the same plane, and the plane is perpendicular to the circuit board; the micro-strip structure is used for coupling out harmonic waves disturbing WiFi signals in the HDMI wiring;
the shielding case is used for limiting the harmonic waves inside the shielding case;
the number of the microstrip structures is two, and the microstrip structures are respectively a first microstrip structure and a second microstrip structure;
the first microstrip structure is arranged on the upper surface of the circuit board, and the second microstrip structure is arranged on the lower surface of the circuit board;
the first microstrip structure and the second microstrip structure are both of serpentine structures;
the serpentine structure of the first microstrip structure is the same as the serpentine structure of the second microstrip structure;
the first microstrip structure has N first folding points, the second microstrip structure has N second folding points corresponding to the N first folding points, and N is greater than or equal to 4;
each first folding point is provided with a through hole along the vertical direction of the circuit board, and each through hole extends to the second folding point corresponding to the first folding point;
the circuit board assembly further comprises a metal piece, and the metal piece penetrates through the through hole.
2. The circuit board assembly according to claim 1, wherein a distance between the microstrip structure and the HDMI trace in a direction perpendicular to the circuit board is a line width of the HDMI trace.
3. The circuit board assembly of claim 1, wherein the microstrip structure has an overall length that is M times a quarter wavelength of the harmonic, where M is an integer greater than or equal to 1.
4. The circuit board assembly of claim 1, wherein an inner surface of the shield is provided with a wave absorbing material.
5. The circuit board assembly of claim 1, wherein the microstrip structure is coated on the circuit board.
6. An electronic device comprising a circuit board assembly according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110157959.6A CN112738985B (en) | 2021-02-04 | 2021-02-04 | Circuit board assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110157959.6A CN112738985B (en) | 2021-02-04 | 2021-02-04 | Circuit board assembly and electronic equipment |
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| Publication Number | Publication Date |
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| CN112738985A CN112738985A (en) | 2021-04-30 |
| CN112738985B true CN112738985B (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110157959.6A Active CN112738985B (en) | 2021-02-04 | 2021-02-04 | Circuit board assembly and electronic equipment |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1144406A (en) * | 1995-03-28 | 1997-03-05 | 株式会社村田制作所 | Planar dielectric line and integrated circuit using the same |
| US6444922B1 (en) * | 1999-11-18 | 2002-09-03 | Nortel Networks Limited | Zero cross-talk signal line design |
| CN103247604A (en) * | 2012-02-01 | 2013-08-14 | 三美电机株式会社 | Electronic module and method of manufacturing same |
| CN109890193A (en) * | 2019-04-16 | 2019-06-14 | 出门问问信息科技有限公司 | A kind of shielding case and shielding harness |
| CN110730609A (en) * | 2019-11-22 | 2020-01-24 | 江苏掌上云企业管理咨询服务有限公司 | Shielding device for mobile terminal |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7129422B2 (en) * | 2003-06-19 | 2006-10-31 | Wavezero, Inc. | EMI absorbing shielding for a printed circuit board |
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2021
- 2021-02-04 CN CN202110157959.6A patent/CN112738985B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1144406A (en) * | 1995-03-28 | 1997-03-05 | 株式会社村田制作所 | Planar dielectric line and integrated circuit using the same |
| US6444922B1 (en) * | 1999-11-18 | 2002-09-03 | Nortel Networks Limited | Zero cross-talk signal line design |
| CN103247604A (en) * | 2012-02-01 | 2013-08-14 | 三美电机株式会社 | Electronic module and method of manufacturing same |
| CN109890193A (en) * | 2019-04-16 | 2019-06-14 | 出门问问信息科技有限公司 | A kind of shielding case and shielding harness |
| CN110730609A (en) * | 2019-11-22 | 2020-01-24 | 江苏掌上云企业管理咨询服务有限公司 | Shielding device for mobile terminal |
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