CN212485287U

CN212485287U - Material structure is got to wafer

Info

Publication number: CN212485287U
Application number: CN202020876918.3U
Authority: CN
Inventors: 周李渊
Original assignee: CYG Semiconductor Equipment Zhuhai Co Ltd
Current assignee: CYG Semiconductor Equipment Zhuhai Co Ltd
Priority date: 2020-05-22
Filing date: 2020-05-22
Publication date: 2021-02-05
Anticipated expiration: 2030-05-22

Abstract

The utility model discloses a wafer taking structure, which comprises a vacuum suction plate, a linear module, a mounting bottom plate, a swing cylinder, a vacuum base, a sensor and a control system, wherein the linear module, the swing cylinder and the sensor are electrically connected with the control system, the mounting bottom plate is arranged on the linear module, the swing cylinder is fixedly arranged on the mounting bottom plate, the vacuum base is rotatably arranged on the swing cylinder, the vacuum suction plate is arranged on the vacuum base, the sensor detects whether a wafer exists in a station, when the wafer exists in the station, the control system drives the linear module to drive the vacuum suction plate to approach the station along the linear motion, the control system drives the swing cylinder to drive the vacuum suction plate to rotate to enable the vacuum suction plate to rotate to the station to adsorb the wafer, the wafer is taken out from the station, when the station does not have the wafer, the control system does not output an instruction, through the design, the, whether the material has and get the material fast is judged to intelligence, and the non-staining light facet and the wafer is not broken when getting the material.

Description

Material structure is got to wafer

Technical Field

The utility model relates to a wafer especially relates to a material structure is got to wafer.

Background

Generally, after the silicon is crystallized into a large, cylindrical shape over most of its length, the columnar crystalline material is cut into thin, circular pieces that become silicon wafers, which may also be referred to as wafers (wafers) because of their circular shape. Various circuit device structures can be further fabricated on the wafer, thereby forming an integrated circuit product with specific electrical functions.

The nature of the wafer product is fragile and the optical facets do not allow direct contact with other objects to avoid contamination. Due to the fact that wafers in the LED industry are thin and the space between material boxes is small, the wafers are continuously developed to be large in size, and material taking is difficult.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, one of the objectives of the present invention is to provide a wafer taking structure, which can take the wafer without contaminating the optical facets and without breaking the wafer when the wafer is taken under the condition of a small space between the material boxes.

The utility model discloses an one of the purpose adopts following technical scheme to realize:

a wafer taking structure comprises a vacuum suction plate, a linear module, a mounting bottom plate, a swing air cylinder, a vacuum base, a sensor and a control system, wherein the linear module, the swing air cylinder and the sensor are electrically connected with the control system, the mounting bottom plate is mounted on the linear module, the swing air cylinder is fixedly mounted on the mounting bottom plate, the vacuum base is rotatably mounted on the swing air cylinder, the vacuum suction plate is mounted on the vacuum base, the sensor detects whether a wafer exists in a station, when the wafer exists in the station, the control system drives the linear module to drive the vacuum suction plate to approach the station along linear motion, the control system drives the swing air cylinder to drive the vacuum suction plate to rotate so that the vacuum suction plate rotates to the station to suck the wafer, the wafer is taken out from the station, when the station does not have the wafer, the control system does not output instructions.

Further, the wafer taking structure further comprises a vacuum generator, and the vacuum generator is communicated with the vacuum base.

Further, the vacuum suction plate comprises a plate body and a vacuum pipeline, the vacuum pipeline is installed on the plate body, and the vacuum pipeline is communicated with the vacuum base.

Furthermore, the plate body is provided with a vacuum suction groove, and the tail end of the vacuum pipeline is positioned in the vacuum suction groove.

Further, the tail end of the vacuum pipeline is arc-shaped.

Furthermore, the number of the vacuum suction grooves is three, and the three vacuum suction grooves are positioned on an arc.

Furthermore, the wafer taking structure further comprises a throttle valve, and the throttle valve is fixedly installed on the vacuum base to adjust the suction force of the vacuum suction plate.

Further, the wafer material taking structure further comprises an air pipe connector, the air pipe connector is connected with the swing air cylinder, and the air pipe connector controls the rotation angle of the swing air cylinder.

Further, the sensor is an infrared sensor.

Further, the sensor is an industrial camera.

Compared with the prior art, the utility model discloses whether there is the wafer in wafer get material structure's sensor detection station, when the station has the wafer, control system orders about sharp module and drives the vacuum suction plate and be close to the station along linear motion, control system orders about swing cylinder and drives the vacuum suction plate and rotate and make the vacuum suction plate rotate to station absorption wafer, take out the wafer from the station, when the station does not have the wafer, control system does not export the instruction, through the above-mentioned design, the wafer is got the material structure and can be under the very little condition of interval between the magazine, intelligence is judged the material and is had or not and get the material fast, non-staining light facet and wafer are not broken when getting the material.

Drawings

Fig. 1 is a perspective view of a wafer taking structure according to the present invention;

fig. 2 is an exploded view of the wafer take out structure of fig. 1.

In the figure: 10. a vacuum generator; 20. a linear module; 30. mounting a bottom plate; 40. a swing cylinder; 50. a vacuum base; 60. a throttle valve; 70. a vacuum suction plate; 71. a vacuum line; 72. a plate body; 720. vacuum suction groove; 80. a sensor; 90. a gas pipe joint; 200. and (5) a wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, secured by intervening elements. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 2, a wafer picking mechanism according to the present invention includes a vacuum generator 10, a linear module 20, a mounting plate 30, a swing cylinder 40, a vacuum base 50, a throttle valve 60, a vacuum suction plate 70, a sensor 80, an air pipe connector 90 and a control system.

The vacuum suction plate 70 includes a vacuum line 71 and a plate body 72. The end of the vacuum line 71 is rounded. The plate body 72 is provided at its end with a vacuum suction groove 720. The number of the vacuum suction grooves 720 is three, and the three vacuum suction grooves 720 are located on the circular arc. The vacuum line 71 is installed on the plate body 72, and the end of the vacuum line 71 is positioned in the vacuum suction groove 720.

The sensor 80 is an infrared sensor or an image sensor. The infrared sensor determines the presence or absence of the wafer 200 at the station based on the reflected light. The image sensor uses an industrial camera to photograph the station, and the control system identifies whether the wafer 200 is on the station according to the photographed image.

When assembling the wafer reclaiming structure, the mounting base plate 30 is mounted on the linear module 20. The swing cylinder 40 is fixed to the mounting base plate 30. The air pipe joint 90 is fixedly installed at the swing cylinder 40 to control the rotation angle of the swing cylinder 40. The vacuum base 50 is rotatably mounted to the swing cylinder 40. The vacuum generator 10 is fixed to the linear module 20 and communicates with the vacuum base 50 through a pipe. The throttle valve 60 is fixedly installed on the vacuum base 50 to control the suction force of the vacuum suction plate 70 by controlling the air flow of the vacuum generator 10. The vacuum suction plate 70 is mounted to the vacuum base 50 and the internal vacuum line 71 communicates with the vacuum base 50. Sensor 80 is located on the side of the station. The vacuum generator 10, the linear module 20, the oscillating cylinder 40 and the sensor 80 are electrically connected to the control system.

When the wafer picking structure is used, the sensor 80 first detects whether the wafer 200 is on the station, and when the wafer 200 is on the station, the control system controls the linear module 20 to drive the vacuum suction plate 70 to move linearly close to the station. The swing cylinder 40 drives the vacuum suction plate 70 to rotate to the position below the working position, and the vacuum generator 10 works to make the vacuum suction plate 70 adsorb the wafer 200. Then the linear module 20 drives the vacuum suction plate 70 to exit the station, and the swing cylinder 40 drives the vacuum suction plate 70 to rotate to realize the connection of the wafer 200. Through above-mentioned design, the wafer is got the material structure and can be under the very little condition in interval between the magazine, and the intelligence is judged the material and is had or not and get the material fast, and the non-staining light facet and wafer 200 are not broken when getting the material.

The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, all according to the equivalent modifications and evolutions of the present invention, which are made to the above embodiments by the essential technology, and all belong to the protection scope of the present invention.

Claims

1. The utility model provides a material structure is got to wafer, includes the vacuum suction plate, its characterized in that: the wafer taking structure also comprises a linear module, a mounting bottom plate, a swing cylinder, a vacuum base, a sensor and a control system, the linear module, the swing cylinder and the sensor are electrically connected with the control system, the mounting bottom plate is arranged on the linear module, the swing cylinder is fixedly arranged on the mounting bottom plate, the vacuum base is rotatably arranged on the swing cylinder, the vacuum suction plate is arranged on the vacuum base, the sensor detects whether a wafer exists in a station or not, when a wafer is on the station, the control system drives the linear module to drive the vacuum suction plate to move along a straight line to be close to the station, the control system drives the swing cylinder to drive the vacuum suction plate to rotate, so that the vacuum suction plate rotates to a station to adsorb the wafer, the wafer is taken out of the station, and when no wafer exists in the station, the control system does not output an instruction.

2. The wafer take out structure of claim 1, wherein: the wafer taking structure further comprises a vacuum generator, and the vacuum generator is communicated with the vacuum base.

3. The wafer take out structure of claim 1, wherein: the vacuum suction plate comprises a plate body and a vacuum pipeline, the vacuum pipeline is installed on the plate body, and the vacuum pipeline is communicated with the vacuum base.

4. The wafer take out structure of claim 3, wherein: the plate body is provided with a vacuum suction groove, and the tail end of the vacuum pipeline is positioned in the vacuum suction groove.

5. The wafer take out structure of claim 4, wherein: the tail end of the vacuum pipeline is arc-shaped.

6. The wafer take out structure of claim 5, wherein: the number of the vacuum suction grooves is three, and the three vacuum suction grooves are positioned on the circular arc.

7. The wafer take out structure of claim 1, wherein: the wafer taking structure further comprises a throttle valve, and the throttle valve is fixedly installed on the vacuum base and used for adjusting the suction force of the vacuum suction plate.

8. The wafer take out structure of claim 1, wherein: the wafer material taking structure further comprises an air pipe connector, the air pipe connector is connected with the swing air cylinder, and the air pipe connector controls the rotation angle of the swing air cylinder.

9. The wafer take out structure of claim 1, wherein: the sensor is an infrared sensor.

10. The wafer take out structure of claim 1, wherein: the sensor is an industrial camera.