CN111668144A - Material structure is got to wafer - Google Patents
Material structure is got to wafer Download PDFInfo
- Publication number
- CN111668144A CN111668144A CN202010443092.6A CN202010443092A CN111668144A CN 111668144 A CN111668144 A CN 111668144A CN 202010443092 A CN202010443092 A CN 202010443092A CN 111668144 A CN111668144 A CN 111668144A
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- Prior art keywords
- wafer
- vacuum
- vacuum suction
- station
- control system
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer taking structure, which comprises a vacuum suction plate, a linear module, a mounting bottom plate, a swing cylinder, a vacuum base, a sensor and a control system, wherein the linear module, the swing cylinder and the sensor are electrically connected with the control system, the mounting bottom plate is arranged on the linear module, the swing cylinder is fixedly arranged on the mounting bottom plate, the vacuum base is rotatably arranged on the swing cylinder, the vacuum suction plate is arranged on the vacuum base, the sensor detects whether a wafer exists in a station, when the wafer exists in the station, the control system drives the linear module to drive the vacuum suction plate to linearly move to be close to the station, the control system drives the swing cylinder to drive the vacuum suction plate to rotate to enable the vacuum suction plate to rotate to the station to adsorb the wafer, the wafer is taken out from the station, when the station does not have the wafer, the control system does not output instructions, through the design, the, whether the material has and get the material fast is judged to intelligence, and the non-staining light facet and the wafer is not broken when getting the material.
Description
Technical Field
The invention relates to a wafer, in particular to a wafer taking structure.
Background
Generally, after the silicon is crystallized into a large, cylindrical shape over most of its length, the columnar crystalline material is cut into thin, circular pieces that become silicon wafers, which may also be referred to as wafers (wafers) because of their circular shape. Various circuit device structures can be further fabricated on the wafer, thereby forming an integrated circuit product with specific electrical functions.
The nature of the wafer product is fragile and the optical facets do not allow direct contact with other objects to avoid contamination. Due to the fact that wafers in the LED industry are thin and the space between material boxes is small, the wafers are continuously developed to be large in size, and material taking is difficult.
Disclosure of Invention
In order to overcome the disadvantages of the prior art, an object of the present invention is to provide a wafer unloading structure, which can unload the wafer without contaminating the optical facet and breaking the wafer under the condition of small space between the magazines.
One of the purposes of the invention is realized by adopting the following technical scheme:
a wafer taking structure comprises a vacuum suction plate, a linear module, a mounting bottom plate, a swing air cylinder, a vacuum base, a sensor and a control system, wherein the linear module, the swing air cylinder and the sensor are electrically connected with the control system, the mounting bottom plate is mounted on the linear module, the swing air cylinder is fixedly mounted on the mounting bottom plate, the vacuum base is rotatably mounted on the swing air cylinder, the vacuum suction plate is mounted on the vacuum base, the sensor detects whether a wafer exists in a station, when the wafer exists in the station, the control system drives the linear module to drive the vacuum suction plate to approach the station along linear motion, the control system drives the swing air cylinder to drive the vacuum suction plate to rotate so that the vacuum suction plate rotates to the station to suck the wafer, the wafer is taken out from the station, when the station does not have the wafer, the control system does not output instructions.
Further, the wafer taking structure further comprises a vacuum generator, and the vacuum generator is communicated with the vacuum base.
Further, the vacuum suction plate comprises a plate body and a vacuum pipeline, the vacuum pipeline is installed on the plate body, and the vacuum pipeline is communicated with the vacuum base.
Furthermore, the plate body is provided with a vacuum suction groove, and the tail end of the vacuum pipeline is positioned in the vacuum suction groove.
Further, the tail end of the vacuum pipeline is arc-shaped.
Furthermore, the number of the vacuum suction grooves is three, and the three vacuum suction grooves are positioned on an arc.
Furthermore, the wafer taking structure further comprises a throttle valve, and the throttle valve is fixedly installed on the vacuum base to adjust the suction force of the vacuum suction plate.
Further, the wafer material taking structure further comprises an air pipe connector, the air pipe connector is connected with the swing air cylinder, and the air pipe connector controls the rotation angle of the swing air cylinder.
Further, the sensor is an infrared sensor.
Further, the sensor is an industrial camera.
Compared with the prior art, the sensor of the wafer taking structure detects whether a wafer exists in the station, when the wafer exists in the station, the control system drives the linear module to drive the vacuum suction plate to move linearly to be close to the station, the control system drives the swing cylinder to drive the vacuum suction plate to rotate so that the vacuum suction plate rotates to the station to adsorb the wafer, the wafer is taken out of the station, when the wafer does not exist in the station, the control system does not output an instruction, through the design, the wafer taking structure can intelligently judge whether the material exists and take the material rapidly under the condition that the space between material boxes is small, light facets are not polluted and the wafer is not broken during taking the material.
Drawings
FIG. 1 is a perspective view of a wafer reclaiming structure according to the present invention;
fig. 2 is an exploded view of the wafer take out structure of fig. 1.
In the figure: 10. a vacuum generator; 20. a linear module; 30. mounting a bottom plate; 40. a swing cylinder; 50. a vacuum base; 60. a throttle valve; 70. a vacuum suction plate; 71. a vacuum line; 72. a plate body; 720. vacuum suction groove; 80. a sensor; 90. a gas pipe joint; 200. and (5) a wafer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, secured by intervening elements. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 2, a wafer unloading structure according to the present invention includes a vacuum generator 10, a linear module 20, a mounting plate 30, a swing cylinder 40, a vacuum base 50, a throttle valve 60, a vacuum suction plate 70, a sensor 80, an air pipe connector 90, and a control system.
The vacuum suction plate 70 includes a vacuum line 71 and a plate body 72. The end of the vacuum line 71 is rounded. The plate body 72 is provided at its end with a vacuum suction groove 720. The number of the vacuum suction grooves 720 is three, and the three vacuum suction grooves 720 are located on the circular arc. The vacuum line 71 is installed on the plate body 72, and the end of the vacuum line 71 is positioned in the vacuum suction groove 720.
The sensor 80 is an infrared sensor or an image sensor. The infrared sensor determines the presence or absence of the wafer 200 at the station based on the reflected light. The image sensor uses an industrial camera to photograph the station, and the control system identifies whether the wafer 200 is on the station according to the photographed image.
When assembling the wafer reclaiming structure, the mounting base plate 30 is mounted on the linear module 20. The swing cylinder 40 is fixed to the mounting base plate 30. The air pipe joint 90 is fixedly installed at the swing cylinder 40 to control the rotation angle of the swing cylinder 40. The vacuum base 50 is rotatably mounted to the swing cylinder 40. The vacuum generator 10 is fixed to the linear module 20 and communicates with the vacuum base 50 through a pipe. The throttle valve 60 is fixedly installed on the vacuum base 50 to control the suction force of the vacuum suction plate 70 by controlling the air flow of the vacuum generator 10. The vacuum suction plate 70 is mounted to the vacuum base 50 and the internal vacuum line 71 communicates with the vacuum base 50. Sensor 80 is located on the side of the station. The vacuum generator 10, the linear module 20, the oscillating cylinder 40 and the sensor 80 are electrically connected to the control system.
When the wafer picking structure is used, the sensor 80 first detects whether the wafer 200 is on the station, and when the wafer 200 is on the station, the control system controls the linear module 20 to drive the vacuum suction plate 70 to move linearly close to the station. The swing cylinder 40 drives the vacuum suction plate 70 to rotate to the position below the working position, and the vacuum generator 10 works to make the vacuum suction plate 70 adsorb the wafer 200. Then the linear module 20 drives the vacuum suction plate 70 to exit the station, and the swing cylinder 40 drives the vacuum suction plate 70 to rotate to realize the connection of the wafer 200. Through above-mentioned design, the wafer is got the material structure and can be under the very little condition in interval between the magazine, and the intelligence is judged the material and is had or not and get the material fast, and the non-staining light facet and wafer 200 are not broken when getting the material.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, variations and modifications can be made without departing from the spirit of the invention, and all equivalent modifications and changes can be made to the above embodiments according to the essential technology of the invention, which falls into the protection scope of the invention.
Claims (10)
1. The utility model provides a material structure is got to wafer, includes the vacuum suction plate, its characterized in that: the wafer taking structure also comprises a linear module, a mounting bottom plate, a swing cylinder, a vacuum base, a sensor and a control system, the linear module, the swing cylinder and the sensor are electrically connected with the control system, the mounting bottom plate is arranged on the linear module, the swing cylinder is fixedly arranged on the mounting bottom plate, the vacuum base is rotatably arranged on the swing cylinder, the vacuum suction plate is arranged on the vacuum base, the sensor detects whether a wafer exists in a station or not, when a wafer is on the station, the control system drives the linear module to drive the vacuum suction plate to move along a straight line to be close to the station, the control system drives the swing cylinder to drive the vacuum suction plate to rotate, so that the vacuum suction plate rotates to a station to adsorb the wafer, the wafer is taken out of the station, and when no wafer exists in the station, the control system does not output an instruction.
2. The wafer take out structure of claim 1, wherein: the wafer taking structure further comprises a vacuum generator, and the vacuum generator is communicated with the vacuum base.
3. The wafer take out structure of claim 1, wherein: the vacuum suction plate comprises a plate body and a vacuum pipeline, the vacuum pipeline is installed on the plate body, and the vacuum pipeline is communicated with the vacuum base.
4. The wafer take out structure of claim 3, wherein: the plate body is provided with a vacuum suction groove, and the tail end of the vacuum pipeline is positioned in the vacuum suction groove.
5. The wafer take out structure of claim 4, wherein: the tail end of the vacuum pipeline is arc-shaped.
6. The wafer take out structure of claim 5, wherein: the number of the vacuum suction grooves is three, and the three vacuum suction grooves are positioned on the circular arc.
7. The wafer take out structure of claim 1, wherein: the wafer taking structure further comprises a throttle valve, and the throttle valve is fixedly installed on the vacuum base and used for adjusting the suction force of the vacuum suction plate.
8. The wafer take out structure of claim 1, wherein: the wafer material taking structure further comprises an air pipe connector, the air pipe connector is connected with the swing air cylinder, and the air pipe connector controls the rotation angle of the swing air cylinder.
9. The wafer take out structure of claim 1, wherein: the sensor is an infrared sensor.
10. The wafer take out structure of claim 1, wherein: the sensor is an industrial camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010443092.6A CN111668144A (en) | 2020-05-22 | 2020-05-22 | Material structure is got to wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010443092.6A CN111668144A (en) | 2020-05-22 | 2020-05-22 | Material structure is got to wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111668144A true CN111668144A (en) | 2020-09-15 |
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ID=72384227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010443092.6A Pending CN111668144A (en) | 2020-05-22 | 2020-05-22 | Material structure is got to wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111668144A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114988108A (en) * | 2022-06-10 | 2022-09-02 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Get and put material manipulator and get and put material equipment |
-
2020
- 2020-05-22 CN CN202010443092.6A patent/CN111668144A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114988108A (en) * | 2022-06-10 | 2022-09-02 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Get and put material manipulator and get and put material equipment |
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Address after: 519080 5th floor, building 3 (R & D building), No.5, Keji 8th Road, high tech Zone, Zhuhai City, Guangdong Province Applicant after: Changyuan semiconductor equipment (Zhuhai) Co.,Ltd. Address before: 519080 5th floor, building 3 (R & D building), No.5, Keji 8th Road, high tech Zone, Zhuhai City, Guangdong Province Applicant before: Changyuan Qihua Intelligent Technology (Zhuhai) Co.,Ltd. |